X-ray beam limiting device and X-ray imaging system

Abstract

The utility model discloses an X-ray beam limiting device and an X-ray imaging system, the beam limiting device comprises a shell assembly, an image projection device, an imaging light adjusting assembly and a heat dissipation assembly, and the shell assembly is provided with a limiting channel used for enabling X-rays to penetrate out to irradiate a detected object; the image projection device is arranged on the shell assembly and is used for emitting imaging light comprising visible light; the imaging light adjusting assembly is used for enabling the imaging light to penetrate out of the limiting channel to form an image; the heat dissipation assembly is used for dissipating heat of the image projection device; the heat dissipation assembly comprises a first heat dissipation piece and a heat conduction piece with a preset length, the heat conduction piece is provided with a heat absorption end and a heat dissipation end which are opposite in the length direction, the heat absorption end of the heat conduction piece is in thermal contact with the image projection device, and the heat dissipation end of the heat conduction piece is in thermal contact with the first heat dissipation piece. The heat generated by the image projection device is transmitted to the first heat dissipation piece through the heat conduction piece, the heat can be prevented from being retained in the image projection device, the temperature rise of the image projection device is effectively reduced, and therefore the heat dissipation efficiency of the beam limiting device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of medical equipment, in particular to an X-ray beam limiter and an X-ray imaging system. Background Art

[0002] The beam limiter (also known as a beam reducer, light shrinker, or line blocker) is a crucial component of an X-ray imaging system. Typically installed at the X-ray tube window, it restricts the X-ray irradiation field to the desired imaging area, preventing irrelevant areas from being irradiated and reducing the patient's radiation dose during imaging. The beam limiter is typically equipped with a projection device for generating visible light. This device simulates the shape and position of the X-ray irradiation field, allowing the invisible X-ray radiation field to be indicated, ensuring that the X-rays reach the intended location. However, the high power and heat generation of the projection device can easily affect the stability and reliability of the projection device or the beam limiter due to excessive temperature. Therefore, improving the heat dissipation performance of the beam limiter is crucial. Utility Model Content

[0003] The main technical problem solved by the utility model is to provide an X-ray beam limiter and an X-ray imaging system using the X-ray beam limiter, which can effectively improve the heat dissipation efficiency of the beam limiter.

[0004] According to a first aspect, an embodiment provides an X-ray beam limiter, comprising:

[0005] The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured;

[0006] An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light;

[0007] an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image;

[0008] a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device;

[0009] The heat dissipation assembly includes a first heat dissipation member and a heat conductive member with a preset length. The heat conductive member has a heat absorbing end and a heat dissipating end at opposite ends in its length direction. The heat absorbing end of the heat conductive member is in thermal contact with the image projection device, and the heat dissipating end of the heat conductive member is in thermal contact with the first heat dissipation member. The heat conductive member can transfer at least part of the heat generated by the image projection device to the first heat dissipation member for heat dissipation.

[0010] In one embodiment, the heat conducting element includes one or more heat conductors having the heat absorbing end and the heat dissipating end, and at least one of the heat conductors is a columnar structure, a sheet structure, or a tubular structure filled with a medium.

[0011] In one embodiment, the tubular structure is a phase change heat pipe or a non-phase change heat pipe.

[0012] In one embodiment, the image projection device has a projection lens and multiple light source components capable of emitting visible light of different colors. The visible light emitted by the light source components forms the imaging light after passing through the projection lens; the heat absorbing end of the heat conductive member is in thermal contact with the light source components.

[0013] In one embodiment, the heat conducting member includes a plurality of heat conductors having the heat absorbing end and the heat dissipating end, the plurality of heat conductors are arranged independently of each other, and each of the light source assemblies is in thermal contact with at least one heat conductor.

[0014] In one embodiment, the image projection device has four light source assemblies, the number of the heat conductors is set to four, and the four light source assemblies are connected to the four heat conductors in a one-to-one correspondence.

[0015] In one embodiment, the four heat conductors are all phase change heat pipes.

[0016] In one embodiment, a heat collecting member is provided at the heat absorbing end of the heat conducting member, and the heat collecting member is in thermal contact with the backlight side of the light source assembly. The heat collecting member is used to absorb at least part of the heat generated by the light source assembly and transfer the heat to the heat conducting member.

[0017] In one embodiment, the heat collecting element includes a copper substrate; wherein the heat absorbing end of the heat conducting element is soldered to the side of the copper substrate facing away from the light source assembly through low-temperature solder paste, and / or a heat conducting material is filled between the copper substrate and the light source assembly.

[0018] In one embodiment, the heat dissipation assembly further includes a second heat dissipation member, which is in thermal contact with a heat source component other than the light source assembly in the image projection device.

[0019] In one embodiment, the first heat sink has a plurality of heat sink fins arranged side by side; the heat sink end of the heat conductor is arranged along the arrangement direction of the heat sink fins and penetrates the plurality of heat sink fins.

[0020] In one embodiment, the imaging light adjustment assembly includes a reflector and an adjustment member; the reflector is arranged on the propagation path of the X-ray and is used to reflect the imaging light to form an image; the adjustment member is coupled to the reflector and is used to adjust the relative position of the reflector and the image projection device so that the light field of the image and the irradiation field of the X-ray remain overlapping.

[0021] In one embodiment, the heat dissipation assembly and the image projection device are arranged inside the shell assembly, the heat dissipation assembly also includes a heat dissipation fan, and the shell assembly also has an air inlet and an air outlet that connect the interior of the shell assembly with the outside world; wherein, the heat dissipation fan is used to drive the airflow entering the interior of the shell assembly through the air inlet to be discharged from the air outlet, so that the airflow flows through the first heat dissipation element.

[0022] In one embodiment, in the flow direction of the airflow inside the housing assembly, the first heat dissipation element is arranged on the downstream side of the image projection device.

[0023] In one embodiment, the first heat sink has a channel structure, which is used to guide airflow through the first heat sink. The cooling fan is provided on the first heat sink and is located on the air inlet side or the air outlet side of the channel structure.

[0024] In one embodiment, the housing assembly further comprises a first housing wall, a second housing wall and a third housing wall, wherein the first housing wall and the second housing wall are arranged opposite to each other, and the third housing wall is connected between the first housing wall and the second housing wall;

[0025] The X-ray inlet of the limiting channel is arranged through the first shell wall, the X-ray outlet of the limiting channel is arranged through the second shell wall, and the air outlet is arranged through the first shell wall or the third shell wall.

[0026] In one embodiment, the air outlet is arranged through the first shell wall, the air inlet is arranged through the second shell wall and / or the air inlet is arranged through the portion where the second shell wall and the third shell wall meet.

[0027] According to a second aspect, an embodiment provides an X-ray beam limiter, comprising:

[0028] The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured;

[0029] An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light;

[0030] an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image;

[0031] a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device;

[0032] In which, the heat dissipation component includes a cooling fan and multiple profile radiators, and the multiple profile radiators are independently in thermal contact with the image projection device; the cooling fan is used to drive air flow through the profile radiators so that at least part of the heat generated by the image projection device is transferred to the profile radiators for heat dissipation.

[0033] In one embodiment, the image projection device has a projection lens and multiple light source components capable of emitting visible light of different colors. The visible light emitted by the light source components forms the imaging light after passing through the projection lens; wherein each of the light source components is in thermal contact with at least one of the profile heat sinks.

