Wafer drying system
By adopting a combination of swing elements and blowing units in the wafer drying system, the problem of incomplete wafer drying is solved, and efficient drying and high-quality wafer processing are achieved.
Patent Information
- Application Number
- CN202422629097.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-30
AI Technical Summary
In existing wafer drying technology, the contact part between the clamping device and the wafer is difficult to completely dry, resulting in residual water, which affects the wafer quality and drying efficiency.
Multiple clamping devices are used, including swing elements, clamping elements and supporting elements. The swing mechanism switches between the pick-and-place position and the clamping position, reducing the contact area between the wafer and the clamping device, and using the blowing unit to accelerate the drying process.
Effectively avoid residual water, improve drying efficiency, ensure wafer quality, and reduce the risk of scratches on the wafer surface.
Smart Images
Figure CN223400084U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a drying system, in particular to a wafer drying system for drying wafers. Background Art
[0002] During the wafer processing process, cleaning and post-cleaning drying are essential steps to ensure wafer production quality. The purpose of drying is to remove moisture from the wafer surface and other contaminants that may affect the process, thereby ensuring the accuracy of the manufacturing process and the quality of the product.
[0003] There are many drying methods, such as spin drying, heat drying, or blow drying. Spin drying means that the wafer is rotated at high speed and the centrifugal force is used to eject moisture. Heat drying is to place the wafer in a heated furnace and evaporate the moisture at high temperature. Blow drying means using a dry gas (such as nitrogen) to dry the wafer surface.
[0004] Taking the spin drying process as an example, conventional wafer clamping devices support the substrate on a clamping seat, creating a contact area between the bottom surface of the wafer and the clamping seat. During the rotation process, the side edge of the wafer is secured by a clamp. After the spin drying process is complete, the contact area does not remove moisture from the rotation process, resulting in residual water. This leads to incomplete drying, affecting wafer quality and even the cleanliness of subsequent transfer units. This means that the moisture in the contact area is difficult to dry, requiring longer drying times and lowering drying efficiency. Furthermore, the subsequent placement of the next wafer directly contacts the contact area with residual water, further impacting its quality. Utility Model Content
[0005] The purpose of the utility model is to provide a wafer drying system that does not produce residual water, improves the efficiency of drying wafers, and thus improves the quality of wafers.
[0006] The utility model provides a wafer drying system suitable for drying a wafer, characterized in that the wafer drying system comprises:
[0007] a rotating base defining a rotation axis;
[0008] A plurality of fulcrum seats are respectively arranged on the rotating base around the rotating axis;
[0009] a plurality of clamping devices, each comprising a swinging element, a clamping element, and a supporting element; each swinging element is pivotally connected to its corresponding fulcrum seat by a first pivot; an upper section of each swinging element is connected to the clamping element and the supporting element; the clamping element has a recess, the supporting element has a pick-and-place point adjacent to the recess, and the supporting element is closer to the rotation axis than the clamping element; and
[0010] A plurality of actuating devices are respectively provided on the rotating base, each of the actuating devices drives a lower section of the corresponding swing element, so that the swing element can swing around the first pivot, thereby causing the plurality of clamping devices to swing between a pick-up position and a clamping position;
[0011] When the multiple clamping devices are in the pick-and-place position, the pick-and-place point of each supporting element can contact the lower surface of the wafer; when the multiple clamping devices are in the clamping position, the recess of each clamping element can clamp a side edge of the wafer.
[0012] In the wafer drying system, the swing element in each clamping device is integrally formed with one of the clamping element and the supporting element.
[0013] The wafer drying system, wherein: the horizontal distance between the pick-up and placement point and a corresponding recess point of the recess ranges from 0.8mm to 1.8mm, and the height distance between the pick-up and placement point and the corresponding recess point of the recess ranges from 0mm to 0.6mm.
[0014] The wafer drying system, wherein: the actuating device includes a cylinder and a transfer rod, the cylinder drives the transfer rod, the transfer rod is pivotally connected to the lower section of the swing element via a second pivot, the cylinder drives the transfer rod to move in a horizontal direction to drive the swing element to rotate around the second pivot.
[0015] The wafer drying system further comprises a blowing unit and an axis portion, wherein the axis portion is arranged on the rotating base, and the blowing unit provides a gas to the lower surface of the wafer via the axis portion.
