Motor base and motor

Abstract

The utility model discloses a motor base and a motor, and the motor base comprises an insulating body, a connecting circuit, an electronic element, and a blocking member. The insulating body is provided with an accommodating groove. At least one part of the connecting circuit is exposed out of the accommodating groove and forms a first connecting part; an electronic component is arranged in the accommodating groove and is electrically connected with the first connecting part; the blocking piece is formed by the bottom of the containing groove in a protruding mode, the blocking piece comprises a first end adjacent to the electronic element and a second end away from the electronic element, and the height of the blocking piece at the second end is larger than that of the first end. The motor base and the motor provided by the utility model are used for ensuring effective connection between the electronic element and the first connecting part and reducing the influence of the blocking piece on the connection operation of the electronic element and the first connecting part.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, and in particular to a motor base and a motor. Background Art

[0002] The motor is a key component in a camera module and typically consists of a motor base. This base includes an insulating body, terminals, and electronic components. The insulating body forms a cavity for mounting the electronic components. The terminals are exposed in the cavity, forming solder pins, to which the electronic components are soldered.

[0003] In the prior art, referring to Figures 1 to 3 , Figure 1 FIG. 3 shows a schematic diagram of the electronic component 3' when the installation position is not offset, that is, the electronic component 3' and the soldering foot 21' are effectively soldered. However, if Figure 2 and Figure 3 As shown, in order to facilitate the tinning operation when soldering the electronic component 3' to the solder foot 21', the cavity 11' formed by the insulating body 1' is larger than the electronic component 3', and the tin 32' will melt and form a liquid when passing through the reflow furnace for soldering. The high fluidity of the liquid tin 32' will generate a pulling force to pull the electronic component 3'. The tin 32' may cause the electronic component 3' in contact with it to move, thereby causing one end of the electronic component 3' to move to a distance from the solder foot 21', resulting in the electronic component 3' being unable to be effectively soldered to the solder foot 21', resulting in poor soldering.

[0004] An existing Chinese utility model patent, CN216699741U, discloses a voice coil motor base with a partition block placed in a recess for accommodating electronic components. The partition block covers a portion of the solder pins, ensuring that the exposed area of ​​each pin is equal or similar, thereby minimizing the impact of tin flow on the position of the electronic components. However, the partition block interferes with the soldering tool during soldering, making it difficult to solder the solder pins. Furthermore, the tool can easily come into contact with the partition block upon exiting the soldering tool, causing tin to linger on the block and resulting in product defects. Utility Model Content

[0005] The purpose of the utility model is to provide a motor base and a motor, which are used to ensure the effective connection between the electronic component and the first connecting part, and reduce the influence of the blocking member on the connection operation between the electronic component and the first connecting part.

[0006] The purpose of this utility model is achieved by the following technical solutions:

[0007] A motor base, comprising:

[0008] The insulating body is provided with a receiving groove;

[0009] a connecting circuit, at least a portion of which is exposed in the receiving groove and forms a first connecting portion;

[0010] an electronic component, mounted in the receiving groove and electrically connected to the first connecting portion;

[0011] The blocking member is formed by a protrusion at the bottom of the accommodating groove. The blocking member includes a first end adjacent to the electronic component and a second end away from the electronic component. The height of the blocking member at the second end is greater than that of the first end.

[0012] Preferably, the accommodating groove has a bottom wall and a side wall, and the blocking member is formed at the junction of the bottom wall and the side wall and is connected to the bottom wall and the side wall respectively;

[0013] The upper surface of the first connecting portion is exposed to the bottom wall, and at least a portion of the blocking member covers a portion of the upper surface of the first connecting portion.

[0014] Preferably, at least two first connecting portions are provided, and the two first connecting portions are provided at opposite ends of the accommodating groove along the first direction, and second connecting portions are provided at opposite ends of the electronic component along the first direction, respectively, and each second connecting portion is electrically connected to the corresponding first connecting portion;

[0015] At least two blocking members are provided, and the two blocking members are provided on two opposite sides of the electronic component along the first direction, and each blocking member partially covers the corresponding first connecting portion.

