Heat dissipation structure and heat dissipation waistcoat of compressed solid state disk module
The design of the fish-fin heat dissipation body and heat dissipation vest solves the heat dissipation problem of the compressed solid-state drive module, improves the stability and reliability of the module, and is suitable for a variety of electronic devices to meet the needs of high performance and miniaturization.
Patent Information
- Application Number
- CN202422496051.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-15
AI Technical Summary
In the existing technology, the heat dissipation problem of compressed solid-state drive modules during high-performance and high-frequency signal transmission has not been effectively solved, and the standardization and replaceability of the modules are insufficient, especially in the lack of unified heat dissipation design standards in board-to-board connection technology.
The design of a shark fin heat sink and heat sink vest is adopted. The shark fin heat sink and stamping parts are manufactured through extrusion molding process. Combined with high thermal conductivity silicone and shock-proof cushions, an integrated heat dissipation structure is formed, including screw hole avoidance structure, ventilation holes and limit structure to ensure the stable fixation of the module and efficient heat dissipation.
It achieves effective heat dissipation of high-performance storage modules, improves product stability and reliability, facilitates installation and observation, reduces production costs and operating difficulty, and is suitable for a variety of electronic devices.
Smart Images
Figure CN223401385U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solid-state hard disk installation, and in particular to a heat dissipation structure and a heat dissipation vest of a compressed solid-state hard disk module. Background Art
[0002] Solid-state drives (SSDs) are hard drives made with arrays of solid-state electronic storage chips. They have the characteristics of fast read and write speeds, shock and drop resistance, low power consumption, no noise, a wide operating temperature range (-40 to 85°C), and are lightweight. They are widely used in many fields such as military, automotive, industrial control, video surveillance, network monitoring, network terminals, electricity, medical care, aviation, and navigation equipment. In today's information technology field, compressed solid-state drive modules are key components and are widely used in various links such as data storage, data transmission, and signal processing. With the continuous advancement of technology, the connection and assembly methods of modules are becoming increasingly diversified to meet the performance and reliability requirements in different application scenarios. Common module connection and assembly methods mainly include embedded welding, connector slots, and board-to-board pin connections.
[0003] Embedded soldering, a highly integrated assembly method, achieves compact and lightweight designs by directly soldering components onto circuit boards. It's commonly used in storage solutions like eMMC and UFS. However, its drawback is that once soldered, upgrading or replacing modules becomes extremely inconvenient, limiting the device's flexibility and future scalability.
[0004] Connector slots, such as those used in conventional memory modules and M.2 solid-state drives, use spring-clip connectors with screws and other structures to secure the module. This approach significantly improves module maintainability and upgrade convenience, but is limited by the physical properties of the spring-clip pin structure and the choice of materials, such as conductivity, length consistency, impedance matching, and shielding protection, making it difficult to meet the stringent standards required for high-frequency signal transmission.
[0005] Board-to-board pin connection technology was initially used in the CPU field, where extremely high precision is crucial. Its high-precision, tiny spring-loaded pin design, coupled with its short length and excellent consistency, makes it an ideal choice for high-frequency applications. As technology evolves, the memory module field has also pioneered the use of board-to-board pin connection technology, with innovative products such as the LPCAMM2 (Low Power DDR VCAMM2 Module) and CAMM2 (Compressed Add-On Memory Module), further driving the trend toward higher performance and smaller size in memory modules.
[0006] However, in the flash storage sector, board-to-board module technology is still in its exploratory stages, with no unified standardization system yet established. This is particularly true regarding the design of peripheral components, such as module heat dissipation. To meet the demands for high-capacity, high-performance, and compact storage, achieving module standardization and interchangeability while maintaining efficient thermal management has become a pressing issue. Utility Model Content
[0007] In order to overcome the shortcomings of the existing technology, the present application provides a heat dissipation structure and heat dissipation vest for a compressed solid-state hard drive module, which is pre-installed on the module at the factory and tightly integrated with it to form an integrated storage solution. This design not only effectively solves the heat dissipation problem generated by the high-performance storage module during operation, but also improves the overall stability and reliability of the product.