[0016] A wafer drying system is suitable for drying a wafer, characterized in that the wafer drying system comprises:
[0017] a rotating base defining a rotation axis;
[0018] A plurality of fulcrum seats are respectively arranged on the rotating base around the rotating axis;
[0019] A plurality of clamping devices, each comprising a swinging element, a clamping element, and a supporting element, each swinging element being pivotally connected to its corresponding fulcrum seat by a first pivot, an upper section of each swinging element being connected to the clamping element and the supporting element, the clamping element being provided with a recess, the supporting element being provided with a pick-and-place point adjacent to the recess, and the supporting element being closer to the rotation axis than the clamping element;
[0020] a turntable disposed on the rotating base, the turntable being concentric with the rotating axis and having a plurality of driving members; and
[0021] At least one actuating device is respectively provided on the rotating base, each actuating device drives the turntable respectively, so that each driving member drives the lower section of the corresponding swing element respectively, so that the swing element can swing around the first pivot, thereby causing the multiple clamping devices to swing between a pick-up position and a clamping position;
[0022] When the multiple clamping devices are in a pick-up and placement position, the pick-up and placement point of each supporting element can contact the lower surface of the wafer; when the multiple clamping devices are in a clamping position, the recess of each clamping element can clamp a side edge of the wafer.
[0023] In the wafer drying system, the swing element in each clamping device is integrally formed with one of the clamping element and the supporting element.
[0024] The wafer drying system, wherein: the horizontal distance between the pick-up and placement point and a corresponding recess point of the recess ranges from 0.8mm to 1.8mm, and the height distance between the pick-up and placement point and the corresponding recess point of the recess ranges from 0mm to 0.6mm.
[0025] In the wafer drying system, the driving component is an arc groove or a cam.
[0026] The wafer drying system further comprises a blowing unit and an axis portion, wherein the axis portion is arranged on the rotating base, and the blowing unit provides a gas to the lower surface of the wafer via the axis portion.
[0027] Based on the above, the two components of the clamping element and the supporting element of the present invention are responsible for different functions respectively. When in the pick-up and placement position, the lower surface of the wafer is placed on the supporting element, and when in the clamping position, the lower surface of the wafer will be separated from the supporting element during the spin-drying process, and the side edge of the wafer will be clamped by the clamping element, which limits the wafer in the axial and radial directions. During the spin-drying process, the wafer is fixed with a minimum contact area. Water droplets will be thrown off when the wafer is spun dry, and there will be no residual water. The efficiency of drying the wafer is improved, and the quality of the wafer is thereby improved.
[0028] In order to make the present invention more clearly understood, embodiments are listed below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a three-dimensional schematic diagram of an embodiment of a wafer drying system according to the present invention.
[0030] Figure 2 It is a cross-sectional schematic diagram of an embodiment of a wafer drying system according to the present invention.
[0031] Figure 3 A schematic cross-sectional view of the clamping device according to the present invention at the pick-and-place position.
[0032] Figure 4 It is a cross-sectional schematic diagram of the clamping device according to the present invention at the clamping position.
[0033] Figure 5 It is a partial three-dimensional schematic diagram of the clamping device according to the present invention in the pick-and-place position.
[0034] Figure 6 It is a partially enlarged schematic diagram of the clamping element and the supporting element according to the present invention.
[0035] Figure 7 It is a partial cross-sectional schematic diagram of an embodiment of the actuating device according to the present invention.
[0036] Figure 8A and Figure 8B They are schematic diagrams of an embodiment of an actuating device in another embodiment of a wafer drying system according to the present invention.
[0037] Figure 9 FIG. 1 is a schematic diagram of another embodiment of an actuating device in another embodiment of a wafer drying system according to the present invention.
[0038] Explanation of reference numerals: 50 - wafer; 52 - upper surface; 54 - lower surface; 56 - side edge; 100, 200, 300 - wafer drying system; 110 - rotating base; 112 - rotation axis; 120 - fulcrum seat; 130 - clamping device; 132 - swing element; 132A - upper section; 132B - lower section; 134 - clamping element; 134A - recess; 134B - recess point; 136 - supporting element; 136A - pick-up and placement point; 140, 240 - actuator; 142 - cylinder; 1 44-transfer rod; 150-axial part; 152A-air supply part; 152B-air transmission pipeline; 152C-air chamber; 154A-blowing part; 154B-blowing pipeline; 160-blowing unit; 270-turntable; 272, 372-driving member; A1-first pivot; A2-second pivot; AD-height distance; B1-fixing element; BD-outlet part; GA-gas; HD-horizontal distance; HR-horizontal direction; PA-clamping position; PB-pick-up and place position; SA-end face; SB-side face. DETAILED DESCRIPTION
[0039] The following examples are illustrated in detail with accompanying figures. However, these examples are not intended to limit the scope of the present invention. Furthermore, the figures are for illustrative purposes only and are not drawn to scale. For ease of understanding, identical components will be designated with the same reference numerals throughout the following description.
