MOS tube heat dissipation structure and circuit board device

Abstract

The utility model relates to an MOS tube heat dissipation structure and a circuit board device, and belongs to the technical field of MOS tube heat dissipation, the MOS tube heat dissipation structure comprises a heat dissipation plate, the heat dissipation plate is provided with a first assembly hole, and the first assembly hole is used for being adaptively connected with an MOS tube; the first heat dissipation module is arranged on the heat dissipation plate, the first heat dissipation module extends in the length direction of the heat dissipation plate, first openings are formed in the two ends of the first heat dissipation module, and a second opening is formed in the side, away from the heat dissipation plate, of the first heat dissipation module; the first heat dissipation module and the heat dissipation plate are enclosed to form a heat dissipation channel, the heat dissipation channel is communicated with the first opening and the second opening, and the heat dissipation channel is communicated with the first assembly hole. According to the MOS tube heat dissipation structure disclosed by the invention, the first assembly hole in the heat dissipation plate is used for being adaptively connected with the MOS tube, so that the assembly process of the MOS tube is simplified, the assembly difficulty of the MOS tube is reduced, and the assembly efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS tube heat dissipation, in particular to a MOS tube heat dissipation structure and a circuit board device. Background Art

[0002] MOS tubes generate a large amount of heat during operation. Therefore, a MOS tube heat dissipation structure is required to dissipate this heat promptly to prevent overheating, which can affect performance and lifespan. However, conventional MOS tube heat dissipation structures generally lack mounting holes, requiring the MOS tube to be fixed to the structure via adhesive bonding. This results in complex assembly and low efficiency. Furthermore, existing MOS tube heat dissipation structures offer poor heat dissipation performance. Utility Model Content

[0003] Based on this, it is necessary to provide a MOS tube heat dissipation structure and a circuit board device to address the problem of low assembly efficiency of traditional MOS tubes.

[0004] A MOS tube heat dissipation structure includes: a heat sink, the heat sink having a first assembly hole, the first assembly hole being used for adapting and connecting with the MOS tube; a first heat dissipation module, the first heat dissipation module being arranged on the heat sink, the first heat dissipation module extending in the length direction of the heat sink, both ends of the first heat dissipation module forming a first opening, a side of the first heat dissipation module away from the heat sink forming a second opening, the first heat dissipation module and the heat sink enclosing a heat dissipation passage, the heat dissipation passage being in communication with the first opening and the second opening, respectively, and the heat dissipation passage being in communication with the first assembly hole.

[0005] The first aspect of the present application discloses a MOS tube heat dissipation structure, which is used to adapt and connect with the MOS tube through the first assembly hole on the heat sink, which simplifies the assembly process of the MOS tube, reduces the difficulty of MOS tube assembly, and has high assembly efficiency. It also ensures that the MOS tube is in close contact with the MOS tube heat dissipation structure, thereby enhancing the heat conduction effect of the MOS tube. A heat dissipation path is formed by enclosing the heat dissipation module and the heat sink, so that external air can enter the heat dissipation path and take away heat, thereby improving the heat dissipation effect. This design enhances the stability of the structure. The heat dissipation path is connected to the first opening and the second opening respectively, ensuring that the heat of the heat dissipation path can be quickly dissipated from multiple directions. The heat dissipation path is connected to the first assembly hole, so that the heat of the components located at the first assembly hole can be directly conducted into the heat dissipation path, and the heat conduction efficiency is high.

[0006] In one embodiment, the first heat dissipation module includes a first fin, a second fin, and a third fin. The first fin and the second fin are both disposed on the heat dissipation plate. The first fin and the second fin are adjacent to each other. There are multiple third fins, each disposed on the heat dissipation plate and spaced apart along the width of the heat dissipation plate. The first fin and the second fin are each located between the multiple third fins. A first passage is formed between the first fin and the second fin. The first assembly hole is connected to the first passage. A second passage is formed between the first fin and the third fin, which is connected to the first passage. A third passage is formed between the second fin and the third fin, which is connected to the first passage. A fourth passage is formed between two adjacent third fins. The multi-layered heat dissipation path design formed by the first, second, and third passages ensures that heat can be rapidly conducted and dissipated from multiple directions, greatly improving heat dissipation efficiency. The fourth passage assists in heat dissipation and increases heat dissipation efficiency. The second and third passages are both connected to the first passage, thereby enhancing heat flow between different passages and facilitating faster heat dissipation. The first assembly hole is connected to the first path, so that heat can be quickly transferred from the MOS tube to the multiple heat dissipation paths, thereby improving the overall heat conduction efficiency.

