SMD device

Abstract

The surface-mounted device comprises a device body and an electric connecting piece, the electric connecting piece is provided with a fixed part, a buffer part and a conductive part which are sequentially connected along a first direction; the fixed part is fixed on the device body and is electrically connected with the device body; the conductive part is provided with a conductive connecting surface, and the conductive connecting surface is used for forming electric connection with a bonding pad on a circuit board; the buffer part can generate elastic deformation so as to reduce stress transmission between the conductive part and the fixed part; the electric connecting piece in the patch device comprises the conductive part and the fixed part, and the conductive part is connected with the fixed part through the buffer part, so that even if the conductive part shifts due to the deformation of the circuit board, the fixed part can be weakened or even prevented from shifting under the action of the buffer part; therefore, the influence of the displacement of the conductive part on the electric connector and the device body is reduced, the possibility of distortion cracks is effectively reduced, and the reliability of the patch device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to a patch device. Background Art

[0002] Electronic equipment and switching power supplies contain a large number of surface mount components. During use, due to stresses such as vibration and high-temperature creep, surface mount components often experience "distortion cracks." That is, the pins of surface mount components move due to bending or aging of the circuit board, causing distortion cracks in the surface mount components themselves, thereby affecting their electrical performance and, in severe cases, causing short circuits. Utility Model Content

[0003] The present application provides a patch device, which aims to solve the problem in the prior art that patch components are prone to distortion cracks, affecting their electrical performance and resulting in poor circuit reliability.

[0004] According to one aspect of the present application, an embodiment provides a patch device, including a device body and an electrical connector;

[0005] The electrical connector has a fixing portion, a buffer portion and a conductive portion connected in sequence along a first direction; the fixing portion is fixed to the device body and electrically connected to the device body; the conductive portion is used to electrically connect to the circuit board, and the conductive portion has a conductive connection surface that is adhered and fixed to the circuit board; the buffer portion can undergo elastic deformation to reduce stress transfer between the conductive portion and the fixing portion.

[0006] In one embodiment, the fixing portion is fixed and electrically connected to the first surface of the device body; the electrical connector also has a limiting portion, which is connected to the fixing portion and abuts against the second surface of the device body. The first surface and the second surface are two adjacent surfaces of the device body in different directions.

[0007] In one embodiment, the number of the limiting parts is set to be multiple, and the multiple limiting parts include a first limiting part and a second limiting part, and the first limiting part and the second limiting part are located on two opposite sides of the fixing part in the second direction; the second direction intersects with the first direction.

[0008] In one embodiment, the buffer portion is a bent structure connected between the fixing portion and the conductive portion.

[0009] In one embodiment, the buffer portion has a first bending section, a connecting section, and a second bending section connected in sequence, the end of the first bending section away from the connecting section is connected to the fixing portion, and the end of the second bending section away from the connecting section is connected to the conductive portion.

[0010] In one embodiment, the first bending section bends along a first rotation direction, and the second bending section bends along a second rotation direction, and the first rotation direction is opposite to the second rotation direction.

[0011] In one embodiment, the connecting section is arranged to abut against the surface of the device body, and the connecting section extends from the first bending section along a third direction toward the geometric center of the device body; the third direction intersects with the first direction.

[0012] In one embodiment, the conductive portion extends from a connection with the second bending segment along the third direction in a direction away from the geometric center of the device body, and the conductive portion and the connecting segment are arranged in parallel in the third direction.

[0013] In one embodiment, the electrical connector has at least two conductive parts, each conductive part is arranged in parallel along a second direction, and there is a gap between adjacent conductive parts; the second direction intersects with the first direction.

[0014] In one embodiment, the electrical connector is an integrated structure made of metal sheets; and / or the number of the electrical connectors is set to two, and the device body is fixed between the fixing portions of the two electrical connectors.

[0015] According to the patch device of the above embodiment, since the electrical connector in the patch device includes a conductive part and a fixed part, and the conductive part and the fixed part are connected by a buffer part, even if the conductive part is displaced due to the deformation of the circuit board, the fixed part will be weakened or even prevented from displacement under the action of the buffer part, thereby reducing the impact of the displacement of the conductive part on the electrical connector and the device body, effectively reducing the possibility of distortion cracks, and improving the reliability of the patch device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of bending deformation of a circuit board in related art.

