MOS tube heat dissipation assembly and circuit board device

Abstract

The utility model relates to an MOS tube heat dissipation assembly and a circuit board device, and belongs to the technical field of MOS tube heat dissipation, the MOS tube heat dissipation assembly comprises a heat conduction plate, the heat conduction plate can abut against an MOS tube, and the heat conduction plate is used for conducting heat generated by the MOS tube; the heat dissipation module is arranged on the heat conduction plate, a heat dissipation channel is defined by the heat dissipation module and the heat conduction plate, first openings are formed in the two ends of the heat dissipation module, a second opening is formed in the side, away from the heat conduction plate, of the heat dissipation module, and the first openings and the second opening communicate with the heat dissipation channel; the fixing plug-in is arranged on the heat conducting plate, the extending direction of the fixing plug-in is perpendicular to the horizontal plane where the heat conducting plate is located, and the fixing plug-in is used for fixing the heat conducting plate to an external component. According to the MOS tube heat dissipation assembly disclosed by the invention, the contact area between the MOS tube heat dissipation assembly and external air can be increased through the arrangement of the heat dissipation module, so that air convection is promoted, and the heat dissipation effect is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS tube heat dissipation, in particular to a MOS tube heat dissipation component and a circuit board device. Background Art

[0002] MOS transistors on circuit boards perform power management and signal processing functions. Since MOS transistors generate a significant amount of heat during operation, failure to dissipate heat can lead to performance degradation or even damage. However, traditional MOS transistor heat sinks have a rectangular structure with a flat heat dissipation surface. This results in poor heat dissipation, as the heat dissipation efficiency is proportional to the surface area. Furthermore, existing heat sink fixing methods may cause loosening, affecting the heat dissipation stability of the heat sink. Utility Model Content

[0003] Based on this, it is necessary to provide a MOS tube heat dissipation assembly and a circuit board device to address the problems of poor heat dissipation effect and possible looseness of traditional MOS tube heat dissipation assemblies.

[0004] A MOS tube heat dissipation assembly includes: a heat conducting plate capable of abutting against the MOS tube and used to conduct heat generated by the MOS tube; a heat dissipation module, disposed on the heat conducting plate, the heat dissipation module and the heat conducting plate forming a heat dissipation channel, both ends of the heat dissipation module forming a first opening, a side of the heat dissipation module away from the heat conducting plate forming a second opening, both the first opening and the second opening being in communication with the heat dissipation channel; and a fixing plug-in, disposed on the heat conducting plate, the extension direction of the fixing plug-in being perpendicular to the horizontal plane on which the heat conducting plate is located, and the fixing plug-in being used to fix the heat conducting plate to an external component.

[0005] The first aspect of the present application discloses a MOS tube heat dissipation assembly, which increases the contact area between the heat-conducting plate and the MOS tube by directly contacting the heat-conducting plate with the external heating element such as the MOS tube, ensuring that the heat generated by the MOS tube can be quickly and effectively conducted to the heat-conducting plate, so that the heat dissipation efficiency of this product is high. Compared with the MOS tube heat dissipation assembly with a flat heat dissipation surface, the setting of the heat dissipation module can increase the contact area between this product and the external air, thereby promoting air convection and enhancing the heat dissipation effect. The first opening and the second opening are both connected to the heat dissipation channel, and heat can be conducted in the heat dissipation channel and output to the outside world from the first opening and the second opening, which is conducive to rapid heat exchange and improved heat dissipation effect. The setting of the fixed plug-in allows the heat-conducting plate to be firmly fixed on the external component, such as the circuit board, etc. The fixed plug-in is inserted into the circuit board and then soldered, so that the fixing effect is good.

[0006] In one embodiment, the heat dissipation module includes a first heat dissipation fin and a second heat dissipation fin. The number of the first heat dissipation fin and the number of the second heat dissipation fin are both multiple. The multiple first heat dissipation fins and the multiple second heat dissipation fins are all arranged on the heat conduction plate and located on the same side of the heat conduction plate. The multiple first heat dissipation fins are arranged opposite each other and are all located between the multiple second heat dissipation fins. A first channel is formed between two adjacent first heat dissipation fins. The first channel is used to accommodate the external heating element. A second channel is formed between adjacent first heat dissipation fins and second heat dissipation fins and / or a second channel is formed between two adjacent second heat dissipation fins. The width of the first channel is larger than the width of the second channel. The fixing plug-in is located on the side of the heat conduction plate where the first channel is provided. The provision of the first channel can accommodate external heating elements such as MOS tubes, making assembly simple and convenient. Moreover, the width of the first channel is larger than the width of the second channel, thereby increasing the volume for accommodating external heating elements. External heating elements such as MOS tubes of different types and sizes can be accommodated, thereby increasing the applicability of the product. By locating the fixing plug-in and the external heating element on the same side, assembly on the circuit board is facilitated, reducing assembly difficulty and improving assembly efficiency. The provision of the first channel and the second channel allows heat to be conducted from the heat conducting plate to the outside through multiple paths, thereby increasing heat dissipation channels and achieving a good heat dissipation effect.

