Multilayer nested HDI circuit board

Abstract

A multi-layer nested HDI circuit board comprises a shell, a plurality of single-layer board bodies and a circuit connection structure, the single-layer board bodies are sequentially embedded in the shell, the circuit connection structure is arranged in the shell and electrically connected with the single-layer board bodies, and the circuit connection structure comprises a plurality of electrical contact discs, connecting wires and a hot plug switching assembly. The plurality of electric contact discs are electrically contacted with the single-layer board body respectively, the plurality of connecting wires are electrically connected with the plurality of electric contact discs respectively, and the hot plug switching assembly is electrically connected with the corresponding connecting wires; the hot plug switching assembly comprises a first rotating sleeve, a first telescopic rod, a first contact ring and a second contact ring. According to the utility model, a parallel circuit connection structure is designed, so that the single-layer board body of the multilayer nested circuit board can be disassembled, overhauled or rapidly replaced without power off, thereby realizing the hot plug function of the circuit board; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to a multi-layer nested HDI circuit board. Background Art

[0002] A circuit board, also known as a circuit board, is a crucial electronic component that supports electronic components and acts as a means of electrical interconnection. Because it is manufactured using electronic printing technology, it is referred to as a "printed" circuit board. This category includes HDI circuit boards, which utilize micro-blind buried via technology in the production of printed circuit boards and feature a relatively high density of circuits. A nested composite multilayer circuit board is an electronic component with a multilayer structure, consisting of several layers of circuit boards nested or stacked together to form a single integrated circuit.

[0003] Most existing multi-layer nested circuit boards are designed to fit multiple circuit boards into a single housing. For example, the circuit board structures disclosed in Chinese patents CN202220585608.5, a nested composite circuit board, and CN202223516291.9, a nested composite circuit board, are similar designs. This nested design not only allows for flexible assembly and installation, but also simplifies disassembly and maintenance. However, these conventional multi-layer nested circuit boards often do not support the hot-swappable functionality of single-layer circuit boards. Even if only a single-layer circuit board is damaged, the entire multi-layer nested circuit board must be completely powered off and removed from the electronic product for repair. Utility Model Content

[0004] Based on this, it is necessary to provide a multi-layer nested HDI circuit board to address the deficiencies in the existing technology.

[0005] A multi-layer nested HDI circuit board comprises a housing, a plurality of single-layer boards, and a circuit connection structure. The single-layer boards are sequentially embedded in the housing. The circuit connection structure is mounted in the housing and electrically connected to each of the single-layer boards. The circuit connection structure comprises a plurality of electrical contact pads, connecting wires, and a hot-swap switching assembly. The electrical contact pads are respectively in electrical contact with the single-layer boards, the connecting wires are respectively electrically connected to the electrical contact pads, and the hot-swap switching assembly is electrically connected to the corresponding connecting wires. The hot-swap switching assembly comprises a first rotating sleeve, a first telescopic rod, a first contact ring, and a second contact ring. The first rotating sleeve is mounted in the housing and has a hollow structure with one end open. The first telescopic rod is inserted into the first rotating sleeve and can be extended and retracted as the first rotating sleeve rotates. The first contact ring and the second contact ring are respectively sleeved on both ends of the first telescopic rod, and the first contact ring and the second contact ring are respectively electrically connected to the corresponding connecting wires. The first rotating sleeve is made of insulating material, and the first telescopic rod, the first contact ring and the second contact ring are all made of conductive material.

[0006] Furthermore, the multi-layer nested HDI circuit board also includes a board locking structure, which is installed in the housing and includes a transmission rack, a second rotating sleeve, a second telescopic rod, and a fixed ring. The two ends of the transmission rack respectively engage with the first rotating sleeve and the second rotating sleeve. The second rotating sleeve is a hollow structure with one end open. The second telescopic rod is inserted into the second rotating sleeve and can be extended and retracted as the second rotating sleeve rotates. The fixed ring is mounted on the second telescopic rod. A limit lock hole is also provided on one side of the single-layer board body. One end of the second telescopic rod corresponds to the limit lock hole and can be mutually engaged with the limit lock hole to limit the position.

[0007] Furthermore, the shell includes a base and several interlayer shells, and the several interlayer shells are stacked and assembled on the base in sequence. The several interlayer shells are all provided with an installation cavity with an opening on one side, and the several single-layer plates are respectively embedded and installed in the installation cavities of the several interlayer shells.

[0008] Furthermore, a hollow heat dissipation cavity is provided in the base, a heat dissipation fan is provided in the heat dissipation cavity, and a plurality of heat dissipation holes are provided on the upper surface of the base and the upper and lower surfaces of the plurality of interlayer shells, and the plurality of heat dissipation holes are respectively connected to the installation cavity or the heat dissipation cavity.

[0009] Furthermore, a finger position is provided at the opening of the installation cavity of the interlayer shell.