[0017] Figure 2 Schematic diagram of pin stretching of SMD device in related technology.

[0018] Figure 3 This is a schematic diagram of the structure of the patch device in the embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the structure of the patch device in the embodiment of this application.

[0020] Figure 5 This is a schematic diagram of the explosion of the chip device in the embodiment of this application.

[0021] Figure 6This is a side view of the electrical connector structure of the patch device in an embodiment of the present application.

[0022] Description of reference numerals:

[0023] 1-circuit board; 2-chip device; 3-pin; 4-device body; 41-first surface; 42-second surface; 43-third surface; 44-connecting electrode; 5-electrical connector; 51-fixing portion; 52-buffering portion; 521-first bending section; 522-connecting section; 523-second bending section; 53-conductive portion; 531-conductive connecting surface; 54-limiting portion; 541-first limiting portion; 542-second limiting portion; 55-gap. DETAILED DESCRIPTION

[0024] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0025] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various implementations, and the operational steps involved in each embodiment may be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a particular embodiment and do not imply a required composition and / or sequence.

[0026] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0027] During the use of chip devices, due to stresses such as vibration and high-temperature creep, the chip device body often experiences "twist cracks". This is related to the material properties of the components themselves. Most chip components are made by printing conductors and then sintering them. The materials of such components themselves have a certain brittleness and poor creep resistance. If too much mechanical force is applied, cracks (cracks) will occur, and twist cracks refer to cracks caused by twisting. Twist cracks are difficult to detect from the outside of the chip device. Their characteristic is that cracks are generated from one end of the external electrode to the diagonal direction. Specifically, the reason for the twist cracks is that the chip device is fixed to the circuit board 1 by welding or other means during use. During the use of the circuit board 1, due to force, heat, and long-term use, the circuit board 1 may deform and bend. Therefore, the upper and lower surfaces relatively set will enter a stretching / contraction state accordingly, which will then cause the pads and solder to move / deform. Please refer to Figure 1 ; The pin 3 of the SMD device 2 fixed on the pad will also shift, and the tensile stress will be concentrated on the electrode of the SMD device 2. Please refer to Figure 2 When the tensile stress exceeds the dielectric strength of the SMD component, strain cracks will form. Strain cracks can degrade the SMD component's electrical performance, causing the circuit on the PCB to appear open. If they reach the internal electrodes of the SMD component, organic acids and moisture in the flux can penetrate through the gaps in the strain cracks, reducing insulation resistance. Furthermore, the voltage load will increase, and excessive current flow may cause a short circuit.

[0028] The present application provides a patch device, please refer to Figure 3-5 As shown, the chip device specifically includes a device body 4 and an electrical connector 5.

[0029] Among them, the specific types of SMD devices in the embodiments of the present application may include SMD resistors, SMD capacitors, SMD inductors, and other SMD components with several pins. In order to allow the device body 4 on the SMD device to be electrically connected to the circuit board, the SMD device in the embodiments of the present application has an electrical connector 5, which is used to connect the electrodes on the SMD device to the corresponding pads on the circuit board to achieve electrical connection between the SMD device and the circuit board. The pads on the circuit board can be designed according to the model of the SMD device, or the corresponding model of the SMD device can be selected according to the arrangement of the pads on the circuit board.

[0030] The electrical connector 5 in the embodiment of the present application is used to form an electrical connection between the device body 4 and the circuit board; wherein, according to different types of surface mount devices, the setting position and setting quantity of the corresponding electrical connector 5 on the device body 4 can be adjusted accordingly. For example, ordinary surface mount devices generally have positive and negative pins, while surface mount devices such as chips can include multiple pins; wherein, in the embodiment of the present application, each surface mount device has at least one electrical connector 5 in the embodiment of the present application.

