Double-station wafer moving mechanism

Abstract

The utility model provides a double-station wafer moving mechanism which is characterized in that the double-station wafer moving mechanism comprises a first driving part, a support, a sliding rail and a clamping assembly, the two sides of the support are each provided with a conveying station, and the conveying stations are configured to convey wafers; each conveying station is provided with a sliding rail, the sliding rails are located on one side of the support, the clamping assemblies are slidably connected with the sliding rails, and the sliding rails are configured to guide the clamping assemblies to slide in the vertical direction where the sliding rails are located. A first driving part is arranged at the bottom of each conveying station, the driving end of each first driving part is connected with a clamping assembly, the clamping assemblies are configured to bear wafers, the two stations operate at the same time, the clamping assemblies are driven by the first driving parts to slide along the sliding rails, and the wafers of the two conveying stations are rapidly and automatically conveyed to preset positions; the conveying efficiency is improved, the wafers are placed in the clamping grooves, the conveying stability is improved, and the wafers are prevented from being damaged in the conveying process.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment, and in particular to a dual-station wafer moving mechanism. Background Art

[0002] With the development of fully automated detection technology for electronic components and the popularization of intelligent devices, higher requirements are placed on the efficiency of the semiconductor manufacturing industry. In the semiconductor manufacturing process, one of the links is to transport the wafers to a preset location for further processing. However, the existing technology mainly relies on manual transportation, which is not only slow and inefficient, but also easy to cause damage to the wafers. Utility Model Content

[0003] The purpose of the present application is to provide a dual-station wafer moving mechanism to solve the problem in the prior art that manual wafer transportation is inefficient and easily damaged.

[0004] To achieve this goal, this application adopts the following technical solutions:

[0005] The present application proposes a dual-station wafer moving mechanism, which includes a first driving member, a bracket, a slide rail, and a clamping assembly, wherein:

[0006] There is a transport station on each side of the bracket, and the transport station is configured to transport wafers;

[0007] Each transport station is provided with a slide rail, the slide rail is located on one side of the bracket, the clamping assembly is slidably connected to the slide rail, and the slide rail is configured to guide the clamping assembly to slide along the vertical direction where the slide rail is located;

[0008] A first driving member is provided at the bottom of the slide rail, and the driving end of the first driving member is connected to the clamping assembly. The clamping assembly is configured to carry the wafer. The first driving member is configured to drive the clamping assembly to slide along the slide rail to transport the wafer to a preset position.

[0009] Optionally, the bracket is supported by a square tube frame, and the bracket is configured to support parts of two transport stations.

[0010] Optionally, the first driving member includes a motor, a transmission screw and a screw nut, the driving end of the motor is connected to the transmission screw, the motor is configured to drive the transmission screw to rotate along its own axis, the screw nut is rotatably mounted on the transmission screw, and the screw nut is fixedly connected to the clamping assembly.

[0011] Optionally, the clamping assembly is connected to one end of the tank chain, and the movement of the clamping assembly simultaneously drives the tank chain to move, and the tank chain is configured to surround the relevant lines.

[0012] Optionally, the clamping assembly includes a connecting table and a wafer plug, the connecting table is connected to the slide rail and is perpendicular to the direction of the slide rail, the connecting table is configured to carry the wafer plug and move along the slide rail, the wafer plug is fixedly connected to the connecting table, and the wafer plug is configured to carry the wafer.

[0013] Optionally, two groups of first sensing elements are provided on both sides of the wafer plug along the first direction, and the first sensing elements are configured to detect whether the wafer exists and whether its position is correct.

[0014] Optionally, the wafer plug is provided with a plurality of slots in parallel along the horizontal direction, and the plurality of slots are configured to vertically carry a plurality of wafers.

[0015] Optionally, a second sensing element is provided on the bracket, and the second sensing element is configured to detect whether the wafer plug has reached a preset position.

[0016] Compared with the prior art, the dual-station wafer moving mechanism provided by this application has the following advantages:

[0017] 1) The first driving members of the two transport stations drive the clamping assembly to slide along the slide rail, which not only realizes the rapid and accurate automatic transportation of the wafers at the two transport stations to the preset position, thereby improving the transportation efficiency, but also places the wafers in the card slot, thereby improving the stability of transportation and preventing the wafers from being damaged during transportation.

