Ceramic heating sheet

Abstract

The utility model discloses a ceramic heating sheet. The ceramic heating sheet comprises a top ceramic layer, an upper heating layer, a middle ceramic layer, a lower heating layer and a bottom ceramic layer which are connected in sequence, the five layers are sequentially stacked and connected into an integrated structure, and the upper heating layer and the lower heating layer are connected to form a parallel circuit or a series circuit to adaptively select heating. Compared with the prior art, according to the technical scheme of the utility model, different pins can be selected for conduction according to different application scenes, heating in series, parallel and single heating layer modes is realized, and circuit connection and heating requirements of users are greatly facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic heating, in particular to a ceramic heating sheet. Background Art

[0002] The ceramic heating plate in the prior art usually has a three-layer structure, that is, it includes a top ceramic layer, a bottom ceramic layer, and a heating layer between the two ceramic layers. The heating layer is usually a metal material layer.

[0003] While the three-layer ceramic heater is compact and can be used in various heating scenarios or devices, in practice, the heating layer only has two pins, making it impossible to adjust the heating layer and the actual heating amount, making it unsuitable for various heating scenarios or equipment installations. Furthermore, due to its small size, the three-layer ceramic heater can withstand a small amount of heating, resulting in a short service life in actual applications. Utility Model Content

[0004] The main purpose of the utility model is to provide a ceramic heating plate, aiming to optimize the internal structure of the ceramic heating plate to improve the heating efficiency and service life of the ceramic heating plate.

[0005] To achieve the above-mentioned purpose, the utility model proposes a ceramic heating plate, comprising a top ceramic layer, an upper heating layer, a middle ceramic layer, a lower heating layer, and a bottom ceramic layer which are sequentially connected; the five-layer structure is stacked and connected in sequence to form an integrated structure, and the upper heating layer and the lower heating layer are connected to form a parallel circuit or a series circuit for adaptive selective heating.

[0006] Preferably, the edge of the top ceramic layer is provided with a top left through hole and a top right through hole, the upper heating layer is provided with an upper left pin and an upper right pin, the middle ceramic layer is provided with a middle left through hole and a middle right through hole, the lower heating layer is provided with a lower left pin and a lower right pin, and the edge of the bottom ceramic layer is provided with a bottom through hole; the top left through hole is opposite to the upper left pin, the top right through hole is opposite to the upper right pin; the bottom through hole is opposite to the lower left pin; the middle left through hole is opposite to the upper left pin and the lower left pin; the middle right through hole is opposite to the upper right pin and the lower right pin.

[0007] Preferably, an embedded conductor may be provided inside the middle right through hole to conduct the upper right pin and the lower right pin; or an embedded conductor may be provided inside the middle left through hole to conduct the upper left pin and the lower left pin.

[0008] Preferably, a conductor is embedded in the middle right through hole, the upper left pin is connected to the positive electrode, the lower left pin is connected to the negative electrode, and the upper heating layer and the lower heating layer form a series circuit.

[0009] Preferably, the upper left pin is connected to the positive electrode, the upper right pin is connected to the negative electrode, and only the upper heating layer forms a heating circuit.

[0010] Preferably, a conductor is embedded in the middle right through hole, the lower left pin is connected to the positive pole, the upper right pin is connected to the negative pole, and only the lower heating layer forms a heating circuit.

[0011] Preferably, a conductor is embedded in the middle right through hole, the upper left pin and the lower left pin are connected to the positive pole at the same time, the upper right pin is connected to the negative pole, and the upper heating layer and the lower heating layer form a parallel circuit.

[0012] Preferably, the upper heating layer is arranged between the top ceramic layer and the middle ceramic layer in a printed circuit manner; and the lower heating layer is arranged between the middle ceramic layer and the bottom ceramic layer in a printed circuit manner.

[0013] Preferably, a first cavity is formed between the top ceramic layer and the middle ceramic layer to accommodate the upper heating layer; and a second cavity is formed between the middle ceramic layer and the bottom ceramic layer to accommodate the lower heating layer.

