Device for separating diamond single crystals by using laser

Abstract

The utility model discloses a device for separating diamond single crystals by using laser, which comprises a fixed platform, an X-axis and Y-axis displacement platform, a Z-axis displacement platform, a laser cutting head, a light beam transmission component, a laser light source, a light beam shaper, a controller and a focus automatic tracking module, the Z-axis displacement platform is arranged on the support and suspended above the XY-axis displacement platform, a laser cutting head mounting base is arranged on the Z-axis displacement platform, the automatic focus tracking module is arranged on one side of the laser cutting head mounting base, the output end of the laser light source is connected with the input end of the beam shaper, and the output end of the laser light source is connected with the output end of the laser cutting head mounting base. The light beam transmission assembly is arranged between the output end of the light beam shaper and the laser cutting head. According to the device for separating the diamond single crystals by using the laser, the separation requirements of various shapes can be met, and the separation efficiency and the automation level of the diamond single crystals are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser separation, in particular to a device for separating diamond single crystals by utilizing laser. Background Art

[0002] Diamond single crystals are relatively hard and can be decomposed using lasers. A laser cutting head that can focus laser light emits high-temperature laser light to split the diamonds.

[0003] In the prior art, the utility model patent application number 2018209342900 discloses a device for laser cutting and separating single-crystal diamonds and polycrystalline diamonds. The height of the laser emitting device can be adjusted by an electric telescopic rod to improve the working efficiency of the laser emitting device. By moving the position of the electric telescopic rod left and right, several diamonds can be cut simultaneously. However, the electric telescopic rod can only move and cut in a straight line, resulting in a low degree of automation and a limited scope of application.

[0004] Furthermore, to improve the efficiency of diamond single crystal separation, a laser light source with a picosecond pulse width and ultra-high peak power can be used. This allows the laser to be focused inside the diamond single crystal, changing the propagation characteristics of the light and causing self-focusing. The laser transmits downward without diverging until the energy is insufficient to continue supporting the self-focusing phenomenon. This trace is left behind at the transmission point, causing the diamond single crystal to separate due to stress along the trace. This is the result of the diamond single crystal being modified by the laser. This laser separation method applied to diamond single crystals focuses the laser into a single point, unevenly, and is inefficient, requiring improvement. Utility Model Content

[0005] The purpose of the utility model is to provide a device for separating diamond single crystals using laser, thereby improving the separation efficiency and automation level of diamond single crystals.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A device for separating diamond single crystals using laser light comprises: a fixed platform, an XY-axis displacement platform, a Z-axis displacement platform, a laser cutting head, a beam transmission component, a laser light source, a beam shaper, a controller, and an automatic focus tracking module. The XY-axis displacement platform is disposed on the fixed platform, a bracket located on one side of the XY-axis displacement platform is disposed on the fixed platform, the Z-axis displacement platform is disposed on the bracket and suspended above the XY-axis displacement platform, a laser cutting head mounting seat is disposed on the Z-axis displacement platform, the laser cutting head is disposed in the laser cutting head mounting seat and points downwardly toward the XY-axis displacement platform, the automatic focus tracking module is disposed on one side of the laser cutting head mounting seat, an output end of the laser light source is connected to an input end of the beam shaper, the beam transmission component is disposed between the output end of the beam shaper and the laser cutting head, the automatic focus tracking module is connected to the controller for signal transmission, and the controller is respectively connected to the laser light source, the beam shaper, the XY-axis displacement platform, and the Z-axis displacement platform for operational control.

[0008] Wherein, the fixed platform adopts a marble platform.

[0009] Among them, a visual positioning module is set on the side of the laser cutting head mounting seat, and the visual positioning module is connected to the controller to send signals.

[0010] Wherein, a carrier is provided on the XY axis displacement platform, and the diamond single crystal is provided on the carrier.

[0011] Wherein, the output end of the beam transmission component extends vertically downward from above the laser cutting head mounting seat to the laser cutting head mounting seat.

[0012] Wherein, the laser light source and the beam shaper are respectively arranged on a bracket.

[0013] Wherein, the laser light source adopts a picosecond laser light source.

[0014] The beneficial effects of the present invention are as follows: a device for separating diamond single crystals using laser can drive the carrier and the diamond single crystal to move through the XY axis displacement platform, change the separation trajectory, and meet the separation needs of various shapes, and use the Z axis displacement platform to drive the laser cutting head to automatically rise and fall, thereby improving the adaptability to the thickness of the diamond single crystal and having a high degree of automation. The laser can also be shaped by the beam shaper, and the micron-level beam focused on a point is formed into a millimeter-level linear focused beam, which greatly improves the separation efficiency of the diamond single crystal. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2It is a schematic diagram of the control principle of the present utility model. DETAILED DESCRIPTION

[0017] The following combination Figures 1 and 2 The technical solution of the present utility model is further illustrated by specific embodiments.

[0018] like Figure 1 The device for separating diamond single crystals using lasers shown includes: a fixed platform 1, an XY-axis displacement platform 2, a Z-axis displacement platform 10, a laser cutting head 11, a beam transmission component 9, a laser light source 6, a beam shaper 7, a controller, and a focus automatic tracking module 5. The XY-axis displacement platform 2 is arranged on the fixed platform 1 and is driven by a servo motor, which has high precision.