[0031] The electrical connector 5 comprises a fixed portion 51, a buffer portion 52, and a conductive portion 53, which are sequentially connected along a first direction. The fixed portion 51 is fixed to the device body 4 and electrically connected to the device body 4. The conductive portion 53 is used for electrical connection to the circuit board and has a conductive connection surface 531 that is affixed to the circuit board. The buffer portion 52 is capable of elastic deformation to reduce stress transfer between the conductive portion 53 and the fixed portion 51. The fixed portion 51 is fixed to the device body 4 and electrically connected to the device body 4, indicating that the relative position of the fixed portion 51 and the device body 4 is fixed. Furthermore, the fixed portion 51 forms an electrical connection with an electrode provided on the device body 4. This connection can be achieved by direct contact between the fixed portion 51 and the electrode, or by other conductive bodies. In some optional embodiments, there are two electrical connectors 5, and the device body 4 is fixed between the fixed portions 51 of the two electrical connectors 5. In other words, the device body 4 can be symmetrically arranged between the two electrical connectors 5 to form the desired surface mount device structure.

[0032] The conductive part 53 is the part where the patch device is directly connected to the electrical connection area on the circuit board, so that the patch device can finally achieve electrical connection with the circuit board; the conductive part 53 has a conductive connection surface 531, through which the conductive connection surface 531 can achieve surface contact connection with the pad on the circuit board, thereby achieving the effect of mounting the patch device on the circuit board; then, based on conductive connection materials, such as solder, conductive glue, etc., a fixed connection between the conductive part 53 and the pad can be further achieved.

[0033] The conductive portion 53 is used to be fixedly connected to the solder pad on the circuit board. Therefore, if the circuit board is deformed, the conductive portion 53 will also shift with the deformation of the circuit board. In order to prevent the conductive portion 53 from damaging other parts of the electrical connector 5 or even the device body 4 due to displacement, the conductive portion 53 and the fixed portion 51 are connected through the buffer portion 52, and the buffer portion 52 can be elastically deformed when subjected to force, thereby reducing the stress transfer between the conductive portion 53 and the fixed portion 51, mainly reducing the stress transfer from the conductive portion 53 to the fixed portion 51. On the premise that the conductive part 53 and the fixed part 51 are connected through the buffer part 52, if the circuit board on which the patch device is installed is bent, causing the conductive part 53 directly connected to the circuit board to be displaced as the circuit board is bent, then the buffer part 52 will be elastically deformed under the drive of the conductive part 53, and the degree of the elastic deformation gradually decreases in the direction from close to the conductive part 53 to close to the fixed part 51, so the deformation that can be generated by the fixed part 51 is correspondingly reduced; the stress of the conductive part 53 is effectively transferred through the buffer part 32, preventing the conductive part 53 from cracking due to stress concentration, and the buffer part 52 weakens the stress transferred to the fixed part 51, thereby reducing the possibility of cracks in the fixed part 51 and the device body 4, greatly improving the reliability of the patch device.

[0034] The fixing portion 51, the buffer portion 52, and the conductive portion 53 are fixedly connected to each other, and are also electrically connected to each other. Therefore, the electrical connector 5 itself can be directly integrally formed from a conductive material. The conductive material can be a metal sheet including copper / aluminum and its alloys, or other non-metallic materials with good electrical conductivity. In some optional embodiments, the electrical connector 5 is an integral structure made of metal sheet. The electrical connector 5 can be integrally formed from a metal sheet by processes such as stamping, cutting, and casting.

[0035] In the electrical connector 5, the fixing portion 51, the buffer portion 52 and the conductive portion 53 are connected in sequence along a first direction, where the first direction refers to the height direction of the patch device. When the patch device is mounted on a circuit board, the distances between the fixing portion 51, the buffer portion 52 and the conductive portion 53 and the circuit board decrease in sequence.