[0007] In one embodiment, the heat dissipation module further includes a third heat dissipation fin and a fourth heat dissipation fin. The third heat dissipation fin and the fourth heat dissipation fin are each provided on the heat conducting plate and are located on either side of the heat conducting plate along with the fixing plug. The third heat dissipation fins are located between the fourth heat dissipation fins. A third channel is formed between two adjacent third heat dissipation fins. The third channel is coaxial with the first channel. A fourth channel is formed between adjacent third heat dissipation fins and / or between adjacent fourth heat dissipation fins. The width of the third channel is greater than the width of the fourth channel. By coaxially arranging the third channel with the first channel and being located on either side of the heat conducting plate, heat generated by the heat dissipation element in the first channel can be preferentially directed to the third channel. The heat in the third channel is more concentrated, facilitating subsequent rapid processing. The width of the third channel is greater than that of the fourth channel, thereby facilitating rapid heat dissipation from the high heat load area of ​​the third channel to the outside world, while the fourth channel can assist in heat dissipation, ensuring balanced operation of the entire heat dissipation system.

[0008] In one embodiment, the heat conducting plate is provided with a first mounting hole, the first mounting hole being in communication with the first channel and the third channel, respectively. The fixing plug-in is disposed on the heat conducting plate and located at the first mounting hole. The provision of the first mounting hole makes the installation process of the fixing plug-in more standardized and simplified, reduces assembly difficulty, and improves assembly efficiency.

[0009] In one embodiment, the heat conducting plate is provided with a second mounting hole, which is connected to the first channel and the third channel respectively, and is adapted to be connected to the MOS tube. The provision of the second mounting hole facilitates the assembly of the MOS tube, ensures a secure connection between the MOS tube and the heat conducting plate, and reduces the risk of loosening due to vibration or other external forces.

[0010] In one embodiment, the width of the first channel is equal to the width of the third channel. This ensures sufficient space for the first channel and sufficient heat dissipation space for the third channel, ensuring good heat dissipation performance. Furthermore, the product's appearance is more harmonious and aesthetically pleasing.

[0011] In one embodiment, the width of the first channel is smaller than that of the third channel. By setting the first channel smaller in width to accommodate the MOS transistor, heat can be quickly and centrally transferred to the heat conducting plate. The third channel is wider to disperse and conduct more heat, improving overall heat dissipation efficiency.

[0012] In one embodiment, the heat dissipation module includes a fifth heat dissipation fin, and the number of the fifth heat dissipation fins is multiple. The multiple fifth heat dissipation fins are arranged in sequence along the length direction of the heat conduction plate, and the multiple fifth heat dissipation fins are arranged in sequence along the width direction of the heat conduction plate. A fifth channel is formed between the fifth heat dissipation fins in two adjacent rows, and a sixth channel is formed between the fifth heat dissipation fins in two adjacent columns. The sixth channel and the fifth channel are staggered. By staggering the sixth channel and the fifth channel, the heat dissipation path is increased, so that heat can be conducted and dissipated from multiple directions, thereby improving the overall heat dissipation efficiency. Moreover, the dense arrangement of the multiple fifth heat dissipation fins significantly increases the contact area with the air, thereby improving the heat dissipation efficiency.

[0013] In one embodiment, the heat conducting plate is provided with a third mounting hole, and the number of the fixing inserts and the number of the third mounting holes are both multiple, the number of the fixing inserts and the number of the third mounting holes are the same, and the fixing inserts are positioned in a one-to-one correspondence with the third mounting holes. By positioning the fixing inserts in the third mounting holes in a one-to-one correspondence, assembly of the fixing inserts is relatively simple and quick. The provision of the fixing inserts ensures a secure assembly of the heat conducting plate.

