Chip testing device
By designing a step-shaped joint surface between the pressure plate and the test bench in a chip testing device, the light leakage problem between the pressure plate and the test bench is solved, and the accuracy of chip detection is improved.
Patent Information
- Application Number
- CN202422468275.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-12
AI Technical Summary
In the prior art, a gap between the pressure plate and the test bench causes light leakage, which affects the accuracy of chip detection.
A chip testing device is designed, in which a pressure plate and a test platform form a step-shaped joint surface when buckled. A convex-concave structure is set between the pressure plate and the test platform to prevent light beam leakage.
It effectively eliminates the light leakage problem, improves the accuracy of chip detection, ensures that the light beam is scattered only in the photosensitive area of the chip, and avoids the uncertainty of external light intensity attenuation.
Smart Images
Figure CN223401007U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip detection, in particular to a chip testing device. Background Art
[0002] Image sensor chips are chips with an on-chip lens, color filter, and photodiode on the front and pins on the back. When testing them, in addition to checking the reliability of the pins' contact, the light intensity, quality, and stability of the photosensitive area on the front must also be tested. Specifically, during testing, the chip is first placed in a loading slot on the test bench. A pressure plate then presses the front of the chip, bringing the pins on the back of the chip into contact with a probe. A light-transmitting port is provided on the pressure plate to expose the photosensitive area. The light source module then emits a light beam through the port toward the front of the chip, allowing the chip to be tested.
[0003] Based on the above, due to the manufacturing tolerances of the pressure plate and / or the test bench and the manufacturing tolerances of the chip, there will be a gap between the pressure plate and the test bench, which will lead to light leakage problems between the pressure plate and the test bench. That is, the light emitted through the light-transmitting port to the front of the chip will leak through the gap between the pressure plate and the test bench, thereby affecting the accuracy of the detection.
[0004] Therefore, the above problems need to be solved urgently. Utility Model Content
[0005] The purpose of the utility model is to provide a chip testing device to solve the problem of light leakage between a pressing plate and a testing platform, thereby affecting the accuracy of detection.
[0006] To achieve this purpose, the present invention adopts the following technical solutions:
[0007] Chip testing device, including:
[0008] A test bench is provided with a loading slot for loading chips; and
[0009] The illumination mechanism includes a pressure plate and a light source module, wherein the pressure plate is provided with a light transmission port, one of the pressure plate and the test bench is provided with a first boss, and the other of the pressure plate and the test bench is provided with a first groove, the loading groove and the light transmission port are respectively provided on the bottom of the first boss and the first groove, and the pressure plate has a first working position that is buckled onto the test bench. When the pressure plate is located at the first working position, the groove wall of the first groove is covered with the outer periphery of the first boss, the light transmission port is opposite to the loading groove, and the part of the pressure plate located at the outer periphery of the light transmission port presses against the non-photosensitive area of the chip, and the light source module can emit a light beam to the photosensitive area of the chip through the light transmission port.
[0010] Preferably, the test bench includes a first carrier and a second carrier, the first carrier is placed on the second carrier, one of the first carrier and the second carrier is provided with a second boss, the other of the first carrier and the second carrier is provided with a second groove, the groove wall of the second groove is covered around the outer periphery of the second boss, the loading groove is opened on the first carrier, and a probe is provided on the second carrier, the joint surface of the second boss and the second groove surrounds the outer periphery of the probe, and the probe passes through the bottom of the second groove and extends into the loading groove.
[0011] Preferably, the pressing plate and the test bench are arranged relative to each other in a vertical direction, and the pressing plate and the test bench can move relative to each other in the vertical direction.
[0012] Preferably, the chip testing device further comprises a positioning structure, wherein the positioning structure is configured to position the pressing plate and the testing table during a process in which the pressing plate and the testing table move relative to each other in a vertical direction.
[0013] Preferably, the positioning structure includes a positioning column and a positioning groove, the positioning column is arranged on one of the pressure plate and the test bench, and the positioning groove is arranged on the other of the pressure plate and the test bench, the positioning column and the positioning groove both extend in the vertical direction, and the positioning column can be inserted into the positioning groove during the relative movement of the pressure plate and the test bench in the vertical direction.