[0034] In one embodiment, the heat dissipation assembly further includes a heat collecting member, which is in thermal contact between the light source assembly and the profile heat sink, and is used to absorb at least part of the heat generated by the light source assembly and transfer the heat to the profile heat sink.

[0035] In one embodiment, the heat collecting element includes a copper substrate; wherein the profile heat sink is soldered to the side of the copper substrate facing away from the light source assembly by low-temperature solder paste; and / or a thermal conductive material is filled between the copper substrate and the light source assembly.

[0036] In one embodiment, the imaging light adjustment assembly includes a reflector and an adjustment member; the reflector is arranged on the propagation path of the X-ray and is used to reflect the imaging light to form an image; the adjustment member is coupled to the reflector and is used to adjust the relative position of the reflector and the image projection device so that the light field of the image and the irradiation field of the X-ray remain overlapping.

[0037] In one embodiment, the heat dissipation assembly and the image projection device are disposed inside the housing assembly, and the housing assembly further comprises a first housing wall, a second housing wall, a third housing wall, and an air inlet and an air outlet connecting the interior of the housing assembly with the outside; wherein:

[0038] The first shell wall and the second shell wall are arranged opposite to each other; the third shell wall is connected between the first shell wall and the second shell wall to enclose the inner space of the housing assembly;

[0039] The X-ray inlet of the limiting channel is set through the first shell wall, the X-ray outlet of the limiting channel is set through the second shell wall, the air outlet is set through the first shell wall or the third shell wall, and the cooling fan can drive the airflow entering the interior of the shell assembly through the air inlet to be discharged from the air outlet.

[0040] In one embodiment, the air outlet is arranged through the first shell wall, the air inlet is arranged through the second shell wall and / or the air inlet is arranged through the portion where the second shell wall and the third shell wall meet.

[0041] According to a third aspect, an embodiment provides an X-ray beam limiter, comprising:

[0042] The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured;

[0043] An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light;

[0044] an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image;

[0045] a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device;

[0046] In which, the heat dissipation component includes a profile radiator and a tubular structure with a preset length and filled with a medium. The tubular structure has a heat absorbing end and a heat dissipating end at opposite ends in its length direction. The heat absorbing end of the tubular structure is in thermal contact with the image projection device, and the heat dissipating end of the tubular structure is in thermal contact with the profile radiator. The tubular structure can transfer at least part of the heat generated by the image projection device to the profile radiator for heat dissipation.

[0047] According to a fourth aspect, an embodiment provides an X-ray beam limiter, comprising:

[0048] The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured;

[0049] An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light;

[0050] an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image;

[0051] a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device;

[0052] Among them, the heat dissipation component includes a heat exchange cold head, a heat dissipation radiator, a circulation pipeline and a circulating liquid pump. The heat exchange cold head and the heat dissipation radiator are connected through the circulation pipeline to form a closed loop of coolant. The heat exchange cold head is in thermal contact with the image projection device; the circulating liquid pump is connected and arranged in the closed loop, and is used to drive the coolant to circulate between the heat exchange cold head and the heat dissipation radiator to transfer at least part of the heat generated by the image projection device to the heat dissipation radiator for heat dissipation.

[0053] According to the fifth aspect, an embodiment provides an X-ray imaging system, comprising a head for emitting X-rays and a detector for receiving the X-rays emitted by the head; wherein the head comprises a bulb having an X-ray source and the X-ray beam limiter described in the aforementioned aspects, and the bulb is arranged outside the shell assembly.

[0054] According to the above-mentioned embodiment, the X-ray beam limiter includes a shell assembly, an image projection device, an imaging light adjustment assembly and a heat dissipation assembly. The shell assembly has a limiting channel for allowing X-rays to pass through the shell assembly to irradiate the object to be measured; the image projection device is arranged inside the shell assembly, and is used to emit imaging light; the imaging light adjustment assembly is used to allow the imaging light to pass through the shell assembly through the limiting channel to form an image; the heat dissipation assembly is used to dissipate the heat generated by the image projection device; the heat dissipation assembly includes a first heat dissipation element and a heat conductive element with a preset length, the heat conductive element having a heat absorbing end and a heat dissipation end opposite to each other in its length direction, the heat absorbing end of the heat conductive element is in thermal contact with the image projection device, and the heat dissipation end of the heat conductive element is in thermal contact with the first heat dissipation element.

[0055] Using an image projection device to replace traditional halogen lamps or LED lamps can project images with richer information and improve the accuracy and convenience of shooting; using a heat conductor to transfer the heat generated by the image projection device to the first heat sink can prevent heat from being retained in the image projection device, thereby effectively reducing the heat or temperature rise of the image projection device, creating favorable conditions for extending the service life of the image projection device or the beam limiter, reducing the failure rate, and improving the stability and reliability of the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 FIG1 is a schematic diagram of the application principle of an X-ray imaging system according to an embodiment (I).

[0057] Figure 2 Schematic diagram of the application principle of an X-ray imaging system according to an embodiment (II).

[0058] Figure 3 The figure is a schematic cross-sectional view of the structure of the head of an X-ray imaging system according to one embodiment.

[0059] Figure 4 This is a reference schematic diagram (1) of the outer contour structure of an X-ray beam limiter according to an embodiment.

[0060] Figure 5 This is a reference schematic diagram (2) of the outer contour structure of an X-ray beam limiter according to an embodiment.

[0061] Figure 6 A schematic diagram of the structural decomposition of an X-ray beam limiter according to an embodiment.

[0062] Figure 7 Schematic diagram of the structural combination of a heat dissipation component and an image projection device in an X-ray beam limiter according to an embodiment.

[0063] Figure 8 Schematic diagram of the structural decomposition of the heat dissipation component and image projection device in an X-ray beam limiter according to one embodiment.

[0064] Figure 9 Schematic diagram of the structural relationship between the first heat sink and the heat conductor in an X-ray beam limiter according to an embodiment.

[0065] Figure 10 Schematic diagram of the structural layout between the heat dissipation component and the image projection device in an X-ray beam limiter according to an embodiment (I).

[0066] Figure 11 Schematic diagram (2) of the structural layout between the heat dissipation component and the image projection device in an X-ray beam limiter according to an embodiment.

[0067] Figure 12 A schematic diagram of the structural decomposition of a heat dissipation component in an X-ray beam limiter according to an embodiment.

[0068] In the picture:

[0069] 100, housing assembly; 100a, restricted passage; 100b, air outlet; 100c, air inlet; 200, image projection device; 210, projection lens; 220, light source assembly; 300, imaging light adjustment assembly; 310, reflector;

[0070] 400, heat dissipation assembly; 410, first heat dissipation element; 410a, heat dissipation fins; 410b, shaped frame; 420, heat conductor; 430, heat collecting element; 440, second heat dissipation element; 450, cooling fan; 460, profile radiator; 470, tubular structure; 481, heat dissipation radiator; 481a, carrier plate; 481b, heat dissipation pipe assembly; 481c, liquid separation container; 481d, liquid collecting container; 482, circulation pipeline; 483, circulation liquid pump; 484, heat exchange cold head;

[0071] A. Detector; B. Tube; C. X-ray beam limiter; D. Bed; E. Column. DETAILED DESCRIPTION

[0072] The present invention is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted under different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0073] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0074] Component numbers used herein, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0075] See also Figure 1 and Figure 2An embodiment of the present application provides an X-ray imaging system that can emit X-rays to illuminate a subject (e.g., a human body, other animal body, or object) and receive X-rays that have passed through the subject to obtain an image of a specific part of the subject, thereby assisting doctors in medical diagnosis and treatment. The X-ray imaging system includes a head for emitting X-rays, a detector A (e.g., a flat-panel detector) for receiving X-rays emitted by the head and that have passed through the subject, and other functional components as needed (e.g., a motion actuator for supporting the head or driving the head to move within an application space).