[0014] In one embodiment, the heat dissipation module includes multiple sixth heat dissipation fins, each of which is disposed on the heat conducting plate and spaced apart, with a seventh channel formed between adjacent sixth heat dissipation fins. The provision of multiple sixth heat dissipation fins significantly increases the contact area between the heat dissipation module and the air, thereby improving heat dissipation efficiency. The formation of the seventh channel between adjacent sixth heat dissipation fins achieves a more uniform heat dissipation effect, avoids local overheating, and improves heat dissipation.

[0015] In one embodiment, the heat conducting plate is provided with a fourth mounting hole, and the number of the fixing inserts and the number of the fourth mounting holes are both multiple, the number of the fixing inserts and the number of the fourth mounting holes are the same, and the fixing inserts are positioned in a one-to-one correspondence with the fourth mounting holes. By positioning the fixing inserts in the fourth mounting holes in a one-to-one correspondence, assembly of the fixing inserts is relatively simple and quick. The provision of the fixing inserts ensures a secure assembly of the heat conducting plate.

[0016] A circuit board device comprises: a circuit board body; the aforementioned MOS tube heat dissipation assembly, the MOS tube heat dissipation assembly being disposed on the circuit board body, a fixing plug-in unit of the MOS tube heat dissipation assembly being inserted into the circuit board body, the MOS tube heat dissipation assembly being provided with a third channel, and the MOS tube heat dissipation assembly being provided with a second mounting hole; a MOS tube assembly, the MOS tube assembly being disposed on the MOS tube heat dissipation assembly and located in the third channel; and a connector, the connector being provided through the MOS tube assembly and being adapted to the second mounting hole after passing through the MOS tube assembly.

[0017] A second aspect of the present application discloses a circuit board device that utilizes a third channel within a MOS tube heat sink assembly to accommodate the MOS tube assembly, thereby improving MOS tube assembly efficiency. This design simplifies installation procedures, reduces installation time and costs, and improves production efficiency. The MOS tube heat sink assembly ensures that heat is rapidly transferred from the MOS tube to the heat sink fins, preventing MOS tube failures caused by overheating. Connectors, such as bolts, allow the MOS tube assembly to be quickly assembled to the MOS tube heat sink assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A first stereoscopic view of a first MOS tube heat dissipation assembly;

[0019] Figure 2 A second stereoscopic view of the first MOS tube heat dissipation assembly;

[0020] Figure 3 A perspective view of a second type of MOS tube heat dissipation assembly;

[0021] Figure 4 This is a first stereoscopic view of a third type of MOS tube heat dissipation assembly;

[0022] Figure 5 A second stereoscopic view of the third MOS tube heat dissipation assembly;

[0023] Figure 6 This is a first stereoscopic view of a fourth type of MOS tube heat dissipation assembly;

[0024] Figure 7 This is a second stereoscopic view of the fourth MOS tube heat dissipation assembly;

[0025] Figure 8 This is a three-dimensional diagram of the MOS tube heat dissipation component and the MOS tube component.

[0026] The corresponding relationship between the reference numerals and component names is as follows:

[0027] 1 heat conducting plate;

[0028] 2 heat dissipation module, 21 first heat dissipation fin, 22 second heat dissipation fin, 23 third heat dissipation fin, 24 fourth heat dissipation fin, 25 fifth heat dissipation fin, 26 sixth heat dissipation fin, 201 heat dissipation channel, 2011 first channel, 2012 second channel, 2013 third channel, 2014 fourth channel, 2015 fifth channel, 2016 sixth channel, 2017 seventh channel, 202 first opening, 203 second opening, 204 first mounting hole, 205 second mounting hole, 206 third mounting hole, 207 fourth mounting hole;

[0029] 3 fixed plug-in;

[0030] 100MOS tube heat dissipation component;

[0031] 200MOS tube assembly. DETAILED DESCRIPTION

[0032] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0034] Example 1

[0035] like Figure 1-2 As shown, this embodiment discloses a MOS tube heat dissipation assembly, including: a heat conducting plate 1, which can abut against the MOS tube and is used to conduct heat generated by the MOS tube; a heat dissipation module 2, which is arranged on the heat conducting plate 1, and the heat dissipation module 2 and the heat conducting plate 1 enclose a heat dissipation channel 201, and a first opening 202 is formed at both ends of the heat dissipation module 2, and a second opening 203 is formed on a side of the heat dissipation module 2 away from the heat conducting plate 1, and the first opening 202 and the second opening 203 are both connected to the heat dissipation channel 201; a fixing plug-in 3, which is arranged on the heat conducting plate 1, and the extension direction of the fixing plug-in 3 is perpendicular to the horizontal plane where the heat conducting plate 1 is located, and the fixing plug-in 3 is used to fix the heat conducting plate 1 to an external component.