[0014] Preferably, one of the pressing plate and the test bench is provided with at least two positioning posts, and the other of the pressing plate and the test bench is provided with at least two positioning grooves, and the at least two positioning posts and the at least two positioning grooves correspond one to one.
[0015] Preferably, the chip testing device further comprises a lifting toggle clamp, and the lifting toggle clamp is configured to drive the test platform to move toward or away from the pressure plate in a vertical direction.
[0016] Preferably, the light source module includes a light source and a light tube, the light tube is mounted on a side of the pressure plate away from the light-transmitting opening, a third groove is provided on the pressure plate, and the groove wall of the third groove covers the outer circumference of the light tube.
[0017] Preferably, the pressing plate and the testing platform are made of black material.
[0018] Preferably, the chip testing device further comprises a base plate, and the pressing plate and / or the testing platform are slidably connected to the base plate in a horizontal direction.
[0019] Beneficial effects of the utility model:
[0020] In the present invention, when the pressure plate is buckled onto the test bench, the joint surface between the pressure plate and the test bench is in a step shape, thereby preventing the light beam emitted toward the front of the chip through the light-transmitting port from leaking to the outside through the gap between the pressure plate and the test bench. That is, the present invention can eliminate the light leakage problem between the pressure plate and the test bench, thereby improving the accuracy of detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is a top view of a chip testing device in an embodiment of the present invention;
[0022] Figure 2 It is along Figure 1 Cross-sectional view along line AA;
[0023] Figure 3 yes Figure 2 A partial enlarged view of point B in the middle;
[0024] Figure 4 It is along Figure 1 Cross-sectional view along the mid-CC line;
[0025] Figure 5 yes Figure 4 A partial enlarged view of point D in the middle.
[0026] In the picture:
[0027] 1. Test table; 11. Loading groove; 12. First boss; 13. First carrier; 131. Second groove; 14. Second carrier; 141. Second boss; 142. Probe; 21. Press plate; 211. Light-transmitting port; 212. First groove; 213. Third groove; 31. Positioning column; 32. Positioning groove; 4. Lifting elbow clamp; 5. Substrate. DETAILED DESCRIPTION
[0028] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.
[0029] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0031] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely for ease of description and simplified operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0032] Based on the above, in the prior art, when performing photosensitivity testing on chips such as image sensor chips that require detection of photosensitive areas, the detection accuracy is low due to light leakage during the testing process.
[0033] To resolve the above issues, please refer to Figures 1 to 5 , this embodiment provides a chip testing device, which includes a test table 1 and a lighting mechanism, wherein the test table 1 is provided with a loading slot 11, the loading slot 11 is used to load the chip, the lighting mechanism includes a pressing plate 21 and a light source module (not shown in the figure), a light-transmitting port 211 is provided on the pressing plate 21, the test table 1 is provided with a first boss 12, the pressing plate 21 is provided with a first groove 212, the loading slot 11 is provided on the first boss 12, the light-transmitting port 211 is provided on the bottom of the first groove 212, the pressing plate 21 has a first working position that is buckled onto the test table 1, and when the pressing plate 21 is in the first working position, the first groove The groove wall of the groove 212 is covered on the outer periphery of the first boss 12, the light-transmitting port 211 is opposite to the loading groove 11, and the portion of the pressure plate 21 located on the outer periphery of the light-transmitting port 211 presses against the non-photosensitive area of the chip, while the photosensitive area of the chip is exposed through the light-transmitting port 211. The light source module can emit a light beam to the photosensitive area of the chip through the light-transmitting port 211. In addition, it can be understood that a probe 142 is provided on the test bench 1, and the probe 142 extends into the loading groove 11. When the pressure plate 21 presses against the chip, the pins of the chip contact with the probe 142, thereby being able to test the photosensitivity, quality and stability of the chip and whether the contact of the pins is reliable.
[0034] Based on the above, in this embodiment, when the pressure plate 21 is buckled onto the test bench 1, the joint surface between the pressure plate 21 and the test bench 1 is in a step shape, thereby preventing the light beam emitted toward the front of the chip through the light-transmitting port 211 from leaking to the outside through the gap between the pressure plate 21 and the test bench 1. That is, this embodiment can eliminate the light leakage problem between the pressure plate 21 and the test bench 1, thereby improving the accuracy of detection.
