Power module packaging structure and electronic equipment

Abstract

The embodiment of the utility model discloses a power module packaging structure and electronic equipment. The power module packaging structure comprises a heat dissipation packaging frame which comprises a first surface and a second surface which are oppositely arranged; the first surface is provided with a groove; the power chip is arranged in the groove; a heat dissipation cover plate; the heat dissipation cover plate is arranged in the groove and located on the side, away from the heat dissipation packaging frame, of the power chip. According to the technical scheme of the embodiment of the utility model, the heat dissipation packaging frame is arranged, the groove is formed in the first surface of the heat dissipation packaging frame, and the power chip is arranged in the groove, so that mechanical protection, electrical connection and a heat dissipation channel are provided for the power chip; the heat dissipation cover plate is arranged in the groove and located on the side, away from the heat dissipation packaging frame, of the power chip, multi-face heat dissipation of the power chip is achieved, the packaging heat dissipation effect is enhanced, the packaging structure is simple, and the packaging process is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a power module packaging structure and electronic equipment. Background Art

[0002] With the continuous increase in chip integration and the continuous improvement of chip performance, high-power chips will generate a lot of heat when working. In order to avoid the chip from burning due to high temperature and ensure the long-term stable operation of the chip, it is necessary to ensure that the chip can be cooled when forming the packaging structure.

[0003] Existing chip packaging mainly includes Quad Flat No-leads Package (QFN) technology or Dual Flat No-leads Package (DFN) technology. The main structure of QFN technology includes a frame, chip and plastic packaging material. There are exposed pads at the bottom of the frame for heat conduction and chip bonding. There are electrical connectors between the chip and the frame. Internal pins are arranged around the frame for electrical connection between the chip, frame and circuit board.

[0004] However, in the existing packaging structure, the chip is attached to the front of the frame, the pads on the surface of the chip are connected to the frame pins, and the packaging is completed by plastic packaging material. The heat dissipation path of the chip is conducted from the bottom of the chip to the frame and then dissipated. The heat dissipation capacity is poor, and the packaging process is complicated due to bonding and plastic packaging. Utility Model Content

[0005] The utility model provides a power module packaging structure and electronic equipment to solve the problems of poor packaging heat dissipation capability and complex packaging process.

[0006] According to one aspect of the present invention, a power module packaging structure is provided, the power module packaging structure comprising:

[0007] The heat dissipation packaging frame comprises a first surface and a second surface arranged opposite to each other; the first surface is provided with a groove; the power chip is arranged in the groove;

[0008] The heat dissipation cover plate is arranged in the groove and is located on the side of the power chip away from the heat dissipation packaging frame.

[0009] Optionally, the groove includes a first recessed portion and a second recessed portion; the first recessed portion and the second recessed portion are connected;

[0010] The projected area of ​​the first recessed portion on the heat dissipation package frame is smaller than the projected area of ​​the second recessed portion on the heat dissipation package frame.

[0011] Optionally, a thermally conductive adhesive layer is provided in the first recessed portion;

[0012] The power chip is fixed in the heat dissipation packaging frame through a thermally conductive adhesive layer.

[0013] Optionally, the thermally conductive adhesive layer includes a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

[0014] Optionally, the size of the power chip is smaller than the size of the first recessed portion;

[0015] The size of the heat dissipation cover plate is smaller than that of the second recessed portion.

[0016] Optionally, a first connecting pad and a second connecting pad are provided on a side of the power chip away from the heat dissipation package frame;

[0017] The heat dissipation cover is composed of a substrate and a conductive layer; the substrate is provided with a first through hole and a second through hole distributed at intervals; the conductive layer includes a first conductive portion and a second conductive portion; the first conductive portion is located in the first through hole, and the second conductive portion is located in the second through hole;

[0018] The first conductive portion is electrically connected to the first connection pad, and the second conductive portion is electrically connected to the second connection pad.

[0019] Optionally, a first conductive column is provided on a surface of the first conductive portion facing the first connecting pad, and the first conductive portion and the first connecting pad are electrically connected via solder;

[0020] A second conductive column is provided on a surface of the second conductive portion facing the second connecting pad. The second conductive column is electrically connected to the second connecting pad through solder.

