Combined circuit board and air conditioning equipment

Abstract

The utility model discloses a combined circuit board and air conditioning equipment, and the combined circuit board comprises a first circuit board which is provided with at least two jacks; the same side of the second circuit board is provided with at least two protruding parts; the jacks are used for being matched with the protruding parts, and the first circuit board and the second circuit board are fixed through the jacks and the protruding parts to form a vertically-inserted combined circuit board; the first circuit board and the second circuit board are electrically connected through pins. Compared with the prior art, in the scheme, the circuit board is designed into the combined circuit board in the vertical insertion form, the vertical space is utilized, the area occupied by a traditional flat plate type circuit board is reduced, the electric control space is reduced, the heat dissipation effect of the combined circuit board can be improved to a great extent, and the assembly difficulty is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of circuit boards, and in particular relates to a combined circuit board and air-conditioning equipment. Background Art

[0002] With the continuous development of science and technology, various electronic products and intelligent devices have become indispensable items in people's lives and work. As the basis of various high-tech and intelligent control systems, electronic circuits have always been a hot topic of research.

[0003] With the development of electronic circuits, integrated circuits (ICs) are becoming larger and more powerful. Arranging the most complex circuit structures within a limited space, while ensuring the integrated circuits possess the most complex and comprehensive functionality, has become the greatest and most fundamental challenge in IC design and manufacturing. To minimize the space required for circuit boards containing complex ICs, modular PCBs are gaining increasing application potential. However, existing modular PCBs present challenges such as difficulty in assembly and heat dissipation. Utility Model Content

[0004] In view of this, an embodiment of the present application provides a combined circuit board and an air-conditioning device, which can greatly improve the heat dissipation effect of the combined circuit board and reduce the difficulty of assembly.

[0005] An embodiment of the present application provides a modular circuit board, comprising:

[0006] a first circuit board having at least two jacks;

[0007] a second circuit board having at least two protrusions on a same side of the second circuit board;

[0008] The socket is used to cooperate with the protrusion, and the first circuit board and the second circuit board are fixed by the socket and the protrusion to form a vertical plug-in type combined circuit board;

[0009] The first circuit board and the second circuit board are electrically connected via pins.

[0010] In a possible implementation, the jack is configured as a long strip-shaped hole.

[0011] In a possible implementation, at least two of the elongated holes have different lengths.

[0012] In a possible implementation, the at least two jacks are located in a middle portion of the first circuit board.

[0013] In a possible implementation, the second circuit board is a metal-based plate, and the heating device of the combined circuit board is mounted on the second circuit board.

[0014] In a possible implementation, the second circuit board is an aluminum-based plate material or a copper-based plate material.

[0015] In a possible implementation, the first circuit board is an FR4 board, a polymer plastic board, or a ceramic board.

[0016] In a possible implementation, the pins are L-shaped pin headers.

[0017] In a possible implementation, two ends of the pin are respectively soldered to the first circuit board and the second circuit board.

[0018] In a possible implementation, the protrusion and the insertion hole are welded at the bottom of the first circuit board.

[0019] An embodiment of the present application also provides an air-conditioning device, including: the combined circuit board in the above embodiment.

[0020] The modular circuit board of an embodiment of the present application includes a first circuit board having at least two sockets; and a second circuit board having at least two protrusions on the same side. The sockets are configured to engage with the protrusions, and the first and second circuit boards are secured together by the sockets and protrusions to form a vertical plug-in modular circuit board. The first and second circuit boards are electrically connected via pins. Compared to the prior art, this solution utilizes vertical space, reduces the area occupied by traditional flat-plate circuit boards, and reduces electrical control space. This significantly improves the modular circuit board's heat dissipation and reduces assembly difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0022] Attachment Figure 1 A schematic structural diagram of a modular circuit board provided by the present application is shown;

[0023] Attachment Figure 2 shows a schematic structural diagram of a first circuit board provided by the present application;

[0024] Attachment Figure 3 shows a schematic structural diagram of a second circuit board provided by the present application;

[0025] Attachment Figure 4It shows a schematic structural diagram of the pin provided by this application;

[0026] Attachment Figure 5 A structural schematic diagram of an air-conditioning device provided in this application is shown.

[0027] Reference numerals:

[0028] Combined circuit board 100;

[0029] A first circuit board 10 and a second circuit board 20;

[0030] Insertion hole 101 and protrusion 201 .

[0031] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0036] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0037] Figure 1 This is a schematic diagram of the structure of a modular circuit board provided in an embodiment of the present application. Figure 1 As shown, the combined circuit board 100 includes a first circuit board 10 and a second circuit board 20. The first circuit board 10 is provided with a pinhole, and the second circuit board 20 is also provided with a pinhole. Pins can be inserted into the pinholes. The first circuit board 10 and the second circuit board 20 are electrically connected via the pins to achieve communication between the two circuit boards. The first circuit board 10 can be the main circuit board of the device, and the second circuit board 20 can be a secondary functional circuit board of the device.