[0036] The first aspect of the present application discloses a MOS tube heat dissipation assembly. By directly contacting the heat conducting plate 1 with an external heating element such as a MOS tube, the contact area between the heat conducting plate 1 and the MOS tube is increased, ensuring that the heat generated by the MOS tube can be quickly and effectively conducted to the heat conducting plate 1, so that the heat dissipation efficiency of this product is high. Compared with the MOS tube heat dissipation assembly with a flat heat dissipation surface, the setting of the heat dissipation module 2 can increase the contact area between this product and the external air, thereby promoting air convection and enhancing the heat dissipation effect. The first opening 202 and the second opening 203 are both connected to the heat dissipation channel 201, and heat can be conducted in the heat dissipation channel 201 and output to the outside world from the first opening 202 and the second opening 203, which is conducive to rapid heat exchange and improved heat dissipation effect. The setting of the fixing plug-in 3 enables the heat conducting plate 1 to be firmly fixed on the external component, such as a circuit board, etc. The fixing plug-in 3 is inserted into the circuit board and then soldered, and the fixing effect is good.

[0037] like Figure 2As shown, in addition to the features of the above embodiment, this embodiment further defines: the heat dissipation module 2 includes a first heat dissipation fin 21 and a second heat dissipation fin 22, the first heat dissipation fin 21 and the second heat dissipation fin 22 are both provided in plurality, the plurality of first heat dissipation fins 21 and the plurality of second heat dissipation fins 22 are all disposed on the heat conducting plate 1 and located on the same side of the heat conducting plate 1, the plurality of first heat dissipation fins 21 are disposed opposite each other and are all located between the plurality of second heat dissipation fins 22, a first channel 2011 is formed between two adjacent first heat dissipation fins 21, the first channel 2011 being used to accommodate the MOS transistor, a second channel 2012 is formed between adjacent first heat dissipation fins 21 and second heat dissipation fins 22 and / or a second channel 2012 is formed between two adjacent second heat dissipation fins 22, the width of the first channel 2011 is greater than the width of the second channel 2012, and the fixing plug 3 is located on the side of the heat conducting plate 1 where the first channel 2011 is provided. The provision of the first channel 2011 enables the accommodation of external heating components such as MOS transistors, making assembly simple and convenient. Furthermore, the width of first channel 2011 is greater than that of second channel 2012, thereby increasing the volume for accommodating external heating elements. This allows for the accommodation of external heating elements such as MOS tubes of different types and sizes, thereby increasing the product's applicability. By locating the fixed plug-in 3 and the external heating element on the same side, assembly on the circuit board is facilitated, reducing assembly difficulty and increasing assembly efficiency. The provision of first channel 2011 and second channel 2012 allows heat to be conducted from the heat conducting plate 1 to the exterior through multiple paths, increasing the number of channels for heat dissipation and achieving improved heat dissipation.

[0038] like Figure 1As shown, in addition to the features of the above embodiment, this embodiment further defines: the heat dissipation module 2 also includes a third heat dissipation fin 23 and a fourth heat dissipation fin 24, and the number of the third heat dissipation fin 23 and the fourth heat dissipation fin 24 is multiple, and the multiple third heat dissipation fins 23 and the multiple fourth heat dissipation fins 24 are all arranged on the heat conducting plate 1 and are respectively located on both sides of the heat conducting plate 1 with the fixing plug-in 3, and the multiple third heat dissipation fins 23 are all located between the multiple fourth heat dissipation fins 24, and a third channel 2013 is formed between two adjacent third heat dissipation fins 23, and the third channel 2013 is coaxially arranged with the first channel 2011, and a fourth channel 2014 is formed between adjacent third heat dissipation fins 23 and fourth heat dissipation fins 24 and / or a fourth channel 2014 is formed between two adjacent fourth heat dissipation fins 24, and the width of the third channel 2013 is larger than the width of the fourth channel 2014. Because third channel 2013 and first channel 2011 are coaxially arranged and located on either side of heat conducting plate 1, heat generated by the heat dissipating element within first channel 2011 is preferentially directed to third channel 2013. Heat in third channel 2013 is more concentrated, facilitating subsequent rapid processing. Because third channel 2013 is wider than fourth channel 2014, heat from the high-heat-load area of ​​third channel 2013 is quickly dissipated to the outside world. Fourth channel 2014 provides additional heat dissipation, ensuring balanced operation of the entire cooling system.

