Motor controller and hovercar

Abstract

The utility model relates to a motor controller and an aerocar. A circuit board and a power device electrically connected with the circuit board are arranged in a shell of the motor controller. The shell is provided with a heat dissipation window penetrating through the interior and the exterior, and a heat dissipation device penetrates through the shell from the interior of the shell and extends to the exterior of the shell. And the radiator is in heat-conducting contact with the power device. And a heat conduction layer formed by heat conduction silicone grease is arranged between the contact surfaces of the radiator and the power device. The radiator is electrically connected on the circuit board through a crimping reed. According to the technical scheme, the radiator and the power device are integrally packaged in the controller shell. Heat generated by the power device is led out to the outside of the shell through the radiator, and forced heat dissipation is achieved through airflow generated during equipment operation. According to the utility model, the electric control internal cavity space occupied by the circuit board is effectively reduced, the whole weight is reduced, good heat dissipation of the shell is realized, and a complicated air cooling airflow driving mechanism does not need to be designed.

Description

Technical Field

[0001] The utility model relates to the technical field, and in particular to a motor controller and a flying car. Background Art

[0002] As a key means of transportation in the low-altitude economy, flying cars (eVTOLs) have experienced rapid growth in recent years. These vehicles, a new type of transportation that combines the characteristics of cars and airplanes, can be driven on roads and flown in the air. Their most significant feature is their ability to take off and land vertically, eliminating the need for a dedicated runway. Electrification was a key design goal for flying cars from the outset, and with the advancement of solid-state batteries, their range will be significantly improved. As the driving force behind flying cars, electric drive assembly technology is also rapidly evolving. The motor design parameters are typically low speed and high torque to meet the technical requirements for vertical takeoff and landing. The electronic control unit is responsible for flight control and overall power output control, and is typically cooled by air or liquid.

[0003] Although liquid cooling has high heat dissipation efficiency, there is a risk of leakage. Once leaked, the risk is either poor heat dissipation or a major accident with the destruction of the aircraft and loss of life. This is unacceptable to the aviation industry, which regards safety as its top priority. The electronic control of this type of cooling method may face great difficulties in the subsequent review process of the authorities after the flying car is put into aviation.

[0004] Besides liquid cooling, the industry typically uses air cooling to design heat dissipation structures for flying car motor controllers. However, traditional air cooling methods suffer from the bulky and heavy aluminum heat sinks. Furthermore, conventional air cooling methods struggle to meet the heat dissipation requirements of electronic controls. The junction temperature of power modules used in flying cars is typically limited to 150°C, placing high demands on electronic controls, especially module heat dissipation design. Therefore, applying air cooling, a safer heat dissipation method, to flying car electronic controls has become a technical challenge for R&D and design professionals in the flying car technology industry chain. Utility Model Content

[0005] In view of the problem that the air cooling technology in the prior art is difficult to meet the heat dissipation requirements of the electronic control of flying cars, the utility model provides a motor controller and a flying car.

[0006] The technical solution of the utility model provides a motor controller having a housing encapsulating an internal structure, wherein the housing includes a circuit board and a power device electrically connected to the circuit board;

[0007] The shell is provided with a heat dissipation window which penetrates inside and outside the shell, and the heat sink extends from the inside of the shell through the shell to the outside of the shell; the heat sink is in thermal contact with the power device.

[0008] Preferably, a heat-conducting layer formed of thermal grease is provided between the contact surfaces of the heat sink and the power device.

[0009] Preferably, the heat sink is electrically connected to the circuit board via a crimping spring.

[0010] Preferably, the circuit board has a press-fit spring, one end of which is fixed to the circuit board and electrically connected to the circuit board; the other end of the press-fit spring is higher than the surface of the circuit board and elastically suspended;

[0011] Preferably, the surface of the heat sink located on the inner side of the housing is provided with a groove for accommodating the power device;

[0012] When the power device is packaged in the housing, the power device is embedded in the groove and is in thermal contact with the bottom surface and side surfaces of the groove.

[0013] Preferably, the portion of the heat sink located outside the housing forms heat dissipation fins, and the heat dissipation fins are arranged side by side to form air flow channels therebetween.

[0014] Preferably, the housing further includes a bus capacitor, which is electrically connected to the circuit board;

[0015] The side of the radiator having the busbar capacitor is located in the upwind direction of the air flow in the air flow channel.

[0016] Preferably, the heat sink is made of a diamond / aluminum composite material.