[0035] Specifically, since the amount of light leakage scattered to the outside world is uncontrollable due to external environmental factors, this embodiment forms a step-shaped joint surface between the pressure plate 21 and the test bench 1, thereby preventing the light beam directed to the front of the chip from being scattered to the outside world. That is, this embodiment can make the light beam directed to the front of the chip only be scattered into the gap between the pressure plate 21 and the test bench 1, and not be scattered to the outside world, thereby controlling the light intensity attenuation of the chip environment caused by the scattering of light into the gap between the pressure plate 21 and the test bench 1 to a constant value, and then the light intensity of the chip environment can be accurately compensated by the light source module to improve the accuracy of detection.
[0036] It is understandable that in other optional embodiments, the test bench 1 may also be provided with a first groove 212, and correspondingly, the pressure plate 21 may be provided with a first boss 12. Correspondingly, the loading groove 11 is provided on the bottom of the first groove 212, and the light-transmitting port 211 is provided on the first boss 12, so that when the pressure plate 21 is buckled onto the test bench 1, the joint surface between the pressure plate 21 and the test bench 1 is in a step shape, and this embodiment does not impose any specific restrictions on this.
[0037] In addition, it should be noted that in this embodiment, the chip testing device is used to test the chip during the design stage, so as to debug the chip or manually screen the chip. Of course, in other optional embodiments, the chip testing device can also be used to test the chip during mass production, and this embodiment does not impose specific restrictions on this.
[0038] To facilitate assembly of the probe 142 , the test platform 1 includes a first carrier 13 and a second carrier 14 . The first carrier 13 is placed on the second carrier 14 . The placement slot 11 is opened on the first carrier 13 , and the probe 142 is disposed on the second carrier 14 .
[0039] Based on the above, the first carrier 13 is provided with a second groove 131, and the second carrier 14 is provided with a second boss 141. The groove wall of the second groove 131 is covered on the outer periphery of the second boss 141, and the joint surface of the second boss 141 and the second groove 131 surrounds the outer periphery of the probe 142. The probe 142 passes through the bottom of the second groove 131 and extends into the loading groove 11, so that it can contact the pins of the chip.
[0040] As described above, this embodiment makes the joint surface of the first carrier 13 and the second carrier 14 into a step shape, thereby preventing the light beam emitted toward the front of the chip through the light-transmitting port 211 from leaking to the outside through the gap between the probe 142 and the first carrier 13 and the gap between the first carrier 13 and the second carrier 14. That is, this embodiment can eliminate the light leakage problem between the probe 142 and the first carrier 13 and between the first carrier 13 and the second carrier 14, thereby further improving the accuracy of detection.
[0041] It is understandable that in other optional embodiments, the first carrier 13 may be provided with a second protrusion 141, and correspondingly, the second carrier 14 may be provided with a second groove 131, so that the joint surface between the first carrier 13 and the second carrier 14 is in a step shape. This embodiment does not impose specific restrictions on this.
[0042] To perform photosensitivity testing on the photosensitive area of the chip, a light source module is required. The light source module includes a light source, a light cylinder, a light source control board, related light source processing components, and other supporting structural components. The light cylinder is mounted on the side of the pressure plate 21 away from the light transmission port 211. The light beam emitted by the light source can pass through the light cylinder to reach the light transmission port 211 and illuminate the photosensitive area of the chip through the light transmission port 211. In addition, a third groove 213 is provided on the pressure plate 21. The groove wall of the third groove 213 covers the outer circumference of the light cylinder, thereby forming a step surface between the pressure plate 21 and the light cylinder. This prevents light leakage between the pressure plate 21 and the light cylinder, thereby further improving the accuracy of the test.
[0043] It is understandable that since the light source module emitting a light beam and the light beam propagation process are both existing technologies, this embodiment will not elaborate on them.
[0044] In addition, based on the content mentioned above, in this embodiment, the pressure plate 21 and the test platform 1 are made of black material to form a dark field environment between the pressure plate 21 and the test platform 1 and between the first carrier 13 and the second carrier 14, thereby absorbing the light reflected to the gap between the pressure plate 21 and the test platform 1 and the gap between the first carrier 13 and the second carrier 14, thereby further ensuring that the light intensity attenuation of the environment in which the chip is located is a constant value, thereby further improving the accuracy of detection.
