Insulated gate bipolar transistor (IGBT) high-efficiency heat dissipation aluminum substrate

Abstract

The utility model discloses an IGBT efficient heat dissipation aluminum substrate, which comprises an aluminum substrate and a circuit board, and also comprises a frame seat and a heat dissipation module, the circuit board is fixedly arranged on the aluminum substrate, a plurality of heat dissipation grooves are uniformly arranged at the lower part of the aluminum substrate along the length direction, the aluminum substrate is detachably arranged in an opening of the frame seat, the heat dissipation module is arranged in the frame seat, and the heat dissipation module is arranged in the frame seat. The upper portion of the heat dissipation module makes contact with the heat dissipation groove. The front side and the rear side of the frame base are provided with an air outlet and an air inlet hole respectively. According to the utility model, the installation mode is flexible, so that the installation mode can be changed according to the actual situation, and when the equipment has enough space for installing the frame seat, the frame seat only needs to be fixedly installed on the equipment, and then the heat dissipation module and the aluminum substrate are installed on the frame seat, so that the heat can be quickly taken away; the aluminum substrate is installed on the equipment, a certain gap can be guaranteed to be formed between the aluminum substrate and the surface of the equipment through the rubber gasket, the gap and the heat dissipation grooves can guarantee air circulation, and therefore the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board equipment, and more specifically, to an aluminum substrate with high-efficiency heat dissipation for IGBTs. Background Art

[0002] At present, there are two main types of aluminum substrates. The first is an aluminum substrate with a flexible material as the substrate, and the other is an aluminum substrate with a rigid material as the substrate. Among them, the aluminum substrate with a flexible material as the substrate generally uses polyimide as the base plate, and a printed circuit with copper foil as the conductor attached to its surface has excellent electrical properties.

[0003] However, the aluminum substrate currently made of hard material is large in size and has low heat dissipation efficiency, resulting in low current capacity. Utility Model Content

[0004] The purpose of the utility model is to provide an aluminum substrate with efficient heat dissipation for IGBT.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: an aluminum substrate with efficient heat dissipation of IGBT, comprising an aluminum substrate and a circuit board, and also comprising a frame seat and a heat dissipation module. The circuit board is fixedly mounted on the aluminum substrate, and a plurality of heat dissipation grooves are evenly opened on the lower part of the aluminum substrate along the length direction. Multiple IGBT modules are fixedly mounted on the circuit board, and through holes penetrating the bottom of the aluminum substrate are opened at both ends of the surface of the circuit board. The upper part of the frame seat is open, and the aluminum substrate is detachably mounted in the opening of the frame seat. The heat dissipation module is located in the frame seat, and the upper part of the heat dissipation module is in contact with the heat dissipation groove. The front and rear sides of the frame seat are respectively provided with air outlets and air inlets.

[0006] Preferably, the heat dissipation module includes a bottom support plate, which is placed at the bottom of the frame seat. A plurality of heat sinks are fixedly mounted on the upper portion of the bottom support plate, and the upper ends of the heat sinks are engaged with the heat dissipation slots at corresponding positions.

[0007] Preferably, rubber gaskets are provided on the upper surface and the lower surface of the circuit board at the through-hole positions.

[0008] Preferably, the air inlet is connected to the air outlet of an external fan through a pipeline.

[0009] Preferably, the aluminum substrate is fixed in the opening of the frame seat by screws.

[0010] Compared with the prior art, the advantages of the present invention are:

[0011] The installation method of the utility model is flexible and can be changed according to actual conditions. When there is enough space to install the frame seat on the equipment, it is only necessary to fix the frame seat on the equipment, and then install the heat dissipation module and the aluminum base plate on the frame seat. Through the external fan, the heat generated by the circuit board is transferred to the aluminum base plate, and the aluminum base plate then transfers the heat to the heat dissipation module. The heat can be quickly taken away by the air discharge of the fan.

[0012] When there is no space to install the frame on the device, you only need to install the aluminum base plate on the device. The rubber gasket can ensure that there is a certain gap between the aluminum base plate and the surface of the device. The gap and the heat dissipation groove can ensure air circulation, thereby increasing the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 This is a structural diagram of an aluminum substrate for efficient heat dissipation of IGBT in the utility model;

[0015] Figure 2 yes Figure 1 A cross-sectional view of an aluminum substrate for efficient heat dissipation of IGBTs.