[0008] The technical means adopted by the present invention to solve its technical problems are: a heat dissipation structure of a compressed solid-state hard disk module, the improvement of which is that it includes: a fish fin heat dissipation body, which is made of an extrusion molding process; the fish fin heat dissipation body includes: a screw hole avoidance structure, which is used to avoid interference when installing screws; ventilation holes, which are arranged on the heat dissipation body to promote air circulation; screw holes, which are used to fix the heat dissipation body to related equipment; an upper limit structure, which is integrally formed with the heat dissipation body, and is used to limit the movement of the module in the vertical direction; wherein the fish fin heat dissipation body, the chamfers on both sides and the upper limit structure are extruded from long strips of aluminum and then cut into appropriate lengths according to the length requirements of the heat sink; the ventilation holes and the screw hole avoidance structure are formed by secondary processing of punching, milling and drilling and tapping; the heat dissipation body is colored through an oxidation process.
[0009] In the above technical solution, the fin heat dissipation body, the chamfers on both sides and the module upper limit structure are extruded and formed using aluminum.
[0010] The surface of the fish fin heat dissipation body in the above technical solution is specially treated, including but not limited to nano-coating treatment or micro-channel structure design.
[0011] The technical means adopted by the present invention to solve its technical problems are: a heat dissipation vest for a compressed solid-state hard disk module, comprising the above-mentioned fin heat dissipation body, a first stamping part, a second stamping part, heat dissipation silicone, and screws, wherein: the first stamping part and the second stamping part have the same structure, including screw holes and a lower limit curling structure; the heat dissipation silicone is used to fill the gap between the fin heat dissipation body and the module to achieve seamless connection and efficient heat dissipation; the screws are used to lock and fix the first stamping part, the second stamping part, and the fin heat dissipation body;
[0012] Among them, the lower limit curling structure and the upper limit structure of the fin heat dissipation body cooperate with each other up and down, and the first stamping part and the second stamping part limit the front and back directions of the module to jointly achieve stable fixation of the module.
[0013] In the above technical solution, the first stamping part and the second stamping part are formed by stamping alloy iron sheets, which provide sufficient strength and rigidity to support and fix the module.
[0014] The heat dissipation silicone described in the above technical solution is made of high thermal conductivity and low viscosity material to ensure that while filling the gap between the fin heat dissipation body and the module, it can maintain good thermal conductivity performance and is easy to be evenly distributed during the module installation process to form an effective heat conduction path.
[0015] The heat dissipation vest described in the above technical solution also includes a shock-proof buffer pad, which is arranged on the surface of the first stamping part and the second stamping part that are in contact with the module.
[0016] The shock-absorbing cushion described in the above technical solution is made of elastic materials such as silicone, rubber or elastic polymer, and its thickness and hardness are optimized according to the module size and weight to achieve the best balance between shock-absorbing effect and heat dissipation performance.
[0017] The beneficial effects of the present invention are: through the extrusion molding process, not only the integrated production of the appearance and the main structure is realized, but also the production cost is significantly reduced, while ensuring the consistency and high precision of the product; the powerful fish-fin heat dissipation design is adopted, even while maintaining the overall light and thin characteristics, it also shows an excellent heat dissipation effect; this heat dissipation structure is composed of four core components: a fish-fin heat dissipation main body, stamping parts, screws and heat dissipation silicone. The structure is simple and clear, which is convenient for industrial production and assembly, and reduces the difficulty of operation and production costs; the unique side vent design not only promotes air convection and significantly improves the heat dissipation efficiency, but also facilitates installation and observation, and improves the practicality and convenience of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 Three views of a heat dissipation structure of a compressed solid-state hard disk module shown in an embodiment of the present utility model;
[0019] Figure 2 Three views of a heat dissipation vest for a compressed solid-state hard disk module shown in an embodiment of the present utility model;
[0020] Figure 3 The three views of a stamping part shown in an embodiment of the present utility model. DETAILED DESCRIPTION
[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0022] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.
[0023] In light of the above background, the present invention proposes a heat dissipation structure and heat dissipation jacket specifically designed for standard-sized and scalable compressed solid-state drive modules. The heat dissipation jacket is designed to be pre-installed on the module upon shipment, tightly integrated with it to form an integrated storage solution. This design not only effectively solves the heat dissipation issues arising from the operation of high-performance storage modules, but also improves the overall stability and reliability of the product, enabling its widespread application in medium- and large-scale devices with specific space requirements, such as desktop computers, workstation servers, high-end laptops, multimedia billboards, and network terminals, meeting these devices' combined needs for large capacity, high performance, and compact size.