[0017] Preferably, the housing further includes a bus capacitor, which is electrically connected to the circuit board.

[0018] This utility model provides a structural solution that integrates a heat sink and power components within the controller housing. The heat sink dissipates heat generated by the power components to the exterior of the housing, where it is forced to dissipate heat through the airflow generated during device operation. This not only effectively reduces the space occupied by the circuit board within the electronic control cavity, lowering overall weight, but also ensures excellent heat dissipation from the housing without requiring a complex air cooling airflow drive mechanism.

[0019] The technical solution of this utility model also improves the connection method between the power device and the heat sink. By embedding the power device in the groove of the heat sink, it not only realizes the auxiliary limit of the power device and avoids the misalignment of the power device during the elastic connection, but also can directly contact with most of the heat dissipation surface of the power device, ensuring the heat conduction effect. The use of crimping springs to elastically support the power device in conjunction with the heat sink ensures the positioning of the power device while ensuring that the heat sink and the power device are in contact with each other with appropriate pressing force for heat conduction, which is also to ensure the heat transfer effect between the two, thereby improving the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is an overall schematic diagram of the motor controller of the present application after being encapsulated in a housing;

[0021] Figure 2 This is a schematic diagram of the internal structure of the motor controller of the present application after the housing is opened;

[0022] Figure 3 A schematic cross-sectional view of the motor controller of the present application;

[0023] Figure 4 This is a schematic cross-sectional view of the motor controller of the present application along the airflow direction.

[0024] In the picture:

[0025] 1: Motor controller; 11: Circuit board; 12: Power device; 13: Heat sink; 131: Groove; 14: Pressed spring; 15: Housing; 151: Lower housing; 152: Upper housing; 153: Heat dissipation window; 16: Busbar capacitor. DETAILED DESCRIPTION

[0026] The following is a detailed description of the present invention in conjunction with the accompanying drawings and specific embodiments. In this specification, the size ratios in the drawings do not represent the actual size ratios, but are only used to reflect the relative positional relationship and connection relationship between the various components. Components with the same name or the same number represent similar or identical structures and are only for illustrative purposes.

[0027] Figure 1 This is an overall schematic diagram of the motor controller of this application after being packaged in a housing. Figure 2 This is a schematic diagram of the internal structure of the motor controller of the present application after the shell is opened. The motor controller 1 has an internal structure encapsulated by a shell 15. In order to ensure the heat dissipation of the internal circuit, a window is opened on the shell 15, and the radiator 13 is exposed to the outside of the shell 15 through the heat dissipation window 153 of the shell 15. The shell 15 contains a circuit board 11, which also includes a power device 12 electrically connected to the circuit board 11. As for the motor controller 1, the shell 15 is made of magnesium alloy. Under the same volume conditions, the mass of magnesium alloy is only one-third of the aluminum alloy shell commonly used in the industry. The shell 15 is divided into a lower shell 151 and an upper shell 152. When the two are opened, the installation of the internal components is completed, and the packaging is completed after the two are combined. The motor controller 1 integrates the drive board and the control board, and the circuit board 11 can realize drive and control. This design can effectively reduce the space of the internal cavity of the electric control occupied by the circuit board, thereby reducing the overall volume and quality of the electric control.

[0028] The radiator 13 in the prior art generally uses an aluminum-based heat dissipation material, and its thermal conductivity is generally concentrated in the range of 100-500w / (mk), while miniaturization and lightweight are important control indicators in the eVTOL design. Within the limited space, the volume of the radiator 13 can only be compressed as much as possible, resulting in a limited heat conduction area and a decrease in heat dissipation capacity. Therefore, the use of existing aluminum-based heat dissipation materials has shown a trend of being unable to meet the requirements when applied to eVTOL design. To this end, the radiator 13 of the present application uses an existing diamond / aluminum composite material to improve the thermal conductivity of the radiator 13. The diamond / aluminum composite material is a new material formed by adding diamond particles to an aluminum alloy matrix. This material adopts a powder metallurgy process in the manufacturing process to mix diamond particles with aluminum powder, and then undergoes high temperature and high pressure treatment to solid-phase sinter the aluminum powder and diamond particles to form a uniform composite material. The advantages of this material are high hardness, density close to that of aluminum alloy, and excellent thermal conductivity. Its thermal conductivity is as high as 1050 W / (mK), which is approximately three times that of commonly used aluminum alloys. Its application in eVTOL can significantly improve the heat dissipation efficiency of the heat sink 13, thereby meeting more stringent heat dissipation requirements within limited space and mass constraints. It should be noted that diamond / aluminum composite materials are prior art, and diamond / aluminum composite materials and their specific preparation methods are fully disclosed in the prior art, including but not limited to Chinese invention disclosures with publication numbers CN116218233A, CN114734039A, and CN117286362A.