[0045] Of course, in other optional embodiments, a dark field environment can be formed between the pressing plate 21 and the test platform 1 and between the first platform 13 and the second platform 14 by coating the outer surfaces of the pressing plate 21, the first carrier 13 and the second carrier 14 with light-absorbing material, thereby absorbing the light reflected to the gap between the pressing plate 21 and the test platform 1 and the light reflected to the gap between the first carrier 13 and the second carrier 14. This embodiment does not impose any specific restrictions on this.
[0046] It is understandable that in this embodiment, a light absorbing material may be coated on the outer surface of the light cylinder to form a dark field environment between the light cylinder and the pressing plate 21 , thereby absorbing the light emitted between the pressing plate 21 and the light cylinder.
[0047] It is worth noting that, in this embodiment, the pressing plate 21 and the test bench 1 are arranged relative to each other in the vertical direction, and the pressing plate 21 and the test bench 1 can move relative to each other in the vertical direction, so that the pressing plate 21 has a first working position where it is buckled onto the test bench 1.
[0048] It is understandable that the pressing plate 21 also has a second working position away from the test bench 1 , so as to facilitate the placement of the chip before testing and the removal of the chip after testing.
[0049] Illustratively, in this embodiment, the chip testing device further includes a lifting toggle clamp 4, which is configured to drive the test bench 1 to move vertically toward or away from the pressure plate 21, thereby switching the pressure plate 21 between the first working position and the second working position.
[0050] From the above, the chip testing device also includes a positioning structure, which is configured to position the pressure plate 21 and the test table 1 during the relative movement of the pressure plate 21 and the test table 1 in the vertical direction, thereby ensuring that the pressure plate 21 can be accurately pressed onto the test table 1, that is, this embodiment can use the positioning structure to make the groove wall of the first groove 212 accurately cover the outer periphery of the first boss 12, thereby effectively eliminating the light leakage problem.
[0051] Exemplarily, the positioning structure includes a positioning column 31 and a positioning groove 32. The positioning column 31 is arranged on the test bench 1, and the positioning groove 32 is arranged on the pressure plate 21. The positioning column 31 and the positioning groove 32 both extend in the vertical direction. The positioning column 31 can be inserted into the positioning groove 32 during the relative movement of the pressure plate 21 and the test bench 1 in the vertical direction, thereby guiding the test bench 1 and ensuring that the pressure plate 21 can be accurately buckled onto the test bench 1.
[0052] It is worth noting that the test bench 1 is provided with at least two positioning posts 31, and the pressure plate 21 is provided with at least two positioning slots 32. The at least two positioning posts 31 and the at least two positioning slots 32 correspond one-to-one, thereby more effectively and stably guiding the test bench 1, and further ensuring that the pressure plate 21 can be accurately buckled onto the test bench 1. Specifically in this embodiment, the test bench 1 is provided with two positioning posts 31, and the pressure plate 21 is provided with two positioning slots 32. The two positioning posts 31 and the two positioning slots 32 correspond one-to-one.
[0053] Of course, in other optional embodiments, the positioning column 31 may be provided on the pressing plate 21 , and correspondingly, the positioning groove 32 may be provided on the test bench 1 . This embodiment does not impose any specific limitation on this.
[0054] In addition, the chip testing device also includes a substrate 5, the test table 1 is slidably connected to the substrate 5 in the horizontal direction, and the pressure plate 21 is fixedly connected to the substrate 5, so that the relative positions of the test table 1 and the pressure plate 21 in the horizontal direction can be adjusted to ensure that the first boss 12 and the first groove 212 and the loading slot 11 and the light-transmitting port 211 are aligned in the horizontal direction, and further the pressure plate 21 can be accurately buckled onto the test table 1, and the light source module can accurately emit a light beam to the photosensitive area of the chip through the light-transmitting port 211.
