Jig

Abstract

The utility model discloses a jig which is used for fixing a circuit substrate so as to carry out vertical degumming and vertical copper plating on the circuit substrate. The jig comprises a plate body, and a limiting space and an opening communicated with the limiting space are defined by the plate body. The board body comprises a first groove facing the limiting space, and the circuit substrate is suitable for penetrating into the limiting space from the opening and being clamped in the first groove so as to prevent the circuit substrate from being separated from the board body in the thickness direction of the circuit substrate. According to the scheme, the fixture is convenient and fast to fix, the operation time can be greatly shortened, and the production efficiency of the circuit substrate is effectively improved. Moreover, the circuit substrate can be clamped in the first groove of the board body, so that the fixing stability of the circuit substrate can be improved, and the processing quality of the circuit substrate is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging substrate manufacturing, in particular to a jig. Background Art

[0002] In the manufacturing of packaging substrates, SAP (Selective Adhesive Process) vertical debonding and vertical copper plating are non-contact processes (no rollers contact the board surface within the equipment line). Specifically, a hanging basket is used to insert the circuit substrate for production processing. When the circuit substrate is produced in a normal size (such as 515mm*510mm), it can be directly placed in the hanging basket for fixation. However, process monitoring in production is completed using large-sized circuit substrates (such as 100cm*100cm). Due to their size, they cannot be directly placed in the hanging basket for use, and therefore require the assistance of additional jigs. In the existing technology, the circuit substrate is manually fixed to the jig using stainless steel wire. The overall operation is complex and time-consuming, which affects the production efficiency of the substrate. Utility Model Content

[0003] The main purpose of the utility model is to provide a jig, aiming to solve the technical problem of complex jig fixing operation.

[0004] To achieve the above-mentioned purpose, an embodiment of the present utility model proposes a jig for fixing a circuit substrate so as to vertically remove glue and vertically copper the circuit substrate. The jig includes: a plate body, enclosing a limiting space and an opening connected to the limiting space, the plate body including a first groove facing the limiting space, the circuit substrate is suitable for passing through the opening into the limiting space and being clamped in the first groove to prevent the circuit substrate from falling out of the plate body along its thickness direction.

[0005] In some embodiments, the plate body includes a first side plate and a second side plate that are connected to each other, the first side plate and the second side plate are arranged crosswise, the first side plate is provided with the first groove, and the second side plate includes a second groove facing the limiting space, and the circuit substrate can be clamped in the second groove to prevent the circuit substrate from falling out of the plate body along its thickness direction.

[0006] In some embodiments, the plate body includes a third side plate facing the limited space, the third side plate is arranged crosswise with the second side plate, and the second side plate is connected to the first side plate and the third side plate at both ends along its extension direction;

[0007] The third side plate includes a third groove facing the limiting space, and the circuit substrate can be snapped into the third groove to prevent the circuit substrate from escaping from the plate body along the thickness direction thereof.

[0008] In some embodiments, the groove depth of the first groove is H1, wherein H1 satisfies: 1 mm≤H1≤2 mm;

[0009] and / or,

[0010] The groove depth of the second groove is H2, wherein H2 satisfies: 1 mm ≤ H2 ≤ 2 mm;

[0011] and / or,

[0012] The groove depth of the third groove is H3, wherein H3 satisfies: 1 mm≤H3≤2 mm.

[0013] In some embodiments, the first side panel includes a first end facing away from the second side panel, the third side panel includes a second end facing away from the second side panel, and the first end and the second end are spaced apart to jointly define the opening.

[0014] In some embodiments, the extension length of the first side plate is L1, and along the extension direction of the first side plate, the distance from the first groove to the first end is D1, wherein D1 and L1 satisfy: 3 / 10≤D1 / L1≤1 / 2;

[0015] The extension length of the third side plate is L2. Along the extension direction of the third side plate, the distance from the third groove to the second end is D2, wherein D2 and L2 satisfy: 3 / 10≤D2 / L2≤1 / 2.