[0029] In the above-mentioned embodiment of the present application, the power device 12 refers to a plastic-encapsulated half-bridge module. This is only one embodiment. For those skilled in the art, any type of power device can be used for electronic control circuit design, and its matching heat sink 13 does not need to be designed based on the performance of the power device. For example, a T-pack type silicon carbide power module is also acceptable, and the heat dissipation structures are compatible.

[0030] The so-called thermal contact between the heat sink 13 and the power device 12 means that the heat of the power device 12 can be effectively conducted between the interface between the power device 12 and the heat sink 13. During actual assembly, the surface of the heat sink 13 can be in direct contact with the surface of the power device 12, or another thermal conductive layer can be provided between the surface of the heat sink 13 and the surface of the power device 12, such as applying a layer of thermal conductive silicone grease between the contact surfaces of the heat sink 13 and the power device 12, so that a thin thermal conductive layer formed by thermal conductive silicone grease exists between the heat sink 13 and the power device 12. Since thermal conductive silicone grease is flexible, it can fit tightly to the surfaces on both sides between the heat sink 13 and the power device 12. Although its thermal conductivity cannot be compared with the material of the heat sink 13, being only about 4W / (mk), it avoids the air layer that may exist between the heat sink 13 and the power device 12, and thus provides better heat transfer than when the heat sink 13 is in direct contact with the power device 12.

[0031] like Figure 3The cross-sectional schematic diagram shown is for improving and optimizing the thermal contact mode between the heat sink 13 and the power device 12. The power device 12 is electrically connected in a floating manner on the circuit board 11, rather than being directly soldered or rigidly fixed to the circuit board 11 by other means. The floating connection of the power device 12 is achieved through a crimping spring 14 provided on the circuit board 11. One end of the crimping spring 14 is fixed to the circuit board 11 and electrically connected to the circuit board 11, and the other end thereof is suspended above the surface of the circuit board 11, and the crimping spring 14 is elastic. When the heat sink 13 and the circuit board 11 are placed in layers in a preset position in the housing 15, the heat sink 13 is in thermal contact with the power device 12, and the pins of the power device 12 are in contact with the suspended end of the crimping spring 14 and are electrically connected. When the housing 15 is closed to enclose the circuit board 11 and the like in the housing 15, the heat sink is fixed in the housing 15, for example, by being fixed to the housing 15 through a threaded connection or by being limited at the heat dissipation window 153 by a step portion around the heat sink 13, thereby ensuring that the heat sink 13 does not fall out of the housing 15. When the housing 15 is closed to enclose the circuit board 11 and the like in the housing 15, the housing 15 presses the circuit board 11, causing the crimping spring 14 between the circuit board 11 and the power device 12 to be elastically compressed, thereby ensuring good electrical contact between the power device 12 and the circuit board 11. At the same time, the compression of the crimping spring 14 also generates positive pressure between the heat sink 13 and the power device 12, thereby ensuring contact between the contact surfaces of the heat sink 13 and the power device 12. In particular, under preferred circumstances, the aforementioned thermal grease layer is added between the heat sink 13 and the power device 12 to improve the heat transfer performance between the two contact interfaces. In this case, if the pressure between the contact surfaces is too high, the thermal grease will be almost completely squeezed out of the gap between the contact surfaces. If the pressure between the contact surfaces is too low, the thermal gap between the contact surfaces will be too thick, which is not conducive to improving the thermal conductivity between the contact surfaces. Due to the presence of the crimping spring 14, regardless of the depth tolerance of the inner cavity of the shell 15, the crimping spring 14 can ensure floating contact between the heat sink 13 and the power device 12, and the pressing force between them is basically maintained, thereby ensuring that there is a grease layer of appropriate thickness between the heat sink 13 and the power device 12, ensuring the thermal conductivity between the contact surfaces. The power module adopts a crimping form, and the crimping spring 14 acts to firmly press the power module and the heat sink together, and the contact gap between the two is filled with thermal grease, thereby ensuring that the thermal grease maintains a designed thickness of about 0.2mm.

