Hot pasting head for chip mounter and chip mounter

Abstract

The utility model belongs to the technical field of equipment for manufacturing component assembly parts, and particularly relates to a heat pasting head for a chip mounter and the chip mounter, and the heat pasting head for the chip mounter comprises a pressure acquisition unit, a stator unit, a mover unit, a heating unit and a gas pipeline unit. The pressure acquisition unit sleeves the outer side of the stator unit; the stator unit, the mover unit and the heating unit are mounted in sequence; the gas pipeline unit sequentially penetrates through the stator unit, the rotor unit and the heating unit so as to adsorb or release an element at the bottom of the heating unit; according to the utility model, the pressure acquisition unit is sleeved on the stator unit, the pressure value of the hot pasting head can be directly and accurately measured, meanwhile, the gas pipeline unit penetrates through the stator unit, the mover unit and the heating unit, the structure is more compact, the dustproof and waterproof requirements are met, and the heating unit is arranged at the bottom of the mover unit, so that the function of heating a paster is realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of component installation, and specifically relates to equipment for manufacturing component assemblies, in particular to a thermal mounting head for a chip mounter and the chip mounter. Background Art

[0002] The traditional patch head determines the pressure it is subjected to by the current of the Z-axis motor. However, there is a conversion relationship between current, torque, and pressure quality inspection. However, this conversion relationship is not ideally linear and there are multiple error interference factors.

[0003] Therefore, there is an urgent need to develop a new thermal mounting head and mounting machine for chip mounting machines to solve the technical problem that the traditional chip mounting head judges the pressure by the current size and causes inaccurate nonlinear conversion.

[0004] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Utility Model Content

[0005] The embodiments of the present disclosure at least provide a thermal mounting head for a chip mounter and a chip mounter.

[0006] In a first aspect, an embodiment of the present disclosure provides a thermal bonding head for a chip placement machine, comprising: a pressure acquisition unit, a stator unit, a mover unit, a heating unit and a gas pipeline unit; wherein the pressure acquisition unit is mounted on the outside of the stator unit, and the stator unit, the mover unit and the heating unit are installed in sequence from top to bottom; the gas pipeline unit passes through the stator unit, the mover unit and the heating unit in sequence to adsorb or release elements at the bottom of the heating unit.

[0007] In an optional embodiment, the pressure acquisition unit includes: a pressure sensor; a first mounting hole is opened on the pressure sensor so that the pressure sensor can be mounted on the stator unit; the pressure sensor is electrically connected to the placement machine control system to collect corresponding pressure data.

[0008] In an optional embodiment, the stator unit includes: a stator adapter and a motor stator; the top of the stator adapter extends into the first mounting hole and is connected to the pressure sensor; the top of the motor stator is connected to the bottom of the stator adapter, and the bottom of the motor stator is connected to the mover unit.

[0009] In an optional embodiment, the stator unit further includes: a slip ring; a limiting cavity is provided in the stator adapter, the slip ring is located in the limiting cavity, and the bottom of the slip ring extends into the motor stator.

[0010] In an optional embodiment, the mover unit includes: a motor mover; the motor mover is connected to the motor stator through a motor shaft.

[0011] In an optional embodiment, the heating unit includes: a heating block; the heating block is connected to the motor mover, and the heating block is electrically connected to the slip ring.

[0012] In an optional embodiment, at least one adsorption port is provided at the bottom of the heating block, and each of the adsorption ports is connected to a gas pipeline unit.

[0013] In an optional embodiment, the gas pipeline unit includes: a ventilation pipe; the ventilation pipe passes through the stator adapter, the slip ring, the motor stator, the motor mover, and the heating block in sequence, and the ventilation pipe is connected to each adsorption port.

[0014] In an optional embodiment, the gas pipeline unit further includes: a trachea rotary joint; the trachea rotary joint is embedded in the top of the heating block, and the ventilation pipe is connected to the trachea rotary joint.

[0015] On the other hand, an embodiment of the present disclosure provides a chip placement machine, which includes: a machine platform and at least one thermal placement head for the chip placement machine as described above; wherein each of the thermal placement heads for the chip placement machine is installed on the machine platform respectively.

[0016] The beneficial effect of the present invention is that the pressure acquisition unit is mounted on the stator unit, so that the pressure value of the thermal patch can be directly and accurately measured. At the same time, the gas pipeline unit passes through the stator unit, the mover unit, and the heating unit, and the structure is more compact, meeting the requirements of dustproof and waterproof. In addition, the heating unit is installed at the bottom of the mover unit to realize the function of the heating patch.

[0017] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A structural diagram of a thermal bonding head for a chip mounter provided in an embodiment of the present disclosure;

[0021] Figure 2 A cross-sectional view of a thermal bonding head for a chip mounter provided in an embodiment of the present disclosure;

[0022] Figure 3 A block diagram of the principle of a thermal bonding head for a chip mounter provided in an embodiment of the present disclosure;

[0023] Figure 4 A schematic diagram of a chip placement machine provided in an embodiment of the present disclosure.

[0024] In the picture:

[0025] 1. Pressure acquisition unit; 11. Pressure sensor; 111. First mounting hole;

[0026] 2. Stator unit; 21. Stator adapter; 211. Limiting cavity; 22. Motor stator; 23. Slip ring;

[0027] 3. Mover unit; 31. Motor mover;

[0028] 4. Heating unit; 41. Heating block; 411. Adsorption port;

[0029] 5. Gas pipeline unit; 51. Ventilation pipe; 52. Gas pipe rotary joint;

[0030] 6. Machine. DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0032] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of components may be exaggerated or reduced in order to effectively describe technical content.