[0036] In some alternative embodiments, please refer to Figure 5Specifically, the fixing portion 51 can be fixed to and electrically connected to the first surface 41 of the device body 4, wherein the first surface 41 can be any exposed surface on the device body 4; alternatively, the fixing portion 51 can also be embedded in the device body 4. In order to enhance the connection strength between the electrical connector 5 and the device body 4 and prevent the electrical connector 5 from detaching from the device body 4, the electrical connector 5 further comprises a limiting portion 54. The limiting portion 54 is connected to the fixing portion 51 and abuts against the second surface 42 of the device body 4. The first surface 41 and the second surface 42 are two adjacent surfaces of the device body 4 in different directions. In other words, in addition to being connected to one surface of the device body 4 through the fixing portion 51 in the embodiment of the present application, the limiting portion 54 can also abut against other surfaces on the device body 4. Through the cooperation between the fixing portion 51 and the limiting portion 54, a certain degree of enclosure of the device body 4 is achieved, thereby enhancing the connection strength between the fixing portion 51 and the device body 4. In addition, in addition to abutting against the device body 4, the limiting portion 54 can also directly form a fixed connection with the device body 4 to further enhance the connection strength.

[0037] In some optional embodiments, please continue to refer to Figure 5 In order to allow the electrical connector 5 to limit the device body 4 in different directions, the number of limiting portions 54 can be specifically set to multiple, wherein the multiple limiting portions 54 include a first limiting portion 541 and a second limiting portion 542. The first limiting portion 541 and the second limiting portion 542 are located on opposite sides of the fixing portion 51 in the second direction; the second direction intersects the first direction. In other words, the first limiting portion 541 and the second limiting portion 542 are arranged opposite each other on both sides of the fixing portion 51 in the second direction; and the second surfaces 42 abutted by the first limiting portion 541 and the second limiting portion 542 are two different surfaces, which are respectively adjacent to the first surface 41 on both sides in the second direction. The second surface 42 is arranged adjacent to the first surface 41, and the first limiting portion 541 and the second limiting portion 542 are arranged on the second surface 42 from the end of the fixing portion 51, across the connection between the first surface 41 and the second surface 42. Because the first limiting portion 541 and the second limiting portion 542 are disposed on opposite sides of the fixing portion 51 along the second direction, the first limiting portion 541, the second limiting portion 542, and the fixing portion 51 form a semi-enclosed structure that can accommodate the end of the device body 4. The first limiting portion 541 and the second limiting portion 542 can limit the movement of the device body 4 in the second direction, thereby enhancing the connection strength between the electrical connector 5 and the device body 4. The second direction intersects with the first direction. Specifically, the second direction can be perpendicular to the first direction. Since the first direction is along the height direction of the SMD device, the second direction can be along the width direction or length direction of the SMD device.

[0038] In addition, the limiting portion 54 can also be provided on other surfaces, and can cooperate with the first limiting portion 541 and the second limiting portion 542 to form a three-sided enclosed structure for the device body 4 to enhance the connection strength.

[0039] In some optional embodiments, please continue to refer to Figure 5 In order to ensure a direct electrical connection between the fixing portion 51 and the device body 4, the device body 4 has a connection electrode 44 located on the first surface 41. The fixing portion 51 forms a contact-type electrical connection with the connection electrode 44. In other words, the connection electrode 44 of the device body 4 is directly formed on the first surface 41. Therefore, when the fixing portion 51 is fixed to the first surface 41 by welding or other means, it can form an electrical connection with the connection electrode 44 through direct contact.

[0040] In some alternative embodiments, please refer to Figure 6 , the various components of the electrical connector 5 can be formed by integral bending; the specific forming method can be: the buffer portion 52 is a bent structure connected between the fixed portion 51 and the conductive portion 53. The fixed portion 51 extends along a first direction, and its end along the first direction is bent along a direction different from the first direction to form the buffer portion 52; the buffer portion 52 itself is bent to form a bent structure, which allows the buffer portion 52 to undergo elastic deformation to release stress and reduce stress transmission between the conductive portion 53 and the fixed portion 51; then, the end of the buffer portion 52 away from the fixed portion 51 is connected to the conductive portion 53. Forming the electrical connector 5 by integral bending can ensure the reliability of the electrical connection of the electrical connector 5, while improving the strength of the electrical connector 5 and reducing the possibility of damage to the electrical connector 5.