[0016] In some embodiments, the plate body includes a first layer plate and a second layer plate that are stacked and connected, and a first limit block and a second limit block are provided on a side of the second layer plate facing away from the first layer plate, the first limit block is located at the first side plate, and the second limit block is located at the second side plate;

[0017] The first limiting block, the first layer plate, and the second layer plate together define the first groove. The second limiting block, the first layer plate, and the second layer plate together define the second groove. The first groove and the second groove are arranged at intervals.

[0018] In some embodiments, a third limit block is provided on the side of the second layer plate facing away from the first layer plate, and the third limit block is located at the third side plate. The third limit block, the first layer plate and the second layer plate jointly define the third groove, and the third groove is spaced apart from the second groove.

[0019] In some embodiments, at the limiting space, the first layer is provided with an opening extending along its thickness direction, and the circuit substrate is suitable for covering the opening.

[0020] In some embodiments, the second limiting block partially extends to the first side plate, and the second limiting block can define a fourth groove together with the first layer plate and the second layer plate, and the circuit substrate can be snapped into the fourth groove;

[0021] and / or,

[0022] The second limiting block partially extends to the third side plate. The second limiting block can define a fifth groove together with the first layer plate and the second layer plate. The circuit substrate can be snapped into the fifth groove.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] In the technical solution of the present utility model, the jig includes a plate body, and the plate body can enclose a limiting space and an opening connected to the limiting space. In the prior art, it is necessary to manually use stainless steel wire to tie the circuit substrate to the jig to achieve fixation. The overall operation is complicated and time-consuming, which will affect the production efficiency of the substrate. The circuit substrate of this solution can directly pass through the limiting space through the opening of the plate body, which can prevent the circuit substrate from escaping from the plate body along its thickness direction, thereby achieving the fixing operation of the circuit substrate. Therefore, the fixing operation of the circuit substrate in this solution is convenient and fast, which can greatly shorten the operation time and effectively improve the production efficiency of the circuit substrate. In addition, the plate body has a first groove facing the limiting space, and the circuit substrate can be snapped into the first groove, which can improve the stability of the circuit substrate fixation and ensure the processing quality of the circuit substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1 Schematic diagram of the structure of a fixture in one embodiment of the present invention; wherein, a first side plate, a second side plate and a third side plate are shown;

[0027] Figure 2 Schematic diagram of a fixture in one embodiment of the present invention; wherein the circuit substrate enters the limited space along the opening;

[0028] Figure 3 Schematic diagram of a fixture fixing a circuit substrate in one embodiment of the present invention; wherein the fourth groove and the fifth groove are shown;

[0029] Figure 4Schematic top view of a fixture in one embodiment of the present invention;

[0030] Figure 5 It is a side view schematic diagram of a fixture in one embodiment of the present invention, wherein the first layer plate, the second layer plate and the limit block are shown.

[0031] Description of Figure Numbers:

[0032] Fixture 10;

[0033] plate body 100;

[0034] Limited space 110; opening 111;

[0035] First side plate 120; first groove 121; first end 122;

[0036] Second side plate 130; second groove 131;

[0037] Third side plate 140; third groove 141; second end 142;

[0038] First layer 150; opening 151;

[0039] Second layer plate 160; first limiting block 161; second limiting block 162; fourth groove 1621; fifth groove 1622; third limiting block 163;

[0040] Circuit board 20.

[0041] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0043] In view of this, an embodiment of the present invention proposes a jig, which is used to fix the circuit substrate so as to vertically remove glue and vertically copper the circuit substrate. Vertical degumming can remove excess glue on the circuit substrate. Vertical copper can deposit a copper layer on a non-conductive circuit substrate. Vertical copper includes the following steps: surface treatment, cleaning and treating the circuit substrate to ensure good adhesion; chemical copper plating, immersing the circuit substrate in a chemical solution containing copper ions, and the copper ions are reduced and deposited on the surface of the circuit substrate to form a copper layer; post-treatment, cleaning and curing the copper plating layer to improve its corrosion resistance and conductivity. The specific operations of vertical degumming and vertical copper can refer to relevant known technologies. It should be noted that when performing vertical degumming and vertical copper operations, refer to Figure 4 Orientation: The circuit substrate needs to be arranged vertically, and the thickness direction of the circuit substrate is perpendicular to the vertical direction.