[0014] Preferably, the upper heating layer and the lower heating layer are heating wires arranged in a planar circuitous manner, and the heating wires of the upper heating layer and the lower heating layer have the same circuitous direction or are perpendicular to each other in the plane.

[0015] The technical solution of this utility model has the following advantages over the existing technology:

[0016] The ceramic heating plate of the technical solution of the present utility model includes a top ceramic layer, an upper heating layer, a middle ceramic layer, a lower heating layer, and a bottom ceramic layer which are connected in sequence; the five-layer structure is stacked and connected in sequence as an integrated structure, and the upper heating layer and the lower heating layer are connected to form a parallel circuit or a series circuit to adaptively select heating. Users can choose different pins for conduction according to different application scenarios to achieve heating in series, parallel, and single heating layer modes, which greatly facilitates users' circuit connection and heating needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the ceramic heating plate of the present invention;

[0019] Figure 2 This is an exploded view of the structure of the ceramic heating plate of the present invention;

[0020] Figure 3 This is a schematic diagram of the series circuit structure of the ceramic heating plate of the present invention;

[0021] Figure 4 This is a schematic diagram of the circuit structure for heating the heating layer above the ceramic heating plate of the present invention;

[0022] Figure 5 This is a schematic diagram of the circuit structure for heating the heating layer below the ceramic heating plate of the present invention;

[0023] Figure 6 This is a schematic diagram of the parallel circuit structure of the ceramic heating plate of the utility model;

[0024] Figure 7 This is a partial structural exploded view of the ceramic heating plate of the present invention having a cavity inside;

[0025] Figure 8 This is a partial structural exploded view of the intermediate ceramic layer of the present invention having an intermediate through hole.

[0026] Description of Figure Numbers:

[0027] 1. Top ceramic layer; 11. Top left through-hole; 12. Top right through-hole; 2. Upper heating layer; 21. Upper left pin; 22. Upper right pin; 3. Middle ceramic layer; 31. Middle left through-hole; 32. Middle right through-hole; 33. Middle through-hole; 4. Lower heating layer; 41. Lower left pin; 42. Lower right pin; 5. Bottom ceramic layer; 51. Bottom through-hole; 6. Conductor; 101. First cavity; 102. Second cavity.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] The utility model provides a ceramic heating plate.

[0031] See Figure 1-2The ceramic heating plate of the present invention includes a top ceramic layer 1, an upper heating layer 2, a middle ceramic layer 3, a lower heating layer 4, and a bottom ceramic layer 5 arranged in sequence from top to bottom. The above five-layer structure is stacked and connected in sequence to form an integrated structure, and the upper heating layer 2 and the lower heating layer 4 are connected to form a parallel circuit or a series circuit to adapt to different heating scenarios and heating requirements.

[0032] Specifically, the top ceramic layer 1 of the utility model is provided with a top left through hole 11 and a top right through hole 12 on the edge, the upper heating layer 2 is provided with an upper left pin 21 and an upper right pin 22, the middle ceramic layer 3 is provided with a middle left through hole 31 and a middle right through hole 32, the lower heating layer 4 is provided with a lower left pin 41 and a lower right pin 42, and the bottom ceramic layer 5 is provided with a bottom through hole 51 on the edge; the top left through hole 11 is opposite to the upper left pin 21 and the lower left pin 41, the top right through hole 12 is opposite to the upper right pin 22 and the lower right pin 42; the bottom through hole 51 is opposite to the lower left pin 42; the middle left through hole 31 is opposite to the upper left pin 21 and the lower left pin 41; the middle right through hole 32 is opposite to the upper right pin 22 and the lower right pin 42. The top left through-hole 11, the top right through-hole 12, and the bottom through-hole 51 of this embodiment are arranged along the edge of the ceramic layer. These three through-holes are open, so in actual use, users can clamp the electrodes to the corresponding pins to complete the circuit. Alternatively, users can directly weld the welding material to the pins, which is convenient for subsequent operation and highly practical.

[0033] See Figure 2 The middle left through hole 31 of the middle ceramic layer 3 of the present invention may be provided with an embedded conductor to connect the upper left pin 21 and the lower left pin 41, or the middle right through hole 32 may be provided with an embedded conductor to connect the upper right pin 22 and the lower right pin 42.

