Wafer cleaning box and semiconductor processing equipment

Abstract

The utility model provides a wafer cleaning box and semiconductor processing equipment, and relates to the technical field of semiconductor equipment. The wafer cleaning box comprises a bottom plate, two side plates, a top plate and a back plate. The two side plates are connected to the two opposite sides of the bottom plate respectively. The top plate and the bottom plate are oppositely arranged, and the top plate is connected with the two side plates. And the back plate is connected with the bottom plate and / or the side plates. The bottom plate, the side plates, the top plate and the back plate jointly form a containing cavity with an opening, and the opening is opposite to the back plate. A partition plate is convexly arranged on one side, facing the accommodating cavity, of the side plate and is used for placing a wafer; through holes are formed in the bottom plate, the side plates, the top plate and the back plate correspondingly and communicate with the containing cavity. The wafer cleaning box is beneficial to fully discharging the cleaning liquid and reducing the pollution of the residual cleaning liquid to the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer cleaning box and semiconductor processing equipment. Background Art

[0002] With the rapid development of the semiconductor industry, in the 2.5D packaging process, it is necessary to use chemical grinding to thin the silicon interposer, and use various methods such as polishing liquid corrosion and polishing pad friction to achieve global flattening of the silicon interposer surface, and then clean the silicon interposer surface again. When performing surface cleaning, most wafers are cleaned by hanging plating. Place the wafer in a cleaning box and immerse the wafer in the cleaning tank again. Use chemical agents such as hydrofluoric acid or isopropyl tone to remove metal ions and organic chemicals after grinding and polishing to ensure that the surface of the silicon interposer is free of foreign matter and has good roughness.

[0003] Existing wafer cleaning boxes have the problem of chemicals easily accumulating in the corners, resulting in the chemicals not being able to be discharged in time when the wafers are taken out. The residual chemical liquid can easily cause secondary contamination to the wafers, affecting the cleaning effect and wafer quality. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer cleaning box and semiconductor processing equipment, which are conducive to fully discharging cleaning liquid and reducing the pollution of residual cleaning liquid to the wafer.

[0005] The utility model embodiment is achieved as follows:

[0006] In a first aspect, an embodiment of the present invention provides a wafer cleaning box, comprising:

[0007] base plate;

[0008] two side panels, the two side panels being respectively connected to opposite sides of the bottom panel;

[0009] A top plate, the top plate and the bottom plate are arranged opposite to each other, and the top plate is connected to the two side plates respectively;

[0010] a back panel connected to the bottom panel and / or the side panels;

[0011] The bottom plate, the side plates, the top plate and the back plate together form a receiving cavity having an opening, and the opening is arranged opposite to the back plate;

[0012] A partition is protruded from one side of the side plate toward the accommodating cavity, and the partition is used to place wafers;

[0013] The bottom plate, the side plate, the top plate and the back plate are respectively provided with through holes, and the through holes are communicated with the accommodating cavity.

[0014] In an optional embodiment, the through hole includes a first through hole, the side plate is provided with the first through hole, and the first through hole and the partition are staggered.

[0015] In an optional embodiment, the first through holes on the two side panels are symmetrically designed.

[0016] In an optional embodiment, the through hole includes a second through hole and a third through hole, the second through hole is provided on the bottom plate, and the third through hole is provided on the top plate.

[0017] In an optional embodiment, the second through hole and the third through hole are symmetrically designed.

[0018] In an optional embodiment, cross-sections of the second through hole and the third through hole are respectively larger than a cross-section of the first through hole.

[0019] In an optional embodiment, a mounting boss and / or a mounting groove is provided on the top plate, and a mounting boss and / or a mounting groove is provided on the bottom plate; the mounting groove or the mounting boss on the top plate of one of the wafer cleaning boxes is plugged into and matched with the mounting boss or the mounting groove on the bottom plate of another wafer cleaning box to achieve stacking and assembly of multiple wafer cleaning boxes.

[0020] In an optional embodiment, one of the back plate and the bottom plate is provided with a limiting groove, and the other is provided with a limiting column, and the limiting groove and the limiting column are plug-fitted.

[0021] In an optional embodiment, a hanging ear is protruding from a side of the side panel away from the accommodating cavity.

[0022] In a second aspect, an embodiment of the present invention further provides a semiconductor processing device, comprising a machine platform and the above-mentioned wafer cleaning box, wherein the wafer cleaning box is detachably connected to the machine platform.