[0007] In one embodiment, the first fin has a first notch, and the second fin has a second notch. The first notch and the second notch are respectively located on either side of the first passage. The first passage, the first notch, and the second passage are sequentially connected, and the first passage, the second notch, and the third passage are sequentially connected. The sequential connection of the first passage, the first notch, and the second passage, and the first passage, the second notch, and the third passage facilitates heat flow and dissipation in different heat dissipation passages and in multiple directions, thereby improving overall heat dissipation efficiency.

[0008] In one embodiment, the first assembly hole is disposed adjacent to the first notch. By disposing the first assembly hole adjacent to the first notch, heat from the component located at the first assembly hole can be quickly transferred through the first notch to other heat dissipation paths, thereby avoiding local overheating and improving heat transfer efficiency.

[0009] In one embodiment, the first assembly hole and the second notch are disposed adjacent to each other. By arranging the first assembly hole and the second notch adjacent to each other, heat from the component located at the first assembly hole can be quickly transferred to other heat dissipation paths through the second notch, thereby avoiding local overheating and improving heat transfer efficiency.

[0010] In one embodiment, the number of the first notches and the number of the second notches are both multiple, and the multiple first notches are spaced apart along the length of the first fin, and the multiple second notches are spaced apart along the length of the first fin. The first passage, the multiple first notches, and the second passage are sequentially connected, and the first passage, the multiple second notches, and the second passage are sequentially connected. By having multiple first and second notches and distributing them along the length, multiple heat exchange points are provided between different passages, allowing heat to be rapidly conducted and dissipated from multiple directions, achieving optimal heat dissipation efficiency. This design increases the air circulation path, promotes air convection, helps to more effectively remove heat, and improves the heat dissipation effect.

[0011] In one embodiment, the first notch and the second notch are positioned opposite each other. This ensures even heat distribution on both sides of the heat dissipation path, preventing unilateral overheating and improving overall heat dissipation uniformity and stability. Furthermore, the appearance is high-quality.

[0012] In one embodiment, the first fins are provided in a plurality and arranged in sequence along the length of the heat sink. First gaps are formed between the first fins, and the first passage, the first gaps, and the second passage are sequentially connected. Compared to first gaps provided in the first fins, the first gaps formed by the gaps between the first fins for heat to pass through are larger in size, resulting in higher air and heat transport efficiency.

[0013] In one embodiment, the number of second fins is multiple, and the multiple second fins are arranged in sequence along the length of the heat sink. Second gaps are formed between the multiple second fins, and the first passage, the second gap, and the third passage are sequentially connected. Compared to second gaps provided in the second fins, the second gaps formed by the gaps between the multiple second fins for heat to pass through are larger in size, thereby improving the efficiency of air and heat transmission.

[0014] In one embodiment, the first heat dissipation module includes a fourth fin, a fifth fin, a sixth fin, and a seventh fin. The fourth fin, the fifth fin, and the sixth fin are all disposed on the heat dissipation plate and are arranged adjacent to each other in sequence. There are multiple seventh fins, each of which is disposed on the heat dissipation plate and spaced apart along the width of the heat dissipation plate. The fourth fin, the fifth fin, and the sixth fin are all located between the multiple seventh fins. A third passage is formed between the fourth fin and the seventh fin, a fourth passage is formed between the fourth fin and the fifth fin, which is connected to the third passage. A seventh passage is formed between the fifth fin and the sixth fin, which is connected to the fourth passage. An eighth passage is formed between the sixth fin and the seventh fin, which is connected to the seventh passage. A ninth passage is formed between two adjacent seventh fins. The arrangement of the fifth, sixth, seventh, and eighth passages forms a multi-level heat dissipation path design, ensuring that heat can be rapidly conducted and dissipated in multiple directions, greatly improving heat dissipation efficiency. The ninth passage can assist in heat dissipation and increase heat dissipation efficiency. The fifth passage, the sixth passage, the seventh passage and the eighth passage are connected in sequence, thereby enhancing the heat flow between different passages and facilitating the accelerated heat dissipation.

[0015] In one embodiment, there are multiple fourth fins, which are sequentially arranged along the length of the heat sink. Third notches are formed between the multiple fourth fins, and the third notches are connected to the third passage and the fourth passage, respectively. The multiple third notches formed by the gaps between the multiple fourth fins sequentially arranged along the length allow heat to be exchanged with heat from other passages at the multiple third notches, greatly enhancing heat dispersion, avoiding local overheating, and improving heat dissipation efficiency.