[0038] The first circuit board 10 has at least two insertion holes 101 , and the number of the insertion holes 101 can be two or more.

[0039] The second circuit board 20 has at least two protrusions 201 on the same side. The number of protrusions 201 can be the same as the number of sockets 101, or can be two or more. For example, the number of sockets 101 and protrusions 201 can both be two, or can both be three, which is not limited in this application.

[0040] The socket 101 is used to cooperate with the protrusion 201, and the first circuit board 10 and the second circuit board 20 are fixed together by the socket 101 and the protrusion 201 to form a vertical plug-in type combined circuit board. In this application, the circuit board is designed as a vertical plug-in type combined circuit board, which utilizes vertical space, reduces the area occupied by traditional flat-plate circuit boards, and reduces the electrical control space. The protrusion 201 is inserted into the socket 101. After the socket 101 and the protrusion 201 are plugged in, they can be reinforced by welding at the bottom of the circuit board. The socket-type installation and welding make the circuit board assembly more secure, and multiple welding positions can also be used for signal transmission.

[0041] Of course, the combined circuit board of the present application may include multiple first circuit boards and multiple second circuit boards, which can be combined together by simply setting corresponding jacks and protrusions.

[0042] In some embodiments, such as Figure 2As shown, the jack 101 on the first circuit board 10 can be configured as an elongated hole. Multiple elongated holes are arranged in a straight line along their length. At least two of the elongated holes have different lengths. The different jack lengths and protrusion lengths mean that only those of the same length can be plugged together when the two are plugged in, thus preventing reverse insertion.

[0043] In some embodiments, such as Figure 2 As shown, the socket 101 on the first circuit board 10 is located in the middle of the first circuit board 10, which can facilitate the plug-in installation of the socket and the protrusion and reduce the difficulty of installation.

[0044] In some embodiments, such as Figure 3 As shown, the second circuit board 20 can be set as a metal-based plate, and the heating device required for the combined circuit board is installed on the second circuit board 20. The heating device is installed on the metal-based plate. Since the metal has good thermal conductivity, and the second circuit board 20 is vertically inserted in the middle of the first circuit board 10, with no obstruction on both sides, the heat dissipation effect of the circuit board can be greatly improved. Specifically, the second circuit board 20 can be set as an aluminum-based plate or a copper-based plate. The first circuit board 10 can be set as a more durable FR4 plate, or it can be set as a common material such as a polymer plastic plate, a ceramic plate, etc.

[0045] In some embodiments, such as Figure 4 As shown, the pins can be L-shaped pin headers, with both ends of the pins soldered to the first circuit board 10 and the second circuit board 20, respectively. Specifically, one end of the L-shaped pin header can be pre-soldered to the second circuit board 20. When the second circuit board 20 is inserted into the first circuit board 10, the other end of the L-shaped pin header simultaneously inserts into the pinholes of the first circuit board 10. The L-shaped pin header can assist in signal transmission while supporting the second circuit board 20, allowing it to remain vertical during installation. The L-shaped pin header connects two circuit boards simultaneously, simplifying circuit board assembly.

[0046] The modular circuit board of an embodiment of the present application includes a first circuit board having at least two sockets; and a second circuit board having at least two protrusions on the same side. The sockets are configured to engage with the protrusions, and the first and second circuit boards are secured together by the sockets and protrusions to form a vertical plug-in modular circuit board. The first and second circuit boards are electrically connected via pins. Compared to the prior art, this solution utilizes vertical space, reduces the area occupied by traditional flat-plate circuit boards, and reduces electrical control space. This significantly improves the modular circuit board's heat dissipation and reduces assembly difficulty.

[0047] like Figure 5As shown, the embodiment of the present application provides an air conditioning device, including a combined circuit board 100. Figure 1 As shown, the combined circuit board 100 includes a first circuit board 10 and a second circuit board 20. The first circuit board 10 is provided with a pinhole, and the second circuit board 20 is also provided with a pinhole. Pins can be inserted into the pinholes. The first circuit board 10 and the second circuit board 20 are electrically connected via the pins to achieve communication between the two circuit boards. The first circuit board 10 can be the main circuit board of the device, and the second circuit board 20 can be a secondary functional circuit board of the device.

[0048] The first circuit board 10 has at least two insertion holes 101 , and the number of the insertion holes 101 can be two or more.

[0049] The second circuit board 20 has at least two protrusions 201 on the same side. The number of protrusions 201 can be the same as the number of sockets 101, or can be two or more. For example, the number of sockets 101 and protrusions 201 can both be two, or can both be three, which is not limited in this application.

[0050] The socket 101 is used to cooperate with the protrusion 201, and the socket 101 and protrusion 201 are used to fix the first circuit board 10 and the second circuit board 20 to form a vertical plug-in type combined circuit board. In this application, the circuit board is designed as a vertical plug-in type combined circuit board, which utilizes vertical space, reduces the area occupied by traditional flat circuit boards, and reduces the electrical control space. The protrusion 201 is inserted into the socket 101. After the socket 101 and the protrusion 201 are plugged in, they can be reinforced by welding at the bottom. The socket-type installation and welding make the circuit board assembly more secure, and the multiple welding positions can also be used for signal transmission.