[0076] The handpiece may include a tube B having an X-ray source and an X-ray beam limiter C for limiting the radiation shooting range of the X-rays; the handpiece may use various existing methods to irradiate the object with X-rays.

[0077] For example, see Figure 1 The head of the machine is set above the bed surface D, the detector A is set on the bed surface D, and the object to be measured lies on the bed surface D. The head of the machine can irradiate the object to be measured from the upper side from top to bottom, so that the detector A receives the X-rays passing through the object to be measured, thereby completing X-ray shooting and imaging.

[0078] For example, see Figure 2 , detector A is set on the column E, the head is arranged in the side space of the column E, and the object to be measured stands between the column E and the head, so that the head can irradiate the object to be measured with X-rays from the side, so as to complete the shooting and imaging after the detector A receives the X-rays passing through the object to be measured.

[0079] The following mainly introduces the X-ray beam limiter C. Other components of the X-ray imaging system can be selected and set with reference to the existing technology and will not be described in detail here.

[0080] See also Figures 3 to 12 The X-ray beam limiter C includes a housing assembly 100, an image projection device 200, an imaging light adjustment assembly 300 and a heat dissipation assembly 400, which will be described in detail below.

[0081] See also Figures 3 to 6 The shell assembly 100 is mainly used as a structural assembly carrier for other components of the X-ray beam limiter C. For example, the shell assembly 100 can be understood as a collection of related components that constitute the overall outline of the X-ray beam limiter C; the shell assembly 100 has a limiting channel 100a set through the shell assembly 100, and the tube B can be set outside the shell assembly 100 and at a position corresponding to the limiting channel 100a. The X-rays emitted by the X-ray source pass through the limiting channel 100a at a certain angle (such as the tube target angle) to limit the range and area of ​​the X-ray emission through the limiting channel 100a, thereby irradiating the object to be measured.

[0082] Exemplarily, the shell assembly 100 can partially adopt a commonly used lead window structure so that the interior of the shell assembly 100 is constructed to form a limiting channel 100a, so that a portion of the X-rays can be emitted from the limiting channel 100a, while another portion of the X-rays are blocked by the shell assembly 100 and cannot be emitted, thereby forming an actual X-ray irradiation area (i.e., the X-ray irradiation field) that can irradiate the object under test.

[0083] For ease of distinction and description, the opening of the shell assembly 100 for allowing X-rays emitted by the tube B to enter the limiting channel 100a is defined as the X-ray entrance of the limiting channel 100a, and the opening of the shell assembly 100 for allowing X-rays to exit the limiting channel 100a is defined as the X-ray exit of the limiting channel 100a.

[0084] See also Figure 3 The image projection device 200 and the imaging light adjustment component 300 are arranged in cooperation with each other on the shell component 100; wherein, the image projection device 200 is mainly used to emit imaging light including visible light. For example, the image projection device 200 can include a more common projector or other device that can project images such as images and videos; the imaging light adjustment component 300 is mainly used to make the imaging light emitted by the image projection device 200 pass through the restriction channel 100a to form an image. For example, the image can be a pattern, video, etc. presented on the object to be measured.

[0085] For one example, see Figure 3 The image projection device 200 replaces the LED lamp, halogen lamp and other lighting light sources in the existing beam limiter and is arranged in the housing assembly 100. The imaging light adjustment assembly 300 includes a reflector 310 and an adjustment member (not shown in the figure); wherein the reflector 310 is made of a material that can allow X-rays to pass through. The reflector 310 is arranged on the propagation path of the X-rays (for example, in the limiting channel 100a) and is mainly used to reflect imaging light to form an image; the adjustment member is coupled to the reflector 310 and is mainly used to adjust the relative position between the reflector 310 and the image projection device 200 so that the image formed based on the image projection device 200 includes a light field for representing the X-ray irradiation field; that is, by adjusting the relative position between the reflector 310 and the image projection device 200, the light field of the image can at least include an imaging area (i.e., an imaging field) that overlaps with the area where the irradiation field is located.

[0086] Of course, the adjusting member can also be coupled to the image projection device 200 separately or simultaneously, so that the light field of the image and the irradiation field of the X-ray are kept coincident through the relative position between the reflecting member 310 and the image projection device 200.

[0087] In this way, compared with the existing beam limiter in which the illumination light source can only simply form an illumination light field that coincides with the irradiation field, the image projection device 200 is used to replace the illumination light source. The imaging function of the image projection device 200 itself can be used to not only form an illumination light field, but also form an image in the illumination light field (i.e., the imaging field) in the form of a pattern, video, or a combination of pattern and video. This can enrich the image content information to provide more information and prompts to doctors or other viewers, assist doctors in taking X-rays of the object under test, and help improve the convenience and accuracy of the operation of the X-ray imaging system.

[0088] In addition, by adjusting the parameters of the image projection device 200, the color, brightness, etc. of the imaging field or the image light field can be adjusted. This not only makes the display of the imaging field more flexible and higher definition, but also makes it easier for doctors to observe the photographed part of the object being measured.

[0089] In another embodiment, the image projection device 200 is provided within the housing assembly 100 in conjunction with an illumination light source. That is, the X-ray beam limiter C is equipped with both the image projection device 200 and an illumination light source, such as an LED lamp. Visible illumination light emitted by the illumination light source can form an illuminated area on the object being measured that overlaps with the irradiation field. Imaging light emitted by the image projection device 200 can form an image in the form of a pattern, video, or the like on the object being measured (e.g., within the illuminated area). This image can include auxiliary information such as the positioning of the handpiece, allowing the physician to obtain more comprehensive information and assisting in imaging.

[0090] See also Figures 6 to 8 、 Figures 10 to 12 The heat dissipation component 400 is at least partially arranged in thermal contact with the image projection device 200, and is mainly used to dissipate heat from the image projection device 200, so as to create favorable conditions for extending the service life of the image projection device 200 or the X-ray beam limiter C as a whole, reducing the failure rate, and improving the stability and reliability of the operation by reducing the heat or temperature rise of the image projection device 200.

[0091] For one example, see Figures 6 to 9The heat dissipation component 400 dissipates heat by transferring at least part of the heat generated by the image projection device 200 to a spatial position away from the image projection device 200; specifically, the heat dissipation component 400 includes a first heat dissipation member 410 and a heat conductive member having a preset length; wherein the heat conductive member may include a columnar or sheet-like heat conductive body 420 made of a heat conductive material, or may include a tubular heat conductive body 420 filled with a medium (for example, the heat conductive body 420 may be a phase-change heat pipe filled with a phase-change medium, or a non-phase-change heat pipe filled with a non-phase-change medium); one end of the heat conductive member (specifically, the heat conductive body 420) in the length direction is in thermal contact with the first heat dissipation member 410, and the other end of the heat conductive member (specifically, the heat conductive body 420) in the length direction is in thermal contact with the image projection device 200.