[0016] In one embodiment, the fifth fins are provided in a plurality and arranged in sequence along the length of the heat sink. Fourth notches are formed between the fifth fins, and the fourth notches are connected to the fourth passage and the seventh passage, respectively. The plurality of fourth notches formed by the gaps between the fifth fins arranged in sequence along the length allow heat to be exchanged with heat from other passages at the fourth notches, greatly enhancing heat dispersion, avoiding local overheating, and improving heat dissipation efficiency.

[0017] In one embodiment, the sixth fins are provided in a plurality and arranged in sequence along the length of the heat sink. Fifth notches are formed between the sixth fins, each of which communicates with the seventh and eighth passages. The fifth notches are formed by the gaps between the sixth fins arranged in sequence along the length, allowing heat to be exchanged with heat from other passages at the fifth notches, greatly enhancing heat dispersion, avoiding local overheating, and improving heat dissipation efficiency.

[0018] In one embodiment, there are multiple first assembly holes, at least one of which is connected to the sixth passage, and another of which is connected to the seventh passage. The provision of three first assembly holes enables this product to be connected to three MOS tubes at the same time, thereby dissipating heat for the three MOS tubes at the same time, which is highly practical. By having two first assembly holes connected to the sixth passage and one first assembly hole connected to the seventh passage, it is ensured that the heat in the first assembly hole component can be quickly conducted and dissipated from multiple directions, thereby improving the overall heat dissipation efficiency.

[0019] In one embodiment, a second heat dissipation module is further included. There are multiple second heat dissipation modules, each of which is disposed on the heat dissipation plate and spaced apart from the first heat dissipation module. The second heat dissipation module and the first heat dissipation module are located on either side of the heat dissipation plate, respectively. By locating the second heat dissipation module and the first heat dissipation module on either side of the heat dissipation plate, the heat dissipation effect on the MOS transistor is further enhanced, ensuring that the MOS transistor remains within a safe temperature range even during high-power operation.

[0020] In one embodiment, the heat sink further includes multiple legs, each of which is disposed on the heat sink and located on the same side of the heat sink. The legs are configured to support the heat sink. The legs provide stable support for the heat sink. Furthermore, the height of the legs enhances air convection around the heat sink, further improving heat dissipation.

[0021] A circuit board device comprises: a circuit board; the aforementioned MOS tube heat dissipation structure, the MOS tube heat dissipation structure being disposed on the circuit board; a MOS tube assembly, the MOS tube assembly being disposed on the MOS tube heat dissipation structure and inserted into the circuit board, the MOS tube assembly being located between the MOS tube heat dissipation structure and the circuit board, the MOS tube heat dissipation structure being used to dissipate heat from the MOS tube assembly, the MOS tube assembly being provided with a second assembly hole; and a fixing member, the fixing member being disposed through the MOS tube assembly and being adapted to the first assembly hole after passing through the second assembly hole.

[0022] The second aspect of the present application discloses a circuit board device that efficiently dissipates heat through the provision of a MOS tube heat dissipation structure, ensuring that the MOS tube assembly remains within a safe temperature range during high-power operation, avoiding performance degradation or damage caused by overheating. Furthermore, the multi-path and notch design of the heat dissipation structure ensures that heat is evenly distributed across the heat sink, avoiding localized overheating and improving the stability and reliability of the overall heat dissipation effect. Assembly efficiency is improved by having a fixing member, such as a connecting bolt, pass through the second assembly hole and then mate with the first assembly hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A first stereoscopic diagram of a first MOS tube heat dissipation structure;

[0024] Figure 2 A second stereoscopic view of the first MOS tube heat dissipation structure;

[0025] Figure 3 A third stereoscopic view of the first MOS tube heat dissipation structure;

[0026] Figure 4 This is a three-dimensional diagram of the second MOS tube heat dissipation structure;

[0027] Figure 5 This is a first stereoscopic view of the third MOS tube heat dissipation structure;

[0028] Figure 6 A second stereoscopic view of the third MOS tube heat dissipation structure;

[0029] Figure 7 A third stereoscopic diagram of the third MOS tube heat dissipation structure;

[0030] Figure 8 This is a three-dimensional diagram of the MOS tube heat dissipation structure and MOS tube components.