[0044] Reference Figure 1 and Figure 2 The fixture 10 includes a plate body 100. The plate body 100 encloses a limiting space 110 and an opening 111, and the opening 111 is connected to the limiting space 110. It should be noted that the circuit substrate 20 can pass through the limiting space 110 through the opening 111 to achieve limiting, and the circuit substrate 20 can also escape from the limiting space 110 through the opening 111 to achieve separation. The limiting space 110 and the opening 111 can be adapted to the structure and size arrangement of the circuit substrate 20, refer to Figure 2 The opening 111 can be provided at the upper portion of the limiting space 110 .

[0045] Reference Figure 1 The plate 100 includes a first groove 121 facing the limiting space 110. The specific location of the first groove 121 can be determined according to the actual situation. Figure 2 In some embodiments of the present application, the first groove 121 is provided on the left side of the board 100. When the circuit substrate 20 needs to be fixed, the circuit substrate 20 can pass through the opening 111 into the limiting space 110 and be locked in the first groove 121, which effectively prevents the circuit substrate 20 from falling out of the board 100 along its thickness direction.

[0046] In the technical solution of the present invention, the jig 10 includes a plate body 100. The plate body 100 can enclose a limiting space 110 and an opening 111 connected to the limiting space 110. In the prior art, it is necessary to manually use stainless steel wire to tie the circuit substrate to the jig to achieve fixation. The overall operation is complicated and time-consuming, which will affect the production efficiency of the circuit substrate. The circuit substrate 20 of this solution can directly penetrate into the limiting space 110 through the opening 111 of the plate body 100, which can prevent the circuit substrate 20 from escaping from the plate body 100 along its thickness direction, thereby achieving the fixing operation of the circuit substrate 20. Therefore, the fixing operation of the circuit substrate 20 in this solution is convenient and fast, which can greatly shorten the operation time and effectively improve the production efficiency of the circuit substrate 20. In addition, the plate body 100 has a first groove 121 facing the limiting space 110, and the circuit substrate 20 can be snapped into the first groove 121, which can ensure the stability of the fixation of the circuit substrate 20 and ensure the processing quality of the circuit substrate 20.

[0047] Reference Figure 1 and Figure 2 , the specific structure of the plate body 100 is introduced below. In some embodiments, the plate body 100 includes a first side plate 120 and a second side plate 130 connected to each other. The structure of the second side plate 130 can be the same as or different from that of the first side plate 120. Some embodiments of the present application are described by taking the second side plate 130 having a different structure from the first side plate 120 as an example. Figure 2 In terms of orientation, the first side panel 120 may be a side panel on the left side of the panel body 100 , and the second side panel 130 may be a side panel on the lower side of the panel body 100 .

[0048] Reference Figure 2 , the first side panel 120 and the second side panel 130 are arranged crosswise. In some embodiments, the first side panel 120 can be arranged perpendicular to the second side panel 130. In other embodiments, the first side panel 120 and the second side panel 130 can also be at other non-vertical inclination angles. The first side panel 120 can be provided with a first groove 121, and the second side panel 130 has a second groove 131 facing the limiting space 110. The structure of the second groove 131 can be the same as that of the first groove 121. When it is necessary to fix the circuit substrate 20, the circuit substrate 20 can be snapped into the second groove 131, which can prevent the circuit substrate 20 from falling out of the plate body 100 along its thickness direction. By adding the second groove 131, this solution can improve the stability of fixing the circuit substrate 20 and ensure the processing quality of the circuit substrate 20.

[0049] Reference Figure 2 , the specific structure of the plate body 100 is described below. In some embodiments, the plate body 100 includes a third side plate 140 facing the limiting space 110, referring to Figure 2The side panel on the right side of the panel body 100 may be the third side panel 140. The second side panel 130 is connected to the first side panel 120 and the third side panel 140 at both ends along its extension direction. The third side panel 140 is arranged crosswise with the second side panel 130. It is understood that the third side panel 140 may be perpendicular to the second side panel 130 or at a non-perpendicular angle.