[0016] In the figure: 1 aluminum base plate, 11 heat sink, 2 circuit board, 21 through hole, 22 rubber gasket, 3 frame seat, 31 air outlet, 32 air inlet, 4 heat dissipation module, 41 bottom support plate, 42 heat sink, 5 IGBT module. DETAILED DESCRIPTION

[0017] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0018] See Figure 1 and Figure 2As shown, the utility model provides an aluminum substrate with efficient heat dissipation of IGBT, including an aluminum substrate 1 and a circuit board 2, and also including a frame seat 3 and a heat dissipation module 4. The circuit board 2 is fixedly mounted on the aluminum substrate 1, and a plurality of heat dissipation grooves 11 are evenly opened at the lower part of the aluminum substrate 1 along the length direction. A plurality of IGBT modules 5 are fixedly mounted on the circuit board 2, and through holes 21 penetrating the bottom of the aluminum substrate 1 are opened at both ends of the surface of the circuit board 2. The upper part of the frame seat 3 is open, and the aluminum substrate 1 is detachably mounted in the opening of the frame seat 3. The heat dissipation module 4 is located in the frame seat 3, and the upper part of the heat dissipation module 4 is in contact with the heat dissipation groove 11. The front and rear sides of the frame seat 3 are respectively provided with an air outlet 31 and an air inlet 32.

[0019] In this embodiment, the heat dissipation module 4 includes a bottom support plate 41, which is placed at the bottom of the frame seat 3. A plurality of heat sinks 42 are fixedly mounted on the upper portion of the bottom support plate 41, and the upper ends of the heat sinks 42 engage with the corresponding heat dissipation slots 11.

[0020] Furthermore, to ensure that there is a certain gap between the aluminum substrate 1 and the device when it is directly mounted on the device, in this embodiment, rubber gaskets 22 are provided on the upper and lower surfaces of the circuit board 2 at the positions of the through holes 21 .

[0021] Furthermore, in order to increase the heat exhaust efficiency, in this embodiment, the air inlet 32 ​​is connected to the air outlet of the external fan through a pipeline.

[0022] In this embodiment, the aluminum substrate 1 is fixed in the opening of the frame seat 3 by screws.

[0023] The specific operation steps are as follows: When there is enough space to install the frame 3 on the device, just fix the frame 3 on the device, then install the heat dissipation module 4 and the aluminum base plate 1 on the frame 3. Through the external fan, the heat generated by the circuit board 2 is transferred to the aluminum base plate 1, and the aluminum base plate 1 then transfers the heat to the heat dissipation module 4. The air discharged by the fan can quickly remove the heat.

[0024] When there is no space on the device to install the frame seat 3, it is only necessary to install the aluminum substrate 1 on the device. The rubber gasket 22 can ensure that there is a certain gap between the aluminum substrate 1 and the surface of the device. The gap and the heat dissipation groove 11 can ensure air circulation, thereby increasing the heat dissipation efficiency.

[0025] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, the patent owner may make various variations or modifications within the scope of the appended claims. As long as they do not exceed the scope of protection described by the claims of the present invention, they should be within the scope of protection of the present invention.

Claims

1. An aluminum substrate for efficient heat dissipation of IGBT, comprising an aluminum substrate and a circuit board, characterized in that: It also includes a frame seat and a heat dissipation module. The circuit board is fixedly mounted on an aluminum substrate. A plurality of heat dissipation grooves are evenly arranged along the length direction at the lower part of the aluminum substrate. A plurality of IGBT modules are fixedly mounted on the circuit board. Through holes penetrating the bottom of the aluminum substrate are provided at both ends of the surface of the circuit board. The upper part of the frame seat is open. The aluminum substrate is detachably mounted in the opening of the frame seat. The heat dissipation module is located in the frame seat. The upper part of the heat dissipation module is in contact with the heat dissipation grooves. An air outlet and an air inlet are respectively provided on the front and rear sides of the frame seat.

2. The aluminum substrate for efficient heat dissipation of IGBT according to claim 1, characterized in that: The heat dissipation module includes a bottom support plate, which is placed at the bottom of the frame seat. A plurality of heat dissipation fins are fixedly mounted on the upper portion of the bottom support plate, and the upper ends of the heat dissipation fins are engaged with heat dissipation slots at corresponding positions.

3. The aluminum substrate for efficient heat dissipation of IGBT according to claim 1, characterized in that: Rubber gaskets are provided at the through-hole positions on the upper surface and the lower surface of the circuit board.

4. The aluminum substrate for efficient heat dissipation of IGBT according to claim 1, characterized in that: The air inlet is connected to the air outlet of the external fan through a pipeline.

5. The aluminum substrate for efficient heat dissipation of IGBT according to claim 1, characterized in that: The aluminum substrate is fixed in the opening of the frame seat by screws.

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