[0031] The corresponding relationship between the reference numerals and component names is as follows:

[0032] 1 heat sink, 101 first assembly hole;

[0033] 2 first heat dissipation module, 21 first fin, 22 second fin, 23 third fin, 24 fourth fin, 25 fifth fin, 26 sixth fin, 27 seventh fin, 201 heat dissipation passage, 2011 first passage, 2012 second passage, 2013 third passage, 2014 fourth passage, 2015 fifth passage, 2016 sixth passage, 2017 seventh passage, 2018 eighth passage, 2019 ninth passage, 202 first opening, 203 second opening, 204 first notch, 205 second notch, 206 third notch, 207 fourth notch, 208 fifth notch;

[0034] 3. Second heat dissipation module;

[0035] 4 legs;

[0036] 100MOS tube heat dissipation structure;

[0037] 200MOS tube assembly, 2001 second assembly hole. DETAILED DESCRIPTION

[0038] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0039] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0040] Example 1

[0041] like Figure 1-4 As shown, this embodiment discloses a MOS tube heat dissipation structure, including: a heat dissipation plate 1, the heat dissipation plate 1 is provided with a first assembly hole 101, the first assembly hole 101 is used to adapt and connect with the MOS tube; a first heat dissipation module 2, the first heat dissipation module 2 is arranged on the heat dissipation plate 1, the first heat dissipation module 2 extends in the length direction of the heat dissipation plate 1, both ends of the first heat dissipation module 2 are formed with a first opening 202, and a side of the first heat dissipation module 2 away from the heat dissipation plate 1 is formed with a second opening 203, the first heat dissipation module 2 and the heat dissipation plate 1 enclose a heat dissipation passage 201, the heat dissipation passage 201 is respectively connected to the first opening 202 and the second opening 203, and the heat dissipation passage 201 is connected to the first assembly hole 101.

[0042] The first aspect of the present application discloses a MOS tube heat dissipation structure, which is used to adapt and connect with the MOS tube through the first assembly hole 101 on the heat sink 1, simplifying the assembly process of the MOS tube, reducing the assembly difficulty of the MOS tube, and improving the assembly efficiency. It also ensures that the MOS tube is in close contact with the MOS tube heat dissipation structure, enhancing the heat conduction effect of the MOS tube. The heat dissipation module and the heat sink 1 are enclosed to form a heat dissipation path 201, so that external air can enter the heat dissipation path 201 and take away heat, thereby improving the heat dissipation effect. This design enhances the stability of the structure. The heat dissipation path 201 is connected to the first opening 202 and the second opening 203 respectively, ensuring that the heat of the heat dissipation path 201 can be quickly dissipated from multiple directions. The heat dissipation path 201 is connected to the first assembly hole 101, so that the heat of the components located at the first assembly hole 101 can be directly conducted into the heat dissipation path 201, with high heat conduction efficiency.

[0043] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines: the first heat dissipation module 2 includes a first fin 21, a second fin 22 and a third fin 23, the first fin 21 and the second fin 22 are both arranged on the heat dissipation plate 1, the first fin 21 and the second fin 22 are adjacent to each other, the number of the third fin 23 is multiple, the multiple third fins 23 are all arranged on the heat dissipation plate 1 and are spaced apart along the width direction of the heat dissipation plate 1, the first fin 21 and the second fin 22 are both located between the multiple third fins 23, a first passage 2011 is formed between the first fin 21 and the second fin 22, the first assembly hole 101 is connected to the first passage 2011, a second passage 2012 connected to the first passage 2011 is formed between the first fin 21 and the third fin 23, a third passage 2013 connected to the first passage 2011 is formed between the second fin 22 and the third fin 23, and a fourth passage 2014 is formed between two adjacent third fins 23. The multi-layered heat dissipation path design formed by the first, second, and third pathways 2011, 2012, and 2013 ensures rapid heat conduction and dissipation from multiple directions, significantly improving heat dissipation efficiency. The fourth pathway 2014 assists in heat dissipation, increasing heat dissipation efficiency. The connection between the second and third pathways 2012, 2013, and first pathway 2011 enhances heat flow between these pathways, accelerating heat dissipation. The connection between the first assembly hole 101 and first pathway 2011 allows heat to be rapidly transferred from the MOS transistor to the multiple heat dissipation pathways 201, improving overall heat conduction efficiency.

