Microphone and electronic equipment
By setting the first MEMS chip in the microphone opposite to the inlet and outlet sound holes, and the second MEMS chip offset from the inlet and outlet sound holes, combined with ASIC chip control, the problem of dust accumulation in the microphone is solved, and efficient dust prevention and signal processing are achieved.
Patent Information
- Application Number
- CN202422857706.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-21
AI Technical Summary
When a microphone is in use, dust easily accumulates in the sound hole and the sound inlet, resulting in a decrease in performance. The existing dust removal structure is complex and ineffective.
The first MEMS chip is set opposite to the inlet and outlet sound holes, and the second MEMS chip is set offset from the inlet and outlet sound holes. Dust is shaken off by vibration through sound signals, and the chip status is controlled by the ASIC chip to achieve dust prevention and signal conversion functions.
It effectively improves the dust-proof effect of the microphone, simplifies the dust removal process, and improves the microphone's performance and signal processing efficiency.
Smart Images
Figure CN223391422U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of microphones, and more specifically, to a microphone and electronic equipment. Background Art
[0002] During microphone use, dust easily accumulates in the sound channel connecting the microphone to the electronic device and in the microphone's sound hole, resulting in poor microphone performance. In the prior art, the device that transmits sound signals corresponds to the sound outlet, and the device that receives sound signals corresponds to the sound inlet. When dust removal is required, the sound outlet is blocked, and then the sound inlet is cleaned using sound waves emitted by the device that transmits sound signals. This results in a complex dust removal structure, and the sound inlet is further covered with dust because it corresponds to the device that receives sound signals.
[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Utility Model Content
[0004] One purpose of the present invention is to provide a new technical solution for a microphone and an electronic device.
[0005] According to a first aspect of the present invention, a microphone is provided, wherein the microphone comprises:
[0006] substrate;
[0007] A housing is provided on the substrate, an inner cavity is formed between the housing and the substrate, and the inner cavity has an inlet and outlet sound hole communicating with the outside;
[0008] A first MEMS chip and a second MEMS chip, the first MEMS chip and the second MEMS chip are arranged in the inner cavity, the first MEMS chip is used to send sound signals, the first MEMS chip is arranged opposite to the inlet and outlet sound holes, the second MEMS chip is used to receive sound signals, and the second MEMS chip is offset from the inlet and outlet sound holes.
[0009] Optionally, the frequency of the sound signal sent by the first MEMS chip is greater than 50 kHz.
[0010] Optionally, the sound inlet and outlet holes are trumpet-shaped, and the aperture of the sound inlet and outlet holes facing the inner cavity is smaller than the aperture of the sound inlet and outlet holes facing the outside world.
[0011] Optionally, an ASIC chip is further included, and the ASIC chip is arranged in the inner cavity. The ASIC chip includes a first connecting portion and a second connecting portion, the first connecting portion is electrically connected to the first MEMS chip, and the second connecting portion is electrically connected to the second MEMS chip.
[0012] Optionally, the ASIC chip is arranged between the first MEMS chip and the second MEMS chip.
[0013] Optionally, it further includes a first gold wire and a second gold wire, the first connecting portion is electrically connected to the first MEMS chip through the first gold wire, and the second connecting portion is electrically connected to the second MEMS chip through the second gold wire.
[0014] Optionally, further comprising a third gold wire;
[0015] The ASIC chip further includes a third connection portion, and the third connection portion is electrically connected to the substrate through the third gold wire.
[0016] Optionally, the ASIC chip controls the first MEMS chip to be in a normally closed state.
[0017] Optionally, the shell is made of at least one of copper, aluminum and stainless steel.
[0018] According to a second aspect of the present invention, an electronic device is provided, comprising a microphone as described in any one of the first aspects.
[0019] The microphone in the embodiment of the present application only requires one sound hole as a sound entry and exit channel. The first MEMS chip is arranged relative to the entry and exit sound holes, so that the sound signal emitted by the first MEMS chip can vibrate and shake off the dust accumulated in the sound channel connecting the microphone and the electronic device, the sound hole of the microphone and the dustproof net and discharge it, thereby effectively improving the dust removal effect of the microphone; in addition, the second MEMS chip is offset from the entry and exit sound holes, so that when the second MEMS chip receives the sound signal, it can prevent dust from being brought into the inner chamber by the airflow and affecting the performance of the second MEMS chip, thereby effectively improving the dust-proof effect of the microphone.
[0020] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
[0022] Figure 1 It is a structural diagram of a microphone in one embodiment of the present invention.
[0023] Figure 2 1 is a top view of a microphone in one embodiment of the present invention.