[0024] Specifically, if Figure 1 As shown, the present application provides a heat dissipation structure of a compressed solid-state hard disk module, including: a fish fin heat dissipation body 10, which is made by an extrusion molding process; the fish fin heat dissipation body 10 includes: a screw hole avoidance structure 11, which is used to avoid interference when installing screws; ventilation holes 12, which are arranged on the heat dissipation body to promote air circulation; screw holes 13, which are used to fix the heat dissipation body to related equipment; an upper limit structure 14, which is integrally formed with the heat dissipation body, and is used to limit the movement of the module in the vertical direction.
[0025] Among them, the fish fin heat dissipation body 10, the chamfers on both sides and the upper limit structure 14 are extruded from long aluminum strips and then cut into appropriate lengths according to the length requirements of the heat sink; the ventilation holes 12 and the screw hole avoidance structure 11 are formed by secondary processing such as punching, milling and drilling and tapping; the heat dissipation body is colored through an oxidation process.
[0026] In one possible implementation, aluminum is extruded for the main fin heat sink, chamfered edges, and module upper limit structure. Aluminum has a moderate thermal conductivity of 237W / (m·K) among metal materials, but its light weight and low hardness make it suitable for extrusion processing. Furthermore, its low cost makes it suitable for fin-style heat sinks. Aluminum was chosen as the material based on a combination of cost, metal processing properties, and thermal conductivity. Processing techniques for metal parts include mold casting, machining, extrusion, and stamping. Extrusion involves extending the material to achieve a desired shape. Common aluminum profiles and metal pipes utilize this process.
[0027] In a possible implementation, the surface of the fish fin heat dissipation body 10 is specially treated, including but not limited to nano-coating treatment or micro-channel structure design.
[0028] Nanocoating: A nano-scale coating is applied to the surface of the fin heat sink 10. This coating not only significantly improves the surface smoothness and wear resistance of the heat sink, but also effectively reduces thermal resistance and enhances heat transfer efficiency. Furthermore, the nano-coating offers corrosion resistance and self-cleaning properties, extending the heat sink's service life while maintaining excellent heat dissipation performance.
[0029] Microchannel Structure Design: The surface of the fin heat sink 10 features a microchannel structure, forming a series of tiny, regularly spaced channels. These microchannels significantly increase the heat dissipation area, accelerating heat dissipation. Furthermore, the microchannel structure optimizes fluid flow within the heat sink, improving heat dissipation efficiency. This design achieves efficient heat dissipation while maintaining the thinness of the heat sink, meeting the high heat dissipation requirements of modern electronic devices.
[0030] Through the above special treatment, not only the heat dissipation efficiency is improved, but also the durability and self-cleaning function of the heat dissipation body are enhanced, providing a strong guarantee for the stable operation of modern electronic equipment.
[0031] like Figure 2-3 As shown, the present invention also provides a heat dissipation vest for a compressed solid-state hard disk module, comprising the above-mentioned fin heat dissipation body 10, a first stamping part 15, a second stamping part 16, heat dissipation silica gel (not shown in the figure) and screws 17, wherein:
[0032] The first stamping part 15 and the second stamping part 16 have the same structure, including a screw hole 18 and a lower limit curling structure 19;
[0033] The heat dissipation silica gel is used to fill the gap between the fin heat dissipation body 10 and the module A to achieve seamless connection and efficient heat dissipation;
[0034] The screws 17 are used to lock and fix the first stamping part 15, the second stamping part 16 and the fin heat dissipation body 10;
[0035] Among them, the lower limit curling structure 19 cooperates with the upper limit structure 14 of the fin heat dissipation body 10 up and down, and the first stamping part 15 and the second stamping part 16 limit the front and rear directions of the module, thereby jointly achieving a stable fixation of the module A.
[0036] In a possible implementation, the first stamping part 15 and the second stamping part 16 are formed by stamping alloy iron sheets, which provide sufficient strength and rigidity to support and fix the module A.
