Driving IC (Integrated Circuit) and LED (Light Emitting Diode) chip sealing structure and luminescent device

Abstract

The utility model discloses a driving IC and LED chip sealing structure and a light-emitting device, the driving IC and LED chip sealing structure comprises a substrate, a bonding pad assembly, a driving IC and a light-emitting chip, the bonding pad assembly comprises a positive electrode bonding pad, a negative electrode bonding pad, a data input bonding pad and a driving output bonding pad which are arranged on the substrate; the driving IC is electrically connected with the positive electrode bonding pad, the negative electrode bonding pad, the data input bonding pad and the driving output bonding pad. The light-emitting chip is electrically connected with the positive electrode bonding pad and the driving output bonding pad. According to the technical scheme, the driving IC or the light-emitting chip can be prevented from being damaged in the welding process due to the fact that the driving IC or the light-emitting chip becomes two welding spots.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp beads, in particular to a sealing structure of a driver IC and an LED chip and a light-emitting device. Background Art

[0002] LED (light-emitting diode) technology, due to its high efficiency and environmentally friendly characteristics, has been widely used in the lighting and display fields. With technological advancements, LEDs are no longer simply light-emitting components, but have integrated a wider range of functions. The introduction of driver ICs has greatly improved the performance and controllability of LEDs. Driver ICs are integrated circuits specifically designed to control the operation of LEDs. They precisely regulate current, enabling complex functions such as brightness control and color mixing, enabling LEDs to adapt to a wider range of application scenarios.

[0003] However, in traditional LED structures, the driver IC is usually connected to the light-emitting chip using a conductive wire. In the process of soldering the conductive wire, there are usually two soldering sequences: one is to first solder one end of the conductive wire to the driver IC, and then solder the other end of the conductive wire to the light-emitting chip. In this soldering sequence, the driver IC serves as the "first soldering point" and the light-emitting chip serves as the "second soldering point". The other is to first solder one end of the conductive wire to the light-emitting chip, and then solder the other end of the conductive wire to the driver IC. In this soldering sequence, the light-emitting chip serves as the "first soldering point" and the driver IC serves as the "second soldering point".

[0004] There are fundamental differences between single- and double-solder joint welding methods. A single-solder joint uses an electric current to melt one end of a conductive wire into a sphere, which is then directly bonded to the corresponding component's electrode using ultrasonic bonding. In contrast, a double-solder joint requires the other end of the conductive wire to be cut into a specific shape using a special porcelain nozzle, with the cutting and bonding process occurring simultaneously. This double-solder joint welding method applies greater power and pressure to the solder joint, generating additional mechanical stress. Furthermore, the heat generated during the welding process causes thermal stress, further exacerbating the effects of mechanical stress. This increased mechanical and thermal stress can have serious consequences for thin, fragile light-emitting chips (especially red light-emitting chips) and driver ICs. For light-emitting chips, these stresses can easily create shear forces between the two electrodes, leading to chip cracking or internal damage. For driver ICs, excessive stress can damage the IC's electrodes or underlying circuitry, compromising proper functionality. These issues directly impact the performance, reliability, and lifespan of LEDs. Therefore, optimizing LED structure to reduce or eliminate the double-solder joint problem has become a critical issue that needs to be addressed in the development of LED technology. Utility Model Content

[0005] The main purpose of the utility model is to propose a sealing structure of a driver IC and an LED chip, aiming to solve the technical problem in the prior art that LEDs use the driver IC or the light-emitting chip as two solder joints, which easily leads to damage to these components.

[0006] To achieve the above-mentioned purpose, the present invention proposes a sealing structure of a driver IC and an LED chip, which includes a substrate, a pad assembly, a driver IC and a light-emitting chip. The pad assembly includes a positive electrode pad, a negative electrode pad, a data input pad and a drive output pad arranged on the substrate; the driver IC is electrically connected to the positive electrode pad, the negative electrode pad, the data input pad and the drive output pad respectively; the light-emitting chip is electrically connected to the positive electrode pad and the drive output pad respectively.