[0092] For ease of distinction and description, the end of the heat conductive element that is in thermal contact with the first heat dissipation element 410 is defined as a heat dissipation end, and the end of the heat conductive element that is in thermal contact with the image projection device 200 is defined as a heat absorption end.

[0093] For example, see Figures 7 to 9 The heat conductor includes a plurality of heat conductors 420, and the plurality of heat conductors 420 may adopt the same structure (for example, the plurality of heat conductors 420 are tubular structures filled with a medium), or the plurality of heat conductors 420 may adopt different structures (for example, a portion of the heat conductors 420 adopts a sheet structure or a columnar structure, and another portion of the heat conductors 420 adopts a tubular structure filled with a medium); wherein the plurality of heat conductors 420 are independently in thermal contact between the first heat sink 410 and the image projection device 200.

[0094] For example, each heat source component of the image projection device 200 is connected to at least one heat conductor 420. Specifically, the heat absorbing end of the heat conductor 420 is connected to the corresponding heat source component in the image projection device 200, while the heat dissipating end of the heat conductor 420 is connected to the first heat sink 410. Thus, through the corresponding contact and connection relationship between the heat conductor 420 and the heat source components, at least a portion of the heat generated by each heat source component of the image projection device 200 can be specifically transferred to the first heat sink 410 for dissipation.

[0095] For another example, some heat source components of the image projection device 200 are in thermal contact with the heat absorbing end of the same heat conductor 420, while another part of the heat source components of the image projection device 200 are in thermal contact with at least one heat conductor 420 in a one-to-one correspondence. Therefore, due to the correspondence between the heat conductor 420 and the heat source components, the heat generated by the image projection device 200 can also be transferred to the first heat sink 410 for heat dissipation.

[0096] For example, the heat conducting element includes a heat conductor 420, the heat absorbing end of the heat conductor 420 is in thermal contact (e.g., contact connection) with multiple heat source components of the image projection device 200, and the heat dissipating end of the heat conductor 420 is contact connected to the first heat dissipating element 410; thus, at least part of the heat generated by the image projection device 200 can be transferred to the first heat dissipating element 410 by means of the heat conductor 420 for heat dissipation.

[0097] Based on this, the thermal conductive member can form a sufficient spacing distance between the first heat sink 410 and the image projection device 200 to avoid direct structural contact between the first heat sink 410 and the image projection device 200, and can also quickly transfer at least part of the heat generated by the image projection device 200 to the first heat sink 410 for heat dissipation, thereby preventing the image projection device 200 from being overly hot or rising too quickly due to heat retention or accumulation in the image projection device 200 (or near the image projection device 200), thereby enhancing the heat dissipation efficiency of the image projection device 200.

[0098] Of course, the heat conducting member may also adopt other suitable structures to achieve heat transfer and heat dissipation of the image projection device 200 by establishing a heat transfer distance between the first heat sink 410 and the image projection device 200; details will not be given here.

[0099] It should be noted that Figures 1 to 3 The bold dashed line in FIG. 1 represents the angle or range of X-rays passing through the limiting channel 100 a.

[0100] For one example, see Figure 8 The image projection device 200 has a projection lens 210 and multiple light source components 220 that can emit visible light of different colors; wherein the light source components 220 may include but are not limited to three-color or four-color LEDs, three-color or four-color lasers. For example, the image projection device 200 has four light source components 220, and the four light source components 220 correspond to the three primary colors of red, green, and blue and an additional other light source; the projection lens 210 can be a combination of one or more optical lenses. The visible light emitted by the light source component 220 can form imaging light after passing through the projection lens 210 or after being transmitted by the projection lens 210. With the cooperation of the imaging light adjustment component 300, the imaging light is finally projected onto the object to be measured to form an image.

[0101] The heat-absorbing end of the heat-conducting member is arranged in thermal contact with the light source assembly 220. Since the heat generated by the image projection device 200 during operation mainly comes from the light source assembly 220, and the light source assembly 220 has a vital impact on the image quality, the heat-conducting member is used to quickly transfer at least part of the heat generated by the light source assembly 220 to the first heat sink 410 for heat dissipation, which is beneficial to accelerate or improve the heat dissipation efficiency of the image projection device 200, reduce the temperature or temperature rise of the image projection device 200, and ensure the performance of the image projection device.

[0102] For example, see Figure 7 and Figure 8 The image projection device 200 has four light source assemblies 220, and the heat conductive member includes four heat conductors 420. The four heat conductors 420 all use phase change heat pipes with preset lengths, and the four light source assemblies 220 are contact-connected with the four heat conductors 420 in a one-to-one correspondence.

[0103] On the one hand, by utilizing the high heat transfer performance of the phase-change heat pipe, the heat generated by the corresponding light source assembly 220 can be quickly transferred to the first heat sink 410 for heat dissipation, thereby preventing heat from being retained in the light source assembly 220; on the other hand, by utilizing the corresponding contact connection relationship between the phase-change heat pipe and the light source assembly 220, heat transfer between different light source assemblies 220 can be avoided, and targeted heat transfer and heat dissipation of the light source assembly 220 can be achieved, thereby improving the heat dissipation efficiency, without significantly increasing the structural complexity of the X-ray beam limiter C or the space occupied by the heat dissipation assembly 400, which is beneficial to reducing the configuration cost of the X-ray beam limiter C.

[0104] In some embodiments, the heat conductor may also adopt other suitable structures and arrangements depending on the number, heat generation, and structural configuration relationship of the light source components 220 in the image projection device 200. For example, each light source component 220 is in thermal contact with at least one heat conductor 420. The heat conductor 420 may be a columnar structure, a sheet structure, or a non-phase change heat pipe with a preset length, and may also transfer and dissipate the heat generated by the light source component 220.

[0105] It should be noted that those skilled in the art should be aware of the basic structural composition and heat transfer principle of phase change heat pipes and non-phase change heat pipes, so no detailed description of phase change heat pipes or non-phase change heat pipes is given here.

[0106] For one example, see Figure 7 and Figure 8The heat absorbing end of the heat conducting member is further provided with a heat collecting member 430, for example, the heat collecting member 430 is arranged at the heat absorbing end of the heat conducting body 420 in the form of a phase change heat pipe; the heat collecting member 430 is in thermal contact with the backlight side of the light source assembly 220, for example, the heat collecting member 430 is in contact and connected with the light source assembly 220 in the form of being attached to the backlight side of the light source assembly 220.

[0107] Thus, the heat collecting member 430 can increase the contact area between the heat conducting member (specifically, the heat conductor 420) and the light source assembly 220, so that the heat collecting member 430 can absorb at least part of the heat generated by the light source assembly 220 and transfer the heat to the heat conducting member, and then the heat conducting member can finally transfer the heat to the first heat sink 410 for heat dissipation.