[0018] 2) Through the cooperation of the motor, the transmission screw and the screw nut, not only the driving of the clamping assembly to slide along the slide rail is achieved, but also the use of the screw drive method improves the accuracy of transportation on the one hand and the transmission efficiency on the other.

[0019] 3) By arranging a plurality of slots in the horizontal direction on the wafer plug, on the one hand, multiple wafers can be transported at one time, and on the other hand, the wafers can be prevented from shaking and being damaged during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present application, a brief introduction is given below to the background technology of the present application and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the content of the embodiments of the present application and these drawings without paying any creative work.

[0021] Figure 1 Schematic diagram of the three-dimensional structure of the dual-station wafer moving mechanism provided in an embodiment of the present application;

[0022] Figure 2 yes Figure 1 A magnified schematic diagram of point A in the middle;

[0023] Figure 3 This is a rear view of the dual-station wafer moving mechanism provided in an embodiment of the present application;

[0024] Figure 4 It is a schematic diagram of the three-dimensional structure of the wafer jammer of the dual-station wafer moving mechanism provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the relevant drawings. Preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosure of the present application. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there can also be a central component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there can also be a central component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by a person skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0026] See also Figures 1 to 4 As shown, an embodiment of the present application provides a dual-station wafer moving mechanism, which includes a first driving member 10, a bracket 20, a slide rail 30 and a clamping assembly 40, wherein:

[0027] A transport station 50 is provided on each side of the support 20 , and the transport station 50 is configured to transport the wafer 60 ;

[0028] Each transport station 50 is provided with a slide rail 30, the slide rail 30 is located on one side of the bracket 20, the clamping assembly 40 is slidably connected to the slide rail 30, and the slide rail 30 is configured to guide the clamping assembly 40 to slide along the vertical direction where the slide rail 30 is located;

[0029] A first driving member 10 is provided at the bottom of the slide rail 30. The driving end of the first driving member 10 is connected to the clamping assembly 40. The clamping assembly 40 is configured to carry the wafer 60. The first driving member 10 is configured to drive the clamping assembly 40 to slide along the slide rail 30 to transport the wafer 60 to a preset position.

[0030] The first driving parts 10 of the two transport stations 50 drive the clamping assembly 40 to slide along the slide rail 30, which not only realizes the rapid and accurate automatic transportation of the wafers 60 of the two transport stations 50 to the preset position, thereby improving the transportation efficiency, but also the wafers 60 are placed in the card slots 420, thereby improving the stability of transportation and avoiding damage to the wafers 60 during transportation.

[0031] In one embodiment, the bracket 20 is supported by a square tube frame, and the bracket 20 is configured to support parts of two transport stations 50 .

[0032] The bracket 20 is supported by a square tube skeleton. On the one hand, the bracket 20 is hollowed out, saving material input costs, and on the other hand, the stability and strength of the overall structure are improved.

[0033] In one embodiment, the first driving member 10 includes a motor 11, a transmission screw and a screw nut. The driving end of the motor 11 is connected to the transmission screw. The motor 11 is configured to drive the transmission screw to rotate along its own axis. The screw nut is rotatably mounted on the transmission screw, and the screw nut is fixedly connected to the clamping assembly 40.

[0034] Through the cooperation of the motor 11, the transmission screw and the screw nut, not only the clamping assembly 40 is driven to slide along the slide rail 30, but also the screw transmission method improves the transportation accuracy on the one hand and the transmission efficiency on the other.

[0035] In one embodiment, the clamping assembly 40 is connected to one end of the tank chain 70. The movement of the clamping assembly 40 simultaneously drives the tank chain 70 to move. The tank chain 70 is configured to surround the relevant line.

[0036] By enclosing the wires with the tank chain 70, it is ensured that the wires can move safely when the clamping assembly 40 moves up and down, thereby ensuring the normal operation of the equipment and extending the service life of the wires.

[0037] In one embodiment, the clamping assembly 40 includes a connecting platform 41 and a wafer plug 42. The connecting platform 41 is connected to the slide rail 30 and is perpendicular to the direction of the slide rail 30. The connecting platform 41 is configured to carry the wafer plug 42 and move along the slide rail 30. The wafer plug 42 is fixedly connected to the connecting platform 41 and is configured to carry the wafer 60.