[0050] The third side plate 140 includes a third groove 141 facing the limiting space 110. The structure of the third groove 141 can be identical to that of the first groove 121. When the circuit substrate 20 needs to be secured, it can be snapped into the third groove 141, thereby preventing the circuit substrate 20 from slipping out of the plate body 100 along its thickness. The addition of the third groove 141 further enhances the stability of the fixture 10 in securing the circuit substrate 20, ensuring the processing quality of the circuit substrate 20.

[0051] Reference Figure 5 The following describes the specific configuration of the first groove 121. In some embodiments, the groove depth of the first groove 121 is H1, where H1 satisfies the following conditions: 1 mm ≤ H1 ≤ 2 mm. For example, H1 can be 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, 1.8 mm, or 2 mm. Some embodiments of this application are described using H1 as 1 mm.

[0052] When processing and testing the circuit substrate 20, it is immersed in a specific solution to react. The reaction information of the circuit substrate 20 is obtained by comparing the weight of the circuit substrate 20 before and after the reaction. However, when the circuit substrate 20 is engaged with the first groove 121, the first groove 121 will shield the circuit substrate 20 along its thickness. If the groove depth of the first groove 121 is too deep and the shielding area is too large, the accuracy of the test will be affected. The above-mentioned configuration of the first groove 121 in this solution not only ensures the stability of the circuit substrate 20 during engagement, but also reduces the shielding area of ​​the circuit substrate 20 by the first groove 121, thereby ensuring the accuracy and stability of the circuit substrate 20 test.

[0053] The following describes the specific configuration of the second groove 131. The dimensions of the second groove 131 can be the same as those of the first groove 121. In some embodiments, the groove depth of the second groove 131 is H2, where H2 satisfies the following: 1 mm ≤ H2 ≤ 2 mm. For example, H2 can be 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, 1.8 mm, or 2 mm. Some embodiments of this application are described using H2 of 1 mm as an example.

[0054] When processing and testing the circuit substrate 20, it is immersed in a specific solution to react. The reaction information is then obtained by comparing the weight of the circuit substrate 20 before and after the reaction. However, when the circuit substrate 20 is engaged with the second groove 131, the second groove 131 will shield the circuit substrate 20 along its thickness. If the second groove 131 is too deep and the shielding area is too large, the accuracy of the test will be affected. The above-described arrangement of the second groove 131 in this embodiment ensures the stability of the circuit substrate 20 engagement while reducing the shielding area of ​​the circuit substrate 20 by the second groove 131, thereby ensuring the accuracy and stability of the circuit substrate 20 test.

[0055] The following describes the specific configuration of the third groove 141. The dimensions of the third groove 141 can be the same as those of the first groove 121. In some embodiments, the depth of the third groove 141 is H3, where H3 satisfies the following conditions: 1 mm ≤ H3 ≤ 2 mm. For example, H2 can be 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, 1.8 mm, or 2 mm. Some embodiments of this application are described using an H3 of 1 mm as an example.

[0056] During processing and testing of the circuit substrate 20, the circuit substrate 20 is immersed in a specific solution to react. The reaction information is then obtained by comparing the weight of the circuit substrate 20 before and after the reaction. However, when the circuit substrate 20 is engaged with the third groove 141, the third groove 141 will shield the circuit substrate 20 along its thickness. If the third groove 141 is too deep and the shielding area is too large, the accuracy of the test will be affected. The third groove 141 of this solution adopts the above-mentioned configuration, which not only ensures the stability of the circuit substrate 20 during engagement, but also reduces the shielding area of ​​the circuit substrate 20 by the third groove 141, thereby ensuring the accuracy and stability of the circuit substrate 20 test.

[0057] Reference Figure 1 The specific configuration of opening 111 is described below. In some embodiments, first side panel 120 includes a first end 122 facing away from second side panel 130, and third side panel 140 includes a second end 142 facing away from second side panel 130. First end 122 can be spaced apart from second end 142 to define opening 111. The specific spacing between first end 122 and second end 142 can be determined based on practical needs.