[0108] In specific implementation, the heat collecting part 430 can adopt a copper substrate, and the heat absorbing end of the heat conducting part (such as the heat conductor 420) can be soldered to the side of the copper substrate facing away from the light source assembly 220 through low-temperature solder paste; a heat-conducting material can be filled between the copper substrate and the light source assembly 220, and the heat-conducting material can be a paste material with high thermal conductivity such as thermal grease, thermal silica gel, etc., or a sheet material with certain flexibility and compressibility such as a thermal pad (such as a silica gel thermal pad); in this way, the heat-conducting material can be used to enhance the closeness of the contact between the heat collecting part 430 and the light source assembly 220, reduce the contact thermal resistance, and improve the heat absorption efficiency of the heat collecting part 430; at the same time, by welding and fixing the heat conducting part and the heat collecting part 430, the structural compactness and stability between the heat conducting part, the heat collecting part 430 and the light source assembly 220 can be effectively enhanced, ensuring that the heat generated by the light source assembly 220 can be transferred to the first heat sink 410 through the heat conducting part to the maximum extent.

[0109] For one example, see Figure 9 The first heat sink 410 has a plurality of heat sink fins 410a arranged side by side and spaced apart. The heat dissipation end of the heat conductor is arranged along the arrangement direction of the heat dissipation fins 410a and is provided in the plurality of heat sink fins 410a, so as to form a contact connection relationship with the first heat sink 410 at the heat dissipation end of the heat conductor, and the heat absorption end of the heat conductor is in contact with the image projection device 200; for example, the heat dissipation end of the phase change heat pipe is arranged through the plurality of heat sink fins 410a, and the heat absorption end of the phase change heat pipe is in contact with the backlight side of the light source assembly 220 through the heat collecting member 430.

[0110] In this way, the use of multiple heat dissipation fins 410a can not only effectively increase the heat dissipation area of ​​the first heat dissipation element 410, but also form a channel structure (not marked in the figure) between adjacent heat dissipation fins 410a for air flow to flow through the first heat dissipation element 410, so that when the air flow flows through the first heat dissipation element 410 through the channel structure, it takes away the heat absorbed by the first heat dissipation element 410, thereby creating conditions for improving the heat dissipation efficiency of the image projection device 200 or the X-ray beam limiter C.

[0111] For some examples, see Figure 7 and Figure 8 The heat dissipation assembly 400 further includes a second heat dissipation element 440, which is in thermal contact with heat source components of the image projection device 200, excluding the light source assembly 220. Exemplarily, the second heat dissipation element 440 utilizes a profile heat dissipation structure, which is in contact with the control board module and other components of the image projection device 200. Thus, the second heat dissipation element 440 effectively increases the heat dissipation area of ​​the corresponding heat source component, providing targeted heat dissipation to the corresponding heat source component, thereby further improving the heat dissipation efficiency of the image projection device 200.

[0112] Of course, the second heat sink 440 may also adopt heat dissipation structural components of other suitable structures. For example, the second heat sink 440 may be structurally and functionally configured with reference to the heat conductor and be in contact and connected with the first heat sink 410. The heat source component in thermal contact with the second heat sink 440 may also be other heat source components in the image projection device 200 other than the light source assembly 220 and the control board module, which will not be elaborated here.

[0113] For one example, see Figures 4 to 7 The heat dissipation component 400 and the image projection device 200 are both arranged inside the shell component 100; wherein, the heat dissipation component 400 also includes a heat dissipation fan 450, and the shell component 100 also has an air inlet 100c and an air outlet 100b that connect the interior of the shell component 100 with the outside.

[0114] Thus, the cooling fan 450 can drive the airflow entering the interior of the shell assembly 100 through the air inlet 100c to be discharged from the shell assembly 100 through the air outlet 100b, so that when the airflow flows through functional components such as the first heat sink 410, the heat conductor, the second heat sink 440, and the image projection device 200, at least part of the heat generated, transferred or absorbed by the relevant functional components is carried to the outside of the shell assembly 100, thereby avoiding heat accumulation inside the shell assembly 100 and accelerating the heat dissipation efficiency of the X-ray beam limiter C.

[0115] It should be noted that Figure 4 、 Figure 5 and Figure 7 The bold dashed line with an arrow in the middle represents the approximate flow direction of the airflow inside the housing assembly 100. Figure 4 The bold solid line with an arrow in it represents the approximate direction in which the X-rays generated by the X-ray source enter the limiting channel 100 a.

[0116] In one embodiment, please combine Figures 4 to 7The first heat sink 410 is arranged on the downstream side of the image projection device 200 in the flow direction of the airflow inside the housing assembly 100. In this way, after at least part of the heat generated by the image projection device 200 is transferred to the first heat sink 410 by the heat conductive member, the heat absorbed by the first heat sink 410 can be prevented from flowing back through the image projection device 200 with the airflow. This can ensure the heat dissipation effect of the image projection device 200 and allow the heat to be quickly discharged to the outside of the housing assembly 100.

[0117] For one example, see Figure 7 The cooling fan 450 is assembled integrally with the first heat sink 410 or employs an integrated structure. For example, the first heat sink 410 further includes a frame 410b, and a plurality of heat sink fins 410a are arranged side by side and spaced apart within the frame 410b. The gaps between adjacent heat sink fins 410a form a plurality of channel structures extending through the first heat sink 410 within the frame 410b. The cooling fan 450 can be disposed within the first heat sink 410 (e.g., fixedly connected to the frame 410b) and located on the air inlet or air outlet side of the channel structure.

[0118] Therefore, by arranging the cooling fan 450 on the first heat sink 410, the structural integration of the cooling fan 450 and the first heat sink 410 can be achieved, and the compactness of the structures of the two can be enhanced, thereby reducing the occupation of the limited space inside the shell assembly 100; at the same time, by locating the cooling fan 450 on the air inlet side or the air outlet side of the channel structure, the air flow can be driven to flow through the first heat sink 410 through the channel structure in a positive pressure air supply or negative pressure air exhaust manner relative to the first heat sink 410, thereby quickly discharging the heat inside the first heat sink 410 or the shell assembly 100 to the outside of the shell assembly 100.

[0119] Of course, in some embodiments, the first heat sink 410 may also be structurally designed with reference to existing profile heat sinks or adopt other suitable structural forms, which will not be described in detail here.

[0120] For one example, see Figures 4 to 6 The shell assembly 100 also has a first shell wall, a second shell wall and a third shell wall. The first shell wall and the second shell wall are arranged opposite to each other, and the third shell wall is connected between the first shell wall and the second shell wall to enclose an internal space of the shell assembly 100; wherein, the X-ray inlet of the limiting channel 100a is set through the first shell wall, the X-ray outlet of the limiting channel 100a is set through the second shell wall, and the air outlet 100b is set through the first shell wall; the air inlet 100c can be set through the second shell wall, or through the part where the second shell wall and the third shell wall are connected, and can also be set through the second shell wall and the part where the second shell wall and the third shell wall are connected.

[0121] For example, see Figure 5 and Figure 6 The shell assembly 100 can be constructed by combining multiple shell components, wherein the shell wall of one shell component serves as a part of the first shell wall, the second shell wall and the third shell wall of the shell assembly 100, and the air inlet 100c and the air outlet 100b are set through the shell wall of the shell component.