[0007] Optionally, the pad assembly includes a data output pad provided on the substrate, and the driver IC is electrically connected to the data output pad.

[0008] Optionally, the number of the driving output pads is three;

[0009] The driver IC is electrically connected to each of the driver output pads respectively;

[0010] The number of the light-emitting chips is the same as the number of the driving output pads and corresponds one to one. Each of the light-emitting chips is electrically connected to the positive electrode pad, and each of the light-emitting chips is electrically connected to the corresponding driving output pad.

[0011] Optionally, two chip welding parts are provided at the bottom of at least one of the light-emitting chips, one chip welding part is welded to the positive electrode welding pad, and the other chip welding part is welded to the corresponding driving output welding pad.

[0012] Optionally, at least one of the light-emitting chips is provided with two conductive wires, one of the two conductive wires is electrically connected to the positive electrode pad, and the other conductive wire is electrically connected to the corresponding drive output pad.

[0013] Optionally, a chip welding portion is provided at the bottom of at least one of the light-emitting chips, and the light-emitting chip is connected to a conductive wire, the chip welding portion is welded to the positive electrode pad, and the light-emitting chip is electrically connected to the corresponding driving output pad through the conductive wire.

[0014] Optionally, a packaging glue is provided on the substrate, and the material of the packaging glue is a light-transmitting material. The packaging glue wraps the positive electrode pad, the negative electrode pad, the data input pad, the data output pad, the three driving output pads, the driving IC and the three light-emitting chips.

[0015] Optionally, the bottom of the driver IC is provided with a first pad portion, a second pad portion, a third pad portion, a fourth pad portion, a fifth pad portion, a sixth pad portion and a seventh pad portion;

[0016] The first pad portion, the second pad portion and the third pad portion are arranged in a row along a first direction to form a first row;

[0017] The fourth pad portion, the fifth pad portion, and the sixth pad portion are arranged in a row along the first direction to form a second row, and the first row and the second row extend in parallel;

[0018] The seventh pad portion is disposed between the first column and the second column.

[0019] Optionally, the substrate includes a backlight surface, on which a positive pin, a negative pin, a data input pin and a data output pin are provided, the positive pin is electrically connected to the positive pad, the negative pin is electrically connected to the negative pad, the data input pin is electrically connected to the data input pad, and the data output pin is electrically connected to the data output pad.

[0020] The present utility model also proposes a light-emitting device, including a sealing structure of a driver IC and an LED chip, the sealing structure of the driver IC and the LED chip including a substrate, a pad assembly, a driver IC and a light-emitting chip, the pad assembly including a positive electrode pad, a negative electrode pad, a data input pad and a drive output pad arranged on the substrate; the driver IC is electrically connected to the positive electrode pad, the negative electrode pad, the data input pad and the drive output pad, respectively; the light-emitting chip is electrically connected to the positive electrode pad and the drive output pad, respectively.

[0021] The driver IC and LED chip sealing structure of the technical solution of the present invention introduces a driver output pad as a connector between the driver IC and the light-emitting chip. Even if the driver IC or the light-emitting chip uses a conductive wire to achieve electrical connection, only the driver output pad will be used as the second soldering point, and the driver IC or the light-emitting chip will not be used as the second soldering point. This effectively avoids the generation of additional mechanical stress and thermal stress on the fragile driver IC and light-emitting chip, significantly reduces the risk of chip cracking, electrode damage or internal structure damage, thereby improving the reliability and service life of the driver IC and LED chip sealing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] Figure 1 This is a structural diagram of an embodiment of the sealing structure of a driver IC and an LED chip according to the present invention;

[0024] Figure 2 for Figure 1 Schematic diagram of the structure of the driver IC and LED chip sealed together without the packaging glue;

[0025] Figure 3 for Figure 2 Schematic diagram of the structure after omitting some structures;

[0026] Figure 4 is a schematic diagram of the back side of the substrate;

[0027] Figure 5 This is a schematic diagram of the back of the driver IC;

[0028] Figure 6 Schematic diagram of the back side of the light emitting chip;

[0029] Figure 7 This is a structural diagram of another embodiment of the sealing structure of the driver IC and LED chip of the present invention.

