Lamp light-emitting module with high heat dissipation performance

Abstract

The utility model relates to the technical field of lamp light-emitting modules, in particular to a lamp light-emitting module with high heat dissipation performance, which comprises a lamp mechanism serving as a device main body, the lamp mechanism comprises an outer plate, and a heat dissipation mechanism used for enhancing heat dissipation of the lamp mechanism is arranged at the bottom of the lamp mechanism. The heat dissipation mechanism is provided with a dismounting and mounting mechanism which is convenient to dismount and mount. The heat dissipation mechanism is arranged, so that the overall heat dissipation effect of the device is greatly improved, the device has excellent heat conduction performance through the outer plate and the outer connecting plate which are made of aluminum plates, heat can be rapidly taken away, the heat conductivity and the high-temperature resistance of the device are guaranteed through the outer fixing plate made of ceramic, and the heat dissipation efficiency of the device is improved through the heat conduction piece made of silica gel. Heat transfer between a heating part and a heat dissipation part can be completed, the heat dissipation effect of the device is further improved, heat in the device is further dissipated through the multiple heat dissipation fans on the bottom plate, and the heat dissipation performance of the device is high.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp light-emitting modules, in particular to a lamp light-emitting module with high heat dissipation. Background Art

[0002] Lighting modules are small, point-like light sources that can be used to create point-like lighting and decorative effects, ensuring high efficiency, energy saving, and long life. Existing light modules are primarily LED lamps, which primarily generate light from semiconductor light-emitting modules. The high brightness of these modules relies primarily on high power, which in turn generates significant heat and limits heat dissipation. Utility Model Content

[0003] In response to the shortcomings of the existing technology, the utility model provides a lamp light-emitting module with high heat dissipation, which has the advantages of reducing heat accumulation and high heat dissipation, and solves the problem in the existing technology that the high brightness and high power of the semiconductor light-emitting module lead to large heat, making the heat dissipation easily limited.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] A lamp light-emitting module with high heat dissipation includes a lamp mechanism as the main body of the device, the lamp mechanism includes an outer plate, the bottom of the lamp mechanism is provided with a heat dissipation mechanism for enhancing the heat dissipation of the lamp mechanism, the heat dissipation mechanism is provided with a disassembly mechanism for easy disassembly, the heat dissipation mechanism includes a support plate and a base plate, a plurality of heat dissipation holes are provided on the outer side of the outer plate, the bottom of the outer plate is fixedly connected to an outer connecting plate, the outer side of the outer connecting plate is fixedly connected to an outer fixing plate, the inner wall of the outer fixing plate is fixedly connected to a heat conducting plate, a plurality of ventilation holes are provided on the support plate, and a plurality of cooling fans are installed on the base plate.

[0006] Preferably, the disassembly and assembly mechanism includes a plurality of snap-fit ​​frames fixedly connected to the outside of the outer fixed plate, a plurality of snap-fit ​​blocks are installed on the top of the support plate, a magnetic plate a is installed on the bottom of the support plate, and a magnetic plate b is fixedly connected to the outside of the bottom plate.

[0007] Preferably, the top ends of the multiple engaging blocks are made of elastic material, and the magnetic plate a and the magnetic plate b can be attracted and connected.

[0008] Preferably, the heat conducting plate is made of silicone, the outer fixing plate is made of ceramic, and the outer plate and the outer connecting plate are both made of aluminum.

[0009] Preferably, a plurality of aluminum heat dissipation fins are installed on the support plate near the plurality of ventilation holes.

[0010] Preferably, a plurality of light-emitting groups are installed on the outer panel.

[0011] By means of the above technical solution, the present invention provides a lighting module for a lamp with high heat dissipation, which has at least the following beneficial effects:

[0012] 1. The utility model greatly improves the overall heat dissipation effect of the device by setting a heat dissipation mechanism. The outer plate and the outer connecting plate made of aluminum plate have excellent thermal conductivity and can quickly take away the heat. The outer fixing plate made of ceramic material ensures its thermal conductivity and high temperature resistance. The heat conductive sheet made of silicone material can complete the heat transfer between the heating part and the heat dissipation part, further improving the heat dissipation effect of the device. The heat inside the device is further dissipated by multiple cooling fans on the bottom plate, making the device have higher heat dissipation performance.