[0040] The terms “including”, “comprising”, “having”, etc. mentioned in this utility model are open terms, which means “including but not limited to”.
[0041] In the description of each embodiment, when terms such as “first,” “second,” “third,” and “fourth” are used to describe elements, they are only used to distinguish these elements from one another and do not limit the order or importance of these elements.
[0042] In the description of each embodiment, the so-called "coupling" or "connection" may refer to two or more elements making direct physical or electrical contact with each other, or making indirect physical or electrical contact with each other, and "coupling" or "connection" may also refer to two or more elements operating or acting on each other.
[0043] Figure 1 It is a three-dimensional schematic diagram of an embodiment of a wafer drying system according to the present invention. Figure 2 It is a cross-sectional schematic diagram of an embodiment of a wafer drying system according to the present invention. Figure 3 A schematic cross-sectional view of the clamping device according to the present invention at the pick-and-place position. Figure 4 It is a cross-sectional schematic diagram of the clamping device according to the present invention at the clamping position. Figure 5This is a partial perspective view of the clamping device according to the present invention in the pick-up and placement position. Figures 1 to 5 As shown, the present invention provides a wafer drying system 100 suitable for drying a wafer 50. The wafer 50 includes an upper surface 52, a lower surface 54 opposite thereto, and a side edge 56. The wafer drying system 100 includes a rotating base 110, a plurality of fulcrums 120, a plurality of clamping devices 130, a plurality of actuators 140, a shaft 150, and an air blowing unit 160. The air blowing unit 160 can be optionally added based on actual needs to accelerate the drying of the wafer 50. The shaft 150 is disposed on the rotating base 110, and the air blowing unit 160 is disposed within the shaft 150.
[0044] The rotating base 110 defines a rotating axis 112, and the shaft portion 150 is coaxial with the rotating axis 112. These fulcrum seats 120 are respectively arranged on the rotating base 110 around the rotating axis 112. For example, the rotating base 110 may be a base with four legs, and the four fulcrum seats 120 are respectively arranged at the positions of the four legs, and the rotating axis 112 is the rotation center of the rotating base 110. In other embodiments not shown in the figure, the shape of the rotating base 110 and the number of the fulcrum seats 120 can be adjusted according to actual conditions, such as if the rotating base is a circular base, and the rotating axis can be the center of the rotating base. In addition, the rotating axis 112 can be a solid element, which is as follows Figure 1 As shown, the rotation axis 112 is a protruding element provided at the center of the rotation base 110; alternatively, the rotation axis 112 may be a dotted line; alternatively, the rotation axis 112 may be both a dotted line and a solid element, as shown in FIG. Figure 1 The embodiment shown.
[0045] The clamping devices 130 of the present invention are disposed correspondingly to the fulcrum seats 120. Each clamping device 130 includes a swinging element 132, a clamping element 134, a supporting element 136, a first pivot axis A1, and a second pivot axis A2. Each swinging element 132 is pivotally connected to its corresponding fulcrum seat 120 via the first pivot axis A1, allowing the swinging element 132 to swing relative to the fulcrum seat 120 about the first pivot axis A1. The swinging element 132 has an upper section 132A and a lower section 132B opposite the upper section 132A. The first pivot axis A1 is located at the upper section 132A. In other embodiments (not shown), the first pivot axis A1 may be located between the upper section 132A and the lower section 132B, or at other appropriate locations, and can be adjusted according to actual conditions. It should be noted that the upper section 132A and the lower section 132B are relative positions and do not refer to the top or bottom of a certain element. In one description, the upper section 132A and the lower section 132B of the swing element 132 can be replaced by the first section and the second section.
