Taiko wafer reworking auxiliary mechanism

Abstract

The utility model provides a Taiko wafer reworking auxiliary mechanism, and belongs to the field of semiconductors. The Taiko wafer reworking auxiliary mechanism comprises a transparent bearing body, the transparent bearing body is provided with a hollow part, the hollow part penetrates through the transparent bearing body in the longitudinal direction, the transparent bearing body is used for supporting a wafer, a positioning platform penetrates through the hollow part to make contact with the wafer, and a positioning unit is used for positioning the wafer on the surface of the transparent bearing body. The number of the limiting mechanisms is multiple, the multiple limiting mechanisms are arranged in the circumferential direction of the transparent bearing body, and the limiting mechanisms are used for limiting the edge of a wafer. According to the utility model, the transparent bearing body is arranged, and the hollow part is arranged on the transparent bearing body. The positioning platform penetrates through the hollow part to be in contact with the wafer, and the transparent bearing body can play a role in supporting the wafer. Meanwhile, the positioning unit can position the edge position of the wafer, so that the reworking success rate of the wafer can be improved, and reworking is reduced. Besides, by arranging the limiting mechanism, the edge position of the wafer can be limited, so that the warping degree of the wafer can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a Taiko wafer rework auxiliary mechanism. Background Art

[0002] Metal Oxide Semiconductor (MOS) devices are widely used in portable electronic devices, automotive electronics, industrial control, lighting and other fields due to their low price, mature technology, fast switching speed and simple driving. In the final stage of device manufacturing, the wafer needs to be thinned to a specific thickness. When the entire 12-inch wafer is thinned to a thickness of less than 100 microns, the wafer becomes as soft as paper, and the transmission capacity of the equipment cannot meet the requirements of automatic production. To solve this problem, the industry uses a method of thinning only the inner area of ​​the wafer while retaining a few millimeters of the outer ring of the wafer as a flat support for the wafer. The wafers produced by this process are called Taiko thin wafers.

[0003] Currently, 12-inch Taiko wafers are mass-produced in the wafer manufacturing industry due to their advantages such as low fab manufacturing costs and short tape-out processes. However, after thinning, the warpage of Taiko wafers will increase by approximately 3mm. However, if the thinning machine fails during the thinning process, the roughness and distribution of the thinned surface of the wafer will vary greatly due to the incomplete rough grinding and fine grinding processes of the wafer, and the warpage of the wafer will increase to approximately 5mm. Due to the small positioning platform area of ​​the thinning machine, it cannot fully support the wafer, resulting in the inability to position the wafer. During rework, the wafer will be out of round, resulting in abnormal positioning and edge finding, and rework failure.

[0004] Taiko wafers that are not completely thinned due to abnormalities in the thinning machine are generally scrapped. Even if rework positioning is completed in the case of large warping, recognition errors may occur, causing damage to the edge of the wafer during processing. The wafer shatters inside the machine processing unit and still needs to be scrapped, which will cause damage to the machine, generate additional maintenance and cleaning costs, and require a lot of manpower.

[0005] It should be noted that the information disclosed in the background technology section of this utility model is only intended to deepen the understanding of the general background technology of the utility model, and should not be regarded as an admission or in any form of implication that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0006] The purpose of the utility model is to provide a Taiko wafer rework auxiliary mechanism to solve the problem that the positioning platform area of ​​the thinning machine is small, the wafer cannot be completely supported, and the edge of the wafer cannot be positioned, resulting in abnormal positioning and edge finding and positioning failure during wafer rework.

[0007] In order to solve the above technical problems, the present invention provides a Taiko wafer rework auxiliary mechanism, which is configured on a wafer thinning machine. The wafer thinning machine includes a positioning platform and a positioning unit. The positioning unit is configured on the positioning platform and includes:

[0008] A transparent carrier having a hollow portion, the hollow portion passing through the transparent carrier in a longitudinal direction, the transparent carrier being used to support a wafer, the positioning platform passing through the hollow portion and in contact with the wafer, and the positioning unit being used to position the wafer on the surface of the transparent carrier;

[0009] There are multiple limiting mechanisms, and the multiple limiting mechanisms are arranged along the circumferential direction of the transparent carrier. The limiting mechanisms abut against the edge positions of the wafer to limit the edge of the wafer.