[0041] In some optional embodiments, in order to enhance the elastic deformation effect of the buffer portion 52 and ensure that the buffer portion 52 reduces stress transfer, the end portion of the fixed portion 51 in the first direction is bent at least twice to form the buffer portion 52. The buffer portion 52 is bent at least twice by the fixed portion 51, that is, the buffer portion 52 has at least two bending structures formed by bending. Generally speaking, the more bending structures there are, the larger the range of elastic deformation of the buffer portion 52, and the better the effect of reducing stress transfer. Specifically, the bending angles and shapes of the bending structures formed by bending may be different, and each bending structure may be realized by continuous bending, or by bending and then passing through a smooth structure, and then bending again.

[0042] In some optional embodiments, please continue to refer to Figure 6In order to reduce the volume of the SMD device and enhance the limiting effect on the device body in the SMD device, the buffer portion 52 has a first bent section 521, a connecting section 522, and a second bent section 523 connected in sequence. The end of the first bent section 521 away from the connecting section 522 is connected to the fixed portion 51, and the end of the second bent section 523 away from the connecting section 522 is connected to the conductive portion 53. In the embodiment of the present application, the buffer portion 52 includes two bent structures, namely the first bent section 521 and the second bent section 523. The first bent section 521 and the second bent section 523 are both formed by bending, and the first bent section 521 and the second bent section 523 are connected to the fixed portion 51 and the conductive portion 53 respectively; the connecting section 522 is connected between the first bent section 521 and the second bent section 523. Therefore, the first bent section 521, the connecting section 522, and the second bent section 523 are connected in sequence to form the buffer portion 52.

[0043] In some optional embodiments, please continue to refer to Figure 6 , the first bending section 521 bends along the first rotation direction, and the second bending section 523 bends along the second rotation direction, wherein the first rotation direction is opposite to the second rotation direction. That is, if the first bending section 521 bends along the clockwise direction, then the second bending section 523 bends along the counterclockwise direction; if the first bending section 521 bends along the counterclockwise direction, then the second bending section 523 bends along the clockwise direction, as shown in FIG. Figure 6 As shown, this can reduce the volume of the buffer portion 52 after bending and forming, while enhancing its elastic performance.

[0044] The connecting section 522 is disposed in contact with a surface of the device body 4 and extends from the first bent section 521 along a third direction toward the geometric center of the device body 4; the third direction intersects the first direction. The connecting section 522 abuts the surface of the device body 4, which may specifically be the third surface 43 adjacent to the first surface 41. The connecting section 522 extends along the third direction, which intersects the first direction. Specifically, the third direction is perpendicular to the first direction and is also perpendicular to the second direction. The first, second, and third directions form mutually perpendicular spatial coordinate systems. Under this structure, the connecting section 522 abuts against the third surface 43 of the device body 4, the first limiting portion 541 and the second limiting portion 542 abut against the two opposite second surfaces 42 of the device body 4, and the fixing portion 51 abuts against the first surface 41, thereby forming a accommodating space that matches the end of the device body 4. The device body 4 can be placed in the accommodating space to achieve the positioning effect of the device body 4, so that the connection posture between the device body 4 and the electrical connector 5 meets the design requirements.

[0045] In some optional embodiments, please continue to refer to Figure 3-5 As shown, in order to improve the connection strength between the SMD device and the circuit board without affecting the overall volume of the SMD device, the conductive portion 53 extends from the connection with the second bent section 523 along the third direction away from the geometric center of the device body 4, and the conductive portion 53 and the connecting section 522 are arranged in parallel in the third direction. In this structure, since the conductive portion 53 extends in a direction away from the geometric center of the device body 4, the problem of limited space for the conductive portion 53 to extend in a direction close to the geometric center of the device body 4 and being easily affected by other electrical connectors 5 is avoided. The area of ​​the conductive connection surface 531 at the bottom of the conductive portion 53 can be adjusted as needed. Therefore, by increasing the area of ​​the conductive connection surface 531, the area of ​​the surface contact formed between the conductive portion 53 and the circuit board can be increased, thereby enhancing the connection strength between the conductive portion 53 and the circuit board. The conductive portion 53 and the connecting section 522 are arranged in parallel in the third direction, indicating that the conductive portion 53 and the connecting section 522 extend in parallel directions.