[0030] Description of Figure Numbers:

[0031] 1. Substrate; 2. Pad assembly; 21. Positive pad; 22. Negative pad; 23. Data input pad; 24. Data output pad; 25. Drive output pad; 26. Positive pin; 27. Negative pin; 28. Data input pin; 29. ​​Data output pin; 3. Driver IC; 31. First pad section; 32. Second pad section; 33. Third pad section; 34. Fourth pad section; 35. Fifth pad section; 36. Sixth pad section; 37. Seventh pad section; 38. First column; 39. Second column; 4. Light-emitting chip; 41. Chip welding section; 5. Conductive wire; 6. Packaging glue.

[0032] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, the descriptions of "first", "second", etc. in this utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, and must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0036] The utility model provides a sealing structure of a driver IC and an LED chip.

[0037] In the embodiment of the present utility model, Figures 1 to 7 As shown, the driver IC and LED chip sealing structure includes a substrate 1, a pad assembly 2, a driver IC 3 and a light-emitting chip 4, the pad assembly 2 includes a positive electrode pad 21, a negative electrode pad 22, a data input pad 23 and a drive output pad 25 arranged on the substrate 1; the driver IC 3 is electrically connected to the positive electrode pad 21, the negative electrode pad 22, the data input pad 23 and the drive output pad 25 respectively; the light-emitting chip 4 is electrically connected to the positive electrode pad 21 and the drive output pad 25 respectively.

[0038] Furthermore, the pad assembly 2 includes a data output pad 24 provided on the substrate 1 , and the driver IC 3 is electrically connected to the data output pad 24 .

[0039] Specifically, the substrate 1 is a basic component of the sealing structure of the driver IC and the LED chip, and is usually made of insulating materials such as ceramic, glass fiber or plastic.

[0040] The pad assembly 2 is a series of metal contact points provided on the substrate 1 for electrical connection. It includes multiple pads with different functions. The positive pad 21 is used to provide a positive power input for the driver IC and LED chip package. The negative pad 22 is used to provide a negative power input or ground connection for the driver IC and LED chip package. The data input pad 23 is used to receive control signals or data. The data output pad 24 is used to transmit data to the next driver IC and LED chip package unit, achieving cascade control. The driver output pad 25 is used to connect the driver IC 3 and the light-emitting chip 4 to transmit the drive signal.

[0041] Driver IC3 is the core control unit of the driver IC and LED chip package structure, responsible for regulating current and processing control signals.

[0042] The light emitting chip 4 is a light emitting element of a sealed structure of a driver IC and an LED chip, which can be single-color or multi-color. It is powered and controlled by being electrically connected to the positive electrode pad 21 and the driver output pad 25.

[0043] The electrical connection of the driver IC 3 or the light-emitting chip 4 can be achieved in various ways, such as direct welding, conductive glue or metal wires.

[0044] It can be understood that the driver IC and LED chip sealing structure of the technical solution of the present invention introduces the driver output pad 25 as a connector between the driver IC3 and the light-emitting chip 4. Even if the driver IC3 or the light-emitting chip 4 uses the conductive wire 5 to achieve electrical connection, only the driver output pad 25 will be used as the second soldering point, and the driver IC3 or the light-emitting chip 4 will not be used as the second soldering point. This effectively avoids the generation of additional mechanical stress and thermal stress on the fragile driver IC3 and the light-emitting chip 4, significantly reduces the risk of chip cracking, electrode damage or internal structure damage, thereby improving the reliability and service life of the driver IC and LED chip sealing structure.