[0046] The upper section 132A of each swinging element 132 is connected to a clamping element 134 and a supporting element 136. The clamping element 134 is used to clamp the side edge 56 of the wafer 50, while the supporting element 136 is used to support the wafer 50. In other words, the clamping element 134 and the supporting element 136 have different functions. The supporting element 136 is closer to the rotation axis 112 than the clamping element 134. In other words, with the rotation axis 112 as the center, the radial distance between the supporting element 136 and the rotation axis 112 is smaller than the distance between the clamping element 134 and the rotation axis 112. In one embodiment, the clamping element 134 is provided on an end surface SA of the upper section 132A of the swing element 132, and the clamping element 134 and the swing element 132 are integrally formed. In other embodiments not shown, the clamping element 134 and the swing element 132 are not integrally formed, and the clamping element 134 and the swing element 132 are assembled together using a fixing element; the supporting element 136 is provided on the side surface SB of the upper section 132A of the swing element 132, and uses at least one (such as Figures 3 to 5 The two fixing elements B1 of FIG. 1 and FIG. 2 assemble the supporting element 136 and the swinging element 132 together. In other embodiments not shown, the supporting element 136 and the swinging element 132 are integrally formed, without the need for additional fixing elements. Thus, it can be seen that the swinging element 132 in the clamping device 130 of the present invention can be integrally formed with either the clamping element 134 or the supporting element 136. Of course, if assembly efficiency is considered, the swinging element 132, the clamping element 134, and the supporting element 136 can be manufactured in an integral manner, while the resulting technical benefits of supporting and clamping still fall within the scope of the present invention.
[0047] Figure 6 This is a partially enlarged schematic diagram of the clamping element and the supporting element according to the present invention. Figure 6As shown, the clamping element 134 is provided with a recess 134A, which is, for example, formed by being sunken in the surface of the clamping element 134. The supporting element 136 is provided with a pick-up and placement point 136A, which is, for example, the top surface position of the supporting element 136. The pick-up and placement point 136A is adjacent to the recess 134A. More specifically, the recess 134A is provided with a recess point 134B to facilitate the calculation of the adjacent distance. The horizontal distance HD between the pick-up and placement point 136A of the supporting element 136 and the recess 134A of the corresponding clamping element 134 is 1.3mm±0.5mm, that is, the horizontal distance HD between the pick-up and placement point 136A and the recess point 134B is in the range of 0.8mm to 1.8mm, and the supporting element 1 The height distance AD between the pick-up and placement point 136A of 36 and the recess 134A of the corresponding clamping element 134 is 0.3mm±0.3mm, that is, the height distance AD between the pick-up and placement point 136A and the recess point 134B ranges from 0mm to 0.6mm, and the pick-up and placement point 136A is higher or higher than the recess point 134B, so that during the swinging process, the wafer 50 can be smoothly supported by the supporting element 136 or clamped by the clamping element 134.
[0048] Please refer to Figures 1 to 5 As shown, these actuators 140 are respectively disposed on the rotating base 110. These actuators 140 have corresponding clamping devices 130, that is, each actuator 140 corresponds to and drives a clamping device 130. Each actuator 140 drives the lower section 132B of the corresponding swing element 132. The lower section 132B of the swing element 132 is moved, so that the swing element 132 can swing around the first pivot A1, thereby causing these clamping devices 130 to swing between a clamping position PA and a pick-and-place position PB, wherein, as shown in FIG. Figure 3 As shown, the wafer 50 can be transferred by a robot arm or other transmission element (not shown). When the clamping device 130 is at the pick-and-place position PB, the pick-and-place point 136A of the supporting element 136 can contact the lower surface 54 of the wafer 50, while the side edge 56 of the wafer 50 does not contact the recess 134A of the clamping element 134 at this time. This is because although the pick-and-place point 136A is adjacent to the recess 134A, it has Figure 6 The horizontal distance HD shown in FIG. 1 is that the present invention can adjust the horizontal distance HD according to the actual size of the wafer 50. On the other hand, based on the thickness of the wafer 50, the horizontal distance HD can also be adjusted as shown in FIG. Figure 6 The height distance AD shown ensures that when the lower surface 54 of the wafer 50 is placed on the pick-and-place point 136A of the supporting element 136 , the side edge 56 of the wafer 50 does not contact the recess 134A of the clamping element 134 .