[0044] like Figure 2As shown, in addition to the features of the above embodiment, this embodiment further defines: the first fin 21 is provided with a first notch 204, the second fin 22 is provided with a second notch 205, the first notch 204 and the second notch 205 are respectively located on either side of the first passage 2011, the first passage 2011, the first notch 204, and the second passage 2012 are sequentially connected, and the first passage 2011, the second notch 205, and the third passage 2013 are sequentially connected. The sequential connection of the first passage 2011, the first notch 204, the second passage 2012, and the first passage 2011, the second notch 205, and the third passage 2013 facilitates heat flow and dissipation in different heat dissipation passages 201 and in multiple directions, thereby improving overall heat dissipation efficiency.

[0045] like Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines that: the first assembly hole 101 is adjacent to the first notch 204. By arranging the first assembly hole 101 and the first notch 204 adjacent to each other, heat from the component located at the first assembly hole 101 can be quickly transferred to other heat dissipation paths 201 through the first notch 204, thereby avoiding local overheating and improving heat transfer efficiency.

[0046] like Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines that: the first assembly hole 101 is adjacent to the second notch 205. By arranging the first assembly hole 101 and the second notch 205 adjacent to each other, heat from the component located at the first assembly hole 101 can be quickly transferred to other heat dissipation paths 201 through the second notch 205, thereby avoiding local overheating and improving heat transfer efficiency.

[0047] like Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines: the number of the first notches 204 and the second notches 205 are both multiple, the multiple first notches 204 are spaced apart along the length of the first fin 21, the multiple second notches 205 are spaced apart along the length of the first fin 21, the first passage 2011, the multiple first notches 204, and the second passage 2012 are sequentially connected, and the first passage 2011, the multiple second notches 205, and the second passage 2012 are sequentially connected. By having multiple first notches 204 and second notches 205 and distributing them along the length, multiple heat exchange points are created between different passages, allowing heat to be rapidly conducted and dissipated in multiple directions, achieving optimal heat dissipation efficiency. This design increases the air circulation path, promotes air convection, helps to more effectively remove heat, and improves the heat dissipation effect.

[0048] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines that the first notch 204 and the second notch 205 are arranged opposite each other. The opposite arrangement of the first notch 204 and the second notch 205 ensures that heat is evenly distributed on both sides of the heat dissipation path 201, avoiding unilateral overheating and improving the uniformity and stability of overall heat dissipation. Furthermore, the appearance is of high quality.

[0049] like Figure 3 As shown, in addition to the features of the above embodiment, this embodiment further defines: it also includes a second heat dissipation module 3, and there are multiple second heat dissipation modules 3. The multiple second heat dissipation modules 3 are all arranged on the heat dissipation plate 1 and spaced apart. The second heat dissipation modules 3 and the first heat dissipation modules 2 are respectively located on either side of the heat dissipation plate 1. By locating the second heat dissipation module 3 and the first heat dissipation module 2 on either side of the heat dissipation plate 1, the heat dissipation effect on the MOS transistor is further enhanced, ensuring that the MOS transistor remains within a safe temperature range during high-power operation.

[0050] like Figure 3 As shown, in addition to the features of the above embodiment, this embodiment further comprises: a plurality of legs 4, each of which is disposed on the heat sink 1 and located on the same side of the heat sink 1, and each of which is used to support the heat sink 1. The provision of the legs 4 provides stable support for the heat sink 1. Furthermore, the height of the legs 4 facilitates enhanced air convection around the heat sink 1, further improving the heat dissipation effect.

[0051] Example 2

[0052] like Figure 1-4 As shown, in addition to the features of the above embodiment, this embodiment further provides that: there are multiple first fins 21, and the multiple first fins 21 are arranged sequentially along the length of the heat sink 1. First gaps 204 are formed between the multiple first fins 21, and the first passage 2011, the first gaps 204, and the second passage 2012 are sequentially connected. Compared to first fins 21 having first gaps 204, the first gaps 204 for heat to pass through are formed by the gaps between the multiple first fins 21. The first gaps 204 are larger in size, and the air and heat transmission efficiency is higher.

[0053] like Figure 1-4As shown, in addition to the features of the above embodiment, this embodiment further provides that: there are multiple second fins 22, and the multiple second fins 22 are sequentially arranged along the length of the heat sink 1. Second gaps 205 are formed between the multiple second fins 22, and the first passage 2011, the second gaps 205, and the third passage 2013 are sequentially connected. Compared to second fins 22 having second gaps 205, the second gaps 205 for heat to pass through are formed by the gaps between the multiple second fins 22. The second gaps 205 are larger in size, and the air and heat transmission efficiency is higher.