[0016] Preferably, the minimum distance between the two first connecting portions along the first direction is smaller than the minimum distance between the two second connecting portions along the first direction;

[0017] The upper surface of the first connecting portion includes an exposed surface facing the second connecting portion and exposed to the blocking member, and the second connecting portion includes a connecting surface facing the first connecting portion, the area of ​​the exposed surface is larger than the connecting surface, and the exposed surface and the connecting surface are at least partially stacked and electrically connected.

[0018] Preferably, at least two of the blocking members confine the electronic component to an active space, and at least a portion of each first connecting portion is exposed in the active space; when the electronic component moves to any position in the active space, the electronic component can maintain electrical connection with the corresponding first connecting portion at the same time.

[0019] Preferably, the blocking members are provided in plurality, and the blocking members are distributed around the electronic component; the blocking members are independent components, or the blocking members form an integrated structure;

[0020] The plurality of blocking members jointly confine the electronic component within an active space, and at least a portion of each first connecting portion is exposed in the active space; when the electronic component moves to any position within the active space, the electronic component can maintain electrical connection with the corresponding first connecting portion at the same time.

[0021] Preferably, the height of the blocking member is smaller than the height of the electronic component, and the blocking member is chamfered or chamfered. When the blocking member is chamfered, the inclination angle of the blocking member is 30-60°.

[0022] Preferably, the electronic component is soldered to the first connecting portion by solder, and the solder is at least arranged on the upper surface of the first connecting portion; the height of the first end of the blocking member is less than the height of the solder, and the height of the second end of the blocking member is greater than the height of the solder and less than the height of the electronic component.

[0023] Preferably, the upper surface of the first connecting portion is provided with a gold-plated layer, and the gold-plated layer is used to absorb the solder;

[0024] And / or, the solder contains tin.

[0025] Preferably, the insulating body includes a plastic block and a plastic body covering the plastic block, the plastic block forms a receiving groove and the containing groove, and the receiving groove is used to receive another electronic component.

[0026] Preferably, the electronic component is a capacitor, the second connecting portion is an external electrode arranged at both ends of the capacitor in the longitudinal direction, the first connecting portions are arranged in pairs and extend along the longitudinal direction, the spacing between the paired first connecting portions along the longitudinal direction is smaller than the spacing between the two external electrodes along the longitudinal direction, the blocking members are arranged in pairs along the longitudinal direction and cover the corresponding first connecting portions, and the spacing between the paired blocking members along the longitudinal direction is greater than the length of the capacitor in the longitudinal direction.

[0027] A motor comprises any one of the above motor bases.

[0028] Compared with the prior art, the beneficial effects of the present invention include at least:

[0029] By setting a blocking member to limit the movement space of the electronic component, the degree of displacement of the electronic component in the accommodating groove can be effectively reduced, so as to prevent the electronic component from being displaced to the point where it cannot be effectively connected to the first connecting part, thereby ensuring the effective connection between the electronic component and the first connecting part; by setting the height of the blocking member so that the height of the second end is greater than the height of the first end, the height of the first end of the blocking member is reduced, which can effectively prevent the blocking member from affecting the connection operation between the electronic component and the first connecting part. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the local structure of the motor base in the prior art when the electronic component installation position is not offset;

[0031] Figure 2 This is a schematic diagram of the local structure of the motor base in the prior art when the electronic component installation position is offset;

[0032] Figure 3 This is a partial structural diagram of a motor base in the prior art in a state where the electronic component installation position is offset;

[0033] Figure 4 This is a schematic structural diagram of a motor base according to an embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the partial structure of the motor base of the embodiment of the utility model when the electronic component installation position is not offset;

[0035] Figure 6 This is a partial cross-sectional view of the motor base of the embodiment of the utility model when the electronic component installation position is not offset;

[0036] Figure 7 This is a partial structural diagram of the motor base of an embodiment of the utility model in a state where the electronic component installation position is offset;

[0037] Figure 8 This is a partial cross-sectional view of the motor base of an embodiment of the utility model in a state where the electronic component installation position is offset;

[0038] Figure 9 This is a partial structural diagram of the motor base of an embodiment of the utility model in a state where the electronic component installation position is still offset;

[0039] Figure 10 This is a partial cross-sectional view of the motor base of the embodiment of the utility model in another offset state of the electronic component installation position;

[0040] Figure 11 It is a partial structural diagram of the motor base of an embodiment of the present utility model.