[0045] Furthermore, by providing data output pads 24 on the driver IC and LED chip package, the data output pads 24 enable the driver IC and LED chip package to simultaneously receive control signals while also transmitting data to the next driver IC and LED chip package. This feature allows multiple driver IC and LED chip packages to be easily connected to form a cascade system, achieving more complex control and display effects. For example, in a large LED display or intelligent lighting system, each driver IC and LED chip package unit can receive, process, and transmit control signals through the data output pads 24, thereby achieving coordinated operation of the entire system and supporting richer lighting effects and interactive functions.

[0046] Optionally, the number of the driving output pads 25 is three;

[0047] The driver IC 3 is electrically connected to each of the driver output pads 25;

[0048] The number of the light-emitting chips 4 is the same as the number of the driving output pads 25 and corresponds one to one. Each of the light-emitting chips 4 is electrically connected to the positive electrode pad 21 , and each of the light-emitting chips 4 is electrically connected to the corresponding driving output pad 25 .

[0049] Specifically, the three light-emitting chips 4 can be the same color or different colors, such as red, green, and blue, to achieve full-color display capabilities. The main advantage of this embodiment is that it significantly improves the integration and functional diversity of the driver IC and LED chip package. By integrating multiple light-emitting chips 4 in a single driver IC and LED chip package and providing independent drive outputs for each chip, more precise control is achieved. This not only allows for more complex lighting effects, such as color mixing and gradients, but also improves the overall brightness and energy efficiency of the driver IC and LED chip package.

[0050] Optionally, two chip welding portions 41 are provided at the bottom of at least one of the light-emitting chips 4 , one chip welding portion 41 is welded to the positive electrode pad 21 , and the other chip welding portion 41 is welded to the corresponding driving output pad 25 .

[0051] Specifically, the bottom of the light-emitting chip 4 refers to the non-luminous surface of the light-emitting chip 4, that is, the side facing the substrate 1. The chip bonding portion 41 can be a metallized area, a raised metal point, or other structure suitable for bonding. This embodiment utilizes flip-chip technology, directly bonding the chip to the substrate 1 rather than connecting via wires. By adopting flip-chip technology, the metal wires used in traditional wire bonding are completely eliminated, thus completely solving the two-solder point problem. This not only significantly reduces the risk of chip damage due to welding stress, but also shortens the signal transmission distance and improves electrical performance. At the same time, direct bonding improves heat conduction, facilitates better heat dissipation, and extends the service life of the driver IC and LED chip package. Furthermore, this structure simplifies the manufacturing process, reduces assembly steps, and potentially reduces production costs. Flip-chip technology also allows for more compact packaging designs, facilitating the manufacture of smaller, higher-density LED devices.

[0052] Optionally, at least one of the light-emitting chips 4 is provided with two conductive wires 5, one of the two conductive wires 5 is electrically connected to the positive electrode pad 21, and the other conductive wire 5 is electrically connected to the corresponding drive output pad 25. The main advantage of this design is that it improves the reliability of the sealing structure of the driver IC and the LED chip by optimizing the connection method while maintaining the advantages of traditional wire bonding technology. Compared with the traditional method of directly using the light-emitting chip 4 as the second solder point, this design transfers the second solder point to a more solid solder pad, significantly reducing the risk of chip damage due to soldering stress. At the same time, this connection method maintains the flexibility of the production process, allowing it to be implemented by simple modification on the existing production line, reducing the cost of technology conversion.

[0053] Of course, the design of the present application is not limited to the above two embodiments. In other embodiments, at least one of the light-emitting chips 4 may be provided with a chip welding portion 41 at the bottom, and the light-emitting chip 4 is connected to a conductive wire 5. The chip welding portion 41 is welded to the positive electrode pad 21, and the light-emitting chip 4 is electrically connected to the corresponding drive output pad 25 through the conductive wire 5.