[0049] Then, each actuator 140 drives the lower section 132B of the corresponding swing element 132, so that the swing element 132 can swing around the first pivot axis A1 relative to the fulcrum seat 120 toward the side edge 56 of the wafer 50, so that the clamping device 130 can be adjusted as shown in FIG. Figure 3 or Figure 5 The pick and place position PB shown is converted to Figures 1 to 2 ,or Figure 4 As shown in the clamping position PA, when the clamping device 130 is in the clamping position PA, the recess 134A of the clamping element 134 can clamp the side edge 56 of the wafer 50, and at this time the lower surface 54 of the wafer 50 does not contact the pick-up and placement point 136A of the supporting element 136. This is because the pick-up and placement point 136A is adjacent to the recess 134A, but has a Figure 6 The height distance AD shown in the figure allows the lower surface 54 of the wafer 50 to gradually separate from the pick-up and placement point 136A of the supporting element 136 during the swinging process of the swing element 132. It is worth noting that since the contact area between the pick-up and placement point 136A and the lower surface 54 of the wafer 50 is very small, it is best to have a point contact like a needle tip, which not only helps to reduce the adhesion of liquid to the wafer 50, but also avoids scratching the wafer 50. In addition, the clamping element 134 can be processed by turning to produce a circular recess 134A, which can be used as a reference. Figure 5 In the state shown, the side edge 56 of the wafer 50 can be clamped with a relatively small contact area. That is, the circular recess 134A clamps the side edge 56 of the wafer 50 in a nearly point contact manner. This not only helps to reduce the amount of liquid adhering to the wafer 50, but also avoids scratching the wafer 50. The nearly point contact method is based on processing accuracy. Of course, in the thickness direction of the wafer 50, it will be a line contact formed by the point contact, which is first stated here.
[0050] Next, the spin base 110 rotates about the rotation axis 112, and during this rotation, water or liquid on the upper surface 52 of the wafer 50 is removed, thereby drying the wafer 50. After the spin-drying process is completed, since the lower surface 54 of the wafer 50 does not contact the pick-up and placement points 136A of the supporting element 136 during the spin-drying process, the aforementioned rotation process can also remove water droplets or liquid on the pick-up and placement points 136A of the supporting element 136, without any residual water or liquid. At the same time, as described above, the recessed portion 134A of the clamping element 134 and the side edge 56 of the wafer 50 are in point contact or line contact. In this way, the side edge 56 of the wafer 50 limits the wafer 50 in the axial and radial directions, and during the spin-drying process, the wafer 50 is fixed with a minimum contact area. Water droplets or liquid are removed during the spin-drying process, without any residual water or liquid, thereby improving the efficiency of drying the wafer 50 and thereby improving the quality of the wafer 50.
[0051] Then, when the spin-drying process is completed, each actuator 140 drives the lower section 132B of the corresponding swing element 132, so that the swing element 132 can swing around the first pivot axis A1 relative to the fulcrum seat 120 in the opposite direction of the side edge 56 of the wafer 50, so that the clamping device 130 is Figures 1 to 2 ,or Figure 4 The clamping position PA shown is converted to Figure 3 or Figure 5 The pick-and-place position PB shown in FIG. 1 is switched. That is, when the actuator 140 is actuated in the reverse direction, causing the clamping device 130 to swing from the clamping position PA to the pick-and-place position PB, the recess 134A of the clamping element 134 disengages from the side edge 56 of the wafer 50, and the pick-and-place point 136A of the supporting element 136 gradually provides support or abutment to the lower surface 54 of the wafer 50. At this time, no residual water or liquid will be present on the pick-and-place point 136A of the supporting element 136. Therefore, when the lower surface 54 of the wafer 50 contacts the pick-and-place point 136A of the supporting element 136, no water droplets or liquid will adhere to the lower surface 54 of the wafer 50. The wafer 50 can then be removed using a robotic arm or other transport device.
[0052] Figure 7 This is a partial cross-sectional diagram of an embodiment of the actuating device according to the present invention. Figures 2 to 4 、 Figure 7 As shown, for example, the actuator 140 includes a cylinder 142 and a transmission rod 144. The cylinder 142 is connected to the transmission rod 144. The transmission rod 144 is pivotally connected to the lower section 132B of the swing element 132 via the second pivot axis A2, so that one end of the transmission rod 144 can be linked to the lower section 132B of the swing element 132. The cylinder 142 drives the transmission rod 144 to move in a horizontal direction HR, thereby driving the swing element 132 to rotate via the second pivot axis A2. At the same time, the swing element 132 can swing about the first pivot axis A1 relative to the fulcrum base 120.