[0038] Through the cooperation between the connecting platform 41 and the wafer plug 42, not only the wafer 60 is stably supported and the safety of the wafer is protected, but also the structure is simple and the cost is saved.

[0039] In one embodiment, the wafer plug 42 is arranged along a first direction ( Figure 1Two groups of first sensing elements 43 are provided on both sides (in the X direction), and the first sensing elements 43 are configured to detect whether the wafer 60 exists and whether its position is correct.

[0040] By arranging the first sensing elements 43 on both sides of the wafer plug 42, it is possible to detect at any time whether the wafer 60 is placed in the slot 420 or whether the position of the wafer 60 is correct, thereby increasing the safety of placement and transportation of the wafer 60 and improving transportation efficiency.

[0041] In one embodiment, the wafer plug 42 is provided with a plurality of slots 420 in parallel along a horizontal direction, and the plurality of slots 420 are configured to vertically support a plurality of wafers 60 .

[0042] By arranging a plurality of slots 420 along the horizontal direction on the wafer plug 42 , on the one hand, multiple wafers 60 can be transported at one time, and on the other hand, shaking of the wafers 60 during transportation and damage to the wafers 60 can be prevented.

[0043] In one embodiment, a second sensing element is provided on the support 20 , and the second sensing element is configured to detect whether the wafer plug 42 reaches a preset position.

[0044] By providing a second sensing element on the support 20 , accurate detection of the position of the wafer plug 42 is achieved to ensure that the wafer 60 is transported to the designated position.

[0045] The above embodiments merely illustrate the basic principles and features of the present application. The present application is not limited by the above examples. Various changes and modifications may be made to the present application without departing from the spirit and scope of the present application. Such changes and modifications are intended to fall within the scope of the present application. The scope of protection claimed in the present application is defined by the appended claims and their equivalents.

Claims

1. A dual-station wafer moving mechanism, characterized in that: The dual-station wafer moving mechanism includes a first driving member, a bracket, a slide rail and a clamping assembly, wherein: A transport station is provided on each side of the support, and the transport station is configured to transport wafers; Each of the transport stations is provided with a slide rail, the slide rail is located on one side of the bracket, the clamping assembly is slidably connected to the slide rail, and the slide rail is configured to guide the clamping assembly to slide along the vertical direction where the slide rail is located; The first driving member is provided at the bottom of the slide rail, and the driving end of the first driving member is connected to the clamping assembly. The clamping assembly is configured to carry the wafer, and the first driving member is configured to drive the clamping assembly to slide along the slide rail to transport the wafer to a preset position.

2. The dual-station wafer moving mechanism according to claim 1, characterized in that: The bracket is supported by a square tube frame and is configured to support parts of two transport stations.

3. The dual-station wafer moving mechanism according to claim 1, characterized in that: The first driving component includes a motor, a transmission screw and a screw nut. The driving end of the motor is connected to the transmission screw. The motor is configured to drive the transmission screw to rotate along its own axis. The screw nut is rotatably mounted on the transmission screw, and the screw nut is fixedly connected to the clamping assembly.

4. The dual-station wafer moving mechanism according to claim 1, characterized in that: The clamping assembly is connected to one end of the tank chain. The movement of the clamping assembly simultaneously drives the tank chain to move. The tank chain is configured to surround the relevant line.

5. The dual-station wafer moving mechanism according to claim 1, characterized in that: The clamping assembly includes a connecting platform and a wafer plug. The connecting platform is connected to the slide rail and is perpendicular to the direction of the slide rail. The connecting platform is configured to carry the wafer plug and move along the slide rail. The wafer plug is fixedly connected to the connecting platform and is configured to carry the wafer.

6. The dual-station wafer moving mechanism according to claim 5, characterized in that: The wafer plug is provided with two groups of first sensing elements on both sides along a first direction, and the first sensing elements are configured to detect whether the wafer exists and whether its position is correct.

7. The dual-station wafer moving mechanism according to claim 5, characterized in that: The wafer plug is provided with a plurality of slots in parallel along a horizontal direction, and the plurality of slots are configured to vertically carry a plurality of wafers.

8. The dual-station wafer moving mechanism according to claim 5, characterized in that: The bracket is provided with a second sensing element, and the second sensing element is configured to detect whether the wafer plug has reached a preset position.

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