[0041] In the figure: 1, 1', insulating body; 11', chamber; 21', solder foot; 32', tin; 11, receiving groove; 111, bottom wall; 112, side wall; 12, plastic block; 121, receiving groove; 122, retaining wall; 123, activity space; 13, plastic body; 2, connecting circuit; 21, first connecting part; 211, upper surface; 212, exposed surface; 3, 3', electronic component; 31, second connecting part; 311, connecting surface; 32, solder; 4, blocking member; 41, first end; 42, second end. DETAILED DESCRIPTION

[0042] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make this disclosure more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures denote identical or similar structures, and thus repeated descriptions thereof will be omitted.

[0043] The words expressing positions and directions described in this utility model are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of this utility model.

[0044] like Figures 4 to 11 As shown, the utility model provides a motor base, which includes an insulating body 1, a connecting circuit 2, an electronic component 3 and a blocking member 4.

[0045] Reference Figure 5 The insulating body 1 is provided with a receiving groove 11, and can also be provided with a receiving groove 121. The receiving groove 11 and the receiving groove 121 are respectively used to receive electronic components 3. In order to facilitate the installation operation of the electronic components 3, the volumes of the receiving groove 11 and the receiving groove 121 are both larger than the electronic components 3 received therein. The electronic components 3 received by the receiving groove 11 and the receiving groove 121 can be of the same type or different types; specifically, in this embodiment, the electronic components 3 received by the receiving groove 11 and the receiving groove 121 are of different types of electronic components 3, the electronic components 3 received by the receiving groove 11 can specifically be capacitors, and the electronic components 3 received by the receiving groove 121 can specifically be ICs (Integrated Circuits).

[0046] In some embodiments, the insulating body 1 includes a plastic block 12 formed by a single injection molding and a plastic body 13 formed by a secondary injection molding. The plastic body 13 covers the plastic block 12. The plastic block 12 defines a receiving groove 121 and a receiving groove 11. The receiving groove 121 and the receiving groove 11 can be arranged adjacent to each other and can be separated by a retaining wall 122.

[0047] Reference Figure 5 、 Figure 6, the connecting circuit 2 can be embedded in the insulating body 1, and the connecting circuit 2 is made of metal conductive material. Specifically, the connecting circuit 2 can be composed of a plurality of connecting terminals. At least a portion of the connecting circuit 2 is exposed to the accommodating groove 11 and forms a first connecting portion 21. For example, a portion of the two connecting terminals in the connecting circuit 2 is respectively exposed to the accommodating groove 11 to form two first connecting portions 21. The two first connecting portions 21 are spaced apart along the first direction, and each first connecting portion 21 is respectively used to electrically connect to the electronic component 3 installed in the accommodating groove 11. Correspondingly, the electronic component 3 includes two second connecting portions 31, and the two second connecting portions 31 can be arranged at opposite ends of the electronic component 3, and each second connecting portion 31 is used to electrically connect to a first connecting portion 21.

[0048] Among them, the first direction is the spacing direction of the two second connecting parts 31 in the electronic component 3, that is, the two second connecting parts 31 are distributed at opposite ends of the electronic component 3. The two first connecting parts 21 are arranged at opposite ends of the accommodating groove 11 along the first direction, that is, the first connecting part 21 can extend from one end of the accommodating groove 11 along the first direction toward the inside of the accommodating groove 11. The upper surface 211 of each first connecting part 21 is exposed in the accommodating groove 11, for example, the upper surface 211 of each first connecting part 21 is flush with the bottom wall 111 of the accommodating groove 11. When the electronic component 3 is a capacitor, the second connecting part 31 can be an external end electrode arranged at both ends of the capacitor in the longitudinal direction, and the first connecting parts 21 are arranged in pairs and extend along the longitudinal direction.