[0054] Example 3

[0055] like Figure 5 and Figure 6 As shown, in addition to the features of the above embodiment, this embodiment further defines that: the first heat dissipation module 2 includes a fourth fin 24, a fifth fin 25, a sixth fin 26 and a seventh fin 27, the fourth fin 24, the fifth fin 25 and the sixth fin 26 are all arranged on the heat dissipation plate 1 and are arranged adjacent to each other in sequence, the number of the seventh fin 27 is multiple, and the multiple seventh fins 27 are all arranged on the heat dissipation plate 1 and are spaced apart along the width direction of the heat dissipation plate 1, the fourth fin 24, the fifth fin 25 and the sixth fin 26 are all located in multiple A third passage 2013 is formed between the seventh fin 27 and between the fourth fin 24 and the seventh fin 27. A fourth passage 2014, which communicates with the third passage 2013, is formed between the fourth fin 24 and the fifth fin 25. A seventh passage 2017, which communicates with the fourth passage 2014, is formed between the fifth fin 25 and the sixth fin 26. An eighth passage 2018, which communicates with the seventh passage 2017, is formed between the sixth fin 26 and the seventh fin 27. A ninth passage 2019 is formed between two adjacent seventh fins 27. The arrangement of the fifth passage 2015, the sixth passage 2016, the seventh passage 2017, and the eighth passage 2018 creates a multi-layered heat dissipation path design, ensuring that heat can be rapidly conducted and dissipated from multiple directions, significantly improving heat dissipation efficiency. The ninth passage 2019 aids in heat dissipation and increases heat dissipation efficiency. The fifth passage 2015, the sixth passage 2016, the seventh passage 2017 and the eighth passage 2018 are connected in sequence, thereby enhancing the heat flow between different passages, which is conducive to accelerating the dissipation of heat.

[0056] like Figure 5 and Figure 6As shown, in addition to the features of the above embodiment, this embodiment further provides that: there are multiple fourth fins 24, and the multiple fourth fins 24 are arranged in sequence along the length of the heat sink 1. Third notches 206 are formed between the multiple fourth fins 24, and the third notches 206 are respectively connected to the third passage 2013 and the fourth passage 2014. The multiple third notches 206 formed by the gaps between the multiple fourth fins 24 arranged in sequence along the length enable heat to be exchanged with heat from other passages at the multiple third notches 206, greatly enhancing the heat dispersion effect, avoiding local overheating, and improving heat dissipation efficiency.

[0057] like Figure 5 and Figure 6 As shown, in addition to the features of the above embodiment, this embodiment further provides that: there are multiple fifth fins 25, and the multiple fifth fins 25 are sequentially arranged along the length of the heat sink 1. Fourth notches 207 are formed between the multiple fifth fins 25, and the fourth notches 207 are respectively connected to the fourth passage 2014 and the seventh passage 2017. The multiple fourth notches 207 formed by the gaps between the multiple fifth fins 25 sequentially arranged along the length enable heat to be exchanged with heat from other passages at the multiple fourth notches 207, greatly enhancing the heat dispersion effect, avoiding local overheating, and improving heat dissipation efficiency.

[0058] like Figure 5 and Figure 6 As shown, in addition to the features of the above embodiment, this embodiment further provides that: there are multiple sixth fins 26, and the multiple sixth fins 26 are arranged in sequence along the length of the heat sink 1. Fifth notches 208 are formed between the multiple sixth fins 26, and the fifth notches 208 are respectively connected to the seventh passage 2017 and the eighth passage 2018. The fifth notches 208 are formed by the gaps between the multiple sixth fins 26 arranged in sequence along the length, allowing heat to be exchanged with heat from other passages at the fifth notches 208, greatly enhancing the heat dispersion effect, avoiding local overheating, and improving heat dissipation efficiency.

[0059] like Figure 5-7As shown, in addition to the features of the above-described embodiment, this embodiment further provides that: there are multiple first assembly holes 101, at least one of the multiple first assembly holes 101 is connected to the sixth passage 2016, and another of the multiple first assembly holes 101 is connected to the seventh passage 2017. The provision of three first assembly holes 101 enables this product to be connected to three MOS transistors simultaneously, thereby dissipating heat for all three MOS transistors simultaneously, which is highly practical. By having two first assembly holes 101 connected to the sixth passage 2016 and one first assembly hole 101 connected to the seventh passage 2017, heat from components located in the first assembly holes 101 can be rapidly conducted and dissipated from multiple directions, thereby improving overall heat dissipation efficiency.