[0010] In summary, the beneficial effects of the multi-layer nested HDI circuit board of the present invention are as follows: by designing a parallel circuit connection structure, the multi-layer nested circuit board can be disassembled, repaired or quickly replaced without powering off the single-layer board, thereby realizing the hot-swappable function of the circuit board; the board locking structure linked to the circuit connection structure is designed, which not only improves the stability of the embedded installation of the single-layer board, but also makes the hot-swappable function of the circuit board safer and more reliable; the shell is designed as a split combination structure, which further facilitates the disassembly and maintenance of the circuit board, and the heat dissipation structure on the shell is more conducive to ventilation and heat dissipation of the circuit board; the utility model is highly practical and has strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a structural diagram of a multi-layer nested HDI circuit board of the utility model;

[0012] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0013] Figure 3 for Figure 2 Schematic diagram of the exploded structure of the middle shell;

[0014] Figure 4 for Figure 2 Schematic diagram of the structure of the single-layer plate;

[0015] Figure 5 for Figure 2 Schematic diagram of the exploded structure of the circuit connection structure;

[0016] Figure 6 for Figure 2 Schematic diagram of the exploded structure of the middle plate locking structure. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not intended to limit the utility model.

[0018] like Figures 1 to 6As shown, the present invention provides a multi-layer nested HDI circuit board 100, which includes a housing 10, a plurality of single-layer boards 20, and a circuit connection structure 30. The plurality of single-layer boards 20 are sequentially embedded in the housing 10. The circuit connection structure 30 is installed in the housing 10 and is electrically connected to each single-layer board 20. The circuit connection structure 30 includes a plurality of electrical contact pads 31, connecting wires 32, and a hot-swap switching component 33. The plurality of electrical contact pads 31 are respectively in electrical contact with the single-layer boards 20, the plurality of connecting wires 32 are respectively electrically connected to the plurality of electrical contact pads 31, and the hot-swap switching component 33 is electrically connected to the corresponding connecting wires 32. It is understandable that the present invention also includes a plurality of electrical connection and fixed installation structures, which are conventional technical contents in this technical field and are therefore not described in detail.

[0019] The hot-swap switching assembly 33 includes a first rotating sleeve 331, a first telescopic rod 332, a first contact ring 333, and a second contact ring 334. The first rotating sleeve 331 is mounted within the housing 10 and is a hollow structure with one end open. The first telescopic rod 332 is inserted into the first rotating sleeve 331 and can be extended and retracted as the first rotating sleeve 331 rotates. The first contact ring 333 and the second contact ring 334 are respectively mounted on both ends of the first telescopic rod 332 and are electrically connected to corresponding connecting wires 32. The first rotating sleeve 331 is made of an insulating material, while the first telescopic rod 332, the first contact ring 333, and the second contact ring 334 are all made of conductive materials.

[0020] The electrical conductive path between the first contact ring 333, the first telescopic rod 332, and the second contact ring 334 is connected in parallel with the corresponding connecting wires 32 and the electrical contact pad 31. When the single-layer board 20 is inserted into the housing 10, the conductive path between the first contact ring 333, the first telescopic rod 332, and the second contact ring 334 is disconnected, and the single-layer board 20 is now normally connected in series with the overall circuit board circuit. Before the single-layer board 20 is removed from the housing 10, the conductive path between the first contact ring 333, the first telescopic rod 332, and the second contact ring 334 is reconnected by simply rotating the first rotating sleeve 331 to extend the first telescopic rod 332. This allows the conductive path between the first contact ring 333, the first telescopic rod 332, and the second contact ring 334 to be reconnected. This allows the overall circuit board circuit to continue operating normally, even if the conductive path between the electrical contact pad 31 and the single-layer board 20 is disconnected.

[0021] The multi-layer nested HDI circuit board 100 also includes a board locking structure 40, which is installed in the housing 10 and includes a transmission rack 41, a second rotating sleeve 42, a second telescopic rod 43, and a fixing ring 44. The ends of the transmission rack 41 respectively engage with the first rotating sleeve 331 and the second rotating sleeve 42. The second rotating sleeve 42 is a hollow structure with one end open. The second telescopic rod 43 is disposed within the second rotating sleeve 42 and can be extended and retracted as the second rotating sleeve 42 rotates. The fixing ring 44 is sleeved on the second telescopic rod 43. A locking hole 21 is also provided on one side of the single-layer board 20. One end of the second telescopic rod 43 corresponds to the locking hole 21 and can be locked with the locking hole 21.

[0022] When the first rotating sleeve 331 is rotated, the transmission rack 41 also synchronously drives the second rotating sleeve 42 to rotate, causing the second telescopic rod 43 to extend and retract along the second rotating sleeve 42. Since the first telescopic rod 332 and the second telescopic rod 43 extend and retract in opposite directions, the plate locking structure 40 locks the single-layer plate 20 when the hot-swap circuit is disconnected, and releases the lock when the hot-swap circuit is connected. This not only ensures a more secure fit of the single-layer plate 20 within the housing 10, but also creates an interlock between the hot-swap function and the plate locking mechanism, effectively preventing the accidental removal of the single-layer plate 20 due to a disconnected hot-swap circuit.