[0049] Reference Figure 6 When the electronic component 3 is installed in the receiving groove 11, at least a portion of the second connecting portion 31 of the electronic component 3 can be stacked with the first connecting portion 21. Specifically, the second connecting portion 31 includes a connecting surface 311 facing the first connecting portion 21, and the first connecting portion 21 includes an upper surface 211 facing the second connecting portion 31. At least a portion of the connecting surface 311 can be stacked with the upper surface 211, so that the connecting surface 311 can be electrically connected to the upper surface 211, thereby electrically connecting the electronic component 3 to the connection circuit 2.

[0050] The electronic component 3 can be soldered to the connecting circuit 2 via solder 32. Specifically, the solder 32 can be disposed within the receiving groove 11 and at least on the upper surface 211 of the first connecting portion 21. For example, the solder 32 can be disposed only on the upper surface 211 of the first connecting portion 21. Alternatively, to reduce the placement accuracy of the solder 32, the solder 32 can be partially disposed on the upper surface 211 of the first connecting portion 21 and partially disposed around the first connecting portion 21. In this case, after the electronic component 3 and the first connecting portion 21 are stacked, at least a portion of the solder 32 is disposed between the second connecting portion 31 of the electronic component 3 and the first connecting portion 21, and the second connecting portion 31 is soldered to the first connecting portion 21 via the solder 32.

[0051] Reference Figure 5 and Figure 11 When the receiving groove 11 is relatively large relative to the electronic component 3, in order to limit the movement of the electronic component 3 in the receiving groove 11 and ensure the effective connection between the electronic component 3 and the first connecting portion 21, a blocking member 4 is provided in the receiving groove 11. The blocking member 4 is specifically formed by protruding from the bottom of the receiving groove 11 into the receiving groove 11, so that the blocking member 4 can limit the range of movement of the bottom of the electronic component 3. When the electronic component 3 deviates, the blocking member 4 can support the electronic component 3 to prevent the electronic component 3 from further deviating, thereby limiting the range of movement of the electronic component 3. When the range of movement of the electronic component 3 in the receiving groove 11 is reduced, the maximum deflection that the electronic component 3 can produce is effectively reduced, thereby reducing the risk of poor contact between the electronic component 3 and the first connecting portion 21 due to deflection. Figures 6 to 9 As shown, even in the case of extreme deflection, effective connection between the electronic component 3 and the first connecting portion 21 can still be ensured.

[0052] Among them, at least a portion of the blocking member 4 covers the first connecting portion 21, so that the blocking member 4 can limit the deflection of the electronic component 3 on the first connecting portion 21, further ensuring the effective connection between the electronic component 3 and the first connecting portion 21. During the soldering process between the electronic component 3 and the first connecting portion 21, the two second connecting portions 31 of the electronic component 3 tend to deflect due to the fluidity of the solder 32. If the area of ​​the first connecting portion 21 is large, the flow area of ​​the solder 32 on the first connecting portion 21 is large, and the flowing solder 32 will cause excessive pulling on the second connecting portions 31 of the electronic component 3, causing a large deflection of the electronic component 3. Therefore, the blocking member 4 covers a portion of the first connecting portion 21, which can effectively control the exposed area of ​​the first connecting portion 21, and further control the flow area of ​​the solder 32 on the first connecting portion 21, preventing the flowing solder 32 from causing excessive pulling on the second connecting portions 31 of the electronic component 3, further reducing the deflection of the electronic component 3, and ensuring the effective connection between the electronic component 3 and the first connecting portion 21.

[0053] In addition, the intensity of the deviation trend generated by the second connection part 31 of the electronic component 3 is positively correlated with the amount of liquid solder 32 connected to the second connection part 31, that is, it is positively correlated with the amount of solder 32 carried by the first connection part 21. Covering the first connection part 21 by the blocking member 4 can limit the area of ​​the first connection part 21 used to carry the solder 32. When the areas of the two first connection parts 21 used to carry the solder 32 are the same or similar, the solder 32 carried on the two first connection parts 21 are the same or similar. At this time, the deviation trend intensities of the two second connection parts 31 are the same or basically the same, and the deviation trends of the two second connection parts 31 can completely or partially offset each other, effectively reducing the deviation of the electronic component 3 caused by the flow of liquid solder 32, and ensuring the effective connection between the electronic component 3 and the first connection part 21.