[0060] Example 4

[0061] like Figure 8 As shown, this embodiment discloses a circuit board device, including: a circuit board; the above-mentioned MOS tube heat dissipation structure 100, the MOS tube heat dissipation structure 100 being arranged on the circuit board; a MOS tube assembly 200, the MOS tube assembly 200 being arranged on the MOS tube heat dissipation structure 100, the MOS tube assembly 200 being inserted into the circuit board, the MOS tube assembly 200 being located between the MOS tube heat dissipation structure 100 and the circuit board, the MOS tube heat dissipation structure 100 being used to dissipate heat for the MOS tube assembly 200, the MOS tube assembly 200 being provided with a second assembly hole 2001; and a fixing member, the fixing member being passed through the MOS tube assembly 200, the fixing member being adapted to the first assembly hole 101 after passing through the second assembly hole 2001.

[0062] The second aspect of the present application discloses a circuit board device that efficiently dissipates heat through the provision of a MOS tube heat dissipation structure 100, ensuring that the MOS tube assembly 200 remains within a safe temperature range during high-power operation, thereby avoiding performance degradation or damage caused by overheating. Furthermore, the multi-path and notch design of the heat dissipation structure ensures that heat is evenly distributed across the heat sink 1, avoiding localized overheating and improving the stability and reliability of the overall heat dissipation effect. By inserting a fixing member, such as a connecting bolt, through the second assembly hole 2001 and then mating with the first assembly hole 101, assembly efficiency is improved.

[0063] The above embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the concept of the present invention, and these variations and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A MOS tube heat dissipation structure, characterized in that: include: A heat dissipation plate (1), the heat dissipation plate (1) being provided with a first assembly hole (101), the first assembly hole (101) being used for adapting and connecting with a MOS tube; A first heat dissipation module (2), the first heat dissipation module (2) is arranged on the heat dissipation plate (1), the first heat dissipation module (2) extends in the length direction of the heat dissipation plate (1), both ends of the first heat dissipation module (2) form a first opening (202), a side of the first heat dissipation module (2) away from the heat dissipation plate (1) forms a second opening (203), the first heat dissipation module (2) and the heat dissipation plate (1) enclose a heat dissipation passage (201), the heat dissipation passage (201) is communicated with the first opening (202) and the second opening (203) respectively, and the heat dissipation passage (201) is communicated with the first assembly hole (101).

2. The MOS tube heat dissipation structure according to claim 1, characterized in that: The first heat dissipation module (2) comprises a first fin (21), a second fin (22) and a third fin (23); the first fin (21) and the second fin (22) are both arranged on the heat dissipation plate (1); the first fin (21) and the second fin (22) are adjacently arranged; there are a plurality of third fins (23); the plurality of third fins (23) are all arranged on the heat dissipation plate (1) and are spaced apart along the width direction of the heat dissipation plate (1); the first fin (21) and the second fin (22) are both located between the plurality of third fins (23) A first passage (2011) is formed between the first fin (21) and the second fin (22), the first assembly hole (101) is connected to the first passage (2011), a second passage (2012) connected to the first passage (2011) is formed between the first fin (21) and the third fin (23), a third passage (2013) connected to the first passage (2011) is formed between the second fin (22) and the third fin (23), and a fourth passage (2014) is formed between two adjacent third fins (23).

3. The MOS tube heat dissipation structure according to claim 2, characterized in that: The first fin (21) is provided with a first notch (204), and the second fin (22) is provided with a second notch (205). The first notch (204) and the second notch (205) are respectively located on both sides of the first passage (2011). The first passage (2011), the first notch (204), and the second passage (2012) are sequentially connected. The first passage (2011), the second notch (205), and the third passage (2013) are sequentially connected.

4. The MOS tube heat dissipation structure according to claim 3, characterized in that: The first assembly hole (101) and the first notch (204) are arranged adjacent to each other; and / or the first assembly hole (101) and the second notch (205) are arranged adjacent to each other; and / or the number of the first notch (204) and the number of the second notch (205) are both multiple, the multiple first notches (204) are spaced apart along the length direction of the first fin (21), the multiple second notches (205) are spaced apart along the length direction of the first fin (21), the first passage (2011), the multiple first notches (204) and the second passage (2012) are sequentially connected, and the first passage (2011), the multiple second notches (205) and the second passage (2012) are sequentially connected; And / or the first notch (204) and the second notch (205) are arranged opposite to each other.