[0024] Description of reference numerals:
[0025] 1. Substrate; 2. Shell; 3. Inner chamber; 4. Inlet and outlet sound holes; 5. First MEMS chip; 6. Second MEMS chip; 7. ASIC chip; 71. First connecting part; 72. Second connecting part; 73. Third connecting part; 8. First gold wire; 9. Second gold wire; 10. Third gold wire. DETAILED DESCRIPTION
[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.
[0027] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.
[0028] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0029] According to one embodiment of the present application, a microphone is provided. Figure 1 and Figure 2 As shown, the microphone includes a substrate 1, a shell 2, a first MEMS (Micro Electro Mechanical System) chip 5 and a second MEMS chip 6. The shell 2 is arranged on the substrate 1, and an inner chamber 3 is formed between the shell 2 and the substrate 1. The inner chamber 3 has an inlet and outlet sound hole 4 connected to the outside world; the first MEMS chip 5 and the second MEMS chip 6 are arranged in the inner chamber 3, the first MEMS chip 5 is used to send sound signals, and the first MEMS chip 5 is arranged opposite to the inlet and outlet sound hole 4, the second MEMS chip 6 is used to receive sound signals, and the second MEMS chip 6 is offset from the inlet and outlet sound hole 4.
[0030] Specifically, the microphone described in the embodiment of the present application includes a substrate 1 and a shell 2. The shell 2 can be covered on the substrate 1 by solder paste or conductive glue to form the inner chamber 3. A first MEMS chip 5 and a second MEMS chip 6 can be fixedly arranged in the inner chamber 3. The first MEMS chip 5 is used to send sound signals, and the second MEMS chip 6 is used to receive sound signals. The first MEMS chip 5 and the second MEMS chip 6 can be fixed on the substrate 1 by solder connection, conductive glue connection, gold-tin solder connection, etc., so that the microphone can directly use the substrate 1 to arrange and support the first MEMS chip 5 and the second MEMS chip 6 without the need for an additional supporting structure. The inner chamber 3 has an inlet and outlet sound hole 4 connected to the outside world. The inlet and outlet sound hole 4 is arranged on the shell 2 and is set through the shell 2. The inlet and outlet sound hole 4 serves as both a sound input channel and a sound output channel.
[0031] Among them, the first MEMS chip 5 of the present application is arranged relative to the inlet and outlet sound hole 4, so that when the first MEMS chip 5 emits a sound signal, it can be directly transmitted out of the inner chamber 3 through the inlet and outlet sound hole 4, thereby effectively improving the working efficiency of the first MEMS chip 5 and reducing the loss of the sound signal emitted by the first MEMS chip 5. The second MEMS chip 6 is offset from the inlet and outlet sound hole 4, so that when the second MEMS chip 6 receives a sound signal, it can prevent the dust accumulated in the inlet and outlet sound hole 4 and the sound channel connecting the microphone and the electronic device from being brought into the inner chamber 3 by the airflow and affecting the sound processing effect of the second MEMS chip 6, thereby effectively ensuring the performance of the second MEMS chip 6 and further improving the dustproof effect of the microphone.
[0032] Therefore, when the microphone needs to be dusted, it is only necessary to open the first MEMS chip 5 so that the first MEMS chip 5 emits a sound signal, and the sound signal can be used to vibrate and shake off the dust accumulated on the sound inlet and outlet holes 4, the sound channel connecting the microphone and the electronic device, and the dustproof net of the microphone, thereby effectively improving the dust-proof and dust-removal effect of the microphone.
[0033] In one embodiment, the frequency of the sound signal sent by the first MEMS chip 5 is greater than 50 kHz.
[0034] Specifically, the embodiment of the present application effectively improves the dust removal effect of the microphone by setting the frequency of the sound signal sent by the first MEMS chip 5 to be greater than 50kHz. Moreover, the embodiment of the present application can further improve the dust removal efficiency of the microphone by setting the frequency of the sound signal sent by the first MEMS chip 5 to be greater than 50kHz, thereby further improving the performance of the microphone.
[0035] In one embodiment, the sound inlet and outlet hole 4 is trumpet-shaped, and the aperture of the sound inlet and outlet hole 4 facing the inner chamber 3 is smaller than the aperture of the sound inlet and outlet hole 4 facing the outside.
[0036] Specifically, the embodiment of the present application effectively enhances the sound signal emitted by the first MEMS chip 5 by setting the sound inlet and outlet hole 4 to be trumpet-shaped and making the aperture of the sound inlet and outlet hole 4 facing the inner chamber 3 smaller than the aperture of the sound inlet and outlet hole 4 facing the outside.
