Mask substrate polishing processing device

Abstract

The utility model discloses a mask substrate grinding and polishing processing device, which belongs to the field of mask substrate processing, and comprises a fixed support, a wandering star wheel, a weight and a positioning plate, the fixed support is used for being installed on a polishing machine, the fixed support comprises a guide plate, the guide plate is provided with a first limiting hole, the wandering star wheel is installed in the first limiting hole, and the weight is installed on the positioning plate. The wandering star wheel is provided with a second limiting hole for placing a mask substrate, the weights are used for pressing the mask substrate, the positioning plate is detachably mounted on the wandering star wheel, the positioning plate is provided with a plurality of positioning holes for placing the weights, and the plurality of positioning holes are communicated with the second limiting hole. According to the mask substrate grinding and polishing device, weights with different weights can be placed in the corresponding positioning holes according to planeness data of different point positions on the mask substrate, differential load control is achieved, the purpose of targeted grinding is achieved, the planeness meeting the requirement is rapidly obtained, the requirement for raw materials can be lowered, and the production efficiency is improved. The technological process is simple and high in processing efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of mask substrate processing, in particular to a mask substrate grinding and polishing processing device. Background Art

[0002] As the carrier of the mask pattern, the mask substrate plays a vital role in the precision and quality of the mask product. The substrate must possess excellent optical transparency, dimensional and chemical stability, flatness, and be free of minor defects such as bubbles. For large-scale mask substrates, surface flatness and minimal defects are key factors in determining their accuracy. If the flatness of a large-scale mask substrate is poor, direct light will be deflected relative to the ideal plane, causing the size of the photolithographic pattern to change (enlarge or reduce), reducing the photolithographic resolution. Therefore, ensuring the high flatness of the mask substrate is a fundamental prerequisite for achieving high precision.

[0003] Existing methods for processing the flatness of large-scale photomask substrates employ at least one of lapping, grinding, and polishing. The primary goal is to obtain a highly flat photomask substrate to improve photolithography resolution. The processing principle involves applying uniform pressure across the entire substrate, with a relatively large amount of grinding applied to the protruding areas and a smaller amount applied to the remaining areas. Overall thinning reduces the height difference between the two surfaces to achieve a relatively flat surface. This processing method places very high demands on the flatness of the raw material. When the flatness difference is too large, a certain amount of overall grinding is required to achieve the required flatness. This results in low processing efficiency and a long processing time. Furthermore, when the substrate thickness margin is insufficient, it is very easy to produce defective products that exceed the lower thickness specification limit. Utility Model Content

[0004] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, it proposes a mask substrate polishing device that determines a processing plan based on the mask substrate's flatness data. By applying different weights to different flatness locations on the mask substrate, differentiated loading is achieved, achieving targeted grinding and quickly achieving the required flatness. This reduces raw material requirements, simplifies the process flow, improves processing efficiency, reduces production costs, and achieves high economic benefits.

[0005] A mask substrate polishing device according to an embodiment of the present invention includes:

[0006] A fixed bracket, used for being mounted on the polishing machine, the fixed bracket comprising a guide plate, and a first limiting hole is provided on the guide plate;

[0007] A planetary wheel is installed in the first limiting hole, and a second limiting hole is provided on the planetary wheel for placing the mask substrate;

[0008] A weight, used to press the mask substrate;

[0009] A positioning plate is detachably mounted on the planetary wheel. The positioning plate is provided with a plurality of positioning holes for placing weights therein, and the plurality of positioning holes are all communicated with the second limiting hole.

[0010] A mask substrate polishing device according to an embodiment of the present invention has at least the following beneficial effects:

[0011] The fixed bracket is installed on the polishing machine, the planetary wheel is installed in the first limiting hole, the mask substrate with measured flatness data is placed in the second limiting hole, and the positioning plate is covered. Different weights can be placed in the corresponding positioning holes according to the flatness data of different points on the mask substrate to achieve differentiated load control and achieve targeted grinding purposes. In this way, the flatness that meets the requirements can be quickly obtained, which can reduce the requirements for raw materials, and the process flow is simple, the processing efficiency is high, the production cost is low, and the economic benefits are high.

[0012] According to some embodiments of the present invention, a positioning protrusion is protruded from the positioning plate, and the positioning protrusion extends into the second limiting hole. The positioning protrusion is used to position the positioning plate, and the plurality of positioning holes pass through the positioning protrusion.

[0013] According to some embodiments of the present invention, the height of the positioning protrusion is smaller than the thickness of the planetary wheel.

[0014] According to some embodiments of the present invention, the fixed bracket also includes a first reinforcing rod and a second reinforcing rod, and the first reinforcing rod and the second reinforcing rod are respectively installed at both ends of the guide plate along the width direction of the guide plate, and the length direction of the first reinforcing rod, the length direction of the second reinforcing rod and the length direction of the guide plate are consistent.