[0046] In some optional embodiments, please continue to refer to Figure 3-5 As shown, in order to further achieve the anti-torsion effect of the patch device and reduce stress transfer, the electrical connector 5 can have at least two conductive parts 53, each conductive part 53 is arranged in parallel along the second direction, and there is a gap 55 between adjacent conductive parts 53; the second direction intersects with the first direction. In the embodiment of the present application, an electrical connector 5 can have two or more conductive parts 53, each conductive part 53 is arranged in parallel with each other, and there is no direct contact between adjacent conductive parts 53, but a gap 55 is formed; due to the existence of the gap 55, the movement mode of each conductive part 53 can be relatively independent to a certain extent, that is, when one of the conductive parts 53 moves, the influence on the movement of other conductive parts 53 is weakened to a certain extent, thereby improving the anti-torsion performance of the patch device, reducing the stress transfer between the conductive parts 53, and further reducing the stress transferred to the fixed part 51.

[0047] In some optional embodiments, the number of the electrical connectors is set to two, and the device body is fixed between the fixing portions of the two electrical connectors.

[0048] An embodiment of the present application provides a patch device. Since the electrical connector 5 in the patch device includes a conductive part 53 and a fixed part 51, and the conductive part 53 and the fixed part 51 are connected by a buffer part 52, even if the conductive part 53 is displaced due to deformation of the circuit board, the fixed part 51 will be weakened or even prevented from displacement under the action of the buffer part 52, thereby reducing the impact of the displacement of the conductive part 51 on the electrical connector 5 and the device body 4, effectively reducing the possibility of distortion cracks, and improving the reliability of the patch device.

[0049] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art of the present invention can make some simple deductions, modifications or substitutions based on the concept of the present invention.

Claims

1. A patch device, characterized in that: including a device body and electrical connectors; The electrical connector has a fixing portion, a buffer portion and a conductive portion connected in sequence along a first direction; the fixing portion is fixed to the device body and electrically connected to the device body; the conductive portion is used to electrically connect to the circuit board, and the conductive portion has a conductive connection surface that is adhered and fixed to the circuit board; the buffer portion can undergo elastic deformation to reduce stress transfer between the conductive portion and the fixing portion.

2. The patch device according to claim 1, wherein: The fixing portion is fixed and electrically connected to the first surface of the device body; the electrical connector also has a limiting portion, which is connected to the fixing portion and abuts against the second surface of the device body. The first surface and the second surface are two adjacent surfaces of the device body in different directions.

3. The patch device according to claim 2, wherein: The number of the limiting parts is set to be multiple, and the multiple limiting parts include a first limiting part and a second limiting part. The first limiting part and the second limiting part are located on two opposite sides of the fixing part in the second direction; the second direction intersects with the first direction.

4. The patch device according to claim 1, wherein: The buffer portion is a bending structure connected between the fixing portion and the conductive portion.

5. The patch device according to claim 4, wherein: The buffer portion has a first bending section, a connecting section, and a second bending section connected in sequence. One end of the first bending section away from the connecting section is connected to the fixing portion, and one end of the second bending section away from the connecting section is connected to the conductive portion.

6. The patch device according to claim 5, characterized in that The first bending section bends along a first rotation direction, and the second bending section bends along a second rotation direction, and the first rotation direction is opposite to the second rotation direction.

7. The patch device according to claim 5, wherein: The connecting section is disposed in contact with the surface of the device body and extends from the first bending section along a third direction toward a geometric center of the device body; the third direction intersects with the first direction.

8. The patch device according to claim 7, wherein: The conductive portion extends from a connection with the second bending section along the third direction in a direction away from the geometric center of the device body, and the conductive portion and the connecting section are arranged in parallel in the third direction.

9. The patch device according to any one of claims 1 to 8, wherein: The electrical connector has at least two conductive parts, each conductive part is arranged in parallel along a second direction, and there is a gap between adjacent conductive parts; the second direction intersects with the first direction.

10. The patch device according to any one of claims 1 to 8, characterized in that: The electrical connector It is an integrated structure made of metal sheet; and / or the number of the electrical connectors is set to two, The device body is fixed between the fixing portions of the two electrical connectors.

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