[0037] Therefore, when the microphone is removing dust, a stronger sound signal can better vibrate and shake off the dust accumulated in the sound inlet and outlet holes 4, the sound channel connecting the microphone and the electronic device, and the dustproof net of the microphone and discharge it, thereby further improving the dust removal effect and efficiency of the microphone.
[0038] In addition, in order to further enhance the effect of the sound hole 4 on enhancing the sound signal emitted by the first MEMS chip 5 , the thickness of the housing 2 may be increased so that the sound hole 4 is shaped like a long trumpet.
[0039] In one embodiment, the microphone further includes an ASIC (Application Specific Integrated Circuit) chip, and the ASIC chip 7 is disposed in the inner chamber 3 . The ASIC chip 7 includes a first connecting portion 71 and a second connecting portion 72 . The first connecting portion 71 is electrically connected to the first MEMS chip 5 , and the second connecting portion 72 is electrically connected to the second MEMS chip 6 .
[0040] Specifically, if Figure 2 As shown, the ASIC chip 7 in the embodiment of the present application can be fixed on the substrate 1 by solder connection, conductive glue connection, gold-tin solder connection, etc., so that the microphone can directly use the substrate 1 to arrange and support the ASIC chip 7, thereby effectively ensuring the stability of the microphone.
[0041] The ASIC chip 7 includes a first connecting part 71 and a second connecting part 72. The first connecting part 71 includes multiple solder pads, and the second connecting part 72 includes multiple solder pads. The multiple solder pads of the first connecting part 71 can be electrically connected to the first MEMS chip 5, and the multiple solder pads of the second connecting part 72 can be electrically connected to the second MEMS chip 6.
[0042] Therefore, when the microphone needs to be dust-removed, the ASIC chip 7 can realize the dust-proof and dust-removal function of the microphone by turning on the first MEMS chip 5 and turning off the second MEMS chip 6; when the microphone is working normally, the ASIC chip 7 can realize the signal conversion function of the microphone by turning off the first MEMS chip 5 and turning on the second MEMS chip 6, thereby effectively ensuring the performance of the microphone.
[0043] In one embodiment, the ASIC chip 7 is disposed between the first MEMS chip 5 and the second MEMS chip 6 .
[0044] Specifically, if Figure 2 As shown, the embodiment of the present application arranges the ASIC chip 7 between the first MEMS chip 5 and the second MEMS chip 6, so that on the basis of the relative arrangement of the first MEMS chip 5 and the sound inlet and outlet holes 4, the distance between the second MEMS chip 6 and the sound inlet and outlet holes 4 can be further expanded. In this way, when the second MEMS chip 6 receives the sound signal, it can further prevent the dust accumulated in the sound inlet and outlet holes 4 and the sound channel connecting the microphone and the electronic device from being brought into the inner chamber 3 by the airflow and affecting the sound processing effect of the second MEMS chip 6.
[0045] In one embodiment, the microphone further includes a first gold wire 8 and a second gold wire 9 , the first connection portion 71 is electrically connected to the first MEMS chip 5 through the first gold wire 8 , and the second connection portion 72 is electrically connected to the second MEMS chip 6 through the second gold wire 9 .
[0046] Specifically, if Figure 1 and Figure 2 As shown, in the embodiment of the present application, the first connection part 71 and the first MEMS chip 5 are electrically connected by the first gold wire 8, and the second connection part 72 and the second MEMS chip 6 are electrically connected by the second gold wire 9, thereby effectively improving the integration of the microphone.
[0047] Because the first connection portion 71 is electrically connected to the first MEMS chip 5 via the first gold wire 8, and the second connection portion 72 is electrically connected to the second MEMS chip 6 via the second gold wire 9, the ASIC chip 7 is electrically connected to both the first MEMS chip 5 and the second MEMS chip 6. Therefore, the ASIC chip 7 can, through application instructions from the electronic device, turn on the first MEMS chip 5 and turn off the second MEMS chip 6 to implement the microphone's dust prevention and removal function; and can also achieve the microphone's signal conversion function by turning off the first MEMS chip 5 and turning on the second MEMS chip 6. This further simplifies dust removal for the microphone and improves its dust removal efficiency.
[0048] In one embodiment, the microphone further includes a third gold wire 10 ; the ASIC chip 7 further includes a third connecting portion 73 , and the third connecting portion 73 is electrically connected to the substrate 1 through the third gold wire 10 .
[0049] Specifically, if Figure 1 and Figure 2 As shown, the ASIC chip 7 in the embodiment of the present application further includes a third connection portion 73 , and the third connection portion 73 includes a plurality of pads. The plurality of pads of the third connection portion 73 are electrically connected to the substrate 1 .