[0013] 2. The utility model provides a disassembly and assembly mechanism so that the internal components of the device can be easily replaced when needed. The external fixing plate and the support plate can be installed and connected through multiple snap-fit ​​frames and multiple snap-fit ​​blocks. The support plate and the bottom plate can be installed and connected through magnetic plates a and magnetic plates b, so that the entire device can be easily disassembled and assembled. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is an exploded view of the heat dissipation mechanism of the utility model;

[0017] Figure 3 This is an exploded view of the disassembly and assembly mechanism of the utility model;

[0018] Figure 4 It is a schematic cross-sectional structure diagram of the heat dissipation mechanism of the present utility model.

[0019] Reference numerals:

[0020] 1. Lamp mechanism; 101. Outer plate; 102. Lighting group; 2. Heat dissipation mechanism; 201. Heat dissipation holes; 202. External connecting plate; 203. External fixing plate; 204. Heat conducting plate; 205. Support plate; 206. Ventilation holes; 207. Bottom plate; 208. Cooling fan; 3. Disassembly and assembly mechanism; 301. Clamping frame; 302. Clamping block; 303. Magnetic plate a; 304. Magnetic plate b. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] The light-emitting modules in the prior art are mainly LED lamps, which are mainly illuminated by semiconductor light-emitting modules. The high brightness of semiconductor light-emitting modules mainly depends on high power, which leads to high heat and easily limited heat dissipation. The following describes a light-emitting module for a lamp with high heat dissipation provided by some embodiments of the present invention in conjunction with the accompanying drawings.

[0023] Example 1:

[0024] In order to reduce the accumulation of heat in the lamp, Figure 1-Figure 4 As shown, a lamp light-emitting module with high heat dissipation is proposed. A lamp mechanism 1 is set as the main body of the device. A heat dissipation mechanism 2 is set at the bottom of the lamp mechanism 1. The heat dissipation mechanism 2 is used to enhance the heat dissipation effect of the lamp mechanism 1. A disassembly mechanism 3 is set on the heat dissipation mechanism 2. The disassembly mechanism 3 makes the entire device easy to disassemble and assemble.

[0025] In order to improve the heat dissipation effect of the device as a whole, a heat dissipation mechanism 2 is proposed. By installing a support plate 205 and a bottom plate 207, a plurality of heat dissipation holes 201 are opened on the outside of the outer plate 101. The bottom of the outer plate 101 is fixedly connected to an outer connecting plate 202, and the outer side of the outer connecting plate 202 is fixedly connected to an outer fixing plate 203. The inner wall of the outer fixing plate 203 is fixedly connected to a heat conducting sheet 204. A plurality of ventilation holes 206 are opened on the support plate 205, and a plurality of cooling fans 208 are installed on the bottom plate 207. The internal air can flow freely through the plurality of heat dissipation holes 201, thereby taking away the heat. The connecting plates 202 are all made of aluminum plates. Aluminum plates have excellent thermal conductivity and can quickly take away heat. The thermal conductivity and high-temperature resistance of the external fixing plate 203 made of ceramic material are guaranteed. The heat conductive sheet 204 made of silicone material can complete the heat transfer between the heating part and the heat dissipation part, further improving the heat dissipation effect of the device. The heat inside the device is further dissipated by multiple cooling fans 208 on the bottom plate 207. Multiple aluminum heat dissipation fins are installed near the multiple ventilation holes 206 on the support plate 205. The multiple aluminum heat dissipation fins increase the heat dissipation surface area and utilize the convection effect, so that the device can dissipate heat quickly and effectively.