[0053] In one embodiment, the axis portion 150 includes an air supply portion 152A, an air delivery pipe 152B, and an air chamber 152C, wherein one end of the air delivery pipe 152B is connected to the air supply portion 152A, and the other end of the air delivery pipe 152B is connected to the air chamber 152C. The air chamber 152C is connected to the cylinder 142, thereby inputting gas into the air supply portion 152A, through the air delivery pipe 152B and the air chamber 152C, as a power driving source for the cylinder 142.
[0054] Please refer back to Figure 2As shown, the air blowing unit 160 provides gas GA to the lower surface 54 of the wafer 50 via the axis portion 150. Specifically, the axis portion 150 includes a air blowing portion 154A and a air blowing line 154B. The air blowing portion 154A is connected to the air blowing line 154B, which is in turn connected to the air blowing unit 160. An outlet BD of the air blowing unit 160 protrudes above the spin base 110. The outlet BD can be a nozzle. In this configuration, gas GA flows into the air blowing portion 154A, is transmitted to the air blowing unit 160 via the air blowing line 154B, and is released from the outlet BD to provide gas GA to the lower surface 54 of the wafer 50, thereby accelerating drying.
[0055] Figure 8A and Figure 8B are schematic diagrams of an embodiment of an actuator in another embodiment of a wafer drying system according to the present invention, and for the sake of convenience in explaining the differences, Figure 8A and Figure 8B Only the above Figures 1 to 7 See the difference between the embodiments of Figure 8A As shown, the wafer drying system 200 of the present invention is similar in technical content to the aforementioned wafer drying system 100, and the main difference lies in the different actuation method of the clamping device 130. The same components are first stated, and their component names and component symbols are used, and their technical features and functions are not repeated here; the wafer drying system 200 disclosed in this embodiment also includes a turntable 270. The turntable 270 is arranged on the rotating base 110 (indicated by a circular dotted line) and is concentric with the rotation axis 112. The turntable 270 is provided with a plurality of driving members 272. Each actuator 240 (indicated by a square dotted line) drives the turntable 270 respectively, and each driving member 272 drives the lower section 132B (such as the lower section 132B) of the corresponding swing element 132 respectively. Figures 2 to 4 As shown), the swing element 132 can swing around the first pivot A1, and the clamping devices 130 swing between the clamping position PA and the pick-and-place position PB, wherein Figure 8A When the swing element 132 is in the clamping position, Figure 8B The swing element 132 is in the pick-and-place position; Figure 8A As shown, the swing element 132 is located at the clamping position PA, that is, the actuator 240 drives the turntable 270 to rotate around the rotation axis 112, thereby driving each driving member 272 to move the corresponding swing element 132, so that the lower section 132B of the swing element 132 is relatively away from the rotation axis 112 in the radial direction. At this time, the swing element 132 swings around the first pivot A1, and its state is as follows. Figure 4 or Figure 7As shown; conversely, when the actuator 240 drives the turntable 270 in the opposite direction, each driving member 272 drives the lower section 132B of the swinging element 132 radially closer to the rotation axis 112, thereby positioning the clamping devices 130 at the pick-and-place position PB. It is also noted that the aforementioned actuator 240 can be a single one to drive the turntable 270 to rotate; however, it can also be a plurality of actuators. Considering rotational inertia, they can be arranged equidistantly on the rotating base 110 about the rotation axis 112. Furthermore, the actuator 240 can be a motor or a cylinder coupled with a transmission element such as a gear or screw to drive the turntable 270 to rotate.
[0056] The driving member 272 of this embodiment is selected as a cam as an example, but it does not limit the scope of implementation of the present invention. Figure 9 As shown, the difference between the wafer drying system 300 of the present invention and the wafer drying system 200 of the present invention is that the driving member 372 is selected as an arc-shaped groove as an example; the lower section 132B of the swing element 132 is limited by the driven member (arc-shaped groove) 372, and as the turntable 270 rotates, the radial distance of the lower section 132B of the movable swing element 132 relative to the rotation axis 112 is changed, thereby achieving the effect of causing the movable swing element 132 to swing around the first pivot A1, so that these clamping devices 130 can swing between the clamping position PA and the pick-and-place position PB.
[0057] In summary, the clamping element and the supporting element of the present invention are responsible for different functions respectively. When in the pick-up and placement position, the lower surface of the wafer is placed on the supporting element. When in the clamping position, the lower surface of the wafer will be separated from the supporting element during the spin-drying process, and the side edge of the wafer will be clamped by the clamping element, which limits the wafer in the axial and radial directions. During the spin-drying process, the wafer is fixed with the minimum contact area. Water droplets will be thrown off when the wafer is spun dry, and there will be no residual water. The efficiency of drying the wafer is improved, and the quality of the wafer is thereby improved.