[0021] Optionally, the power module packaging structure further includes: filling glue;

[0022] The filling glue is arranged between the heat dissipation cover plate and the power chip, and between the heat dissipation cover plate and the heat dissipation packaging frame.

[0023] Optionally, the second surface is provided with a grid structure.

[0024] Optionally, a projected area of ​​the grid structure on the heat dissipation package frame is greater than or equal to a projected area of ​​the power chip on the heat dissipation package frame.

[0025] Optionally, the heat dissipation packaging frame is a metal copper heat dissipation frame.

[0026] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising: a supporting substrate, a conductive circuit being provided on one side of the supporting substrate;

[0027] A power module packaging structure, in which the power chip is electrically connected to the conductive circuit through a heat dissipation cover plate, and the power module packaging structure is the aforementioned power module packaging structure.

[0028] Optionally, the supporting substrate is a printed circuit board.

[0029] The technical solution of the embodiment of the utility model is to set a heat dissipation packaging frame and set a groove on the first surface of the heat dissipation packaging frame, and set the power chip in the groove to provide mechanical protection, electrical connection and heat dissipation channel for the power chip, and set the heat dissipation cover plate in the groove on the side of the power chip away from the heat dissipation packaging frame, thereby realizing multi-sided heat dissipation of the power chip and enhancing the heat dissipation effect of the package. The packaging structure is simple, and the packaging process is simplified.

[0030] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 This is a schematic cross-sectional view of a power module packaging structure provided according to an embodiment of the present utility model;

[0033] Figure 2 This is a front view of a power module packaging structure provided according to an embodiment of the present utility model;

[0034] Figure 3 This is a schematic diagram of the back side of a power module packaging structure provided according to an embodiment of the present utility model;

[0035] Figure 4 This is a schematic cross-sectional view of a heat dissipation packaging frame provided according to an embodiment of the present utility model;

[0036] Figure 5 This is a schematic cross-sectional view of a power chip provided according to an embodiment of the present utility model;

[0037] Figure 6 This is a schematic cross-sectional view of a heat dissipation cover plate provided according to an embodiment of the present utility model;

[0038] Figure 7 This is a schematic cross-sectional view of a power chip placed in a groove according to an embodiment of the present utility model;

[0039] Figure 8This is a schematic cross-sectional view of another power module packaging structure provided according to an embodiment of the present utility model;

[0040] Figure 9 This is a schematic diagram of the back side of another power module packaging structure provided according to an embodiment of the present utility model;

[0041] Figure 10 It is a structural diagram of an electronic device provided according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0042] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0044] To address the issues of poor packaging heat dissipation and complex packaging processes, the present invention provides the following technical solutions: Figure 1 It is a schematic cross-sectional structure diagram of a power module packaging structure provided according to an embodiment of the present utility model. Figure 2 It is a front schematic diagram of a power module packaging structure provided according to an embodiment of the present utility model. Figure 3 This is a schematic diagram of the back of a power module packaging structure provided according to an embodiment of the present utility model. Figure 1 、 Figure 2 and Figure 3As shown, the power module packaging structure includes: a heat dissipation packaging frame 10, including a first surface 101 and a second surface 102 arranged opposite to each other; the first surface 101 is provided with a groove 103; the power chip 20 is arranged in the groove 103; the heat dissipation cover 30; the heat dissipation cover 30 is arranged in the groove 103 and is located on the side of the power chip 20 away from the heat dissipation packaging frame 10.

[0045] In the present embodiment, the heat dissipation packaging frame 10 is a key component for heat dissipation and packaging protection of chips or electronic components. It provides physical support and electrical connections for the chips or electronic components, and provides an effective heat dissipation path. The heat dissipation packaging frame 10 is typically made of metal or a material with high thermal conductivity. It surrounds the electronic components, forming a relatively enclosed space to ensure that the electronic components operate within a suitable temperature range and operate stably, avoiding damage due to excessive temperatures.