[0051] In some embodiments, such as Figure 2 As shown, the jack 101 on the first circuit board 10 can be configured as an elongated hole. Multiple elongated holes are arranged in a straight line along their length. At least two of the elongated holes have different lengths. The different jack lengths and protrusion lengths mean that only those of the same length can be plugged together when the two are plugged in, thus preventing reverse insertion.

[0052] In some embodiments, such as Figure 2 As shown, the socket 101 on the first circuit board 10 is located in the middle of the first circuit board 10, which can facilitate the plug-in installation of the socket and the protrusion and reduce the difficulty of installation.

[0053] In some embodiments, the second circuit board 20 can be configured as a metal-based plate material, and the heating device required for the combined circuit board is installed on the second circuit board 20. The heating device is installed on the metal-based plate material. Since the metal has good thermal conductivity, and the second circuit board 20 is vertically inserted in the middle of the first circuit board 10 with no obstruction on both sides, the heat dissipation effect of the circuit board can be greatly improved. Specifically, the second circuit board 20 can be configured as an aluminum-based plate material or a copper-based plate material. The first circuit board 10 can be configured as a more durable FR4 plate material, or it can be configured as a common material such as a polymer plastic plate material, a ceramic plate material, etc.

[0054] FR4 is a code name for a flame-resistant material grade, which means that the resin material must be able to extinguish itself after burning. It is not a material name, but a material grade. Therefore, there are many types of FR4 grade materials used in general circuit boards, but most of them are composite materials made of so-called quad-functional epoxy resin, fillers and glass fiber.

[0055] Aluminum-based laminates are metal-based copper-clad laminates with excellent heat dissipation. Single-sided laminates typically consist of three layers: a circuit layer (copper foil), an insulating layer, and a metal base layer. Double-sided laminates for high-end applications also have a structure consisting of a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. A very rare application involves multi-layer laminates, which can be constructed by laminating a conventional multi-layer laminate with an insulating layer and an aluminum base.

[0056] Copper substrate is also a metal substrate, and its thermal conductivity is many times better than that of aluminum substrate.

[0057] In some embodiments, such as Figure 3 As shown, the pins can be L-shaped pin headers, with both ends of the pins soldered to the first circuit board 10 and the second circuit board 20, respectively. Specifically, one end of the L-shaped pin header can be pre-soldered to the second circuit board 20. When the second circuit board 20 is inserted into the first circuit board 10, the other end of the L-shaped pin header simultaneously inserts into the pinholes of the first circuit board 10. The L-shaped pin header can assist in signal transmission while supporting the second circuit board 20, allowing it to remain vertical during installation. The L-shaped pin header connects two circuit boards simultaneously, simplifying circuit board assembly.

[0058] Compared with the existing technology, the present application designs the circuit board into a modular circuit board in the form of a plug-in, utilizes the vertical space, reduces the area occupied by the traditional flat circuit board, reduces the electrical control space, and can greatly improve the heat dissipation effect of the modular circuit board and reduce the difficulty of assembly.

[0059] In air-conditioning equipment, the area occupied by the circuit board and the heat dissipation effect are important indicators affecting the performance of the air-conditioning equipment. Therefore, the above-mentioned combined circuit board provided in this application can be applied to air-conditioning equipment to improve the performance of the air-conditioning equipment.

[0060] It should be noted that:

[0061] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0062] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.

[0063] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0064] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A modular circuit board, characterized in that: include: a first circuit board having at least two jacks; a second circuit board having at least two protrusions on a same side of the second circuit board; The socket is used to cooperate with the protrusion, and the first circuit board and the second circuit board are fixed by the socket and the protrusion to form a vertical plug-in type combined circuit board; The first circuit board and the second circuit board are electrically connected via pins.

2. The modular circuit board according to claim 1, wherein: The insertion hole is configured as a long strip hole.

3. The modular circuit board according to claim 2, wherein: At least two of the elongated holes have different lengths.

4. The modular circuit board according to claim 1, wherein: The at least two jacks are located in the middle of the first circuit board.

5. The modular circuit board according to claim 1, wherein: The second circuit board is a metal-based plate, and the heating device of the combined circuit board is mounted on the second circuit board.

6. The modular circuit board according to claim 5, characterized in that: The second circuit board is an aluminum-based plate or a copper-based plate.

7. The modular circuit board according to any one of claims 1 to 6, characterized in that: The first circuit board is an FR4 board, a polymer plastic board or a ceramic board.

8. The modular circuit board according to claim 1, wherein: The pins are L-shaped pin headers.

9. The modular circuit board according to claim 1 or 8, characterized in that: Two ends of the pin are respectively welded on the first circuit board and the second circuit board.

10. The modular circuit board according to claim 1, wherein: The protrusion and the insertion hole are soldered on the bottom of the first circuit board.

11. An air conditioning device, characterized in that: include: The modular circuit board according to any one of claims 1 to 10.

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