[0010] Preferably, the plurality of limiting mechanisms are evenly distributed along the circumferential direction of the transparent carrier.

[0011] Preferably, the transparent carrier has a first end surface and a second end surface, the first end surface is configured to support a wafer, and a surface of the positioning platform in contact with the wafer along the longitudinal direction is in the same plane as the first end surface.

[0012] Preferably, the Taiko wafer rework assist mechanism also includes a base, which is installed on the second end face, and the diameter of the base is smaller than the diameter of the wafer to expose the edge position of the wafer. The base is configured to adjust the height of the first end face along the longitudinal direction so that the side of the positioning platform in contact with the wafer is in the same plane as the first end face along the longitudinal direction.

[0013] Preferably, the limiting mechanism includes a caster, and the caster includes a roller, and the roller abuts against the edge of the wafer to limit the edge of the wafer.

[0014] Preferably, the limiting mechanism includes a spring-type universal wheel, and the spring-type universal wheel includes a roller, and the roller abuts against the edge of the wafer to limit the edge of the wafer.

[0015] Preferably, the limiting mechanism further includes:

[0016] The lock includes a movable part and a fixed part, the movable part is connected to the spring-loaded universal wheel, and the fixed part is connected to the transparent carrier. The lock is configured so that when the lock is in a locked state, the spring-loaded universal wheel is fixed to the transparent carrier to limit the wafer. When the lock is in an unlocked state, the spring-loaded universal wheel rotates around the axial direction of the lock, and the spring-loaded universal wheel is separated from the transparent carrier to release the wafer from being limited.

[0017] Preferably, the diameter of the positioning platform along the transverse direction is smaller than the diameter of the hollow portion.

[0018] Preferably, the transparent carrier is made of acrylic material.

[0019] Preferably, the wafer has a step, and the step is located at the edge of the wafer.

[0020] Compared with the prior art, the Taiko wafer rework auxiliary mechanism of the present invention has the following advantages:

[0021] The utility model is provided with a transparent carrier, and a hollow portion is provided on the transparent carrier. The positioning platform passes through the hollow portion and contacts the wafer, and the transparent carrier can not only support the wafer. At the same time, the positioning unit can also locate the edge position of the wafer, thereby improving the rework success rate of the wafer and reducing rework. In addition, by providing a limiting mechanism, the edge position of the wafer can be limited, thereby reducing the warping of the wafer, reducing scrap, and improving the product yield. At the same time, it can also reduce labor costs, improve the rework success rate of the wafer, reduce rework, save rework time, reduce damage to the thinning machine caused by rework fragments, and reduce additional maintenance costs.

[0022] The wafer thinning machine provided by this utility model and the Taiko wafer rework assist mechanism provided by this utility model are based on the same utility model concept. Therefore, the positioning unit of the wafer thinning machine provided by this utility model can locate the edge of the wafer, thereby improving the success rate of wafer rework, reducing rework, and reducing wafer warpage and scrap. At the same time, it can also reduce labor costs, improve the success rate of wafer rework, save rework time, reduce damage to the thinning machine caused by rework fragments, and reduce additional maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the main structure of the Taiko wafer rework auxiliary mechanism in one embodiment of the present invention;

[0024] Figure 2 This is a schematic top view of the Taiko wafer rework assist mechanism in one embodiment of the present invention;

[0025] Figure 3 This is a bottom-view structural diagram of a Taiko wafer rework assist mechanism in one embodiment of the present invention;

[0026] In the figure,

[0027] 100-transparent carrier; 110-base;

[0028] 120-hollow portion; 130-first end surface;

[0029] 140-second end surface; 200-limiting mechanism;

[0030] 210-spring universal wheel; 220-lock;

[0031] 300-wafer; 310-step;

[0032] 400-Positioning platform. DETAILED DESCRIPTION

[0033] In order to make the purpose, advantages and features of the present invention clearer, the Taiko wafer rework auxiliary mechanism proposed in the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present invention in proportion, and the illustrative features used to illustrate certain principles of the present invention in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the present invention disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific application and use environment. In addition, in the embodiments described below, the same figure mark is sometimes used in common between different drawings to represent the same part or part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0036] The core idea of ​​the present invention is to provide a Taiko wafer rework auxiliary mechanism, which can provide support for the Taiko wafer that has not been completely thinned due to an abnormality in the thinning machine during rework, so as to position and find the edge of the wafer and prevent the problem of positioning failure during rework.