[0054] Optionally, a packaging glue 6 is provided on the substrate 1, and the material of the packaging glue 6 is a light-transmitting material. The packaging glue 6 wraps the positive electrode pad 21, the negative electrode pad 22, the data input pad 23, the data output pad 24, the three driving output pads 25, the driving IC3 and the three light-emitting chips 4.

[0055] Specifically, the encapsulant 6 is a protective material, usually made of a transparent or translucent polymer, such as epoxy resin, silicone, etc. The encapsulant 6 can be applied by various methods, such as molding, dispensing, potting, etc.

[0056] The primary advantage of this packaging design is that it comprehensively improves the reliability and performance of the driver IC / LED chip co-package. First, encapsulant 6 provides physical protection for all key components, preventing damage to the internal structure of the driver IC / LED chip co-package from external environmental factors (such as moisture, dust, and mechanical shock), significantly improving the durability and service life of the co-package. Second, the use of translucent materials ensures efficient light transmission. The color and quality of light can be adjusted by adding materials such as phosphors, enhancing the optical performance of the co-package. Furthermore, encapsulant 6 acts as a heat dissipator, helping to evenly distribute heat, reduce hot spots, and further extend the service life of the co-package.

[0057] Optionally, the bottom of the driver IC 3 is provided with a first pad portion 31, a second pad portion 32, a third pad portion 33, a fourth pad portion 34, a fifth pad portion 35, a sixth pad portion 36 and a seventh pad portion 37;

[0058] The first pad portion 31 , the second pad portion 32 and the third pad portion 33 are arranged in a row along a first direction to form a first row 38 ;

[0059] The fourth pad portion 34 , the fifth pad portion 35 and the sixth pad portion 36 are arranged in a row along the first direction to form a second row 39 , and the first row 38 and the second row 39 extend in parallel;

[0060] The seventh pad portion 37 is provided between the first column 38 and the second column 39 .

[0061] Specifically, the first direction in this embodiment can be understood as a specific direction on the driver IC 3, such as the long side direction or the short side direction, and the column arrangement means that the three pad portions are arranged in sequence on the same straight line.

[0062] The primary advantage of this layout design is that it optimizes space utilization and signal transmission. By dividing the seven pads into two columns with a central pad, a compact and orderly layout is achieved. This arrangement not only reduces the overall size of driver IC3 but also simplifies PCB wiring design. The two parallel columns shorten signal transmission paths, reducing signal interference and attenuation. This symmetrical layout facilitates even heat distribution and improves heat dissipation efficiency. From a manufacturing perspective, this regular layout facilitates automated production, improving production efficiency and soldering quality.

[0063] Optionally, the substrate 1 includes a backlight surface, on which a positive pin 26, a negative pin 27, a data input pin 28 and a data output pin 29 are provided, the positive pin 26 is electrically connected to the positive pad 21, the negative pin 27 is electrically connected to the negative pad 22, the data input pin 28 is electrically connected to the data input pad 23, and the data output pin 29 is electrically connected to the data output pad 24.

[0064] Specifically, the pins can take various forms, such as metal sheets, solder balls, and pins, depending on the application. Positive and negative pins 26 and 27 provide power to the driver IC and LED chip package. Data input pin 28 receives control signals. Data output pin 29 transmits data to the next device, enabling cascade control.

[0065] By placing pins on the backlight side, the light-emitting surface of substrate 1 remains clean and flat, facilitating optical design and thermal management. This layout also simplifies the connection between the driver IC and LED chip package and external circuitry, making it easier to integrate the driver IC and LED chip package into various applications. The backlight-side pin design is particularly well-suited for surface mount technology (SMT), facilitating automated production and improving production efficiency and consistency. Furthermore, the separation of data input and output pins provides the driver IC and LED chip package with higher signal integrity and stronger anti-interference capabilities, facilitating the implementation of complex control functions and cascaded applications.