[0050] Therefore, the present application electrically connects the third connection portion 73 and the substrate 1 through the third gold wire 10, thereby further improving the integration of the microphone.
[0051] In one embodiment, the ASIC chip 7 controls the first MEMS chip 5 to be in a normally closed state.
[0052] Specifically, in the embodiment of the present application, the ASIC chip 7 controls the first MEMS chip 5 to be in a normally closed state, so that the first MEMS chip 5 is an intermittently used device.
[0053] Therefore, when the microphone is working normally, the ASIC chip 7 does not supply power to the first MEMS chip 5, effectively reducing the power consumption of the microphone. Only when dust removal is required will the ASIC chip 7 control the first MEMS chip 5 to turn on and enter the working state.
[0054] In one embodiment, the material of the housing 2 includes at least one of copper, aluminum and stainless steel.
[0055] Specifically, the present application effectively avoids interference of external electronic devices on the first MEMS chip 5 by setting the material of the shell 2 to include at least one of copper, aluminum and stainless steel, thereby improving the performance of the microphone.
[0056] In addition, if Figure 2 As shown, since the ASIC chip 7 described in the embodiment of the present application is arranged between the first MEMS chip 5 and the second MEMS chip 6, and the second MEMS chip 6 is offset from the sound inlet and outlet holes 4, the material of the shell 2 is set to at least one of copper, aluminum and stainless steel, which effectively reduces the influence of external electronic devices on the performance of the second MEMS chip 6, and further improves the sound processing effect of the second MEMS chip 6.
[0057] According to another embodiment of the present application, an electronic device is provided, which includes the microphone described in the embodiment of the present application.
[0058] Specifically, the electronic device described in the embodiments of the present application can be any one of a mobile phone, a tablet computer, a personal digital assistant, a television, a smart wearable product, a virtual reality terminal device, an augmented reality terminal device, a rechargeable small household appliance (such as a soymilk maker, a robot vacuum), a drone, a radar, aerospace equipment, and an in-vehicle device. The microphone can be directly fixed to the above-mentioned electronic device, or the microphone can be detachably installed in the above-mentioned electronic device.
[0059] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.
[0060] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.
Claims
1. A microphone, characterized in that: include: base(1); A shell (2), the shell (2) being arranged on the substrate (1), an inner chamber (3) being formed between the shell (2) and the substrate (1), the inner chamber (3) having an inlet and outlet sound hole (4) communicating with the outside; A first MEMS chip (5) and a second MEMS chip (6), wherein the first MEMS chip (5) and the second MEMS chip (6) are arranged in the inner chamber (3), the first MEMS chip (5) is used to send sound signals, and the first MEMS chip (5) is arranged opposite to the inlet and outlet sound holes (4), and the second MEMS chip (6) is used to receive sound signals, and the second MEMS chip (6) is arranged offset from the inlet and outlet sound holes (4).
2. The microphone according to claim 1, wherein The frequency of the sound signal sent by the first MEMS chip (5) is greater than 50 kHz.
3. The microphone according to claim 1, wherein The sound inlet and outlet holes (4) are trumpet-shaped, and the aperture of the sound inlet and outlet holes (4) facing the inner chamber (3) is smaller than the aperture of the sound inlet and outlet holes (4) facing the outside world.
4. The microphone according to claim 1, wherein The invention also includes an ASIC chip (7), which is arranged in the inner chamber (3). The ASIC chip (7) includes a first connecting portion (71) and a second connecting portion (72), wherein the first connecting portion (71) is electrically connected to the first MEMS chip (5), and the second connecting portion (72) is electrically connected to the second MEMS chip (6).
5. The microphone according to claim 4, characterized in that The ASIC chip (7) is arranged between the first MEMS chip (5) and the second MEMS chip (6).
6. The microphone according to claim 4, characterized in that It also includes a first gold wire (8) and a second gold wire (9), wherein the first connecting portion (71) is electrically connected to the first MEMS chip (5) via the first gold wire (8), and the second connecting portion (72) is electrically connected to the second MEMS chip (6) via the second gold wire (9).
7. The microphone according to claim 6, characterized in that Also included is a third gold thread (10); The ASIC chip (7) further comprises a third connecting portion (73), and the third connecting portion (73) is electrically connected to the substrate (1) via the third gold wire (10).
8. The microphone according to claim 4, wherein The ASIC chip (7) controls the first MEMS chip (5) to be in a normally closed state.
9. The microphone according to claim 1, wherein The material of the shell (2) includes at least one of copper, aluminum and stainless steel.
10. An electronic device, characterized in that: The microphone comprises the microphone according to any one of claims 1 to 9.