[0046] The first surface 101 of the heat dissipation package frame 10 is provided with a groove 103. The power chip 20 is positioned within the groove 103. The heat dissipation package frame 10 provides mechanical protection, electrical connection, and heat dissipation for the power chip 20. The heat dissipation package frame 10 promptly conducts heat generated by the power chip 20, preventing the power chip 20 from overheating and causing performance degradation, shortening its lifespan, or even damage. The heat dissipation package frame 10 and the groove 103 provide physical support and protection for the power chip 20, protecting it from external environmental factors such as mechanical shock, vibration, dust, and moisture.

[0047] Power chips 20 are integrated circuits capable of processing high-voltage and high-current signals. They are primarily used to convert, control, and drive electrical energy to meet the power requirements of various electronic devices. Power chips 20 primarily include metal-oxide-semiconductor field-effect transistor (MOSFET) power chips, insulated-gate bipolar transistor (IGBT) power chips, and bipolar transistor (BBT) power chips.

[0048] The power module packaging structure also includes a heat dissipation cover plate 30. This cover plate 30 is positioned within the recess 103 and on the side of the power chip 20 away from the heat dissipation packaging frame 10. It dissipates heat from the power chip 20 and provides electrical connections and mechanical support. By providing the heat dissipation packaging frame 10 and the heat dissipation cover plate 30, multi-faceted heat dissipation of the power chip 20 is achieved, enhancing the heat dissipation effect of the package. During the packaging process of the power chip 20, bonding and plastic encapsulation are not required, simplifying the packaging process and resulting in a simpler power module packaging structure.

[0049] The technical solution of the embodiment of the utility model is to set a heat dissipation packaging frame and set a groove on the first surface of the heat dissipation packaging frame, and set the power chip in the groove to provide mechanical protection, electrical connection and heat dissipation channel for the power chip, and set the heat dissipation cover plate in the groove on the side of the power chip away from the heat dissipation packaging frame, thereby realizing multi-sided heat dissipation of the power chip and enhancing the heat dissipation effect of the package. The packaging structure is simple, and the packaging process is simplified.

[0050] Figure 4 This is a cross-sectional structural diagram of a heat dissipation packaging frame provided according to an embodiment of the present utility model. Figure 1 and Figure 4 Optionally, the groove 103 includes a first recessed portion 1031 and a second recessed portion 1032; the first recessed portion 1031 and the second recessed portion 1032 are connected; the projection area of ​​the first recessed portion 1031 on the heat dissipation packaging frame 10 is smaller than the projection area of ​​the second recessed portion 1032 on the heat dissipation packaging frame 10.

[0051] In an embodiment of the present invention, the first recessed portion 1031 is used to place the power chip 20, and the second recessed portion 1032 is used to place the heat dissipation cover plate 30. The first recessed portion 1031 and the second recessed portion 1032 are connected, thereby achieving a connection between the heat dissipation cover plate 30 and the power chip 20, and dissipating heat from the power chip 20 and achieving electrical connection through the heat dissipation cover plate 30. The projected area of ​​the first recessed portion 1031 on the heat dissipation package frame 10 is smaller than the projected area of ​​the second recessed portion 1032 on the heat dissipation package frame 10, so that the heat dissipation cover plate 30 completely covers the power chip 20, and the heat dissipation of the power chip 20 is achieved through the heat dissipation package frame 10, thereby improving the heat dissipation effect of the power module packaging structure. The first recessed portion 1031 and the second recessed portion 1032 can be formed by etching or stamping the heat dissipation package frame 10.

[0052] Based on the technical solution of the above utility model embodiment, Figure 1 and Figure 4 Optionally, a thermally conductive adhesive layer 104 is provided in the first recess 1031 ; the power chip 20 is fixed in the heat dissipation packaging frame 10 through the thermally conductive adhesive layer 104 .

[0053] In the embodiment of the present invention, a highly thermally conductive adhesive is applied to the first recessed portion 1031 of the groove 103 of the heat dissipation package frame 10 to form a thermally conductive adhesive layer 104. The thermally conductive adhesive layer 104 secures the power chip 20 to the heat dissipation package frame 10, thereby achieving both fixation and heat conduction of the power chip 20.