[0037] In order to realize the above idea, the utility model provides a Taiko wafer rework auxiliary mechanism, Figures 1 to 3 A specific embodiment of a Taiko wafer rework auxiliary mechanism disclosed. The Taiko wafer rework auxiliary mechanism is configured on a wafer thinning machine, the wafer thinning machine includes a positioning platform 400 and a positioning unit, the positioning unit is configured on the positioning platform 400, and includes: a transparent carrier 100, having a hollow portion 120, the hollow portion 120 is along the longitudinal direction (i.e., Figure 1 The direction of the arrow a in the figure) passes through the transparent carrier 100, and the transparent carrier 100 is used to support the wafer 300. The positioning platform 400 passes through the hollow portion 120 and contacts the wafer 300. The positioning unit (not shown in the figure) is used to position the wafer 300 on the surface of the transparent carrier 100. There are multiple limiting mechanisms 200, and the multiple limiting mechanisms 200 are arranged along the circumferential direction of the transparent carrier 100 (that is, Figure 2 The limiting mechanism 200 is arranged in the direction of the arrow c), and abuts against the edge of the wafer to limit the edge of the wafer 300.

[0038] Due to the small size of the existing positioning platform 400, it is unable to support and position the wafer 300 when the wafer needs to be reworked and thinned. This causes problems such as edge finding errors and positioning failures during rework. Furthermore, for 12-inch wafers, excessive warpage can occur due to their inherent thinness or uneven roughness of the back surface after grinding.

[0039] However, the Taiko wafer rework auxiliary mechanism disclosed in the present embodiment, by arranging a transparent carrier 100, and arranging a hollow portion 120 in the transparent carrier 100, the positioning platform 400 penetrates the hollow portion 120 and contacts with the wafer 300, and the transparent carrier 100 can not only play a supporting role to the wafer 300. At the same time, the positioning unit can also position the edge position of the wafer 300, thereby improving the rework success rate of the wafer 300 and reducing rework. In addition, by arranging a limiting mechanism 200, the edge position of the wafer 300 can be limited, thereby reducing the warpage of the wafer 300, reducing scrap, and improving product yield. At the same time, it is also possible to reduce labor costs, improve the rework success rate of the wafer 300, save rework time, reduce the damage to the thinning machine caused by the rework splinter fragments, and reduce additional maintenance costs.

[0040] The transparent carrier 100 is made of a transparent material, allowing the positioning unit to locate the edge of the wafer. Preferably, the transparent carrier 100 is made of acrylic. Because acrylic is lightweight, has high support strength, and is transparent, making the transparent carrier 100 of acrylic not only reduces the overall weight of the auxiliary mechanism but also provides support for the wafer 300. Simultaneously, the positioning unit can also locate the edge of the wafer 300. The positioning platform 400 can absorb the wafer 300 and drive it to rotate, thereby enabling the thinning machine to thin the wafer 300. Both the positioning unit and the positioning platform 400 are prior art. Those skilled in the art are familiar with their specific structures and principles, and will not be described in detail here. Since the wafer 300 is circular, the transparent carrier 100 is preferably cylindrical. Of course, the transparent carrier 100 can also be a rectangular parallelepiped, a cube, or other special-shaped structure, as long as it can provide support for the wafer 300.

[0041] The wafer 300 has a step 310 . The step 310 is located at the edge of the wafer 300 .

[0042] The hollow portion 120 is a hollow structure provided on the transparent carrier 100. The hollow portion 120 is provided coaxially with the transparent carrier 100. The positioning platform 400 is provided in the transverse direction (ie, Figure 1 The diameter of the wafer 300 is smaller than the diameter of the hollow portion 120. The positioning platform 400 can pass through the hollow portion 120 to absorb the wafer 300 and drive the wafer 300 to rotate, and the thinning machine thins the wafer 300.

[0043] For example, the plurality of limiting mechanisms 200 are arranged along the circumferential direction of the transparent carrier 100 (ie, Figure 2 The ions are evenly distributed in the direction of the arrow c in the middle.