[0023] The wafer cleaning box and semiconductor processing equipment provided by the embodiments of the present invention have the following beneficial effects:

[0024] The wafer cleaning box provided by the embodiment of the present invention has through holes on the bottom plate, side plate, top plate and back plate, respectively, and the through holes are connected to the accommodating cavity. During cleaning, the flow rate of the cleaning liquid entering the accommodating cavity is large and the speed is fast, so that the cleaning liquid fully contacts the surface of the wafer, which is conducive to thoroughly cleaning the surface of the wafer. When the cleaning is completed and taken out, the cleaning liquid in the accommodating cavity can be quickly discharged from each through hole, the discharge speed is fast, the discharge is more thorough, and the residual cleaning liquid is reduced. Thereby reducing the secondary contamination of the wafer by the residual liquid. In this way, it is conducive to improving the cleaning effect and improving the quality of the wafer.

[0025] The semiconductor processing equipment provided by the embodiment of the present invention includes the above-mentioned wafer cleaning box. When cleaning and removing the wafer cleaning box, chemical liquid residue can be reduced, preventing the wafer from being secondary contamination by residual substances, which is conducive to improving the cleaning effect and enhancing the wafer quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of the overall structure of a wafer cleaning box provided in an embodiment of the present utility model;

[0028] Figure 2 for Figure 1 Schematic diagram of the split structure;

[0029] Figure 3 A schematic diagram of the overall structure of the wafer cleaning box provided by an embodiment of the present invention from another perspective;

[0030] Figure 4 A schematic diagram of the splicing structure of a wafer cleaning box provided in an embodiment of the present utility model.

[0031] Icon: 100-wafer cleaning box; 110-bottom plate; 111-second through hole; 120-side plate; 121-partition plate; 123-first through hole; 125-hanging ear; 130-top plate; 131-third through hole; 140-back plate; 141-fourth through hole; 101-accommodating cavity; 151-mounting boss; 153-mounting slot; 161-limiting slot; 163-limiting column; 200-wafer. DETAILED DESCRIPTION

[0032] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0037] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0038] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0039] The wafer cleaning box provided in the embodiment of the present invention is used to clean the wafer surface, remove metal ions and organic chemicals after grinding and polishing, ensure that the surface of the silicon interposer is free of foreign matter and has good roughness, and facilitate the improvement of subsequent electroplating quality.

[0040] Combine Figures 1 to 4 The wafer cleaning box 100 includes a bottom plate 110, two side plates 120, a top plate 130 and a back plate 140. The two side plates 120 are respectively connected to the opposite sides of the bottom plate 110. The top plate 130 and the bottom plate 110 are arranged opposite to each other, and the top plate 130 and the two side plates 120 are respectively connected; the back plate 140 is connected to the bottom plate 110 and / or the side plates 120. The bottom plate 110, the side plates 120, the top plate 130 and the back plate 140 together form a accommodating cavity 101 with an opening, and the opening is arranged opposite to the back plate 140. A partition 121 is protruded from one side of the side plate 120 facing the accommodating cavity 101, and the partition 121 is used to place the wafer 200; through holes are respectively provided on the bottom plate 110, the side plates 120, the top plate 130 and the back plate 140, and the through holes are connected to the accommodating cavity 101. Since the through holes are distributed in multiple directions of the top, bottom and side of the wafer cleaning box 100, more sufficient and thorough drainage can be achieved. The wafer cleaning box 100 is conducive to fully draining the cleaning liquid and reducing the contamination of the residual cleaning liquid to the wafer 200.

[0041] It should be noted that, in this embodiment, the wafer cleaning box 100 is designed to be a cube or a cuboid. In other embodiments, it can also be designed to be cylindrical, elliptical, hexagonal, octagonal, or other shapes, which are not specifically limited here.

[0042] There are multiple partitions 121 on the side panel 120, and the multiple partitions 121 are evenly spaced in the height direction. The partitions 121 on the two side panels 120 are arranged in a one-to-one correspondence. A placement groove is formed between adjacent partitions 121. Each placement groove can hold a wafer 200, and a wafer cleaning box 100 can hold multiple wafers 200, that is, the wafers 200 can be cleaned at the same time, and the cleaning efficiency is high. The partition 121 plays a positioning and supporting role for the wafer 200. It can be understood that the length of the partition 121 protruding from the side panel 120 is relatively short. That is, the contact area between the partition 121 and the wafer 200 is relatively small, and it only needs to contact the edge of the wafer 200. This ensures that most areas of the wafer 200 can fully contact chemical liquids such as cleaning liquid, thereby effectively cleaning the surface of the wafer 200 and cleaning more thoroughly.

