LED chip packaging anti-shake die bonder swing arm

Abstract

The utility model relates to the technical field of semiconductors, in particular to an LED chip packaging anti-shake die bonder swing arm, which comprises a swing arm mounting seat and a front swing arm, one end of the swing arm mounting seat is provided with a slot, and the slot is used for fixing the front swing arm and ensuring the stability of the whole structure of the swing arm. A shoulder part is arranged at one end of the front swing arm, an insertion block is arranged on one side of the shoulder part, the shoulder part abuts against the swing arm mounting base, and the insertion block is inserted into the insertion groove; a flat triangular pyramid is arranged at the other end of the shoulder part; the first side face of the triangular pyramid is perpendicular to the shoulder part. By means of the structural design, stress distribution can be optimized, air resistance can be remarkably reduced through the flat triangular pyramid, especially when a current swing arm is in a high-speed swing state, extra loads caused by the air resistance can be greatly reduced, and then unstable factors in movement are reduced. The vibration resistance is improved, and tiny vibration in the packaging process is effectively reduced, so that the packaging precision and stability of the LED chip are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a swing arm of an anti-shake die bonding machine for LED chip packaging. Background Art

[0002] LED packaging is the process of connecting the LED chip to external circuitry and protecting it from environmental influences. The primary purpose of packaging is to improve LED reliability, heat dissipation, and optical performance. The packaging process involves multiple steps, including die bonding, wire bonding, sealing, baking, cutting, and packaging.

[0003] LED die bonders, also known as placement machines, are key equipment in the semiconductor packaging process. They are primarily used to securely connect the electrical connection points (solder joints) between the chip (wafer) and the packaging substrate to achieve both electrical connectivity and physical support. Die bonders play a vital role in the semiconductor packaging process, placing components at high speed and precision, and performing key steps such as positioning, alignment, flip-chip mounting, and continuous placement. LED die bonders are key equipment in the packaging process of LED production and are developing towards high speed and high precision. As the production cycle of die bonders accelerates, vibration at the end of the die bonder's swing arm has become increasingly severe, severely impacting its positioning accuracy. Therefore, effectively suppressing vibration at the end of the die bonder's swing arm has become a key solution to improving LED production efficiency. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an anti-shake die bonder swing arm for LED chip packaging, which effectively suppresses the vibration of the die bonder swing arm end and improves the production efficiency of LEDs.

[0005] According to an embodiment of the present invention, a swing arm for an LED chip packaging anti-shake die bonder includes:

[0006] A swing arm mounting seat, wherein one end of the swing arm mounting seat is provided with a slot;

[0007] A front swing arm, wherein a shoulder is provided at one end of the front swing arm, an insert block is provided on one side of the shoulder, the shoulder abuts the swing arm mounting seat, and the insert block is inserted in the slot; a flat triangular pyramid is provided at the other end of the shoulder; the first side surface of the triangular pyramid is perpendicular to the shoulder.

[0008] According to some embodiments of the present invention, each edge of the triangular pyramid is provided with a guide fillet.

[0009] According to some embodiments of the present invention, a receiving cavity is provided inside the triangular pyramid, and the receiving cavity is provided with an opening on the first side surface.

[0010] According to some embodiments of the present invention, a plurality of slots are respectively provided on the second side surface and the third side surface of the triangular pyramid.

[0011] According to some embodiments of the present invention, the triangular pyramid is formed by bending an alloy plate.

[0012] According to some embodiments of the present invention, a pipe clamp is provided at one end of the triangular pyramid away from the shoulder.

[0013] According to some embodiments of the present invention, the swing arm mounting seat is provided with a clamping block, the bottom of the clamping block abuts the insertion block, and is threadedly connected to the insertion block through a first bolt; mounting arms are respectively provided on both sides of the clamping block, and the mounting arms are threadedly connected to the swing arm mounting seat through a second bolt.

[0014] According to some embodiments of the present invention, an adjusting bolt is provided on the clamping block, and the adjusting bolt is threadedly connected to the clamping block, with one end of the adjusting bolt abutting against the inserting block.