5. The MOS tube heat dissipation structure according to claim 2, characterized in that: There are a plurality of first fins (21), and the plurality of first fins (21) are sequentially arranged along the length direction of the heat dissipation plate (1); a first notch (204) is formed between the plurality of first fins (21); and the first passage (2011), the first notch (204), and the second passage (2012) are sequentially connected; And / or the number of the second fins (22) is multiple, the multiple second fins (22) are arranged in sequence along the length direction of the heat sink (1), second gaps (205) are formed between the multiple second fins (22), and the first passage (2011), the second gap (205) and the third passage (2013) are connected in sequence.

6. The MOS tube heat dissipation structure according to claim 1, characterized in that: The first heat dissipation module (2) comprises a fourth fin (24), a fifth fin (25), a sixth fin (26) and a seventh fin (27); the fourth fin (24), the fifth fin (25) and the sixth fin (26) are all arranged on the heat dissipation plate (1) and are arranged adjacent to each other in sequence; there are a plurality of seventh fins (27); the plurality of seventh fins (27) are all arranged on the heat dissipation plate (1) and are spaced apart along the width direction of the heat dissipation plate (1); the fourth fin (24), the fifth fin (25) and the sixth fin (26) are all located between the plurality of seventh fins (27); A fifth passage (2015) is formed between the fourth fin (24) and the seventh fin (27); a sixth passage (2016) connected to the fifth passage (2015) is formed between the fourth fin (24) and the fifth fin (25); a seventh passage (2017) connected to the sixth passage (2016) is formed between the fifth fin (25) and the sixth fin (26); an eighth passage (2018) connected to the seventh passage (2017) is formed between the sixth fin (26) and the seventh fin (27); and a ninth passage (2019) is formed between two adjacent seventh fins (27).

7. The MOS tube heat dissipation structure according to claim 6, characterized in that: There are a plurality of fourth fins (24), and the plurality of fourth fins (24) are sequentially arranged along the length direction of the heat dissipation plate (1). A third notch (206) is formed between the plurality of fourth fins (24), and the third notch (206) is respectively connected to the fifth passage (2015) and the sixth passage (2016); and / or the number of the fifth fins (25) is plural, the plurality of the fifth fins (25) are sequentially arranged along the length direction of the heat dissipation plate (1), a fourth notch (207) is formed between the plurality of the fifth fins (25), and the fourth notch (207) is respectively connected to the sixth passage (2016) and the seventh passage (2017); And / or the number of the sixth fins (26) is multiple, the multiple sixth fins (26) are arranged in sequence along the length direction of the heat sink (1), and a fifth notch (208) is formed between the multiple sixth fins (26), and the fifth notch (208) is connected to the seventh passage (2017) and the eighth passage (2018) respectively.

8. The MOS tube heat dissipation structure according to claim 6, characterized in that: There are multiple first assembly holes (101), at least one of the multiple first assembly holes (101) is connected to the sixth passage (2016), and another one of the multiple first assembly holes (101) is connected to the seventh passage (2017).

9. The MOS tube heat dissipation structure according to claim 1, characterized in that: It also includes a second heat dissipation module (3), the number of the second heat dissipation modules (3) is multiple, the multiple second heat dissipation modules (3) are all arranged on the heat dissipation plate (1) and are arranged at intervals, and the second heat dissipation module (3) and the first heat dissipation module (2) are respectively located on both sides of the heat dissipation plate (1); And / or further comprising a support leg (4), the support legs (4) being multiple in number, the multiple support legs (4) being all arranged on the heat dissipation plate (1) and located on the same side of the heat dissipation plate (1), and the multiple support legs (4) being all used to support the heat dissipation plate (1).

10. A circuit board device, characterized in that: include: circuit boards; The MOS tube heat dissipation structure (100) according to any one of claims 1 to 9, wherein the MOS tube heat dissipation structure (100) is arranged on the circuit board; A MOS tube assembly (200), the MOS tube assembly (200) being arranged on the MOS tube heat dissipation structure (100), the MOS tube assembly (200) being inserted into the circuit board, the MOS tube assembly (200) being located between the MOS tube heat dissipation structure (100) and the circuit board, the MOS tube heat dissipation structure (100) being used for heat dissipation of the MOS tube assembly (200), and the MOS tube assembly (200) being provided with a second assembly hole (2001); A fixing piece is provided on the MOS tube assembly (200), and the fixing piece is adapted to the first assembly hole (101) after passing through the second assembly hole (2001).

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