[0039] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines: the heat conducting plate 1 is provided with a first mounting hole 204, the first mounting hole 204 being in communication with the first channel 2011 and the third channel 2013, respectively; the fixing plug 3 is disposed on the heat conducting plate 1 and located at the first mounting hole 204. The provision of the first mounting hole 204 makes the installation process of the fixing plug 3 more standardized and simple, reduces assembly difficulty, and improves assembly efficiency.

[0040] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further defines: the heat conducting plate 1 is provided with a second mounting hole 205, which is connected to the first channel 2011 and the third channel 2013 respectively, and is used to adapt and connect with the MOS tube. The provision of the second mounting hole 205 facilitates the assembly of the external heating element, ensures the stability of the connection between the external heating element and the heat conducting plate 1, and reduces the risk of loosening due to vibration or other external forces.

[0041] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiment, this embodiment further provides that the width of the first channel 2011 is equal to the width of the third channel 2013. By ensuring that the width of the first channel 2011 is equal to the width of the third channel 2013, sufficient space for receiving the first channel 2011 and sufficient space for heat dissipation in the third channel 2013 can be ensured, thereby ensuring heat dissipation performance. Furthermore, the product has a more harmonious and aesthetically pleasing appearance.

[0042] Example 2

[0043] like Figure 3 As shown, in addition to the features of the above embodiment, this embodiment further defines that the width of the first channel 2011 is smaller than the width of the third channel 2013. By setting the first channel 2011 to be smaller in width, it is specifically used to accommodate external heating components, ensuring that heat can be quickly and concentratedly transferred to the heat conducting plate 1. The third channel 2013 is wider to disperse and transfer more heat, thereby improving overall heat dissipation efficiency.

[0044] Example 3

[0045] like Figure 4 and Figure 5 As shown, in addition to the features of the above embodiment, this embodiment further provides that: the heat dissipation module 2 includes a plurality of fifth heat dissipation fins 25, the plurality of fifth heat dissipation fins 25 being arranged sequentially along the length of the heat conducting plate 1 and the plurality of fifth heat dissipation fins 25 being arranged sequentially along the width of the heat conducting plate 1. A fifth channel 2015 is formed between two adjacent rows of the fifth heat dissipation fins 25, and a sixth channel 2016 is formed between two adjacent columns of the fifth heat dissipation fins 25. The sixth channel 2016 and the fifth channel 2015 are arranged alternately. The alternating arrangement of the sixth channel 2016 and the fifth channel 2015 increases the heat dissipation path, allowing heat to be conducted and dissipated in multiple directions, thereby improving overall heat dissipation efficiency. Furthermore, the dense arrangement of the plurality of fifth heat dissipation fins 25 significantly increases the contact area with the air, thereby improving heat dissipation efficiency.

[0046] like Figure 5 As shown, in addition to the features of the above embodiment, this embodiment further defines: the heat conducting plate 1 is provided with a third mounting hole 206, the number of the fixing plugs 3 and the number of the third mounting holes 206 are both multiple, the number of the fixing plugs 3 and the number of the third mounting holes 206 are the same, and the fixing plugs 3 are located in the third mounting holes 206 in a one-to-one correspondence. By having the fixing plugs 3 located in the third mounting holes 206 in a one-to-one correspondence, the assembly of the fixing plugs 3 is relatively simple and quick. The provision of the fixing plugs 3 ensures that the heat conducting plate 1 is securely assembled.

[0047] Example 4

[0048] like Figure 6 and Figure 7 As shown, in addition to the features of the above embodiment, this embodiment further provides that: the heat dissipation module 2 includes a plurality of sixth heat dissipation fins 26, each of which is disposed on the heat conducting plate 1 and spaced apart, with a seventh channel 2017 formed between adjacent sixth heat dissipation fins 26. The provision of multiple sixth heat dissipation fins 26 significantly increases the contact area between the heat dissipation module 2 and the air, thereby improving heat dissipation efficiency. The formation of the seventh channel 2017 between adjacent sixth heat dissipation fins 26 achieves a more uniform heat dissipation effect, avoids local overheating, and improves heat dissipation.