[0122] When the X-ray imaging system takes X-ray photos of the object to be measured, since the X-ray outlet of the limiting channel 100a is usually facing the object to be measured, the air outlet 100b is arranged on the first shell wall so that the air outlet 100b and the X-ray outlet are located at different positions of the shell assembly 100. In this way, the high-temperature airflow can be avoided from blowing towards the object to be measured during X-ray shooting, creating favorable conditions for improving the user experience of the X-ray imaging system; at the same time, by utilizing the relative positional relationship between the first shell wall and the second shell wall, the position distance between the air outlet 100b and the air inlet 100c on the shell assembly 100 can be effectively shortened, thereby shortening the length of the airflow path inside the shell assembly 100, which is beneficial to the realization of air convection and allows the hot airflow to be quickly discharged from the shell assembly 100.

[0123] In other embodiments, the air outlet 100b can also be set through the third shell wall, and the air inlet 100c can be set at a specific position according to actual needs, for example, through the first shell wall, the second shell wall or the third shell wall; this can also prevent hot air from blowing towards the object being measured.

[0124] It should be noted that the "first shell wall, second shell wall and third shell wall" described in the embodiment of the present application are only for distinguishing the structural parts of the shell assembly 100 in different directions, and do not necessarily mean that the first shell wall, the second shell wall and the third shell wall are relatively complete or relatively independent structural parts.

[0125] For one example, see Figure 10 and Figure 11 The heat dissipation component 400 dissipates heat from the image projection device 200 by increasing the surface area or heat dissipation area of ​​the image projection device 200 .

[0126] For example, see Figure 10The heat dissipation assembly 400 includes a heat dissipation fan 450 and a plurality of profile radiators 460; wherein, the plurality of profile radiators 460 are independently arranged in thermal contact with the image projection device 200, for example, each heat source assembly 220 of the image projection device 200 is correspondingly connected to at least one profile radiator 460; the heat dissipation fan 450 is arranged in conjunction with the plurality of profile radiators 460 to drive airflow through the profile radiators 460, so that at least part of the heat generated by the image projection device 200 is transferred to the profile radiators 460 for heat dissipation.

[0127] Therefore, the surface area or heat dissipation area of ​​the image projection device 200 is effectively increased by the multiple profile heat sinks 460, and the heat dissipation fan 450 can drive the air flow through the profile heat sink 460 to remove the heat absorbed by the profile heat sink 460 from the profile heat sink 460. This can also prevent heat from being retained in the image projection device 200 or near the image projection device 200, thereby reducing the temperature rise or temperature of the image projection device 200. At the same time, the relatively independent arrangement relationship between the multiple profile heat sinks 460 can not only avoid the influence of direct contact between the profile heat sinks 460 on heat transfer and dissipation, but also can provide targeted heat dissipation to different parts or different heat source components of the image projection device 200.

[0128] For example, see Figure 11 The heat dissipation component 400 includes a profile heat sink 460 and a tubular structure 470 (such as a phase change heat pipe or a non-phase change heat pipe) with a preset length and filled with a medium; wherein the tubular structure 470 has a heat absorption end and a heat dissipation end at both ends in its length direction, and the profile heat sink 460 can be arranged at a position close to the image projection device 200 (for example, in contact with and connected to the light source component 220 of the image projection device 200, or the profile heat sink 460 is not arranged in contact with the light source component 220 of the image projection device 200), the heat absorption end of the tubular structure 470 is in thermal contact with (for example, in contact with and connected to) the image projection device 200 (for example, the light source component 220), and the heat absorption end of the tubular structure 470 is in thermal contact with (for example, in contact with and connected to) the profile heat sink 460.

[0129] Therefore, based on the structural characteristics of the large surface area of ​​the profile heat sink 460, the surface area or heat dissipation area of ​​the image projection device 200 is effectively increased. By utilizing the high heat transfer performance of the tubular structure 470, the heat generated by the image projection device 200 (specifically, the light source assembly 220) can be quickly transferred to the profile heat sink 460 for heat dissipation.

[0130] It should be noted that Figure 10 The bold dashed line with an arrow in it represents the approximate direction of airflow in the housing assembly 100 .

[0131] In some embodiments, the tubular structure 470 may have a shorter length compared to the heat conductor 420 of the aforementioned embodiment to enhance the compactness of the combined structure of the heat dissipation component 400 and the image projection device 200 and reduce the structural space occupied by the heat dissipation component 400 and the image projection device 200 in the housing component 100.

[0132] For some examples, see Figure 11 The number of profile heat sinks 460 that establish thermal contact with the image projection device 200 through the tubular structure 470 can be one or more; for example, one profile heat sink 460 is in thermal contact with different heat source components (such as multiple light source assemblies 220, control board modules, etc.) of the image projection device 200 through one or more tubular structures 470; for another example, multiple profile heat sinks 460 correspond one-to-one to multiple tubular structures 470 and are in thermal contact with the image projection device 200 through the corresponding tubular structures 470; for another example, multiple profile heat sinks 460 are in thermal contact with the image projection device 200 through one tubular structure 470 at the same time.

[0133] For some examples, see Figure 10 and combined Figure 8 In the solution where the profile radiator 460 cooperates with the cooling fan 450 to dissipate heat, each profile radiator 460 can correspond to and be contacted with multiple light source assemblies 220 of the image projection device 200 through the corresponding heat collecting component 430, so that the heat collecting component 430 absorbs at least part of the heat generated by the light source assembly 220 and transfers the heat to the profile radiator 460 for dissipation.

[0134] Exemplarily, the heat collecting part 430 may include a copper substrate, and the profile heat sink 460 may be soldered to the side of the copper substrate facing away from the light source assembly 220 by means of low-temperature solder paste, while the space between the copper substrate and the light source assembly 220 is filled with thermal conductive materials such as thermal grease and thermal pads; in this way, the thermal conductive materials can be used to enhance the tightness of contact between the heat collecting part 430 and the light source assembly 220, thereby reducing the contact thermal resistance and improving the heat absorption efficiency of the heat collecting part 430; at the same time, by welding and fixing the profile heat sink 460 to the corresponding heat collecting part 430 (specifically, the copper substrate), the structural compactness and stability between the profile heat sink 460, the heat collecting part 430 and the light source assembly 220 can be effectively enhanced, thereby ensuring that the heat generated by the light source assembly 220 can be transferred to the profile heat sink 460 to the maximum extent.

[0135] In other embodiments, the heat collecting member 430 may be omitted, and the profile heat sink 460 may be attached and fixed to the backlight side of the light source assembly 220 , or a thermal conductive material may be filled between the profile heat sink 460 and the light source assembly 220 .

[0136] For some examples, see Figure 11 and combined Figure 8 Referring to the contact connection method between the heat conductor 420 and the light source assembly 220, a heat collector 430 can be installed between the heat-absorbing end of the tubular structure 470 and the backlight side of the light source assembly 220. This increases the contact area between the tubular structure 470 and the light source assembly 220, ensuring that the heat generated by the light source assembly 220 can be transferred to the tubular structure 470 through the heat collector 430 to the maximum extent possible, and then transferred to the profile heat sink 460 through the tubular structure 470 for dissipation. Alternatively, a cooling fan 450 can be added to drive airflow through the profile heat sink 460 and the tubular structure 470, thereby dissipating heat through convection.