[0044] Specifically, refer to Figure 1 and Figure 2 As shown, a plurality of limiting mechanisms 200 are provided, for example, two, three, or more. Furthermore, the plurality of limiting mechanisms 200 are evenly distributed along the circumference of the transparent carrier 100. Preferably, there are four limiting mechanisms 200, and the four limiting mechanisms 200 are evenly distributed along the circumference of the transparent carrier 100 to limit the edge of the wafer 300, thereby reducing the warpage of the wafer 300 that increases when suspended. Furthermore, the wafer 300 can be prevented from moving during the rotation and thinning process of the wafer 300.

[0045] As one embodiment, the limiting mechanism 200 includes a caster, and the caster includes a roller, and the roller abuts against the edge of the wafer 300 to limit the edge of the wafer 300. Figure 1 As shown, the casters are fixedly connected to the transparent carrier 100. When the positioning platform 400 drives the wafer 300 to rotate, the rollers can not only limit the edge of the wafer 300 but also slide on the surface of the wafer 300, thereby reducing damage to the wafer 300. By limiting the edge of the wafer 300, the warpage of the edge of the wafer 300 can be reduced.

[0046] As another embodiment, the limiting mechanism 200 includes a spring-type universal wheel 210, and the spring-type universal wheel 210 includes a roller, and the roller abuts against the edge position of the wafer 300 to limit the edge of the wafer 300. Figure 1 As shown, the limiting mechanism 200 includes a spring-type universal wheel 210. The spring-type universal wheel 210 is fixedly connected to the transparent carrier 100. The spring-type universal wheel 210 includes a roller (not shown in the figure) and a spring (not shown in the figure). When the positioning platform 400 drives the wafer 300 to rotate, the roller limits the edge of the wafer 300. Further, when the roller limits the wafer 300, the spring can be in the longitudinal direction (i.e., Figure 1 The wafer 300 is compressed and extended (in the direction indicated by arrow a), thereby strengthening the edge restraint of the wafer 300 and further reducing the warpage of the edge of the wafer 300. In addition, when the wafer 300 rotates, the elastic deformation of the wafer 300 in the longitudinal direction can further reduce damage to the wafer 300.

[0047] It should be noted that both the caster and the spring-type universal wheel 210 are prior art, and those skilled in the art are already familiar with their specific structures, which will not be described in detail herein. In this embodiment, the spring-type universal wheel 210 is preferably used as the limiting mechanism 200.

[0048] For example, Figure 1 As shown, the limiting mechanism 200 further includes a lock 220, which includes a movable portion (not shown) and a fixed portion (not shown), wherein the movable portion is connected to the spring-loaded universal wheel 210, and the fixed portion is connected to the transparent carrier 100. The lock 220 is configured such that when the lock 220 is in a locked state, the spring-loaded universal wheel 210 is fixed to the transparent carrier 100 to limit the position of the wafer 300. When the lock 220 is in an unlocked state, the spring-loaded universal wheel 210 rotates about the axial direction of the lock 220, and the spring-loaded universal wheel 210 is separated from the transparent carrier 100 to release the limit on the wafer 300. When the lock 220 is in an unlocked state, it is not only convenient to remove the wafer 300 from the transparent carrier 100, but also convenient to load the wafer 300 into the transparent carrier 100.

[0049] Exemplarily, the transparent carrier 100 has a first end surface 130 and a second end surface 140, wherein the first end surface 130 is configured to support the wafer 300 along the longitudinal direction (ie, Figure 1 The surface of the positioning platform 400 in contact with the wafer 300 (in the direction of the arrow a) is in the same plane as the first end surface 130.

[0050] Specifically, refer to Figures 1 to 3 As shown, the Taiko wafer rework auxiliary mechanism further includes a base 110, which is mounted on the second end surface 140, and the diameter of the base 110 is smaller than the diameter of the wafer 300 to expose the edge position of the wafer 300. The base 110 is configured to adjust the first end surface 130 along the longitudinal direction (ie, Figure 1 The positioning platform 400 is rotated to a height (in the direction indicated by arrow a) such that the surface of the positioning platform 400 in contact with the wafer 300 is flush with the first end surface 130 along the longitudinal direction. During the rotation of the positioning platform 400, the overall warpage of the wafer 300 to be reworked is significantly reduced, allowing it to remain flat like an unthinned wafer 300, allowing for normal positioning operations and subsequent processing.