[0034] See Figure 3 The middle right through hole 32 of the present invention is embedded with a conductor 6, the upper left pin 21 is connected to the positive pole, and the lower left pin 41 is connected to the negative pole. The upper heating layer 2 and the lower heating layer 4 are embedded with a conductor through the middle right through hole 32 to form a series circuit (the dotted circuit path shown in the figure), so the upper heating layer 2 and the lower heating layer 4 are simultaneously turned on to achieve heating.

[0035] See Figure 4 In the present invention, the upper left pin 21 is connected to the positive pole, and the upper right pin 22 is connected to the negative pole. Only the upper heating layer 2 forms a single heating circuit (the dotted circuit path shown in the figure), so only the upper heating layer 2 is turned on to achieve heating.

[0036] See Figure 5The middle right through hole 32 of the present invention is embedded with the conductor 6, the lower left pin is connected to the positive pole 41, and the upper right pin is connected to the negative pole 22. Only the lower heating layer 4 forms a heating circuit (the dotted circuit path shown in the figure), so only the lower heating layer 4 is turned on to achieve heating.

[0037] See Figure 6 The middle right through hole 32 of the present invention is embedded with a conductor 6, the upper left pin 21 and the lower left pin 41 are connected to the positive pole at the same time, the upper right pin 22 is connected to the negative pole, and the upper heating layer 2 and the lower heating layer 4 form a parallel circuit (the dotted circuit path shown in the figure), so the upper heating layer 2 and the lower heating layer 4 are turned on at the same time to achieve heating.

[0038] Therefore, the five-layer ceramic heating plate of the utility model can select different pins for conduction according to different application scenarios, realizing heating in series, parallel, and single heating layer modes, which greatly facilitates the user's circuit connection and heating needs.

[0039] In addition, the five-layer ceramic heating plate of the present invention has increased thickness by stacking five layers. Compared with the ordinary three-layer ceramic heating plate of the prior art or the three-layer ceramic heating plate with simply increased ceramic layer thickness, it can improve the dry-burning resistance. By reducing the thickness of the insulating layer, it improves thermal conductivity and energy efficiency conversion, reduces the generation of accumulated heat, and further improves the dry-burning resistance of the ceramic heating element.

[0040] At the same time, the ceramic heating plate of the utility model can be applied to the heating body of an instant water heater, so that it has excellent performance, stable structure, and heating performance comparable to that of a tubular heating body.

[0041] The upper heating layer 2 of the utility model is arranged between the top ceramic layer 1 and the middle ceramic layer 3 in the form of a printed circuit; the lower heating layer 4 is arranged between the middle ceramic layer 3 and the bottom ceramic layer 5 in the form of a printed circuit, and the five-layer structure of the ceramic heating plate of the utility model can be produced by bonding using an isostatic pressing process and a 1650-degree Celsius hydrogen atmosphere ceramic-metal co-firing process, which greatly facilitates manufacturing.

[0042] Preferably, in other embodiments of the present invention, a first cavity 101 is formed between the top ceramic layer 1 and the middle ceramic layer 3 to accommodate the upper heating layer 2; a second cavity 102 is formed between the middle ceramic layer 3 and the bottom ceramic layer 5 to accommodate the lower heating layer 4, see Figure 7 .

[0043] More preferably, the surface of the intermediate ceramic layer of the present invention is provided with an intermediate through hole 33, which connects the first cavity 101 with the second cavity 102. The heat inside the first cavity 101 and the heat inside the second cavity 102 can flow relative to each other along the intermediate through hole 33. Therefore, when the upper heating layer 2 and the lower heating layer 4 are heated in different cavities, the heat from the two adjacent cavities can flow through the intermediate through hole 33, making the heat inside the two cavities more balanced. In the actual heating process, local overheating that may cause the ceramic material to crack is less likely to occur. Figure 8 .

[0044] Preferably, the top ceramic layer 1 , the middle ceramic layer 3 , and the bottom ceramic layer 4 of this embodiment are aluminum oxide material layers.