[0037] In one possible implementation, the heat dissipating silicone is made of a high thermal conductivity, low viscosity material to ensure that while filling the gap between the fin heat dissipating body 10 and the module A, it can maintain good thermal conductivity performance and be easy to be evenly distributed during the module installation process to form an effective heat conduction path.
[0038] In a possible implementation, the heat dissipation vest further includes a shock-absorbing cushion, which is provided on the surfaces of the first stamping part 15 and the second stamping part 16 that are in contact with the module A.
[0039] The shock-proof cushion is made of elastic material, such as silicone, rubber or elastic polymer, and its thickness and hardness are optimized according to the size and weight of the module to achieve the best balance between shock-proof effect and heat dissipation performance.
[0040] This utility model is manufactured through an extrusion molding process, which not only realizes the integrated production of appearance and main structure, but also significantly reduces production costs, while ensuring product consistency and high precision; it adopts a powerful fish-fin heat dissipation design, which shows excellent heat dissipation effect while maintaining the overall light and thin characteristics; this heat dissipation structure consists of four core components: fish-fin heat dissipation main body, stamping parts, screws and heat dissipation silicone. The structure is simple and clear, which is convenient for industrial production and assembly, and reduces operational difficulty and production costs; the unique side vent design not only promotes air convection and significantly improves heat dissipation efficiency, but also facilitates installation and observation, and improves the practicality and convenience of the product.
[0041] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A heat dissipation structure of a compressed solid-state hard disk module, characterized in that: include: The fin heat dissipation body is made by an extrusion molding process; the fin heat dissipation body comprises: Screw hole avoidance structure to avoid interference when installing screws; Ventilation holes are provided on the heat dissipation body to promote air circulation; Screw holes, used to fix the heat dissipation body to related equipment; An upper limit structure, integrally formed with the heat dissipation body, for limiting the movement of the module in the vertical direction; Among them, the upper limit structure is extruded from a long strip of aluminum and then cut into appropriate lengths according to the length requirements of the heat sink; the ventilation holes and screw hole avoidance structures are formed through secondary processing such as punching, milling and drilling and tapping; the heat dissipation body is colored through an oxidation process.
2. The heat dissipation structure according to claim 1, characterized in that: The fin heat dissipation body, the chamfers on both sides and the module upper limit structure are extruded and formed using aluminum.
3. The heat dissipation structure according to claim 1, characterized in that: The surface of the fish fin heat dissipation body is specially treated, including but not limited to nano-coating treatment or micro-channel structure design.
4. A heat dissipation vest for a compressed solid-state hard disk module, characterized in that: The heat dissipation device comprises the fin heat dissipation body according to any one of claims 1 to 3, a first stamping part, a second stamping part, heat dissipation silicone and screws, wherein: The first stamping part and the second stamping part have the same structure, including screw holes and a lower limit curling structure; The heat dissipation silicone is used to fill the gap between the fin heat dissipation body and the module to achieve seamless connection and efficient heat dissipation; The screws are used to lock and fix the first stamping part, the second stamping part and the fin heat dissipation body; Among them, the lower limit curling structure and the upper limit structure of the fin heat dissipation body cooperate with each other up and down, and the first stamping part and the second stamping part limit the front and back directions of the module to jointly achieve stable fixation of the module.
5. The heat dissipation vest according to claim 4, characterized in that: The first stamping part and the second stamping part are formed by stamping alloy iron sheets, providing sufficient strength and rigidity to support and fix the module.
6. The heat dissipation vest according to claim 4, characterized in that: The heat dissipation silicone is made of high thermal conductivity and low viscosity material to ensure that while filling the gap between the fin heat dissipation body and the module, it can maintain good thermal conductivity performance and is easy to be evenly distributed during the module installation process to form an effective heat conduction path.
7. The heat dissipation vest according to claim 4, characterized in that: The heat dissipation vest also includes a shock-proof buffer pad, which is arranged on the surface of the first stamping part and the second stamping part that contacts the module.
8. The heat dissipation vest according to claim 7, characterized in that: The shock-proof cushion is made of elastic material, and its thickness and hardness are optimized according to the size and weight of the module to achieve the best balance between shock-proof effect and heat dissipation performance.