[0043] The back plate 140 may be connected to the bottom plate 110. Alternatively, the back plate 140 may be connected to the side plate 120. Alternatively, the back plate 140 may be connected to the top plate 130. Alternatively, the back plate 140 may be connected to two or more of the side plates 120, the bottom plate 110, and the top plate 130. Any method is sufficient as long as the back plate 140 can be fixed. The back plate 140 serves to limit the position of the wafer 200.

[0044] Optionally, the through hole includes a first through hole 123, and the side panel 120 is provided with a first through hole 123, and the first through hole 123 and the partition 121 are staggered. In this way, the supporting strength of the partition 121 can be maintained. It is also beneficial for the cleaning liquid or other chemical liquid to enter or discharge the accommodating cavity 101. The number, distribution position, shape and size of the first through holes 123 can be flexibly set according to actual conditions. For example, the distribution of the first through holes 123 is generally in a matrix or an annular array or in any other shape. The cross-section of the first through hole 123 can be triangular, quadrilateral, pentagonal, hexagonal, elliptical, circular, semicircular, crescent-shaped, long strip or other arbitrary shapes.

[0045] Optionally, the first through holes 123 on the two side plates 120 are symmetrically designed. The plurality of first through holes 123 on each side plate 120 are evenly spaced and distributed.

[0046] The through holes also include a second through hole 111 and a third through hole 131. The second through hole 111 is provided on the bottom plate 110, and the third through hole 131 is provided on the top plate 130. Optionally, the second through hole 111 and the third through hole 131 are designed symmetrically. Optionally, the cross-sections of the second through hole 111 and the third through hole 131 are respectively larger than the cross-section of the first through hole 123. Since the side plate 120 mainly plays a supporting role for the wafer 200, the structural strength requirements of the side plate 120 are relatively high. Therefore, the through holes on the bottom plate 110 and the top plate 130 can be designed to be relatively larger to improve the efficiency of liquid entering or exiting the accommodating cavity 101. In this embodiment, long strip-shaped through holes are respectively provided on the bottom plate 110 and the top plate 130, and the opening ratio of the top plate 130 and the bottom plate 110 is relatively high. For example, the opening area of ​​the top plate 130 accounts for approximately half or more of the top plate 130. The opening area of ​​the bottom plate 110 accounts for approximately half or more of the bottom plate 110.

[0047] Optionally, the back plate 140 is further provided with a plurality of fourth through holes 141. These fourth through holes 141 are evenly distributed. The fourth through holes 141 are circular, and the back plate 140 has a high aperture ratio. This allows the cleaning liquid to be quickly drained from all directions through the bottom plate 110, top plate 130, side plates 120, and back plate 140 when the wafer cleaning cassette 100 is removed. This allows for efficient and thorough drainage, significantly reducing residual liquid.

[0048] Optionally, a mounting boss 151 and / or a mounting groove 153 is provided on the top plate 130, and a mounting boss 151 and / or a mounting groove 153 is provided on the bottom plate 110; the mounting groove 153 or the mounting boss 151 on the top plate 130 of one wafer cleaning box 100 is plugged into and matched with the mounting boss 151 or the mounting groove 153 on the bottom plate 110 of another wafer cleaning box 100 to achieve stacking and assembly of multiple wafer cleaning boxes 100.

[0049] It is easy to understand that the wafer cleaning box 100 is a box body. The top plate 130 of one box body is provided with a mounting boss 151, and the bottom plate 110 of the other box body is provided with a mounting groove 153 that plugs into the mounting boss 151. The two can be plugged in to achieve assembly and stacking in the height direction. Alternatively, the bottom plate 110 of one box body is provided with a mounting boss 151, and the top plate 130 of the other box body is provided with a mounting groove 153 that plugs into the mounting boss 151. The two can be plugged in to achieve assembly and stacking in the height direction. Alternatively, the top plate 130 of one box body is provided with a mounting boss 151 and a mounting groove 153, respectively, and the bottom plate 110 of the other box body is provided with a mounting boss 151 and a mounting groove 153, respectively, and the mounting boss 151 of one box body and the mounting groove 153 of the other box body are correspondingly arranged, and the mounting groove 153 of one box body and the mounting boss 151 of the other box body are correspondingly arranged, and the two can also be plugged in to achieve assembly and stacking in the height direction. No specific limitation is made here.