[0051] To realize the above idea, this embodiment further discloses a wafer thinning machine, including the Taiko wafer rework auxiliary mechanism as described above.

[0052] The wafer thinning machine provided in this embodiment and the Taiko wafer rework assist mechanism provided in this utility model are based on the same utility model concept. Therefore, the positioning unit of the wafer thinning machine provided in this embodiment can locate the edge of the wafer 300, thereby improving the rework success rate of the wafer 300, reducing rework, and reducing the warpage of the wafer 300, thereby reducing scrap. At the same time, it can also reduce labor costs, improve the rework success rate of the wafer 300, save rework time, reduce damage to the thinning machine caused by rework fragments, and reduce additional maintenance costs.

[0053] In summary, the above embodiments provide a detailed description of the different configurations of the Taiko wafer rework assist mechanism. Of course, the above description is only a description of the preferred embodiment of the present invention, and is not any limitation to the scope of the present invention. The present invention includes but is not limited to the configurations listed in the above embodiments. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A Taiko wafer rework auxiliary mechanism, configured on a wafer thinning machine, wherein the wafer thinning machine comprises a positioning platform and a positioning unit, wherein the positioning unit is configured on the positioning platform, characterized in that: include: A transparent carrier having a hollow portion, the hollow portion passing through the transparent carrier in a longitudinal direction, the transparent carrier being used to support a wafer, the positioning platform passing through the hollow portion and in contact with the wafer, and the positioning unit being used to position the wafer on the surface of the transparent carrier; There are multiple limiting mechanisms, and the multiple limiting mechanisms are arranged along the circumferential direction of the transparent carrier. The limiting mechanisms abut against the edge positions of the wafer to limit the edge of the wafer.

2. The Taiko wafer rework assist mechanism according to claim 1, characterized in that: The plurality of limiting mechanisms are evenly distributed along the circumferential direction of the transparent carrier.

3. The Taiko wafer rework assist mechanism according to claim 1, characterized in that: The transparent carrier has a first end surface and a second end surface, the first end surface is configured to support a wafer, and a surface of the positioning platform in contact with the wafer along the longitudinal direction is in the same plane as the first end surface.

4. The Taiko wafer rework assist mechanism according to claim 3, characterized in that: The Taiko wafer rework auxiliary mechanism also includes a base installed on the second end face, the diameter of the base is smaller than the diameter of the wafer to expose the edge position of the wafer, and the base is configured to adjust the height of the first end face along the longitudinal direction so that the side of the positioning platform in contact with the wafer is in the same plane as the first end face along the longitudinal direction.

5. The Taiko wafer rework assist mechanism according to claim 1, characterized in that: The limiting mechanism includes a caster, and the caster includes a roller. The roller abuts against the edge of the wafer to limit the edge of the wafer.

6. The Taiko wafer rework assist mechanism according to claim 1, characterized in that: The limiting mechanism includes a spring-type universal wheel, and the spring-type universal wheel includes a roller. The roller abuts against the edge of the wafer to limit the edge of the wafer.

7. The Taiko wafer rework assist mechanism according to claim 6, characterized in that: The limiting mechanism also includes: The lock includes a movable part and a fixed part, the movable part is connected to the spring-loaded universal wheel, and the fixed part is connected to the transparent carrier. The lock is configured so that when the lock is in a locked state, the spring-loaded universal wheel is fixed to the transparent carrier to limit the wafer. When the lock is in an unlocked state, the spring-loaded universal wheel rotates around the axial direction of the lock, and the spring-loaded universal wheel is separated from the transparent carrier to release the wafer from being limited.

8. The Taiko wafer rework assist mechanism according to claim 1, wherein: The diameter of the positioning platform along the transverse direction is smaller than the diameter of the hollow portion.

9. The Taiko wafer rework assist mechanism according to claim 1, characterized in that: The transparent carrier is made of acrylic material.

10. The Taiko wafer rework assist mechanism according to claim 1, wherein: The wafer has a step, and the step is located at the edge of the wafer.

Images