[0019] In this embodiment, the fixed platform 1 is a marble platform with high stability. The XY axis displacement platform 2 is provided with a carrier 3, and the diamond single crystal 4 is placed on the carrier 3 and moves along the X and Y axis with the XY axis displacement platform 2 to meet the separation needs of various shapes.

[0020] A bracket 13 is provided on the fixed platform 1 and is located on one side of the XY-axis displacement platform 2. The Z-axis displacement platform 10 is provided on the bracket 13 and is suspended above the XY-axis displacement platform 2. A laser cutting head mounting seat 8 is provided on the Z-axis displacement platform 10. The Z-axis displacement platform 10 is driven by a servo motor to drive the lifting and lowering adjustment of the laser cutting head mounting seat 8, thereby improving the adaptability to the thickness of the diamond single crystal.

[0021] The laser cutting head 11 is set in the laser cutting head mounting seat 8 and points to the XY axis displacement platform 2 below. As the laser cutting head mounting seat 8 rises and falls, the distance between the laser cutting head 11 and the diamond single crystal 4 changes.

[0022] like Figure 1 As shown, the focus automatic tracking module 5 is set on one side of the laser cutting head mounting seat 8, and the focus automatic tracking module 5 is connected to the controller to send signals, as shown in FIG. Figure 2 As shown, the height change of the surface of the diamond single crystal 4 is detected by the focus automatic tracking module 5 to ensure that the laser focus is always maintained on the diamond single crystal 4, thereby improving the processing accuracy and efficiency.

[0023] In this embodiment, the laser light source 6 utilizes a picosecond laser source with a pulse width in the picosecond range and ultra-high peak power. The output of the laser light source 6 is connected to the input of the beam shaper 7. The beam transmission assembly 9, positioned between the output of the beam shaper 7 and the laser cutting head 11, transmits the shaped laser light to the laser cutting head 11, achieving linear focusing of the beam on the diamond single crystal 4 and improving cutting and separation efficiency.

[0024] like Figure 1 As shown, the output end of the beam transmission assembly 9 extends vertically downward from above the laser cutting head mounting seat 8 into the laser cutting head mounting seat 8. This not only transmits the shaped laser light to the laser cutting head 11, but also adapts to the slight rise and fall of the laser cutting head mounting seat 8. A visual positioning module 12 is provided on the side of the laser cutting head mounting seat 8. The visual positioning module 12 is connected to the controller to transmit signals. Visual inspection of the diamond single crystal 4 is performed through the visual positioning module 12, which facilitates the adjustment of the position of the diamond single crystal 4 via the XY axis displacement platform 2, thereby achieving automatic positioning.

[0025] The laser light source 6 and the beam shaper 7 are respectively arranged on the bracket 13 and fixed by screws, so that the structure is stable. Figure 2 As shown, the controller is connected to the laser light source 6, the beam shaper 7, the XY-axis displacement platform 2 and the Z-axis displacement platform 10 respectively, and can perform automatic operation control to improve the automation level and separation efficiency.

[0026] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there may be changes in the specific implementation methods and application scope. The content of this specification should not be understood as limiting the present invention.

Claims

1. A device for separating diamond single crystals using laser, which is used for separating diamond single crystals, characterized in that: include: A fixed platform, an XY-axis displacement platform, a Z-axis displacement platform, a laser cutting head, a beam transmission component, a laser light source, a beam shaper, a controller and a focus automatic tracking module. The XY-axis displacement platform is arranged on the fixed platform. A bracket located on one side of the XY-axis displacement platform is provided on the fixed platform. The Z-axis displacement platform is arranged on the bracket and suspended above the XY-axis displacement platform. A laser cutting head mounting seat is provided on the Z-axis displacement platform. The laser cutting head is arranged in the laser cutting head mounting seat and points to the XY-axis displacement platform downward. The focus automatic tracking module is arranged on one side of the laser cutting head mounting seat. The output end of the laser light source is connected to the input end of the beam shaper. The beam transmission component is arranged between the output end of the beam shaper and the laser cutting head. The focus automatic tracking module is connected to the controller for signal transmission. The controller is respectively connected to the laser light source, the beam shaper, the XY-axis displacement platform and the Z-axis displacement platform for operation control.

2. The device for separating diamond single crystals using laser according to claim 1, characterized in that: The fixed platform is a marble platform.

3. The device for separating diamond single crystals using laser according to claim 1, characterized in that: A visual positioning module is provided on the side of the laser cutting head mounting seat, and the visual positioning module is connected to the controller for signal transmission.

4. The device for separating diamond single crystals using laser according to claim 1, characterized in that: A carrier is provided on the XY axis displacement platform, and the diamond single crystal is provided on the carrier.

5. The device for separating diamond single crystals using laser according to claim 1, characterized in that: The output end of the beam transmission component extends vertically downward from above the laser cutting head mounting seat into the laser cutting head mounting seat.

6. The device for separating diamond single crystals using laser according to claim 1, characterized in that: The laser light source and the beam shaper are respectively arranged on a bracket.

7. The device for separating diamond single crystals using laser according to claim 1, characterized in that: The laser light source adopts a picosecond laser light source.

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