[0015] According to an embodiment of the present invention, a swing arm for an LED chip packaging anti-shake die bonder has at least the following beneficial effects:

[0016] According to the solution of the present invention, the swing arm of the LED chip packaging anti-shake crystal bonding machine includes a swing arm mounting seat and a front swing arm. A slot is provided at one end of the swing arm mounting seat, and the slot is used to fix the front swing arm to ensure the stability of the overall structure of the swing arm. A shoulder is provided at one end of the front swing arm, and an insert is provided on one side of the shoulder. The shoulder abuts the swing arm mounting seat, and the insert is inserted in the slot; a flat triangular pyramid is provided at the other end of the shoulder; the first side surface of the triangular pyramid is perpendicular to the shoulder. In this embodiment, a flat triangular pyramid is used at the other end of the shoulder, and the first side surface is perpendicular to the shoulder. The design of this structure can optimize the force distribution. The flat triangular pyramid can significantly reduce air resistance, especially when the front swing arm is in a high-speed swinging state, which can greatly reduce the additional load caused by wind resistance, thereby reducing the unstable factors in the movement. Improve the anti-vibration performance, effectively reduce the small vibrations in the packaging process, and thus improve the packaging accuracy and stability of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A structural diagram of the utility model;

[0018] Figure 2 This is a structural schematic diagram of the front swing arm of the utility model;

[0019] Figure 3 A schematic structural diagram of the front swing arm of the present invention from a bottom perspective;

[0020] Figure 4 This is a structural schematic diagram of the swing arm mounting seat of the present utility model.

[0021] In the picture:

[0022] 100-swing arm mounting base, 110-slot, 120-block, 121-mounting arm, 130-first bolt, 140-second bolt, 150-adjusting bolt;

[0023] 200 - front swing arm, 210 - shoulder, 220 - insert, 230 - triangular pyramid, 231 - guide fillet, 232 - accommodating cavity, 233 - first side surface, 234 - second side surface, 235 - third side surface, 236 - slot, 240 - pipe clamp. DETAILED DESCRIPTION

[0024] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0025] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientation or positional relationship indicated by up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In the description of this utility model, "a plurality" means more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0027] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0028] Reference Figures 1 to 4As shown, the present invention discloses a swing arm for an anti-shake die bonder for LED chip packaging, comprising a swing arm mounting base 100 and a front swing arm 200, wherein a slot 110 is provided at one end of the swing arm mounting base 100; a shoulder 210 is provided at one end of the front swing arm 200, an insert block 220 is provided on one side of the shoulder 210, the shoulder 210 abuts the swing arm mounting base 100, and the insert block 220 is inserted into the slot 110; a flat triangular pyramid 230 is provided at the other end of the shoulder 210; a first side surface 233 of the triangular pyramid 230 is perpendicular to the shoulder 210. In this embodiment, the other end of the shoulder 210 adopts a flat triangular pyramid 230; and the first side surface 233 is perpendicular to the shoulder 210. It should be noted that in this embodiment, the first side surface 233 is one side of the bottom of the front swing arm 200 in the working state. In the working state, the first side surface 233 always remains horizontal to facilitate the precise positioning of the end of the front swing arm 200. This structural design optimizes force distribution. The flat triangular pyramid 230 significantly reduces air resistance, especially when the swing arm 200 is swinging at high speed. This significantly reduces the additional load caused by wind resistance, thereby reducing instability during movement. This improves vibration resistance and effectively reduces minor vibrations during the packaging process, thereby enhancing the packaging accuracy and stability of the LED chip.

[0029] In some embodiments of the present invention, each edge of the triangular pyramid 230 is provided with a guide fillet 231. In this embodiment, based on the design of the flat triangular pyramid 230, each edge of the triangular pyramid 230 is further provided with a guide fillet 231, so that the three sides of the triangular pyramid 230 are smoothly transitioned. Based on the principles of aerodynamics, air resistance can be further reduced. In particular, in the scenario where the front swing arm 200 swings at high speed, energy consumption can be more effectively reduced while reducing vibration effects.

[0030] In some embodiments of the present invention, a receiving cavity 232 is provided within the triangular pyramid 230, and the receiving cavity 232 has an opening on the first side 233. In this embodiment, the provision of the receiving cavity 232 within the triangular pyramid 230 significantly reduces the weight of the triangular pyramid. Furthermore, the center position of the triangular pyramid 230 can be adjusted by adjusting the opening position of the receiving cavity 232. While maintaining the rigidity and strength of the triangular pyramid 230, the influence of inertial force is reduced, allowing the triangular pyramid 230 to have better balance during high-speed swinging, thereby significantly reducing the sense of instability during movement and increasing control precision.