[0050] In this embodiment, the top plate 130 is provided with two mounting bosses 151, and the other bottom plate 110 is provided with two corresponding mounting grooves 153. The two mounting bosses 151 are provided at a set of opposite corners of the top plate 130. This has a better limiting effect.

[0051] Optionally, one of the back panel 140 and the bottom panel 110 is provided with a limiting groove 161, and the other is provided with a limiting post 163, and the limiting groove 161 and the limiting post 163 are plugged in and matched. It can be understood that the back panel 140 is provided with a limiting groove 161 and the bottom panel 110 is provided with a limiting post 163, and the two are plugged in and matched to achieve a detachable connection between the bottom panel 110 and the back panel 140. Alternatively, the back panel 140 can be provided with a limiting post 163 and the bottom panel 110 can be provided with a limiting groove 161, which can also achieve a similar plug-in effect. Alternatively, the back panel 140 can be provided with both a limiting groove 161 and a limiting post 163. The bottom panel 110 can be provided with both a limiting groove 161 and a limiting post 163. The limiting grooves 161 on the bottom plate 110 are plugged into the limiting posts 163 on the back plate 140 , and the limiting posts 163 on the bottom plate 110 are plugged into the limiting grooves 161 on the back plate 140 . Specific limitations are not given here.

[0052] In this embodiment, the back plate 140 is provided with limiting grooves 161 at both ends in the height direction, so that it can be installed regardless of the forward or reverse direction, and the installation operation is more convenient and flexible.

[0053] Of course, in some other embodiments, the back plate 140 may also be detachably connected to the top plate 130. The connection method is similar to the connection method between the back plate 140 and the bottom plate 110, and will not be repeated here.

[0054] Optionally, a lug 125 is protruding from the side of the side panel 120 away from the accommodating chamber 101. The lug 125 can be used to secure the entire wafer cleaning box 100 to the machine. The machine is provided with a cleaning tank with a fixing clamp inside. After the wafer cleaning box 100 is placed in the cleaning tank, it is immersed in the cleaning solution. The fixing frame and the lug 125 are connected to secure the wafer cleaning box 100 in the cleaning tank. When cleaning is complete, the fixing frame and the lug 125 are separated, and the wafer cleaning box 100 can be removed from the cleaning tank.

[0055] The operating principle of the wafer cleaning box 100 is as follows:

[0056] The wafer 200 to be cleaned is first placed in the wafer cleaning box 100, and the wafer 200 is arranged between the partitions 121 on the side plate 120. One wafer 200 is placed on each layer of partition 121, and multiple wafers 200 can be cleaned at the same time. The wafer cleaning box 100 is placed in the cleaning tank of the machine and fixed. The wafer cleaning box 100 is completely immersed in the cleaning liquid so that all wafers 200 are in full contact with the cleaning liquid, and the surface impurities of the wafer 200 after grinding are cleaned and removed. After cleaning is completed, the wafer cleaning box 100 is taken out of the cleaning tank, and the cleaning liquid in the accommodating cavity 101 will be quickly discharged from the through holes on the bottom plate 110, the top plate 130, the side plate 120 and the back plate 140, reducing the residual cleaning liquid on the wafer cleaning box 100, thereby preventing the wafer 200 from being contaminated again by the residual cleaning liquid.

[0057] Optionally, the wafer cleaning box 100 removed from the cleaning tank can be transferred to an electroplating tank for electroplating without removing the wafer 200, thereby improving operation efficiency. Optionally, during the electroplating process, a layer of metal such as titanium, nickel, copper or silver can be plated on the surface of the wafer 200.

[0058] The wafer cleaning box 100 can be used in the cleaning operation of the wafer 200, and can also be used in the electroplating process of the wafer 200, or used in other processes of processing the wafer 200. The usage scenario is flexible and is not specifically limited here.