[0058] Reference Figure 4, the specific setting position of the first groove 121 is introduced below. In some embodiments, the extension length of the first side plate 120 is L1. Along the extension direction of the first side plate 120, the distance from the first groove 121 to the first end 122 is D1, wherein D1 and L1 satisfy: 3 / 10≤D1 / L1≤1 / 2. Exemplarily, D1 / L1 can be 3 / 10, 2 / 5 or 1 / 2, etc. Some embodiments of the present application are described by taking D1 / L1 as 3 / 10 as an example. Specifically, refer to Figure 4 When the height of the fixture 10 along the vertical direction is 100 mm, the distance from the first groove 121 to the first end 122 along the vertical direction may be 30 mm.

[0059] When the circuit substrate 20 is vertically inserted into the confined space 110 of the jig 10, the first groove 121 may scratch the surface of the circuit substrate 20, causing damage to the circuit substrate 20 and affecting the accuracy of the test. Therefore, the circuit substrate 20 needs to be tilted relative to the jig 10 (which can be 30 degrees) before insertion. However, when the distance from the first groove 121 to the first end 122 is small, the tilted circuit substrate 20 may become stuck during insertion. By arranging the first groove 121 in the above-mentioned position, this solution ensures both smooth insertion of the circuit substrate 20 and the stability of the jig 10 in securing the circuit substrate 20.

[0060] Reference Figure 4 , the specific setting position of the third groove 141 is introduced below. In some embodiments, the extension length of the third side plate 140 is L2. Along the extension direction of the third side plate 140, the distance from the third groove 141 to the second end 142 is D2, wherein D2 and L2 satisfy: 3 / 10≤D2 / L2≤1 / 2. Exemplarily, D2 / L2 can be 3 / 10, 2 / 5 or 1 / 2, etc. Some embodiments of the present application are described by taking D2 / L2 as 3 / 10 as an example. Specifically, refer to Figure 4 In terms of orientation, when the height of the fixture 10 along the vertical direction is 100 mm, the distance from the third groove 141 to the second end 142 along the vertical direction may be 30 mm.

[0061] When the circuit substrate 20 is vertically inserted into the confined space 110 of the jig 10, the third groove 141 may scratch the surface of the circuit substrate 20, causing damage to the circuit substrate 20 and affecting the accuracy of the test. Therefore, the circuit substrate 20 needs to be tilted relative to the jig 10 (which can be 30 degrees) before insertion. However, when the distance from the third groove 141 to the second end 142 is small, the tilted circuit substrate 20 may become stuck during insertion. By arranging the third groove 141 in this position, this solution ensures both smooth insertion of the circuit substrate 20 and the stability of the jig 10 in securing the circuit substrate 20.

[0062] It should be noted that to facilitate insertion of the circuit substrate 20 after tilting it relative to the jig 10, the widths of the first groove 121, the second groove 131, and the third groove 141 must each be greater than the thickness of the circuit substrate 20. It is understood that the widths of the first groove 121, the second groove 131, and the third groove 141 can be equal. For example, when the thickness of the circuit substrate 20 is N, the width of the first groove 121 can be N + 1 mm.

[0063] Reference Figure 3 and Figure 5 , the relative positions of the first groove 121 and the second groove 131 are described below. In some embodiments, the board body 100 includes a first layer board 150 and a second layer board 160 that are stacked and connected. The first layer board 150 can be welded to the second layer board 160. Figure 5 Regarding the orientation, the first layer 150 can be the layer on the lower side of the plate body 100, and the second layer 160 can be the layer on the upper side of the plate body 100. A first stopper 161 and a second stopper 162 can be provided on the side of the second layer 160 facing away from the first layer 150. The first stopper 161 can be located on the first side panel 120, and the second stopper 162 can be located on the second side panel 130.