[0015] According to some embodiments of the present invention, the fixed bracket also includes a first support member and a second support member, and the first support member and the second support member are respectively detachably connected to the two ends of the guide plate along the length direction of the guide plate, the first support member and the second support member support the guide plate, and the first support member and the second support member are used to be installed on the polishing machine.

[0016] According to some embodiments of the present utility model, a first long slot hole is provided on the guide plate, the length direction of the first long slot hole is the width direction of the guide plate, a first connecting hole is provided on the first support member, the guide plate and the first support member are connected through a first connecting member, and the first connecting member is passed through the first connecting hole and the first long slot hole.

[0017] According to some embodiments of the present invention, a first threaded portion and a second threaded portion are respectively provided at opposite ends of the first connecting member, the first threaded portion is passed through the first long slot hole, and the second threaded portion is passed through the first connecting hole.

[0018] According to some embodiments of the present invention, the first support member includes a first horizontal plate and a first vertical plate, the first horizontal plate is horizontally arranged, the first horizontal plate is detachably connected to the guide plate, the first vertical plate is vertically arranged, the first vertical plate is connected to the end of the first horizontal plate away from the guide plate, and the first vertical plate is used to be installed on the polishing machine.

[0019] According to some embodiments of the present invention, the first support member further includes a first reinforcing rib, and the first reinforcing rib connects the first transverse plate and the first vertical plate.

[0020] According to some embodiments of the present invention, a buffer pad is attached to the end of the weight that contacts the mask substrate.

[0021] Additional aspects and advantages of the present invention will be described in part in the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a schematic structural diagram of a mask substrate polishing device according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the exploded structure of the mask substrate polishing processing device according to an embodiment of the present invention;

[0025] Figure 3 This is a structural schematic diagram of a positioning plate of a mask substrate polishing device according to an embodiment of the present invention;

[0026] Figure 4 This is a structural schematic diagram of a first supporting member of a mask substrate polishing device according to an embodiment of the present invention;

[0027] Figure 5 This is a structural schematic diagram of the first connecting member of the mask substrate polishing processing device according to an embodiment of the present utility model.

[0028] Figure Number:

[0029] 100, fixing bracket; 110, guide plate; 111, first limiting hole; 112, first long slotted hole; 120, first support member; 121, first connecting hole; 122, first horizontal plate; 123, first vertical plate; 124, first reinforcing rib; 130, second support member; 140, first reinforcing rod; 150, second reinforcing rod; 160, first connecting member; 161, first threaded portion; 162, second threaded portion;

[0030] 200, planetary wheel; 210, second limiting hole;

[0031] 300, positioning plate; 310, positioning hole; 320, positioning protrusion. DETAILED DESCRIPTION

[0032] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0034] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0035] See also Figure 1 、 Figure 2 and Figure 3A mask substrate polishing processing device according to an embodiment of the present invention includes a fixed bracket 100, a planetary wheel 200, a weight, and a positioning plate 300. The fixed bracket 100 can be installed on a polishing machine. The fixed bracket 100 includes a guide plate 110, and a first limiting hole 111 is provided on the guide plate 110. The planetary wheel 200 is installed in the first limiting hole 111, and a second limiting hole 210 is provided on the planetary wheel 200. The second limiting hole 210 is used for placing the mask substrate. The weight is used to press the mask substrate. The positioning plate 300 is detachably mounted on the planetary wheel 200. The positioning plate 300 is provided with a plurality of positioning holes 310. The positioning holes 310 are used for placing weights. The plurality of positioning holes 310 are all connected to the second limiting hole 210.

[0036] The fixed bracket 100 is installed on the polishing machine, the planetary wheel 200 is installed in the first limiting hole 111, the mask substrate with measured flatness data is placed in the second limiting hole 210, and the positioning plate 300 is covered. Different weights can be placed in the corresponding positioning holes 310 according to the flatness data of different points on the mask substrate to achieve differentiated load control and achieve targeted grinding purposes. In this way, the required flatness can be quickly obtained, the requirements for raw materials can be reduced, the process flow is simple, the processing efficiency is high, the production cost is low, and the economic benefits are high.

[0037] In some embodiments, see Figure 1 、 Figure 2 and Figure 3 The positioning plate 300 is provided with a positioning protrusion 320, which extends into the second limiting hole 210. The positioning protrusion 320 is used to position the positioning plate 300. The plurality of positioning holes 310 all extend through the positioning protrusion 320. The positioning protrusion 320 ensures the positioning of the positioning plate 300 and the planetary wheel 200, ensuring that the positioning plate 300 does not slide on the planetary wheel 200, thereby ensuring the positioning accuracy of the positioning holes 310.