[0058] Although the present invention has been disclosed above by the embodiments, they are not intended to limit the scope of the present invention. Any person skilled in the art with ordinary knowledge in the relevant technical field should be able to make slight changes and modifications without departing from the spirit and scope of the present invention, and all of these fall within the scope of protection of the present invention.
Claims
1. A wafer drying system, suitable for drying a wafer, characterized in that: The wafer drying system comprises: a rotating base defining a rotation axis; A plurality of fulcrum seats are respectively arranged on the rotating base around the rotating axis; a plurality of clamping devices, each comprising a swinging element, a clamping element, and a supporting element; each swinging element is pivotally connected to its corresponding fulcrum seat by a first pivot; an upper section of each swinging element is connected to the clamping element and the supporting element; the clamping element has a recess, the supporting element has a pick-and-place point adjacent to the recess, and the supporting element is closer to the rotation axis than the clamping element; and A plurality of actuating devices are respectively provided on the rotating base, each of the actuating devices drives a lower section of the corresponding swing element, so that the swing element can swing around the first pivot, thereby causing the plurality of clamping devices to swing between a pick-up position and a clamping position; When the multiple clamping devices are in the pick-and-place position, the pick-and-place point of each supporting element can contact the lower surface of the wafer; when the multiple clamping devices are in the clamping position, the recess of each clamping element can clamp a side edge of the wafer.
2. The wafer drying system according to claim 1, wherein: The swing element in each of the clamping devices is integrally formed with one of the clamping element and the supporting element.
3. The wafer drying system according to claim 1, wherein: A horizontal distance between the pick-up point and a corresponding concave point of the concave portion ranges from 0.8 mm to 1.8 mm, and a height distance between the pick-up point and the corresponding concave point of the concave portion ranges from 0 mm to 0.6 mm.
4. The wafer drying system according to claim 1, wherein: The actuating device includes a cylinder and a transmission rod. The cylinder drives the transmission rod, which is pivotally connected to the lower section of the swing element via a second pivot. The cylinder drives the transmission rod to move in a horizontal direction to drive the swing element to rotate around the second pivot.
5. The wafer drying system according to claim 1, wherein: The invention also comprises a blowing unit and an axis portion. The axis portion is arranged on the rotating base. The blowing unit provides a gas to the lower surface of the wafer via the axis portion.
6. A wafer drying system, suitable for drying a wafer, characterized in that: The wafer drying system includes: a rotating base defining a rotation axis; A plurality of fulcrum seats are respectively arranged on the rotating base around the rotating axis; A plurality of clamping devices, each comprising a swinging element, a clamping element, and a supporting element, each swinging element being pivotally connected to its corresponding fulcrum seat by a first pivot, an upper section of each swinging element being connected to the clamping element and the supporting element, the clamping element being provided with a recess, the supporting element being provided with a pick-and-place point adjacent to the recess, and the supporting element being closer to the rotation axis than the clamping element; a turntable disposed on the rotating base, the turntable being concentric with the rotating axis and having a plurality of driving members; and At least one actuating device is respectively provided on the rotating base, each actuating device drives the turntable respectively, so that each driving member drives the lower section of the corresponding swing element respectively, so that the swing element can swing around the first pivot, thereby causing the multiple clamping devices to swing between a pick-up position and a clamping position; When the multiple clamping devices are in a pick-up and placement position, the pick-up and placement point of each supporting element can contact the lower surface of the wafer; when the multiple clamping devices are in a clamping position, the recess of each clamping element can clamp a side edge of the wafer.
7. The wafer drying system according to claim 6, wherein: The swing element in each of the clamping devices is integrally formed with one of the clamping element and the supporting element.
8. The wafer drying system according to claim 6, wherein: A horizontal distance between the pick-up point and a corresponding concave point of the concave portion ranges from 0.8 mm to 1.8 mm, and a height distance between the pick-up point and the corresponding concave point of the concave portion ranges from 0 mm to 0.6 mm.
9. The wafer drying system according to claim 6, wherein: The driving member is an arc groove or a cam.
10. The wafer drying system according to claim 6, wherein: The invention also comprises a blowing unit and an axis portion. The axis portion is arranged on the rotating base. The blowing unit provides a gas to the lower surface of the wafer via the axis portion.