[0049] like Figure 7 As shown, in addition to the features of the above embodiment, this embodiment further defines: the heat conducting plate 1 is provided with a fourth mounting hole 207, the number of the fixing plug-ins 3 and the fourth mounting hole 207 are both multiple, the number of the fixing plug-ins 3 and the fourth mounting hole 207 are the same, and the fixing plug-ins 3 are located in the fourth mounting holes 207 in a one-to-one correspondence. By having the fixing plug-ins 3 located in the fourth mounting holes 207 in a one-to-one correspondence, the assembly of the fixing plug-ins 3 is relatively simple and quick. The provision of the fixing plug-ins 3 ensures that the heat conducting plate 1 is securely assembled.

[0050] Example 5

[0051] like Figure 8 As shown, this embodiment discloses a circuit board device, including: a circuit board body; the above-mentioned MOS tube heat dissipation assembly 100, wherein the MOS tube heat dissipation assembly 100 is arranged on the circuit board body, the fixing plug-in 3 of the MOS tube heat dissipation assembly 100 is inserted into the circuit board body, the MOS tube heat dissipation assembly 100 is provided with a third channel 2013, and the MOS tube heat dissipation assembly 100 is provided with a second mounting hole 205; a MOS tube assembly 200, wherein the MOS tube assembly 200 is arranged on the MOS tube heat dissipation assembly 100 and is located at the third channel 2013; and a connector, wherein the connector is provided through the MOS tube assembly 200 and is adapted to the second mounting hole 205 after passing through the MOS tube assembly 200.

[0052] A second aspect of the present application discloses a circuit board device that utilizes a third channel 2013 within a MOS tube heat sink assembly 100 for accommodating a MOS tube assembly 200, thereby improving MOS tube assembly efficiency. This design simplifies installation procedures, reduces installation time and costs, and improves production efficiency. The provision of the MOS tube heat sink assembly 100 ensures that heat is rapidly transferred from the MOS tube to the heat sink fins, preventing MOS tube failures caused by excessive temperatures. Connectors, such as bolts, allow the MOS tube assembly 200 to be quickly assembled to the MOS tube heat sink assembly 100.

[0053] The above embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the concept of the present invention, and these variations and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A MOS tube heat dissipation component, characterized in that: include: A heat conducting plate (1), the heat conducting plate (1) being capable of abutting against the MOS tube, and the heat conducting plate (1) being used to conduct heat generated by the MOS tube; A heat dissipation module (2), the heat dissipation module (2) being arranged on the heat conducting plate (1), the heat dissipation module (2) and the heat conducting plate (1) enclosing to form a heat dissipation channel (201), first openings (202) being formed at both ends of the heat dissipation module (2), a second opening (203) being formed on a side of the heat dissipation module (2) away from the heat conducting plate (1), the first opening (202) and the second opening (203) both being in communication with the heat dissipation channel (201); A fixing plug-in (3) is provided on the heat conducting plate (1), an extension direction of the fixing plug-in (3) is perpendicular to a horizontal plane on which the heat conducting plate (1) is located, and the fixing plug-in (3) is used to fix the heat conducting plate (1) on an external component.

2. The MOS tube heat dissipation assembly according to claim 1, characterized in that: The heat dissipation module (2) comprises a first heat dissipation fin (21) and a second heat dissipation fin (22); the number of the first heat dissipation fin (21) and the number of the second heat dissipation fin (22) are both multiple; the multiple first heat dissipation fins (21) and the multiple second heat dissipation fins (22) are all arranged on the heat conduction plate (1) and are located on the same side of the heat conduction plate (1); the multiple first heat dissipation fins (21) are arranged opposite to each other and are all located between the multiple second heat dissipation fins (22); and there is a gap between two adjacent first heat dissipation fins (21). A first channel (2011) is formed, the first channel (2011) being used to accommodate the MOS tube, a second channel (2012) is formed between adjacent first heat dissipation fins (21) and second heat dissipation fins (22) and / or a second channel (2012) is formed between two adjacent second heat dissipation fins (22), the width of the first channel (2011) being greater than the width of the second channel (2012), and the fixing plug-in (3) is located on a side of the heat conducting plate (1) where the first channel (2011) is provided.