[0064] Reference Figure 3 , the first limit block 161 can define the first groove 121 together with the first layer 150 and the second layer 160, and the second limit block 162 can define the second groove 131 together with the first layer 150 and the second layer 160. The first groove 121 and the second groove 131 are arranged at intervals, and the specific spacing between the first groove 121 and the second groove 131 can be determined according to actual conditions. After fixing the circuit substrate 20, the fixture 10 needs to undergo multiple processes and be processed with different chemical solutions. When the first groove 121 and the second groove 131 are connected, the chemical solution of the previous process will remain in the groove structure and then contaminate the chemical solution of the subsequent process, interfering with the test results. In this solution, the first groove 121 and the second groove 131 are spaced apart, that is, they are fixed in sections, so that the chemical solution can easily leak out from the gap between the first groove 121 and the second groove 131, effectively avoiding the situation where the chemical solution remains, and ensuring the test accuracy and processing quality of the circuit substrate 20.

[0065] Reference Figure 3In some embodiments, a third limit block 163 is provided on the side of the second layer 160 facing away from the first layer 150. The third limit block 163 may have the same structure as the first limit block 161. The third limit block 163 may be provided at the third side plate 140. The third limit block 163 can define a third groove 141 together with the first layer 150 and the second layer 160. The third groove 141 is spaced apart from the second groove 131. It can be understood that the spacing between the third groove 141 and the second groove 131 may be the same as the spacing between the second groove 131 and the first groove 121. In this solution, the third groove 141 and the second groove 131 are spaced apart, that is, they are fixed in sections, so that the chemical solution can easily leak out from the gap between the second groove 131 and the third groove 141, effectively avoiding the situation where the chemical solution is retained, and ensuring the test accuracy and processing quality of the circuit substrate 20.

[0066] Reference Figure 2 In some embodiments, at the limiting space 110 of the board body 100, the first layer 150 has an opening 151 extending along its thickness direction. The specific size and shape of the opening 151 of the first layer 150 can be adapted to the arrangement of the circuit substrate 20. The circuit substrate 20 can cover the opening 151. It can be understood that because the board body 100 is provided with the opening 151, that is, after the circuit substrate 20 passes through the limiting space 110, the fixture 10 does not cover the two side walls of the circuit substrate 20 along its thickness direction. This solution facilitates the simultaneous processing and testing of both sides of the circuit substrate 20, which can ensure test efficiency.

[0067] Reference Figure 3 , the specific setting of the second limit block 162 is introduced below. In some embodiments, the second limit block 162 can partially extend to the first side plate 120, and the second limit block 162 can jointly define a fourth groove 1621 with the first layer plate 150 and the second layer plate 160. When the circuit substrate 20 needs to be fixed, the circuit substrate 20 can be snapped into the fourth groove 1621. By adding the fourth groove 1621, this solution can improve the stability of fixing the circuit substrate 20 and ensure the processing quality of the circuit substrate 20. It should be noted that the fourth groove 1621 can be separated from the first groove 121 and connected to the second groove 131.

[0068] Reference Figure 3, the specific setting of the second limit block 162 is introduced below. In some embodiments, the second limit block 162 can partially extend to the third side plate 140, and the second limit block 162 can jointly define the fifth groove 1622 with the first layer plate 150 and the second layer plate 160. When the circuit substrate 20 needs to be fixed, the circuit substrate 20 can be snapped into the fifth groove 1622. By adding the fifth groove 1622, this solution can improve the stability of fixing the circuit substrate 20 and ensure the processing quality of the circuit substrate 20. It should be noted that the second groove 131 can be set to multiple, and the fifth groove 1622 can be separated from the third groove 141 and connected to the second groove 131.

[0069] The applicant found that the average operation time for manually tying the circuit substrate 20 to the existing jig 10 and then placing the existing jig 10 into the hanging basket is 30 minutes. However, the jig 10 of the present solution does not need to be taken out of the hanging basket, and the circuit substrate 20 can be directly placed in, with an average operation time of 1 minute, which can effectively improve operational efficiency. After comparing the copper thickness test data, the double-sample test P value of the copper thickness of the two jigs 10 is greater than 0.05, that is, there is no significant difference in the copper thickness value of the circuit substrate 20 processed by the jig 10 of the present solution and the existing jig 10, which meets the requirements for replacing the jig 10. After comparing the weight loss and roughness test data, the double-sample test P value of the two jigs 10 is greater than 0.05, that is, there is no significant difference in the weight loss and roughness value of the circuit substrate 20 processed by the jig 10 of the present solution and the existing jig 10, which meets the requirements for replacing the jig 10.