[0059] The present invention also provides a semiconductor processing device comprising a platform and the aforementioned wafer cleaning box 100. The wafer cleaning box 100 is detachably connected to the platform to facilitate various processing steps of a wafer 200. The semiconductor processing device includes, but is not limited to, cleaning equipment, electroplating equipment, rack plating equipment, or other equipment, which are not specifically limited herein.

[0060] In summary, the wafer cleaning box 100 and semiconductor processing equipment provided by the embodiment of the present invention have the following beneficial effects:

[0061] The wafer cleaning box 100 provided by the embodiment of the present invention is provided with through holes on the bottom plate 110, the side plate 120, the top plate 130 and the back plate 140, respectively, and the through holes are connected to the accommodating chamber 101. During cleaning, the flow rate of the cleaning liquid entering the accommodating chamber 101 is large and the speed is fast, so that the cleaning liquid fully contacts the surface of the wafer 200, which is conducive to thoroughly cleaning the surface of the wafer 200. When the cleaning is completed and taken out, the cleaning liquid in the accommodating chamber 101 can be quickly discharged from each through hole, the discharge speed is fast, the discharge is more thorough, and the residual cleaning liquid is reduced. Thereby reducing the secondary contamination of the residual liquid to the wafer 200. In this way, it is conducive to improving the cleaning effect and improving the quality of the wafer 200.

[0062] Furthermore, the wafer cleaning box 100 is suitable for both cleaning and electroplating operations on wafers 200, thus having a wide range of applications. During production and processing, different processes can share the wafer cleaning box 100, reducing the number of wafers 200 to be placed and transferred, reducing the risk of damage during transfer, and improving operational efficiency.

[0063] The semiconductor processing equipment provided by the present invention includes the above-mentioned wafer cleaning box 100. When cleaning and removing the wafer cleaning box 100, chemical liquid residue can be reduced, preventing the wafer 200 from secondary contamination by residual substances, thereby improving the cleaning effect and enhancing the quality of the wafer 200.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made should be included in the scope of protection of the present invention.

Claims

1. A wafer cleaning box, characterized in that: include: base plate; two side panels, the two side panels being respectively connected to opposite sides of the bottom panel; A top plate, the top plate and the bottom plate are arranged opposite to each other, and the top plate is connected to the two side plates respectively; a back panel connected to the bottom panel and / or the side panels; The bottom plate, the side plates, the top plate and the back plate together form a receiving cavity having an opening, and the opening is arranged opposite to the back plate; A partition is protruded from one side of the side plate toward the accommodating cavity, and the partition is used to place wafers; The bottom plate, the side plate, the top plate and the back plate are respectively provided with through holes, and the through holes are communicated with the accommodating cavity.

2. The wafer cleaning box according to claim 1, characterized in that: The through hole includes a first through hole, the side plate is provided with the first through hole, and the first through hole and the partition are staggered.

3. The wafer cleaning box according to claim 2, characterized in that: The first through holes on the two side panels are symmetrically designed.

4. The wafer cleaning box according to claim 2, characterized in that: The through holes include a second through hole and a third through hole. The second through hole is provided on the bottom plate, and the third through hole is provided on the top plate.

5. The wafer cleaning box according to claim 4, characterized in that: The second through hole and the third through hole are designed symmetrically.

6. The wafer cleaning box according to claim 4, characterized in that: The cross-sections of the second through hole and the third through hole are respectively larger than the cross-section of the first through hole.

7. The wafer cleaning box according to claim 1, characterized in that: The top plate is provided with a mounting boss and / or a mounting groove, and the bottom plate is provided with a mounting boss and / or a mounting groove; the mounting groove or mounting boss on the top plate of one of the wafer cleaning boxes is plugged into and matched with the mounting boss or mounting groove on the bottom plate of another wafer cleaning box to realize the stacking and assembly of multiple wafer cleaning boxes.

8. The wafer cleaning box according to claim 1, characterized in that: One of the back plate and the bottom plate is provided with a limiting groove, and the other is provided with a limiting column, and the limiting groove and the limiting column are plug-fitted.

9. The wafer cleaning box according to any one of claims 1 to 8, characterized in that: A hanging ear is protruded from one side of the side plate away from the accommodating cavity.

10. A semiconductor processing equipment, characterized in that: The invention comprises a machine platform and a wafer cleaning box according to any one of claims 1 to 9, wherein the wafer cleaning box is detachably connected to the machine platform.

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