[0038] In some embodiments, see Figure 1 、 Figure 2 and Figure 3 The height of the positioning protrusion 320 is less than the thickness of the planetary wheel 200. The second limiting hole 210 is used to accommodate the mask substrate, and the positioning protrusion 320 extends into the second limiting hole 210. Setting the height of the positioning protrusion 320 to be less than the thickness of the planetary wheel 200 ensures that the positioning protrusion 320 positions the positioning plate 300 while also reducing the impact of the positioning plate 300 on the mask substrate (when the positioning protrusion 320 is high, the positioning protrusion 320 extends into the second limiting hole 210 to press the mask substrate, and the mask substrate bears the weight of the entire positioning plate 300).

[0039] In some embodiments, see Figure 1 and Figure 2The fixing bracket 100 further includes a first reinforcing rod 140 and a second reinforcing rod 150, which are respectively mounted at both ends of the guide plate 110 along the width direction of the guide plate 110. The length directions of the first reinforcing rod 140 and the second reinforcing rod 150 are aligned with the length direction of the guide plate 110. The first reinforcing rod 140 and the second reinforcing rod 150 ensure the strength of the guide plate 110 and prevent it from breaking.

[0040] In some embodiments, see Figure 1 and Figure 2 The fixing bracket 100 further includes a first support member 120 and a second support member 130. The first support member 120 and the second support member 130 are respectively connected to the guide plate 110 at both ends along the length direction of the guide plate 110. The first support member 120 and the second support member 130 are detachably connected to the guide plate 110. The first support member 120 and the second support member 130 support the guide plate 110 and are used to be mounted on the polishing machine. The first support member 120 and the second support member 130 can support the guide plate 110, ensuring that the guide plate 110 is suspended above the polishing machine, thereby preventing the polishing machine from grinding the guide plate 110.

[0041] In some embodiments, see Figure 1 、 Figure 2 and Figure 4 The guide plate 110 is provided with a first long slotted hole 112, the length direction of the first long slotted hole 112 is the width direction of the guide plate 110, and the first support member 120 is provided with a first connecting hole 121. The guide plate 110 and the first support member 120 are connected by a first connecting member 160, and the first connecting member 160 is inserted into the first connecting hole 121 and the first long slotted hole 112. The first connecting member 160 is threadedly connected to a nut to achieve a detachable connection between the first support member 120 and the guide plate 110. The first long slotted hole 112 is provided, and the first connecting member 160 can slide in the first long slotted hole 112. After the first support member 120 is installed on the polishing machine, the position of the guide plate 110 can be adjusted in the width direction of the guide plate 110 by adjusting the position of the first connecting member 160 in the first long slotted hole 112.

[0042] A second long slot is provided on the guide plate 110, and the length direction of the second long slot is the width direction of the guide plate 110. A second connecting hole is provided on the second support member 130. The guide plate 110 and the second support member 130 are connected through a second connecting member, and the second connecting member is passed through the second connecting hole and the second long slot.

[0043] In some embodiments, see Figure 2 、 Figure 4 and Figure 5The first connecting member 160 has a first threaded portion 161 and a second threaded portion 162 at opposite ends. The first threaded portion 161 is inserted into the first slotted hole 112, and the second threaded portion 162 is inserted into the first connecting hole 121. Both ends of the first connecting member 160 are threadedly connected to the nut, making assembly and disassembly easy.

[0044] In some embodiments, see Figure 1 、 Figure 2 and Figure 4 The first support member 120 includes a first transverse plate 122 and a first vertical plate 123. The first transverse plate 122 is horizontally disposed and detachably connected to the guide plate 110. The first vertical plate 123 is vertically disposed and connected to the end of the first transverse plate 122 away from the guide plate 110. The first vertical plate 123 is used to be mounted on the polishing machine. The first connecting hole 121 is located on the first transverse plate 122, and the first vertical plate 123 can be mounted on the polishing machine. The lateral extension of the first transverse plate 122 ensures that the first transverse plate 122 can support the horizontally placed guide plate 110.

[0045] The second support member 130 includes a second horizontal plate and a second vertical plate. The second horizontal plate is horizontally arranged and detachably connected to the guide plate 110. The second vertical plate is vertically arranged and connected to the end of the second horizontal plate away from the guide plate 110. The second vertical plate is used to be installed on the polishing machine.

[0046] In some embodiments, see Figure 1 、 Figure 2 and Figure 4 The first support member 120 further includes a first reinforcing rib 124, which connects the first transverse plate 122 and the first vertical plate 123. The first reinforcing rib 124 is provided to ensure the support strength of the first support member 120.