3. The MOS tube heat dissipation assembly according to claim 2, characterized in that: The heat dissipation module (2) further comprises a third heat dissipation fin (23) and a fourth heat dissipation fin (24), the number of the third heat dissipation fin (23) and the number of the fourth heat dissipation fin (24) are both multiple, the multiple third heat dissipation fins (23) and the multiple fourth heat dissipation fins (24) are all arranged on the heat conduction plate (1) and are respectively located on both sides of the heat conduction plate (1) with the fixed plug-in (3), and the multiple third heat dissipation fins (23) are all located between the multiple fourth heat dissipation fins (24). A third channel (2013) is formed between two adjacent third heat dissipation fins (23), the third channel (2013) being coaxially arranged with the first channel (2011), a fourth channel (2014) being formed between adjacent third heat dissipation fins (23) and fourth heat dissipation fins (24), and / or a fourth channel (2014) being formed between two adjacent fourth heat dissipation fins (24), and the width of the third channel (2013) being greater than the width of the fourth channel (2014).

4. The MOS tube heat dissipation assembly according to claim 3, characterized in that: The heat conducting plate (1) is provided with a first mounting hole (204), the first mounting hole (204) being in communication with the first channel (2011) and the third channel (2013) respectively, and the fixing plug-in (3) is arranged on the heat conducting plate (1) and located at the first mounting hole (204); And / or the heat conducting plate (1) is provided with a second mounting hole (205), the second mounting hole (205) being in communication with the first channel (2011) and the third channel (2013) respectively, and the second mounting hole (205) being used for adaptive connection with the MOS tube.

5. The MOS tube heat dissipation assembly according to claim 3, characterized in that: The width of the first channel (2011) is equal to the width of the third channel (2013); Or the width of the first channel (2011) is smaller than the width of the third channel (2013).

6. The MOS tube heat dissipation assembly according to claim 1, characterized in that: The heat dissipation module (2) comprises a fifth heat dissipation fin (25), the number of the fifth heat dissipation fin (25) is multiple, the multiple fifth heat dissipation fins (25) are sequentially arranged along the length direction of the heat conduction plate (1), the multiple fifth heat dissipation fins (25) are sequentially arranged along the width direction of the heat conduction plate (1), a fifth channel (2015) is formed between the fifth heat dissipation fins (25) in two adjacent rows, a sixth channel (2016) is formed between the fifth heat dissipation fins (25) in two adjacent columns, and the sixth channel (2016) and the fifth channel (2015) are staggered.

7. The MOS tube heat dissipation assembly according to claim 6, characterized in that: The heat conducting plate (1) is provided with a third mounting hole (206), the number of the fixing plug-ins (3) and the third mounting hole (206) are both multiple, the number of the fixing plug-ins (3) and the third mounting hole (206) are the same, and the fixing plug-ins (3) are located at the third mounting holes (206) in a one-to-one correspondence.

8. The MOS tube heat dissipation assembly according to claim 1, characterized in that: The heat dissipation module (2) comprises a sixth heat dissipation fin (26), the number of the sixth heat dissipation fin (26) is multiple, the multiple sixth heat dissipation fins (26) are all arranged on the heat conduction plate (1) and are arranged at intervals, and a seventh channel (2017) is formed between two adjacent sixth heat dissipation fins (26).

9. The MOS tube heat dissipation assembly according to claim 8, characterized in that: The heat conducting plate (1) is provided with a fourth mounting hole (207), the number of the fixing plug-ins (3) and the fourth mounting hole (207) are both multiple, the number of the fixing plug-ins (3) and the fourth mounting hole (207) are the same, and the fixing plug-ins (3) are located at the fourth mounting holes (207) in a one-to-one correspondence.

10. A circuit board device, characterized in that: include: Circuit board body; The MOS tube heat dissipation assembly (100) according to any one of claims 1 to 5, wherein the MOS tube heat dissipation assembly (100) is arranged on the circuit board body, the fixing plug-in unit (3) of the MOS tube heat dissipation assembly (100) is inserted into the circuit board body, the MOS tube heat dissipation assembly (100) is provided with a third channel (2013), and the MOS tube heat dissipation assembly (100) is provided with a second mounting hole (205); A MOS tube assembly (200), the MOS tube assembly (200) being arranged on the MOS tube heat dissipation assembly (100) and located at the third channel (2013); A connecting piece is provided through the MOS tube assembly (200), and the connecting piece is adapted to the second mounting hole (205) after passing through the MOS tube assembly.

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