[0055] It is understood that in other optional embodiments, the pressure plate 21 may be slidably connected to the base plate 5 in a horizontal direction, while the test table 1 is fixedly connected to the base plate 5. Alternatively, both the pressure plate 21 and the test table 1 may be slidably connected to the base plate 5 in a horizontal direction. This embodiment does not impose specific limitations on this. It is understood that when the pressure plate 21 is slidably connected to the base plate 5 in a horizontal direction, the light source can also move in the horizontal direction, so that the light source is always directly opposite the light transmission port 211.
[0056] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A chip testing device, characterized in that: include: A test bench (1) is provided with a loading slot (11), wherein the loading slot (11) is used for loading chips; and The lighting mechanism comprises a pressing plate (21) and a light source module, wherein the pressing plate (21) is provided with a light-transmitting port (211), one of the pressing plate (21) and the test bench (1) is provided with a first boss (12), the other of the pressing plate (21) and the test bench (1) is provided with a first groove (212), the loading groove (11) and the light-transmitting port (211) are respectively provided on the bottom of the first boss (12) and the first groove (212), and the pressing plate (21) has The pressure plate (21) is buckled to a first working position on the test bench (1). When the pressure plate (21) is located at the first working position, the groove wall of the first groove (212) covers the outer periphery of the first boss (12), the light-transmitting opening (211) is directly opposite to the loading groove (11), and the portion of the pressure plate (21) located at the outer periphery of the light-transmitting opening (211) presses against the non-photosensitive area of the chip, and the light source module can emit a light beam to the photosensitive area of the chip through the light-transmitting opening (211).
2. The chip testing device according to claim 1, characterized in that: The test platform (1) includes a first carrier (13) and a second carrier (14), the first carrier (13) is placed on the second carrier (14), one of the first carrier (13) and the second carrier (14) is provided with a second boss (141), the other of the first carrier (13) and the second carrier (14) is provided with a second groove (131), the groove wall of the second groove (131) is covered on the outer periphery of the second boss (141), the loading groove (11) is opened on the first carrier (13), and a probe (142) is provided on the second carrier (14), the joint surface of the second boss (141) and the second groove (131) surrounds the outer periphery of the probe (142), and the probe (142) passes through the groove bottom of the second groove (131) and extends into the loading groove (11).
3. The chip testing device according to claim 1, wherein: The pressing plate (21) and the test bench (1) are arranged relative to each other in a vertical direction, and the pressing plate (21) and the test bench (1) are capable of relative movement in the vertical direction.
4. The chip testing device according to claim 3, characterized in that: The chip testing device further comprises a positioning structure, wherein the positioning structure is configured to position the pressing plate (21) and the test table (1) during a process in which the pressing plate (21) and the test table (1) move relative to each other in a vertical direction.
5. The chip testing device according to claim 4, characterized in that: The positioning structure comprises a positioning column (31) and a positioning groove (32), wherein the positioning column (31) is arranged on one of the pressing plate (21) and the test bench (1), and the positioning groove (32) is arranged on the other of the pressing plate (21) and the test bench (1), and the positioning column (31) and the positioning groove (32) both extend in a vertical direction, and the positioning column (31) can be inserted into the positioning groove (32) during the relative movement of the pressing plate (21) and the test bench (1) in the vertical direction.
6. The chip testing device according to claim 5, characterized in that: One of the pressing plate (21) and the test bench (1) is provided with at least two positioning posts (31), and the other of the pressing plate (21) and the test bench (1) is provided with at least two positioning grooves (32), and the at least two positioning posts (31) and the at least two positioning grooves (32) correspond one to one.
7. The chip testing device according to claim 3, wherein: The chip testing device further comprises a lifting toggle clamp (4), wherein the lifting toggle clamp (4) is configured to drive the test table (1) to move toward or away from the pressing plate (21) in a vertical direction.
8. The chip testing device according to claim 1, wherein: The light source module comprises a light source and a light cylinder. The light cylinder is mounted on a side of the pressure plate (21) away from the light-transmitting opening (211). A third groove (213) is provided on the pressure plate (21), and the groove wall of the third groove (213) covers the outer periphery of the light cylinder.
9. The chip testing device according to claim 1, wherein: The pressing plate (21) and the test bench (1) are made of black material.
10. The chip testing device according to claim 1, wherein: The chip testing device further comprises a base plate (5), and the pressing plate (21) and / or the testing platform (1) are connected to the base plate (5) in a sliding manner in a horizontal direction.