[0054] During the connection operation between the electronic component 3 and the first connecting portion 21, auxiliary tools may be needed to assist or complete the connection operation, and the auxiliary tools may be moved into or out of the receiving groove 11. Specifically, during the soldering operation between the electronic component 3 and the first connecting portion 21, auxiliary tools such as soldering tools may be used to move into or out of the receiving groove 11.

[0055] In order to prevent the auxiliary tool from interfering with the blocking member 4 and thus affecting the connection operation or causing defects, the blocking member 4 is configured to have a structure with a variable height and distance from the electronic component 3. Figure 6 and Figure 11 The barrier 4 includes a first end 41 adjacent to the electronic component 3 and a second end 42 distal from the electronic component 3. The height of the barrier 4 at the second end 42 is greater than that of the first end 41. The first end 41 of the barrier 4 is adjacent to the electronic component 3 and serves to restrict movement of the electronic component 3. The lower height of the barrier 4 at the first end 41 adjacent to the electronic component 3 minimizes the impact on the movement of auxiliary tools, preventing soldering operations performed near the first end 41 by auxiliary tools such as soldering tools. This facilitates connection and reduces the risk of defects. The higher height of the barrier 4 distal from the electronic component 3 increases the contact area between the barrier 4 and the insulating body 1, thereby increasing the bonding strength between the barrier 4 and the insulating body 1. Furthermore, when the auxiliary tool is removed from the receiving slot 11, the distance between the second end 42 and the electronic component 3 prevents solder 32 from catching on the barrier 4. In some embodiments, the height of the barrier 4 gradually increases from the first end 41 toward the second end 42 to simplify the structure of the barrier 4 and prevent solder 32 from accumulating in the depression formed by the fluctuation in the height of the barrier 4.

[0056] In some specific embodiments, the height of the blocking member 4 is less than the height of the electronic component 3, so as to effectively reduce the impact of the blocking member 4 on the connection between the electronic component 3 and the first connecting portion 21. Specifically, the height of the first end 41 of the blocking member 4 is less than the height of the solder 32, and the height of the second end 42 of the blocking member 4 is greater than the height of the solder 32 and less than the height of the electronic component 3.

[0057] Reference Figure 5 and Figure 11 , wherein the blocking member 4 can be formed at the junction of the bottom wall 111 and the side wall 112 of the receiving groove 11, and the blocking member 4 can be connected to the bottom wall 111 and the side wall 112. The higher height of the second end 42 of the blocking member 4 can increase the connection area between the blocking member 4 and the side wall 112, thereby increasing the bonding strength between the blocking member 4 and the insulating body 1. The blocking member 4 is located above the bottom wall 111 to cover at least a portion of the first connecting portion 21, specifically covering the portion of the upper surface 211 of the first connecting portion 21 located at the edge of the receiving groove 11. The portion of the upper surface 211 of the first connecting portion 21 not covered by the blocking member 4 forms an exposed surface 212, which is used to electrically connect with the electronic component 3. The area of ​​the exposed surface 212 can be larger than the area of ​​the connection surface 311 of the corresponding second connection portion 31, and the minimum spacing between the exposed surfaces 212 of the two first connection portions 21 along the first direction, that is, the minimum spacing between the two first connection portions 21 along the first direction is smaller than the minimum spacing between the two second connection portions 31 in the electronic component 3 along the first direction, so as to ensure that at least a portion of the two first connection portions 21 of the electronic component 3 can remain stacked with the corresponding first connection portion 21, thereby ensuring a stable connection between the electronic component 3 and the first connection portion 21.