[0032] It is obviously possible to have multiple heat sinks 13. In this case, several heat sinks 13 are preferably arranged regularly on the circuit board 11, and the heat sinks 13 are in thermal contact with the surfaces of all power devices 12 that need to be dissipated. To improve the heat dissipation effect, the heat sink 13 is provided with a groove 131 on the surface inside the housing 15 for accommodating the power device 12. When the power device 12 is encapsulated in the housing 15, the power device 12 is embedded in the groove 131 and is in thermal contact with the bottom and side surfaces of the groove 131. This achieves all-round heat conduction from the heat sink 13 to the power device 12, thereby improving the heat dissipation effect.

[0033] The portion of the heat sink 13 located outside the housing 15 forms heat dissipation fins, which are arranged side by side to form air flow channels. The fins are 7.5 mm high and 0.5 mm thick, and the width of the air flow channels between the fins is 1 mm.

[0034] The shell 15 also includes a bus capacitor 16 electrically connected to the circuit board 11. The bus capacitor 16 is arranged on one side of the heat sink 13 along the direction of the air flow channel in the shell 15. When the motor controller 1 is used in a flying car, the motor controller 1 is placed near the propeller, and the rotation of the propeller drives the surrounding air flow to flow through the radiator 13 to achieve heat dissipation of the electronic control. Forced convection heat is dissipated between the airflow and the electronic control structural components. The minimum wind speed around the electronic control is 6m / s, and the maximum wind speed is 15m / s. According to numerical simulation, under continuous and peak combined working conditions, the junction temperature of the power device 12 does not exceed 110°C, and there is no risk of module overheating. As Figure 4 As shown, to reduce the impact of the heat dissipation structure on the bus capacitor 16 and prevent the heat dissipation airflow from causing additional heating to the bus capacitor 16, the side of the radiator 13 with the bus capacitor 16 is preferably oriented upwind of the airflow, so that the cooling airflow first passes over the bus capacitor 16 and then exchanges heat through the fins of the radiator 13. The low-heating bus capacitor 16 is arranged at the upwind side, and the high-heating radiator 13 is located at the downwind side, thereby preventing the heat generated by the module from affecting the heat dissipation of the bus capacitor.

[0035] The above content is only a description of the preferred implementation mode of the present invention, and does not limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solution of the present invention by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A motor controller having a housing (15) encapsulating an internal structure, characterized in that: The housing (15) includes a circuit board (11) and a power device (12) electrically connected to the circuit board (11); The shell is provided with a heat dissipation window (153) that passes through the inside and outside of the shell; the heat sink (13) extends from the inside of the shell (15) through the shell to the outside of the shell (15); the heat sink (13) is in thermal contact with the power device (12).

2. The motor controller according to claim 1, wherein: A heat-conducting layer formed by heat-conducting silicone grease is provided between the contact surfaces of the heat sink (13) and the power device (12).

3. The motor controller according to claim 2, wherein: The heat sink (13) is electrically connected to the circuit board (11) via a crimping spring (14).

4. The motor controller according to claim 3, wherein: The circuit board (11) has a press-connecting spring (14), one end of which is fixed to the circuit board (11) and electrically connected to the circuit board (11); the other end of which is higher than the surface of the circuit board (11) and elastically suspended.

5. The motor controller according to claim 1, wherein: The surface of the heat sink (13) located on the inner side of the housing (15) is provided with a groove (131) for accommodating the power device (12); When the power device (12) is encapsulated in the housing (15), the power device (12) is embedded in the groove (131) and is in thermal contact with the bottom and side surfaces of the groove (131).

6. The motor controller according to claim 1, wherein: The portion of the radiator (13) located outside the housing (15) forms heat dissipation fins, which are arranged side by side to form air flow channels therebetween.

7. The motor controller according to claim 1, wherein: The housing (15) further includes a bus capacitor (16), and the bus capacitor (16) is electrically connected to the circuit board (11); The side of the radiator (13) having the busbar capacitor (16) is located in the upwind direction of the airflow in the airflow channel.

8. The motor controller according to claim 1, wherein: The material of the radiator (13) is a diamond / aluminum composite material.

9. The motor controller according to any one of claims 1 to 8, wherein: The housing (15) further includes a busbar capacitor (16), which is electrically connected to the circuit board (11).

10. A flying car, characterized in that: The motor controller comprises the motor controller according to any one of claims 1 to 9.

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