[0066] The present utility model also proposes a light-emitting device, which includes a sealing structure of a driver IC and an LED chip. The specific structure of the sealing structure of the driver IC and the LED chip refers to the above-mentioned embodiment. Since the light-emitting device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0067] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A driver IC and LED chip sealing structure, characterized in that: include: base(1); A pad assembly (2), the pad assembly (2) comprising a positive pad (21), a negative pad (22), a data input pad (23), and a drive output pad (25) provided on the substrate (1); A driving IC (3), wherein the driving IC (3) is electrically connected to the positive electrode pad (21), the negative electrode pad (22), the data input pad (23), and the driving output pad (25); A light-emitting chip (4), the light-emitting chip (4) being electrically connected to the positive electrode pad (21) and the drive output pad (25), respectively; The pad assembly (2) includes a data output pad (24) provided on the substrate (1), and the driver IC (3) is electrically connected to the data output pad (24); The number of the drive output pads (25) is three; The driver IC (3) is electrically connected to each of the drive output pads (25); The number of the light-emitting chips (4) is the same as the number of the drive output pads (25) and corresponds one to one, each of the light-emitting chips (4) is electrically connected to the positive electrode pad (21), and each of the light-emitting chips (4) is electrically connected to the corresponding drive output pad (25); The bottom of the driver IC (3) is provided with a first pad portion (31), a second pad portion (32), a third pad portion (33), a fourth pad portion (34), a fifth pad portion (35), a sixth pad portion (36) and a seventh pad portion (37); The first pad portion (31), the second pad portion (32), and the third pad portion (33) are arranged in a row along a first direction to form a first row (38); The fourth pad portion (34), the fifth pad portion (35) and the sixth pad portion (36) are arranged in a row along the first direction to form a second row (39), and the first row (38) and the second row (39) extend in parallel; The seventh pad portion (37) is provided between the first column (38) and the second column (39).

2. The driver IC and LED chip sealing structure according to claim 1, characterized in that: Two chip welding portions (41) are provided at the bottom of at least one of the light-emitting chips (4), one of the chip welding portions (41) is welded to the positive electrode welding pad (21), and the other of the chip welding portions (41) is welded to the corresponding drive output welding pad (25).

3. The driver IC and LED chip sealing structure according to claim 1, characterized in that: At least one of the light-emitting chips (4) is provided with two conductive wires (5), one of the two conductive wires (5) is electrically connected to the positive electrode pad (21), and the other conductive wire (5) is electrically connected to the corresponding drive output pad (25).

4. The driver IC and LED chip sealing structure according to claim 1, characterized in that: A chip welding portion (41) is provided at the bottom of at least one of the light-emitting chips (4), and the light-emitting chip (4) is connected to a conductive wire (5), the chip welding portion (41) is welded to the positive electrode pad (21), and the light-emitting chip (4) is electrically connected to the corresponding drive output pad (25) via the conductive wire (5).

5. The driver IC and LED chip sealing structure according to claim 1, characterized in that: The substrate (1) is provided with a packaging glue (6), the packaging glue (6) being made of a light-transmitting material, and the packaging glue (6) wraps the positive electrode pad (21), the negative electrode pad (22), the data input pad (23), the data output pad (24), the three drive output pads (25), the driver IC (3), and the three light-emitting chips (4).

6. The driver IC and LED chip sealing structure according to claim 1, characterized in that: The substrate (1) comprises a backlight surface, on which a positive electrode pin (26), a negative electrode pin (27), a data input pin (28) and a data output pin (29) are provided, wherein the positive electrode pin (26) is electrically connected to the positive electrode pad (21), the negative electrode pin (27) is electrically connected to the negative electrode pad (22), the data input pin (28) is electrically connected to the data input pad (23), and the data output pin (29) is electrically connected to the data output pad (24).

7. A light emitting device, characterized in that: It comprises the driver IC and LED chip sealing structure according to any one of claims 1 to 6.

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