[0058] When the electronic component 3 is a capacitor, the spacing between the paired first connecting portions 21 along the longitudinal direction is smaller than the spacing between the two outer electrodes along the longitudinal direction, and the blocking members 4 are arranged in pairs along the longitudinal direction and cover the corresponding first connecting portions 21. The spacing between the paired blocking members 4 along the longitudinal direction is greater than the length of the capacitor in the longitudinal direction. The longitudinal direction can specifically be the first direction.

[0059] The surface of the first connecting portion 21 used to carry the solder 32 is the exposed surface 212 of the first connecting portion 21. When the exposed surfaces 212 of the two second connecting portions 31 have the same or similar areas, the amount of solder 32 carried by the two first connecting portions 21 is the same or similar. In this case, the deflection tendency of the two second connecting portions 31 is the same or substantially the same, and the deflection tendencies of the two second connecting portions 31 can completely or partially offset each other, ensuring an effective connection between the electronic component 3 and the first connecting portion 21. Specifically, the area of ​​the exposed surface 212 of one first connecting portion 21 can be 0.8-1.2 times the area of ​​the exposed surface 212 of the other first connecting portion 21, so that the exposed surfaces 212 of the two second connecting portions 31 have the same or similar areas.

[0060] In some specific embodiments, while the blocking member 4 restricts the movement of the electronic component 3 by physically blocking it, it also controls the area of ​​the solder 32 flowing on the first connecting portion 21 by controlling the area covered by the blocking member 4. Furthermore, the exposed surfaces 212 of the two first connecting portions 21 can be controlled to be the same or similar in area. In still other specific embodiments, the blocking member 4 can restrict the movement of the electronic component 3 by physically blocking it without additionally controlling the area covered by the blocking member 4 on the first connecting portion 21.

[0061] In some specific embodiments, two blocking members 4 may be provided, and the two blocking members 4 are provided on opposite sides of the electronic component 3 along the first direction to limit the relative movement of the electronic component 3 along the first direction. Each blocking member 4 can be used to cover a corresponding first connecting portion 21. The two blocking members 4 are used together to confine the electronic component 3 within a movable space 123, and the exposed surface 212 of the first connecting portion 21 is exposed to the movable space 123. When the electronic component 3 moves to any position within the movable space 123, the electronic component 3 can maintain electrical connection with the corresponding first connecting portion 21 at the same time, that is, at least a portion of each second connecting portion 31 of the electronic component 3 is stacked with the corresponding first connecting portion 21, and can be soldered by solder 32 to achieve electrical connection.

[0062] At the same time, the two blocking members 4 and the side walls 112 that form the accommodating groove 11 together form a receiving cavity for accommodating the solder 32. The solder 32 is gathered in the receiving cavity, so that the solder 32 can be better gathered on the exposed surface 212 of the first connecting part 21, ensuring the connection effect between the electronic component 3 and the first connecting part 21.

[0063] In some other specific embodiments, the blocking member 4 may be provided with more than two, for example, Figure 11, three or four blocking members 4 can be provided. In addition to the two blocking members 4 spaced apart in the first direction, a blocking member 4 can also be provided at at least one end of the receiving groove 11 along the second direction. Specifically, when the length of the receiving groove 11 along the second direction is long, so that the displacement of the electronic component 3 along the second direction causes a poor connection between the electronic component 3 and the first connecting portion 21, or one or two side walls 112 located in the second direction affect the connection operation between the electronic component 3 and the first connecting portion 21, a blocking member 4 is provided at at least one end of the receiving groove 11 along the second direction. The blocking member 4 is used to limit the displacement of the electronic component 3 along the second direction; and the provision of the blocking member 4 can also allow one or two side walls 112 located in the second direction to be provided to reserve a large space between the predetermined installation position of the electronic component 3, thereby preventing one or two side walls 112 located in the second direction from affecting the connection operation between the electronic component 3 and the first connecting portion 21. The predetermined installation position of the electronic component 3 is the ideal installation position of the electronic component 3 in the receiving groove 11, that is, the position when the electronic component 3 is not displaced. The second direction is perpendicular to the first direction. For example, the second direction is the width direction of the electronic component 3 , and the first direction is the length direction of the electronic component 3 .