[0054] Based on the technical solution of the above utility model embodiment, Figure 1Optionally, the thermal conductive adhesive layer 104 includes a tin thermal conductive adhesive layer or a sintered silver paste thermal conductive adhesive layer.

[0055] In the embodiment of the present invention, the thermally conductive adhesive layer 104 can be a highly thermally conductive adhesive material such as solder paste or sintered silver paste. When providing the thermally conductive adhesive layer 104, it is necessary to select a highly thermally conductive adhesive material based on requirements such as bonding strength, thermal conductivity, temperature and corrosion resistance, construction process, and cost.

[0056] Based on the technical solution of the above utility model embodiment, Figure 1 and Figure 4 Optionally, the size of the power chip 20 is smaller than the size of the first recess 1031 ; the size of the heat dissipation cover plate 30 is smaller than the size of the second recess 1032 .

[0057] In the embodiment of the present invention, the size of the power chip 20 is set to be smaller than the size of the first recessed portion 1031, so that the power chip 20 is completely embedded in the heat dissipation packaging frame 10. The size of the heat dissipation cover plate 30 is smaller than the size of the second recessed portion 1032, so that the heat dissipation cover plate 30 is embedded in the heat dissipation packaging frame 10 and covers the power chip 20, achieving comprehensive heat dissipation of the power chip 20.

[0058] Figure 5 It is a schematic diagram of the cross-sectional structure of a power chip provided according to an embodiment of the utility model. Figure 6 This is a cross-sectional structural diagram of a heat dissipation cover provided according to an embodiment of the present utility model. Figure 1 、 Figure 5 and Figure 6 Optionally, a first connecting pad 201 and a second connecting pad 202 are provided on a side of the power chip 20 away from the heat dissipation packaging frame 10; the heat dissipation cover 30 is composed of a substrate 301 and a conductive layer 302; the substrate 301 is provided with first through holes 3011 and second through holes 3012 distributed at intervals; the conductive layer 302 includes a first conductive portion 3021 and a second conductive portion 3022; the first conductive portion 3021 is located in the first through hole 3011, and the second conductive portion 3022 is located in the second through hole 3012; the first conductive portion 3021 is electrically connected to the first connecting pad 201, and the second conductive portion 3022 is electrically connected to the second connecting pad 202.

[0059] In the embodiment of the present invention, the first connection pad 201 can be connected to the drain of the power chip 20, and the second connection pad 202 can be connected to the gate of the power chip 20. The power chip 20 is thinned so that the power chip 20 can be placed in the first recess 1031. Figure 7 This is a schematic diagram of a cross-sectional structure of a power chip placed in a groove according to an embodiment of the present utility model. Figure 7As shown, after the power chip 20 provided with the first connecting pad 201 and the second connecting pad 202 is thinned, the power chip 20 is placed in the first recessed portion 1031 of the heat dissipation packaging frame 10 provided with the thermally conductive adhesive layer 104, so that the heat dissipation packaging frame 10 is connected to multiple surfaces of the power chip 20 through the thermally conductive adhesive layer 104, thereby dissipating heat from multiple surfaces of the power chip 20.

[0060] The heat dissipation cover 30 is composed of a substrate 301 and a conductive layer 302. The substrate 301 can be a ceramic substrate with high thermal conductivity. The conductive layer 302 includes a first conductive portion 3021 and a second conductive portion 3022, both of which are metal conductive layers. The metal includes, but is not limited to, copper. For example, the first conductive portion 3021 is electrically connected to the drain of the power chip 20 via the first connection pad 201, and the second conductive portion 3022 is electrically connected to the gate of the power chip 20 via the second connection pad 202. The substrate 301 is provided with first and second through-holes 3011 and 3012 spaced apart for injecting metal to form the first and second conductive portions 3021 and 3022.