[0137] In the solution based on the cooperation of the profile radiator 460 and the cooling fan 450 for heat dissipation, or in the solution based on the cooperation of the profile radiator 460 and the tubular structure 470 for heat dissipation. Figures 4 to 6 The image projection device 200 and the heat dissipation assembly 400 can be arranged inside the housing assembly 100. The heat dissipation fan 450 drives the air flow entering through the air inlet 100c of the housing assembly 100 to flow through the profile radiator 460 and then be discharged from the air outlet 100b of the housing assembly 100, thereby dissipating the heat inside the housing assembly 100 (specifically, the heat generated by the image projection device 200 and the heat absorbed by the profile radiator 460) to the outside of the housing assembly 100.

[0138] In specific implementation, the air outlet 100b of the shell assembly 100 can be set at a position where the X-ray beam limiter C does not face the object to be measured (for example, on the first shell wall or the third shell wall of the shell assembly 100); the cooling fan 450 can be arranged at a position close to the air inlet 100c or the air outlet 100b as needed, so as to discharge heat to the outside of the shell assembly 100 by positive pressure air supply or negative pressure exhaust.

[0139] It should be noted that the specific structures or types of the "profile heat sink 460 and profile heat dissipation structure" described in the embodiments of this application may include, but are not limited to, extruded profile heat sinks, semi-extruded profile semi-insert-type heat sinks, fin-jointed heat sinks, insert-type heat sinks, etc. In other words, the profile heat sink 460 can be selected and configured based on the processing technology, heat dissipation requirements, structural characteristics, and applicable scenarios. The specific structure of the profile heat sink 460 does not constitute a limitation on the X-ray beam limiter.

[0140] For one example, see Figure 12The heat dissipation component 400 dissipates heat for the image projection device 200 in the form of liquid circulation; specifically, the heat dissipation component 400 includes a heat dissipation radiator 481, a circulation pipeline 482, a circulation liquid pump 483 and a heat exchange cold head 484; wherein, the heat exchange cold head 484 is connected to the heat dissipation radiator 481 through the circulation pipeline 482 to form a closed loop circuit of cooling liquid (such as water), the heat exchange cold head 484 is in thermal contact with the image projection device 200, and the circulation liquid pump 483 is connected and arranged in the closed loop circuit.

[0141] Thus, the circulating liquid pump 483 can drive the coolant to circulate between the heat exchange cold head 484 and the heat dissipation radiator 481, thereby utilizing the thermal contact relationship between the heat exchange cold head 484 and the image projection device 200 to transfer at least part of the heat generated by the image projection device 200 to the heat dissipation radiator 481 for heat dissipation.

[0142] For some examples, see Figure 12 The heat exchange cold head 484 can adopt a hollow plate structure, and the heat dissipation radiator 481 can include a carrier plate 481a and a heat dissipation pipe group 481b, a liquid separation container 481c and a liquid collection container 481d arranged on the carrier plate 481a; wherein the heat exchange cold head 484 is connected in contact with the image projection device 200 (for example, the heat exchange cold head 484 is directly in contact with the light source component 220, or is in contact with the light source component 220 through the heat collecting component 430), and the cooling liquid inlet and the cooling liquid outlet of the heat exchange cold head 484 are connected through the circulation pipe The path 482 is respectively connected to the liquid separation container 481c and the liquid collection container 481d, and the heat dissipation tube group 481b is connected between the liquid collection container 481d and the liquid separation container 481c; the heat dissipation tube group 481b can be a plurality of heat dissipation tubes extending roughly along a straight path, a U-shaped path or a serpentine path, so as to extend the flow distance of the coolant in the heat dissipation radiator 481 or increase the area of ​​the coolant flowing through the heat dissipation radiator 481, so that the heat carried by the coolant can be fully dissipated in the process of flowing through the heat dissipation radiator 481.

[0143] In a specific implementation, the number of heat exchange cold heads 484 can be set to one, with one heat exchange cold head 484 simultaneously in thermal contact (e.g., in contact with) different parts of the image projection device 200 (e.g., the light source assembly 220, the control board module, etc.). The number of heat exchange cold heads 484 can also be set to multiple, for example, with multiple heat exchange cold heads 484 corresponding to and in contact with multiple light source components 220.

[0144] As for the circulating liquid pump 483, the circulating liquid pump 483 is built into the heat dissipation radiator 481, for example, the circulating liquid pump 483 is connected between the heat dissipation pipe group 481b and the liquid separation container 481c or between the heat dissipation pipe group 481b and the liquid collection container 481d; this can enhance the structural compactness of the heat dissipation component 400 and facilitate the structural disassembly and assembly between the heat dissipation component 400 and the image projection device 200.

[0145] The heat dissipation assembly 400 constructed based on the heat dissipation radiator 481, the circulation pipeline 482, the circulation liquid pump 483 and the heat exchange cold head 484 can also be arranged inside the shell assembly 100 together with the image projection device 200, and when the air flow is driven through the heat dissipation radiator 481 by the heat dissipation fan 450 arranged in the shell assembly 100, the heat inside the shell assembly 100 (specifically, such as the heat absorbed by the heat dissipation radiator 481) is quickly discharged to the outside of the shell assembly 100; as for the setting form of the heat dissipation fan 450 and the setting positions of the air inlet 100c and the air outlet 100d, please refer to the above-mentioned embodiment and will not be repeated here.

[0146] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art of the present invention can make some simple deductions, modifications or substitutions based on the concept of the present invention.

Claims

1. An X-ray beam limiter, characterized in that: include: The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured; An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light; an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image; a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device; The heat dissipation assembly includes a first heat dissipation member and a heat conductive member with a preset length. The heat conductive member has a heat absorbing end and a heat dissipating end at opposite ends in its length direction. The heat absorbing end of the heat conductive member is in thermal contact with the image projection device, and the heat dissipating end of the heat conductive member is in thermal contact with the first heat dissipation member. The heat conductive member can transfer at least part of the heat generated by the image projection device to the first heat dissipation member for heat dissipation.

2. The X-ray beam limiter according to claim 1, wherein: The heat conducting element includes one or more heat conducting bodies having the heat absorbing end and the heat dissipating end, and at least one of the heat conducting bodies is a columnar structure, a sheet structure or a tubular structure filled with a medium.

3. The X-ray beam limiter according to claim 2, wherein: The tubular structure is a phase-change heat pipe or a non-phase-change heat pipe.

4. The X-ray beam limiter according to claim 1, wherein: The image projection device comprises a projection lens and a plurality of light source assemblies capable of emitting visible light of different colors. The visible light emitted by the light source assemblies passes through the projection lens to form the imaging light. The heat absorbing end of the heat conductive member is in thermal contact with the light source assemblies.

5. The X-ray beam limiter according to claim 4, wherein: The heat conducting member includes a plurality of heat conductors having the heat absorbing end and the heat dissipating end. The plurality of heat conductors are arranged independently of each other, and each of the light source components is in thermal contact with at least one heat conductor.

6. The X-ray beam limiter according to claim 5, wherein: The image projection device has four light source assemblies, the number of the heat conductors is set to four, and the four light source assemblies are connected to the four heat conductors in a one-to-one correspondence.

7. The X-ray beam limiter according to claim 6, wherein: The four heat conductors are all phase change heat pipes.

8. The X-ray beam limiter according to claim 4, wherein: A heat collecting member is provided at the heat absorbing end of the heat conducting member, and the heat collecting member is in thermal contact with the backlight side of the light source assembly. The heat collecting member is used to absorb at least part of the heat generated by the light source assembly and transfer the heat to the heat conducting member.