[0045] Preferably, the upper heating layer 2 and the lower heating layer 4 of this embodiment are heating wires arranged in a planar circuitous manner, and the heating wires of the upper heating layer 2 and the lower heating layer 4 have the same circuitous direction or are perpendicular to each other in plane.

[0046] The upper heating layer 2 and the lower heating layer 4 are planar winding heating wires, that is, the heating wires are arranged flatly in the same plane with intervals and meanders to form the final heating layer. The heating wires of this embodiment have the same winding direction, which can be easily manufactured.

[0047] In addition, the circuitous manner of the heating wires of the upper heating layer 2 and the lower heating layer 4 can also be set along different dimensional directions of the ceramic heating plate. Therefore, the heating wires of the upper heating layer 2 and the lower heating layer 4 are partially perpendicular to each other in the plane in the direction of mutual projection. The perpendicular relationship in the plane can avoid the heating wires of adjacent heating layers from overlapping in the thickness direction of the ceramic heating plate, resulting in excessive concentration of heating in some areas of the ceramic heating plate, affecting its actual service life.

[0048] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A ceramic heating plate, characterized in that: It includes a top ceramic layer, an upper heating layer, a middle ceramic layer, a lower heating layer, and a bottom ceramic layer which are connected in sequence; the five layers are stacked and connected in sequence to form an integrated structure, and the upper heating layer and the lower heating layer are connected to form a parallel circuit or a series circuit to adaptively select heating.

2. The ceramic heating plate according to claim 1, wherein: The edge of the top ceramic layer is provided with a top left through hole and a top right through hole, the upper heating layer is provided with an upper left pin and an upper right pin, the middle ceramic layer is provided with a middle left through hole and a middle right through hole, the lower heating layer is provided with a lower left pin and a lower right pin, and the edge of the bottom ceramic layer is provided with a bottom through hole; the top left through hole is opposite to the upper left pin, the top right through hole is opposite to the upper right pin; the bottom through hole is opposite to the lower left pin; the middle left through hole is opposite to the upper left pin and the lower left pin; the middle right through hole is opposite to the upper right pin and the lower right pin.

3. The ceramic heating plate according to claim 2, wherein: An embedded conductor may be provided inside the middle right through hole to conduct the upper right pin and the lower right pin; or an embedded conductor may be provided inside the middle left through hole to conduct the upper left pin and the lower left pin.

4. The ceramic heating plate according to claim 3, wherein: The middle right through hole is embedded with a conductor, the upper left pin is connected to the positive electrode, the lower left pin is connected to the negative electrode, and the upper heating layer and the lower heating layer form a series circuit.

5. The ceramic heating plate according to claim 3, wherein: The upper left pin is connected to the positive electrode, the upper right pin is connected to the negative electrode, and only the upper heating layer forms a heating circuit.

6. The ceramic heating plate according to claim 3, wherein: The middle right through hole is embedded with a conductor, the lower left pin is connected to the positive pole, and the upper right pin is connected to the negative pole. Only the lower heating layer forms a heating circuit.

7. The ceramic heating plate according to claim 3, wherein: The middle right through hole is embedded with a conductor, the upper left pin and the lower left pin are connected to the positive pole at the same time, the upper right pin is connected to the negative pole, and the upper heating layer and the lower heating layer form a parallel circuit.

8. The ceramic heating plate according to claim 1, wherein: The upper heating layer is arranged between the top ceramic layer and the middle ceramic layer in a printed circuit manner; the lower heating layer is arranged between the middle ceramic layer and the bottom ceramic layer in a printed circuit manner.

9. The ceramic heating plate according to claim 1, wherein: A first cavity is formed between the top ceramic layer and the middle ceramic layer to accommodate the upper heating layer; and a second cavity is formed between the middle ceramic layer and the bottom ceramic layer to accommodate the lower heating layer.

10. The ceramic heating plate according to claim 1, wherein: The upper heating layer and the lower heating layer are heating wires arranged in a winding manner in a plane, and the heating wires in the upper heating layer and the lower heating layer have the same winding direction or are perpendicular to each other in the plane.

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