[0061] Based on the technical solution of the above utility model embodiment, Figure 1 and Figure 6 Optionally, a first conductive column 303 is provided on the surface of the first conductive part 3021 facing the first connecting pad 201, and the first conductive part 3021 and the first connecting pad 201 are electrically connected through solder 305; a second conductive column 304 is provided on the surface of the second conductive part 3022 facing the second connecting pad 202, and the second conductive column 304 and the second connecting pad 202 are electrically connected through solder 305.

[0062] In an embodiment of the present invention, the first conductive pillar 303 can be a copper pillar. The solder 305 can be tin. The heat dissipation cover plate 30 is electrically connected to the power chip 20 through the first conductive pillar 303 and solder 305 of the first conductive portion 3021 facing the first connection pad 201, and the second conductive pillar 304 and solder 305 of the second conductive portion 3022 facing the second connection pad 202. This allows the heat dissipation cover plate 30 to not only dissipate heat from the power chip 20 but also transmit electrical signals.

[0063] Based on the technical solution of the above utility model embodiment, Figure 1 Optionally, the power module packaging structure further includes: a filling glue 50; the filling glue 50 is arranged between the heat dissipation cover plate 30 and the power chip 20, and between the heat dissipation cover plate 30 and the heat dissipation packaging frame 10.

[0064] In the embodiment of the present invention, the filling glue 50 is used to fix the heat dissipation cover plate 30 and the power chip 20 and serves as an insulating spacer.

[0065] Figure 8 It is a schematic cross-sectional structure diagram of another power module packaging structure provided according to an embodiment of the present utility model. Figure 9 This is a schematic diagram of the back side of another power module packaging structure provided according to an embodiment of the present utility model. Figure 8 and Figure 9 Optionally, the second surface 102 is provided with a grid structure 1021 .

[0066] In the embodiment of the present utility model, Figure 8 The power module packaging structure shown is similar to Figure 1 The difference between the power module packaging structure shown is that Figure 8 In the power module packaging structure shown, the second surface 102 is provided with a grid structure 1021. Providing the grid structure 1021 on the second surface 102 can increase the surface area of ​​the power module packaging structure, thereby achieving a better heat dissipation effect. Figure 8 The power module packaging structure shown does not require an external heat sink. By providing a grid structure 1021 on the second surface 102 , the heat sink is integrated into the packaging structure, thereby reducing the packaging size and achieving a better heat dissipation effect.

[0067] Based on the technical solution of the above utility model embodiment, Figure 8 Optionally, the projection area of ​​the grid structure 1021 on the heat dissipation package frame 10 is greater than or equal to the projection area of ​​the power chip 20 on the heat dissipation package frame 10 .

[0068] In an embodiment of the present invention, the projection area of ​​the grid structure 1021 on the heat dissipation packaging frame 10 is greater than or equal to the projection area of ​​the power chip 20 on the heat dissipation packaging frame 10, thereby increasing the heat dissipation area, being more conducive to heat dissipation of the power chip 20, and not affecting the overall packaging size of the power module packaging structure.

[0069] Based on the technical solution of the above utility model embodiment, Figure 1 Optionally, the heat dissipation packaging frame 10 is a metal copper heat dissipation frame.

[0070] In the embodiment of the present invention, the metallic copper heat dissipation frame features high thermal conductivity, good thermal stability, and uniform heat dissipation. Furthermore, the metallic copper heat dissipation frame possesses high strength and hardness, protecting the power chip 20 from external impacts. The metallic copper heat dissipation frame also exhibits antioxidant and corrosion resistance.

[0071] Figure 10 is a structural diagram of an electronic device provided according to an embodiment of the present utility model, such as Figure 10As shown, the electronic device includes: a supporting substrate 100, a conductive circuit is provided on one side of the supporting substrate 100; a power module packaging structure 200, in which the power chip 20 is electrically connected to the conductive circuit through a heat dissipation cover plate 30, and the power module packaging structure 200 is the power module packaging structure 200 of any embodiment of the present utility model.