[0023] The housing 10 comprises a base 11 and a plurality of interlayer shells 12. The interlayer shells 12 are stacked and assembled on the base 11. Each of the interlayer shells 12 has a mounting cavity 121 with an opening on one side. The single-layer boards 20 are respectively fitted into the mounting cavities 121 of the interlayer shells 12. Finger holes 122 are also provided at the openings of the mounting cavities 121 of the interlayer shells 12. The layered design of the housing 10 facilitates circuit board disassembly, making it easy to inspect not only the single-layer boards 20 but also damaged areas of the housing 10. The finger holes 122 facilitate removal of the single-layer boards 20 from the interlayer shells 12.

[0024] The base 11 also includes a hollow heat dissipation cavity 111, which is equipped with a cooling fan 112. The upper surface of the base 11 and the upper and lower surfaces of the interlayer shells 12 are also provided with a plurality of heat dissipation holes 113, each of which communicates with the mounting cavity 121 or the heat dissipation cavity 111. The cooling fan 112 within the heat dissipation cavity 111 accelerates air flow within the housing 10, thereby improving heat dissipation within the circuit board, thereby preventing excessive heat accumulation within the circuit board and affecting operation.

[0025] In summary, the beneficial effects of the multi-layer nested HDI circuit board 100 of the present invention are as follows: by designing a parallel circuit connection structure 30, the multi-layer nested circuit board can be disassembled, repaired or quickly replaced without turning off the power, thereby realizing the hot-swappable function of the circuit board; the board locking structure 40 linked to the circuit connection structure 30 is designed, which not only improves the stability of the embedded installation of the single-layer board 20, but also makes the hot-swappable function of the circuit board safer and more reliable; the shell 10 is designed as a split combination structure, which further facilitates the disassembly and maintenance of the circuit board, and the heat dissipation structure on the shell 10 is more conducive to ventilation and heat dissipation of the circuit board; the utility model is highly practical and has strong promotion significance.

[0026] The above-described embodiment merely represents one embodiment of the utility model. While the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the concept of the utility model, and these modifications and improvements fall within the scope of protection of the utility model. Therefore, the scope of protection of the utility model patent shall be determined by the appended claims.

Claims

1. A multi-layer nested HDI circuit board, characterized by: The hot-swap switching assembly comprises a shell, a plurality of single-layer boards and a circuit connection structure, wherein the single-layer boards are sequentially embedded in the shell, the circuit connection structure is installed in the shell and is electrically connected to each single-layer board, the circuit connection structure comprises a plurality of electrical contact plates, connecting wires and a hot-swap switching assembly, the plurality of electrical contact plates are respectively electrically contacted with the single-layer boards, the plurality of connecting wires are respectively electrically connected to the plurality of electrical contact plates, and the hot-swap switching assembly is electrically connected to the corresponding connecting wires; the hot-swap switching assembly comprises a first rotating sleeve, a first telescopic rod, a first contact ring and a second contact ring, the first rotating sleeve is installed in the shell, and it has a hollow structure design with one end open, the first telescopic rod is inserted into the first rotating sleeve and can be extended and retracted with the rotation of the first rotating sleeve, the first contact ring and the second contact ring are respectively sleeved on both ends of the first telescopic rod, and the first contact ring and the second contact ring are respectively electrically connected to the corresponding connecting wires; the first rotating sleeve is made of insulating material, and the first telescopic rod, the first contact ring and the second contact ring are all made of conductive material.

2. The multi-layer nested HDI circuit board according to claim 1, wherein: The cam is secured to the cam face and is adapted to engage the first and second rotating sleeves, wherein the cam is secured to the cam face and is adapted to engage with the first and second rotating sleeves, respectively.

3. The multi-layer nested HDI circuit board according to claim 1, wherein: The shell includes a base and several interlayer shells, which are stacked and assembled on the base in sequence. The several interlayer shells are each provided with an installation cavity with one side open, and the several single-layer plates are respectively embedded and installed in the installation cavities of the several interlayer shells.

4. The multi-layer nested HDI circuit board according to claim 3, wherein: A hollow heat dissipation cavity is also provided in the base, and a heat dissipation fan is also provided in the heat dissipation cavity; a plurality of heat dissipation holes are also provided on the upper surface of the base and the upper and lower surfaces of the plurality of interlayer shells, and the plurality of heat dissipation holes are respectively connected to the installation cavity or the heat dissipation cavity.

5. The multi-layer nested HDI circuit board according to claim 3, wherein: A finger position is also provided at the opening of the installation cavity of the interlayer shell.

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