[0047] The second support member 130 further includes a second reinforcing rib connecting the second transverse plate and the second vertical plate.

[0048] In some embodiments, see Figure 1 A buffer pad is attached to the end of the weight that contacts the mask substrate to prevent the weight from causing damage and scratches to the mask substrate.

[0049] The processing steps of the mask substrate polishing processing device of the embodiment of the present application are as follows:

[0050] 1. Install the first and second support members 120 and 130 on the polishing machine. Install the guide plate 110 on the first and second support members 120 and 130, and install the planetary wheel 200 in the first stop hole 111. Install the guide plate 110 3-6 mm above the polishing machine's bottom plate surface, but avoid contact with it. The outer arc edge of the planetary wheel 200 must be >5 cm away from the center of the bottom plate.

[0051] 2. Place the mask substrate, after measuring its flatness, into the second stopper hole 210 of the planetary wheel 200 and cover it with the positioning plate 300. Based on the flatness data at different points on the mask substrate, weights of varying weights are placed in the corresponding positioning holes 310 to achieve differentiated load control. Flatness data is obtained by measuring the height difference at 6-8 cm intervals along the X and Y axes using a micrometer on a marble platform. These are marked on the back of the corresponding locations. Weights range from 200g to 2400g.

[0052] 3. After 10 minutes of polishing, remove the mask substrate and measure its flatness. Repeat step 2 until the flatness is acceptable. Simultaneously perform steps 2 and 3 on the other side. Use a diamond polishing pad and YM-02 slurry (diluted to a concentration of 2.5-3.5%). The lower platen rotates at 30-36 rpm and the planetary wheel rotates at 10-14 rpm.

[0053] 4. After the double-sided flatness is qualified, it enters the next process. The final process is the rough polishing and fine polishing process to obtain high flatness, high transmittance and high smoothness.

[0054] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0055] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A mask substrate polishing device, characterized in that: include: A fixed bracket, used for being mounted on the polishing machine, the fixed bracket comprising a guide plate, and a first limiting hole is provided on the guide plate; A planetary wheel is installed in the first limiting hole, and a second limiting hole is provided on the planetary wheel for placing the mask substrate; A weight, used to press the mask substrate; A positioning plate is detachably mounted on the planetary wheel. The positioning plate is provided with a plurality of positioning holes for placing weights therein, and the plurality of positioning holes are all communicated with the second limiting hole.

2. The mask substrate polishing device according to claim 1, characterized in that: A positioning protrusion is protruded from the positioning plate and extends into the second limiting hole. The positioning protrusion is used to position the positioning plate, and the plurality of positioning holes all pass through the positioning protrusion.

3. The mask substrate polishing device according to claim 2, characterized in that: The height of the positioning protrusion is smaller than the thickness of the planetary wheel.

4. The mask substrate polishing device according to claim 1, characterized in that: The fixed bracket also includes a first reinforcement rod and a second reinforcement rod, and the first reinforcement rod and the second reinforcement rod are respectively installed at both ends of the guide plate along the width direction of the guide plate, and the length direction of the first reinforcement rod, the length direction of the second reinforcement rod and the length direction of the guide plate are consistent.

5. The mask substrate polishing device according to claim 1, characterized in that: The fixed bracket also includes a first support member and a second support member, which are respectively detachably connected to the two ends of the guide plate along the length direction of the guide plate, and the first support member and the second support member support the guide plate. The first support member and the second support member are used to be installed on the polishing machine.

6. The mask substrate polishing device according to claim 5, characterized in that: A first long slot hole is provided on the guide plate, and the length direction of the first long slot hole is the width direction of the guide plate. A first connecting hole is provided on the first support member, and the guide plate and the first support member are connected through a first connecting member, and the first connecting member is passed through the first connecting hole and the first long slot hole.

7. The mask substrate polishing device according to claim 6, characterized in that: The first connecting member is provided with a first threaded portion and a second threaded portion at opposite ends thereof, respectively. The first threaded portion is passed through the first long slotted hole, and the second threaded portion is passed through the first connecting hole.

8. The mask substrate polishing device according to claim 5, characterized in that: The first support member includes a first horizontal plate and a first vertical plate. The first horizontal plate is horizontally arranged and detachably connected to the guide plate. The first vertical plate is vertically arranged and connected to the end of the first horizontal plate away from the guide plate. The first vertical plate is used to be installed on the polishing machine.

9. The mask substrate polishing device according to claim 8, characterized in that: The first support member further includes a first reinforcing rib connecting the first transverse plate and the first vertical plate.

10. The mask substrate polishing device according to claim 1, characterized in that: A buffer pad is attached to one end of the weight that contacts the mask substrate.

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