9. The X-ray beam limiter according to claim 8, wherein: The heat collecting element includes a copper substrate; wherein the heat absorbing end of the heat conducting element is soldered to the side of the copper substrate facing away from the light source assembly through low-temperature solder paste, and / or a heat conducting material is filled between the copper substrate and the light source assembly.

10. The X-ray beam limiter according to claim 4, wherein: The heat dissipation assembly further includes a second heat dissipation member, which is in thermal contact with a heat source component other than the light source assembly in the image projection device.

11. The X-ray beam limiter according to claim 1, wherein: The first heat sink has a plurality of heat sink fins arranged side by side; the heat sink end of the heat conducting member is arranged along the arrangement direction of the heat sink fins and penetrates the plurality of heat sink fins.

12. The X-ray beam limiter according to claim 1, wherein: The imaging light adjustment assembly includes a reflector and an adjustment member; the reflector is arranged on the propagation path of the X-ray and is used to reflect the imaging light to form an image; the adjustment member is coupled to the reflector and is used to adjust the relative position of the reflector and the image projection device so that the light field of the image and the irradiation field of the X-ray remain overlapping.

13. The X-ray beam limiter according to any one of claims 1 to 12, wherein: The heat dissipation component and the image projection device are arranged inside the shell component, the heat dissipation component also includes a heat dissipation fan, and the shell component also has an air inlet and an air outlet that connect the interior of the shell component with the outside world; wherein, the heat dissipation fan is used to drive the airflow entering the interior of the shell component through the air inlet to be discharged from the air outlet, so that the airflow flows through the first heat dissipation component.

14. The X-ray beam limiter according to claim 13, wherein: In the flow direction of the airflow inside the housing assembly, the first heat dissipation member is arranged on the downstream side of the image projection device.

15. The X-ray beam limiter according to claim 13, wherein: The first heat sink has a channel structure, which is used to guide airflow to flow through the first heat sink. The heat dissipation fan is arranged on the first heat sink and is located on the air inlet side or the air outlet side of the channel structure.

16. The X-ray beam limiter according to claim 13, wherein: The housing assembly further comprises a first housing wall, a second housing wall and a third housing wall, wherein the first housing wall is arranged opposite to the second housing wall, and the third housing wall is connected between the first housing wall and the second housing wall; The X-ray inlet of the limiting channel is arranged through the first shell wall, the X-ray outlet of the limiting channel is arranged through the second shell wall, and the air outlet is arranged through the first shell wall or the third shell wall.

17. The X-ray beam limiter according to claim 16, wherein: The air outlet is arranged through the first shell wall, the air inlet is arranged through the second shell wall and / or the air inlet is arranged through the portion where the second shell wall and the third shell wall meet.

18. An X-ray beam limiter, characterized in that: include: The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured; An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light; an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image; a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device; In which, the heat dissipation component includes a cooling fan and multiple profile radiators, and the multiple profile radiators are independently in thermal contact with the image projection device; the cooling fan is used to drive air flow through the profile radiators so that at least part of the heat generated by the image projection device is transferred to the profile radiators for heat dissipation.

19. The X-ray beam limiter according to claim 18, wherein: The image projection device comprises a projection lens and a plurality of light source assemblies capable of emitting visible light of different colors. The visible light emitted by the light source assemblies forms the imaging light after passing through the projection lens. Each of the light source assemblies is in thermal contact with at least one of the profile heat sinks.

20. The X-ray beam limiter according to claim 19, wherein: The heat dissipation assembly further includes a heat collecting member, which is in thermal contact between the light source assembly and the profile heat sink. The heat collecting member is used to absorb at least part of the heat generated by the light source assembly and transfer the heat to the profile heat sink.

21. The X-ray beam limiter according to claim 20, wherein: The heat collecting element includes a copper substrate; wherein the profile heat sink is soldered to the side of the copper substrate facing away from the light source assembly by low-temperature solder paste; and / or a heat conducting material is filled between the copper substrate and the light source assembly.

22. The X-ray beam limiter according to claim 18, wherein: The imaging light adjustment assembly includes a reflector and an adjustment member; the reflector is arranged on the propagation path of the X-ray and is used to reflect the imaging light to form an image; the adjustment member is coupled to the reflector and is used to adjust the relative position of the reflector and the image projection device so that the light field of the image and the irradiation field of the X-ray remain overlapping.

23. The X-ray beam limiter according to any one of claims 18 to 22, wherein: The heat dissipation assembly and the image projection device are arranged inside the housing assembly, and the housing assembly further comprises a first housing wall, a second housing wall, a third housing wall, and an air inlet and an air outlet connecting the interior of the housing assembly with the outside; wherein: The first shell wall and the second shell wall are arranged opposite to each other; the third shell wall is connected between the first shell wall and the second shell wall to enclose the inner space of the housing assembly; The X-ray inlet of the limiting channel is set through the first shell wall, the X-ray outlet of the limiting channel is set through the second shell wall, the air outlet is set through the first shell wall or the third shell wall, and the cooling fan can drive the airflow entering the interior of the shell assembly through the air inlet to be discharged from the air outlet.

24. The X-ray beam limiter according to claim 23, wherein: The air outlet is arranged through the first shell wall, the air inlet is arranged through the second shell wall and / or the air inlet is arranged through the portion where the second shell wall and the third shell wall meet.

25. An X-ray beam limiter, characterized in that: include: The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured; An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light; an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image; a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device; In which, the heat dissipation component includes a profile radiator and a tubular structure with a preset length and filled with a medium. The tubular structure has a heat absorbing end and a heat dissipating end at opposite ends in its length direction. The heat absorbing end of the tubular structure is in thermal contact with the image projection device, and the heat dissipating end of the tubular structure is in thermal contact with the profile radiator. The tubular structure can transfer at least part of the heat generated by the image projection device to the profile radiator for heat dissipation.

26. An X-ray beam limiter, characterized in that: include: The housing assembly has a restriction passage extending through the housing assembly; the restriction passage is configured to allow X-rays emitted by the X-ray source to pass through the restriction passage to irradiate the object being measured; An image projection device, disposed in the housing assembly, configured to emit imaging light, wherein the imaging light includes visible light; an imaging light adjustment component, disposed on the housing component, and configured to allow the imaging light to pass through the restriction channel to form an image; a heat dissipation component for dissipating heat from the image projection device, wherein the heat dissipation component is at least partially in thermal contact with the image projection device; Among them, the heat dissipation component includes a heat exchange cold head, a heat dissipation radiator, a circulation pipeline and a circulating liquid pump. The heat exchange cold head and the heat dissipation radiator are connected through the circulation pipeline to form a closed loop of coolant. The heat exchange cold head is in thermal contact with the image projection device; the circulating liquid pump is connected and arranged in the closed loop, and is used to drive the coolant to circulate between the heat exchange cold head and the heat dissipation radiator to transfer at least part of the heat generated by the image projection device to the heat dissipation radiator for heat dissipation.

27. An X-ray imaging system, characterized in that: It comprises a head for emitting X-rays and a detector for receiving the X-rays emitted by the head; wherein the head comprises a bulb having an X-ray source and an X-ray beam limiter as described in any one of claims 1-26, and the bulb is arranged outside the shell assembly.

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