[0070] It should be noted that if any embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative positional relationships and movement of various components in a specific posture. If the specific posture changes, the directional indications will also change accordingly. When a directional reference is introduced in a specific embodiment, unless the direction is specifically limited to unidirectional, the direction can be unidirectional or bidirectional (two parallel and opposite directions). The specific unidirectional or bidirectional is based on the ability of ordinary technicians in this field to implement. When the directional reference is bidirectional, it should be considered that two different embodiments are described simultaneously.

[0071] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or", "and / or" or "and / or" appear in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0072] The above are only preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A fixture for fixing a circuit substrate to perform vertical debonding and vertical copper plating on the circuit substrate, characterized in that: The fixture includes: a plate body, enclosing a limiting space and an opening connected to the limiting space, the plate body including a first groove facing the limiting space, the circuit substrate is suitable for passing through the limiting space through the opening and being clamped in the first groove to prevent the circuit substrate from falling out of the plate body along its thickness direction.

2. The fixture according to claim 1, wherein: The plate body includes a first side plate and a second side plate that are connected to each other, the first side plate and the second side plate are arranged crosswise, the first side plate is provided with the first groove, and the second side plate includes a second groove facing the limiting space, and the circuit substrate can be snapped into the second groove to prevent the circuit substrate from falling out of the plate body along its thickness direction.

3. The fixture according to claim 2, wherein: The plate body includes a third side plate facing the limiting space, the third side plate is arranged crosswise with the second side plate, and the second side plate is connected to the first side plate and the third side plate at both ends along its extension direction; The third side plate includes a third groove facing the limiting space, and the circuit substrate can be snapped into the third groove to prevent the circuit substrate from escaping from the plate body along the thickness direction thereof.

4. The fixture according to claim 3, wherein: The groove depth of the first groove is H1, wherein H1 satisfies: 1 mm≤H1≤2 mm; and / or, The groove depth of the second groove is H2, wherein H2 satisfies: 1 mm ≤ H2 ≤ 2 mm; and / or, The groove depth of the third groove is H3, wherein H3 satisfies: 1 mm≤H3≤2 mm.

5. The fixture according to claim 4, wherein: The first side panel includes a first end facing away from the second side panel, and the third side panel includes a second end facing away from the second side panel. The first end and the second end are spaced apart to jointly define the opening.

6. The jig according to claim 5, wherein: The extension length of the first side plate is L1, and along the extension direction of the first side plate, the distance from the first groove to the first end is D1, wherein D1 and L1 satisfy: 3 / 10≤D1 / L1≤1 / 2; The extension length of the third side plate is L2. Along the extension direction of the third side plate, the distance from the third groove to the second end is D2, wherein D2 and L2 satisfy: 3 / 10≤D2 / L2≤1 / 2.

7. The fixture according to claim 3, wherein: The plate body includes a first layer plate and a second layer plate that are stacked and connected, and a first limit block and a second limit block are provided on a side of the second layer plate facing away from the first layer plate, the first limit block is located at the first side plate, and the second limit block is located at the second side plate; The first limiting block, the first layer plate, and the second layer plate together define the first groove. The second limiting block, the first layer plate, and the second layer plate together define the second groove. The first groove and the second groove are arranged at intervals.

8. The fixture according to claim 7, wherein: A third limit block is provided on the side of the second layer plate facing away from the first layer plate. The third limit block is located at the third side plate. The third limit block, the first layer plate and the second layer plate together define the third groove. The third groove is spaced apart from the second groove.

9. The fixture according to claim 7, wherein: At the limiting space, the first layer plate is provided with an opening extending along the thickness direction thereof, and the circuit substrate is suitable for covering the opening.

10. The fixture according to claim 7, wherein: The second limiting block partially extends to the first side plate, and the second limiting block can define a fourth groove together with the first layer plate and the second layer plate, and the circuit substrate can be clamped in the fourth groove; and / or, The second limiting block partially extends to the third side plate. The second limiting block can define a fifth groove together with the first layer plate and the second layer plate. The circuit substrate can be snapped into the fifth groove.

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