[0026] Example 2:

[0027] On the basis of Example 1, the technical solution proposed in Example 1 is used to solve the problem in the prior art that the realization of high brightness of semiconductor light-emitting modules mainly relies on high power, which causes large heat and poor heat dissipation effect. When the internal components of the device are damaged and need to be repaired and replaced, in order to improve the maintenance efficiency of the device, the device should be able to be easily disassembled and assembled.

[0028] In order to make the components of the device easy to repair and replace, Figure 1 and Figure 3 as well as Figure 4 As shown, a disassembly and assembly mechanism 3 is proposed, which fixes multiple snap-fit ​​frames 301 on the outside of the outer fixed plate 203, installs multiple snap-fit ​​blocks 302 on the top of the support plate 205, installs a magnetic plate a303 on the bottom of the support plate 205, and fixes the outer side of the bottom plate 207 with a magnetic plate b304. The top ends of the multiple snap-fit ​​blocks 302 are made of elastic material, and the magnetic plates a303 and b304 can be attracted and connected. The outer fixed plate 203 and the support plate 205 can be installed and connected through the multiple snap-fit ​​frames 301 and the multiple snap-fit ​​blocks 302, and the support plate 205 and the bottom plate 207 can be installed and connected through the magnetic plates a303 and b304, so that the entire device can be easily disassembled and assembled, and the user can conveniently repair and replace the internal components.

[0029] In order to ensure the lighting effect of the device, a lamp mechanism 1 is proposed, which ensures the lighting effect of the device by providing an outer plate 101 and a plurality of light-emitting groups 102 mounted on the surface thereof.

[0030] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements that are inherent to such process, method, article or apparatus.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A lighting module with high heat dissipation performance, comprising a lighting mechanism (1) as a device body, wherein the lighting mechanism (1) comprises an outer plate (101), and is characterized in that: The bottom of the lamp mechanism (1) is provided with a heat dissipation mechanism (2) for enhancing heat dissipation of the lamp mechanism (1), and the heat dissipation mechanism (2) is provided with a disassembly mechanism (3) for facilitating disassembly; The heat dissipation mechanism (2) comprises a support plate (205) and a bottom plate (207); a plurality of heat dissipation holes (201) are provided on the outer side of the outer plate (101); an outer connecting plate (202) is fixedly connected to the bottom of the outer plate (101); an outer fixing plate (203) is fixedly connected to the outer side of the outer connecting plate (202); a heat conducting plate (204) is fixedly connected to the inner wall of the outer fixing plate (203); a plurality of ventilation holes (206) are provided on the support plate (205); and a plurality of heat dissipation fans (208) are installed on the bottom plate (207).

2. The light-emitting module for a lamp with high heat dissipation according to claim 1, characterized in that: The disassembly and assembly mechanism (3) comprises a plurality of snap-fit ​​frames (301) fixedly connected to the outside of the outer fixing plate (203); a plurality of snap-fit ​​blocks (302) are installed on the top of the support plate (205); a magnetic plate a (303) is installed on the bottom of the support plate (205); and a magnetic plate b (304) is fixedly connected to the outside of the bottom plate (207).

3. The light-emitting module for a lamp with high heat dissipation according to claim 2, characterized in that: The top ends of the multiple engaging blocks (302) are made of elastic material, and the magnetic plate a (303) and the magnetic plate b (304) can be attracted and connected.

4. The light-emitting module for a lamp with high heat dissipation according to claim 1, characterized in that: The heat conducting plate (204) is made of silica gel, the external fixing plate (203) is made of ceramic, and the external plate (101) and the external connecting plate (202) are both made of aluminum plates.

5. The light-emitting module for a lamp with high heat dissipation according to claim 1, characterized in that: A plurality of aluminum heat dissipation fins are installed on the support plate (205) near the plurality of ventilation holes (206).

6. The light-emitting module for a lamp with high heat dissipation according to claim 1, characterized in that: A plurality of light-emitting groups (102) are mounted on the outer plate (101).

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