[0031] In some embodiments of the present invention, a plurality of slots 236 are provided on the second side 234 and the third side 235 of the triangular pyramid 230. In this embodiment, the slots 236 disrupt the surface continuity of the triangular pyramid 230, altering the trajectory of airflow and reducing the boundary layer thickness, thereby effectively lowering the drag coefficient. This is particularly effective in reducing terminal vibration during high-speed swing arm movement. Furthermore, by removing material from non-load-bearing portions, the slots 236 reduce the total mass of the front swing arm 200 without sacrificing strength, lowering its swing inertia. This results in faster response and more flexible movements, making it suitable for high-intensity, high-frequency work.

[0032] In some embodiments of the present invention, the triangular pyramid 230 is formed by bending an alloy sheet. In this embodiment, the triangular pyramid 230 is formed integrally by bending an alloy sheet. This integral molding process improves the structural strength of the triangular pyramid 230. After bending, it undergoes grinding and polishing to remove burrs and improve surface smoothness. Sometimes, a protective coating or heat treatment is applied to enhance corrosion resistance. In this embodiment, the alloy sheet can be aluminum alloy or magnesium-aluminum alloy.

[0033] In some embodiments of the present invention, a tube clamp 240 is provided at one end of the triangular pyramid 230 away from the shoulder 210. In this embodiment, a receiving cavity 232 is provided inside the triangular pyramid 230. The tube clamp 240 can be used to fix the nozzle of the die bonder, and the receiving cavity 232 can accommodate the pipe connecting the nozzle and the control circuit.

[0034] In some embodiments of the present invention, the swing arm mounting base 100 is provided with a clamping block 120. The bottom of the clamping block 120 abuts against the inserting block 220 and is threadedly connected to the inserting block 220 via a first bolt 130. Mounting arms 121 are provided on either side of the clamping block 120 and are threadedly connected to the swing arm mounting base 100 via a second bolt 140. In this embodiment, by quickly securing the inserting block 220, the first bolt 130, once secured, can effectively resist the rotational torque of the front swing arm 200, preventing it from loosening during high-speed movement.

[0035] In some embodiments of the present invention, an adjusting bolt 150 is provided on the clamping block 120, and the adjusting bolt 150 is threadedly connected to the clamping block 120, so that one end of the adjusting bolt 150 abuts against the insert block 220. By providing the adjusting bolt 150, the front swing arm 200 can be fine-tuned to control the accuracy of the end of the front swing arm 200.

[0036] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A swing arm for an LED chip packaging anti-shake die bonder, characterized in that: include: A swing arm mounting seat (100), wherein one end of the swing arm mounting seat (100) is provided with a slot (110); A front swing arm (200), wherein one end of the front swing arm (200) is provided with a shoulder (210), one side of the shoulder (210) is provided with an insert block (220), the shoulder (210) abuts against the swing arm mounting seat (100), and the insert block (220) is inserted into the slot (110); the other end of the shoulder (210) is provided with a flat triangular pyramid (230); and a first side surface (233) of the triangular pyramid (230) is perpendicular to the shoulder (210).

2. The swing arm for anti-shake die bonding machine for LED chip packaging according to claim 1, characterized in that: Each edge of the triangular pyramid (230) is provided with a guide fillet (231).

3. The swing arm for the LED chip packaging anti-shake die bonder according to claim 2, characterized in that: An accommodating cavity (232) is provided inside the triangular pyramid (230), and an opening is provided on the first side surface (233) of the accommodating cavity (232).

4. The swing arm for the LED chip packaging anti-shake die bonder according to claim 3, characterized in that: A plurality of slots (236) are respectively provided on the second side surface (234) and the third side surface (235) of the triangular pyramid (230).

5. The swing arm of the LED chip packaging anti-shake die bonder according to claim 4, characterized in that: The triangular pyramid (230) is formed by bending an alloy plate.

6. The swing arm for the LED chip packaging anti-shake die bonder according to claim 1, characterized in that: A pipe clamp (240) is provided at one end of the triangular pyramid (230) away from the shoulder (210).

7. The swing arm for the LED chip packaging anti-shake die bonder according to claim 1, characterized in that: The swing arm mounting seat (100) is provided with a clamping block (120), the bottom of the clamping block (120) abuts against the inserting block (220) and is threadedly connected to the inserting block (220) via a first bolt (130); mounting arms (121) are respectively provided on both sides of the clamping block (120), and the mounting arms (121) are threadedly connected to the swing arm mounting seat (100) via a second bolt (140).

8. The swing arm for the LED chip packaging anti-shake die bonder according to claim 7, characterized in that: An adjusting bolt (150) is provided on the clamping block (120), and the adjusting bolt (150) and the clamping block (120) are threadedly connected, with one end of the adjusting bolt (150) abutting against the inserting block (220).

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