[0064] In this embodiment, a plurality of blocking members 4 can be distributed around the electronic component 3 to form a limit around the electronic component 3. The plurality of blocking members 4 together limit the electronic component 3 within an active space 123, and the exposed surface 212 of the first connecting portion 21 is exposed in the active space 123. Figures 5 to 10 When the electronic component 3 moves to any position in the active space 123, the electronic component 3 can maintain electrical connection with the corresponding first connection part 21 at the same time, that is, at least a part of each second connection part 31 of the electronic component 3 is stacked with the corresponding first connection part 21, and can be welded by solder 32 to achieve electrical connection.

[0065] At the same time, multiple blocking members 4 together form a receiving cavity for receiving the solder 32. The solder 32 is gathered in the receiving cavity, so that the solder 32 can be better gathered on the exposed surface 212 of the first connecting part 21, ensuring the connection effect between the electronic component 3 and the first connecting part 21.

[0066] Specifically, four blocking members 4 are provided, distributed along the four sides of a roughly rectangular shape, preventing excessive displacement of the electronic component 3 from multiple different positions. The blocking members 4 can be independent of each other, or adjacent blocking members 4 can be connected to form a single-piece structure to increase the structural strength of the blocking members 4. The blocking members 4 form a single-piece structure with the insulating body 1, specifically with the plastic block 12. The blocking members 4 and the plastic block 12 can be made of the same insulating material.

[0067] In some embodiments, a gold-plated layer is provided on at least the exposed surface 212 of the first connecting portion 21. For example, the gold-plated layer is provided only on the exposed surface 212 or on the upper surface 211 of the first connecting portion 21. The solder 32 includes tin, for example, solder 32 is solder. Due to the wettability and ductility of gold, it can attract the solder 32. Therefore, during the soldering process between the first connecting portion 21 and the electronic component 3, the solder 32 on the surface of the barrier 4 or on the bottom wall 111 is attracted to the gold-plated layer and then accumulates on the gold-plated layer, ensuring stable soldering between the electronic component 3 and the first connecting portion 21.

[0068] The blocking member 4 may be chamfered, for example, an oblique chamfer or a circular chamfer. Preferably, the blocking member 4 is an oblique chamfer. When the blocking member 4 is an oblique chamfer, the inclination angle of the blocking member 4 is 30-60° to prevent the blocking member 4 from increasing the risk of interference with the auxiliary tool when the blocking member 4 affects the movement of the auxiliary tool in the receiving groove 11 due to a steep slope, and to prevent the blocking member 4 from having a gentle slope, resulting in a small contact area between the blocking member 4 and the insulating body 1 and a reduced bonding force. The inclination angle of the blocking member 4 can specifically be the inclination angle of the blocking member 4 relative to the bottom wall 111, and the inclination angle of the blocking member 4 is preferably 45°.

[0069] Depending on actual needs, the blocking member 4 may be provided only in the receiving groove 11. Alternatively, when the electronic component 3 received in the receiving groove 121 may also be offset to the point where it cannot be effectively connected to the connecting circuit 2, the blocking member 4 may also be provided in the receiving groove 121. The manner of providing the blocking member 4 in the receiving groove 121 is similar to the manner of providing the blocking member 4 in the receiving groove 11, and therefore will not be described in detail here.

[0070] The utility model also provides a motor, comprising the above-mentioned motor base.

[0071] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limiting the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A motor base, characterized in that: include: The insulating body (1) is provided with a receiving groove (11); A connecting circuit (2), at least a portion of which is exposed in the receiving groove (11) and forms a first connecting portion (21); An electronic component (3) is installed in the receiving groove (11) and is electrically connected to the first connecting portion (21); A blocking member (4) is formed by a protrusion at the bottom of the accommodating groove (11), the blocking member (4) comprising a first end (41) adjacent to the electronic component (3) and a second end (42) away from the electronic component (3), the height of the blocking member (4) at the second end (42) being greater than the height of the first end (41).

2. The motor base according to claim 1, wherein: The accommodating groove (11) has a bottom wall (111) and a side wall (112); the blocking member (4) is formed at the junction of the bottom wall (111) and the side wall (112) and is connected to the bottom wall (111) and the side wall (112) respectively; The upper surface (211) of the first connecting portion (21) is exposed to the bottom wall (111), and at least a portion of the blocking member (4) covers a portion of the upper surface (211) of the first connecting portion (21).