[0072] In an embodiment of the present invention, a support substrate 100 is used to support and secure a power module package structure 200. The formed power module package structure 200 is attached to the support substrate 100. A conductive circuit is provided on one side of the support substrate 100. The power chip 20 in the power module package structure 200 is electrically connected to the conductive circuit via a heat dissipation cover 30. A portion of the heat generated by the power chip 20 is transferred to the support substrate 100 via the copper pillars and dissipated through the copper through-holes in the support substrate 100. The remaining portion is dissipated through the metal copper heat dissipation frame in contact with the power chip 20, achieving six-sided heat dissipation for the power chip 20 and achieving a better heat dissipation effect.

[0073] Based on the technical solution of the above utility model embodiment, Figure 10 Optionally, the supporting substrate 100 is a printed circuit board.

[0074] In this embodiment of the present invention, the support substrate 100 is a printed circuit board (PCB). A PCB is a printed circuit board formed on an insulating substrate, with point-to-point connections and printed components formed according to a predetermined design. The PCB provides electrical connections and mechanical support for the power chip 20 in the power module package 200. It is a key component in enabling the functions of the power chip 20, ensuring accurate signal transmission and a stable power supply.

[0075] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this utility model can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of this utility model can be achieved. This is not limited herein.

[0076] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A power module packaging structure, characterized in that: include: The heat dissipation packaging frame comprises a first surface and a second surface arranged opposite to each other; the first surface is provided with a groove; the power chip is arranged in the groove; The heat dissipation cover plate is arranged in the groove and is located on a side of the power chip away from the heat dissipation packaging frame.

2. The power module packaging structure according to claim 1, characterized in that: The groove includes a first recessed portion and a second recessed portion; the first recessed portion and the second recessed portion are connected; The projected area of ​​the first recessed portion on the heat dissipation package frame is smaller than the projected area of ​​the second recessed portion on the heat dissipation package frame.

3. The power module packaging structure according to claim 2, characterized in that: A thermally conductive adhesive layer is provided in the first recessed portion; The power chip is fixed in the heat dissipation packaging frame through the thermally conductive adhesive layer.

4. The power module packaging structure according to claim 3, characterized in that: The thermally conductive adhesive layer includes a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

5. The power module packaging structure according to claim 2, characterized in that: The size of the power chip is smaller than the size of the first recessed portion; The size of the heat dissipation cover plate is smaller than that of the second recessed portion.

6. The power module packaging structure according to claim 1, wherein: A first connecting pad and a second connecting pad are provided on a side of the power chip away from the heat dissipation package frame; The heat dissipation cover plate is composed of a substrate and a conductive layer; the substrate is provided with a first through hole and a second through hole distributed at intervals; the conductive layer includes a first conductive portion and a second conductive portion; the first conductive portion is located in the first through hole, and the second conductive portion is located in the second through hole; The first conductive portion is electrically connected to the first connection pad, and the second conductive portion is electrically connected to the second connection pad.

7. The power module packaging structure according to claim 6, characterized in that: A first conductive column is provided on a surface of the first conductive portion facing the first connecting pad, and the first conductive portion and the first connecting pad are electrically connected via solder; A second conductive column is provided on a surface of the second conductive portion facing the second connecting pad, and the second conductive column is electrically connected to the second connecting pad via solder.

8. The power module packaging structure according to claim 1, wherein: Also includes: Filling glue; The filling glue is arranged between the heat dissipation cover plate and the power chip, and between the heat dissipation cover plate and the heat dissipation packaging frame.

9. The power module packaging structure according to claim 1, wherein: The second surface is provided with a grid structure.

10. The power module packaging structure according to claim 9, characterized in that: The projected area of ​​the grid structure on the heat dissipation package frame is greater than or equal to the projected area of ​​the power chip on the heat dissipation package frame.

11. The power module packaging structure according to claim 1, wherein: The heat dissipation packaging frame is a metal copper heat dissipation frame.

12. An electronic device, characterized in that: include: A supporting substrate, wherein a conductive circuit is provided on one side of the supporting substrate; A power module packaging structure, wherein the power chip is electrically connected to the conductive circuit through the heat dissipation cover plate, and the power module packaging structure is the power module packaging structure according to any one of claims 1 to 11.

13. The electronic device according to claim 12, wherein: The supporting substrate is a printed circuit board.

Images