3. The motor base according to claim 2, wherein: At least two first connecting portions (21) are provided, and the two first connecting portions (21) are provided at opposite ends of the accommodating groove (11) along the first direction. Second connecting portions (31) are provided at opposite ends of the electronic component (3) along the first direction, respectively, and each second connecting portion (31) is electrically connected to the corresponding first connecting portion (21). At least two blocking members (4) are provided, and the two blocking members (4) are provided on opposite sides of the electronic component (3) along the first direction, and each blocking member (4) partially covers the corresponding first connecting portion (21).

4. The motor base according to claim 3, wherein: The minimum distance between the two first connecting portions (21) along the first direction is smaller than the minimum distance between the two second connecting portions (31) along the first direction; The upper surface (211) of the first connecting portion (21) includes an exposed surface (212) facing the second connecting portion (31) and exposed to the blocking member (4); the second connecting portion (31) includes a connecting surface (311) facing the first connecting portion (21); the area of ​​the exposed surface (212) is larger than that of the connecting surface (311); and the exposed surface (212) and the connecting surface (311) are at least partially stacked and electrically connected.

5. The motor base according to claim 3, wherein: At least two of the blocking members (4) confine the electronic component (3) within an active space (123), and at least a portion of each first connecting portion (21) is exposed in the active space (123); when the electronic component (3) moves to any position within the active space (123), the electronic component (3) can maintain electrical connection with the corresponding first connecting portion (21) at the same time.

6. The motor base according to claim 3, wherein: A plurality of the blocking members (4) are provided, and the plurality of blocking members (4) are distributed around the electronic component (3); the plurality of blocking members (4) are independent components, or the plurality of blocking members (4) form an integrated structure; The plurality of blocking members (4) jointly confine the electronic component (3) within an active space (123), and at least a portion of each first connecting portion (21) is exposed in the active space (123); when the electronic component (3) moves to any position within the active space (123), the electronic component (3) can maintain electrical connection with the corresponding first connecting portion (21) at the same time.

7. The motor base according to claim 1, wherein: The height of the blocking member (4) is less than the height of the electronic component (3), and the blocking member (4) is an oblique chamfer or a circular arc chamfer. When the blocking member (4) is an oblique chamfer, the inclination angle of the blocking member (4) is 30-60°.

8. The motor base according to claim 1, wherein: The electronic component (3) is soldered to the first connecting portion (21) via solder (32), and the solder (32) is at least provided on the upper surface (211) of the first connecting portion (21); the height of the first end (41) of the blocking member (4) is less than the height of the solder (32), and the height of the second end (42) of the blocking member (4) is greater than the height of the solder (32) and less than the height of the electronic component (3).

9. The motor base according to claim 8, wherein: The upper surface (211) of the first connecting portion (21) is provided with a gold-plated layer, and the gold-plated layer is used to absorb the solder (32); And / or, the solder (32) contains tin.

10. The motor base according to claim 1, wherein: The insulating body (1) comprises a plastic block (12) and a plastic body (13) covering the plastic block (12); the plastic block (12) forms a receiving groove (121) and the receiving groove (11); the receiving groove (121) is used to receive another electronic component (3).

11. The motor base according to claim 3, wherein: The electronic component (3) is a capacitor, the second connecting portion (31) is an external end electrode arranged at both ends of the capacitor in the longitudinal direction, the first connecting portions (21) are arranged in pairs and extend in the longitudinal direction, the spacing between the paired first connecting portions (21) in the longitudinal direction is smaller than the spacing between the two external end electrodes in the longitudinal direction, the blocking members (4) are arranged in pairs in the longitudinal direction and cover the corresponding first connecting portions (21), and the spacing between the paired blocking members (4) in the longitudinal direction is larger than the length of the capacitor in the longitudinal direction.

12. A motor, characterized in that: Comprising the motor base according to any one of claims 1 to 11.

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