[0033] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0035] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0036] like Figures 1 to 3 At least one embodiment provides a thermal bonding head for a chip placement machine, which includes: a pressure acquisition unit 1, a stator unit 2, a mover unit 3, a heating unit 4 and a gas pipeline unit 5; wherein the pressure acquisition unit 1 is mounted on the outside of the stator unit 2, and the stator unit 2, the mover unit 3, and the heating unit 4 are installed in sequence from top to bottom; the gas pipeline unit 5 passes through the stator unit 2, the mover unit 3, and the heating unit 4 in sequence to adsorb or release components at the bottom of the heating unit 4.

[0037] In at least one embodiment, by mounting the pressure acquisition unit 1 on the stator unit 2, the pressure value of the thermal patch can be directly and accurately measured. At the same time, the gas pipeline unit 5 passes through the stator unit 2, the mover unit 3, and the heating unit 4. The structure is more compact and meets the requirements of dustproof and waterproof. The heating unit 4 is installed at the bottom of the mover unit 3 to realize the function of the heating patch.

[0038] In at least one embodiment, the pressure acquisition unit 1 includes: a pressure sensor 11; a first mounting hole 111 is opened on the pressure sensor 11 so that the pressure sensor 11 can be mounted on the stator unit 2; the pressure sensor 11 is electrically connected to the placement machine control system to collect corresponding pressure data.

[0039] Specifically, the pressure sensor 11 can directly collect the pressure value of the thermal bonding head and send the pressure value to the placement machine control system to accurately measure the pressure value of the thermal bonding head.

[0040] Specifically, the pressure sensor 11 may adopt an hx711 pressure sensing chip.

[0041] In at least one embodiment, the stator unit 2 includes: a stator adapter 21 and a motor stator 22; the top of the stator adapter 21 extends into the first mounting hole 111 and is connected to the pressure sensor 11; the top of the motor stator 22 is connected to the bottom of the stator adapter 21, and the bottom of the motor stator 22 is connected to the mover unit 3.

[0042] Specifically, the stator adapter 21 and the pressure sensor 11 are connected via threads to achieve detachable fit, making assembly and disassembly easy.

[0043] Specifically, the stator adapter 21 serves to mount the motor stator 22 .

[0044] Specifically, the motor stator 22 is electrically connected to the placement machine control system.

[0045] In at least one embodiment, the stator unit 2 further includes: a slip ring 23; a limiting cavity 211 is defined in the stator adapter 21, the slip ring 23 is located in the limiting cavity 211, and the bottom of the slip ring 23 extends into the motor stator 22.

[0046] Specifically, the slip ring 23 is used to transmit power and control signals to the motor stator 22, thereby overcoming the problem of wire winding.

[0047] In at least one embodiment, the mover unit 3 includes: a motor mover 31; the motor mover 31 is connected to the motor stator 22 through a motor shaft.

[0048] Specifically, the motor stator 22 drives the motor mover 31 to rotate via the rotating shaft, and the motor mover 31 drives the heating unit 4 to rotate.

[0049] In at least one embodiment, the heating unit 4 includes: a heating block 41 ; the heating block 41 is connected to the motor mover 31 , and the heating block 41 is electrically connected to the slip ring 23 .

[0050] Specifically, the heating block 41 includes a block body and a heating circuit. The slip ring 23 can rotate synchronously with the heating block 41. At the same time, the slip ring 23 is connected to the heating block 41 through a wire to avoid the problem of wire entanglement.

[0051] In at least one embodiment, at least one adsorption port 411 is defined at the bottom of the heating block 41 , and each adsorption port 411 is connected to the gas pipeline unit 5 .

[0052] Specifically, by opening the adsorption port 411 on the heating block 41 and communicating the adsorption port 411 with the gas pipeline unit 5 , it is possible to adsorb or release the component at the bottom of the heating block 41 .

[0053] In at least one embodiment, the gas pipeline unit 5 includes: a vent pipe 51; the vent pipe 51 passes through the stator adapter 21, the slip ring 23, the motor stator 22, the motor mover 31, and the heating block 41 in sequence, and the vent pipe 51 is connected to each adsorption port 411.

[0054] Specifically, the vent pipe 51 is connected to an external air pump to realize a negative pressure adsorption element or a positive pressure release element.

[0055] In at least one embodiment, the gas pipeline unit 5 further includes: a gas pipe rotating joint 52 ; the gas pipe rotating joint 52 is embedded in the top of the heating block 41 , and the ventilation pipe 51 is connected to the gas pipe rotating joint 52 .

[0056] Specifically, by connecting the air pipe via the air pipe rotating joint 52 , the heat attaching head can be rotated multiple times without the air pipe being entangled.

[0057] like Figures 1 to 4 In at least one embodiment, a chip placement machine is provided, which includes: a machine platform 6 and at least one thermal placement head for the chip placement machine as described above; wherein each of the thermal placement heads for the chip placement machine is respectively installed on the machine platform 6.

[0058] To sum up, the utility model can directly and accurately measure the pressure value of the thermal patch by mounting the pressure acquisition unit on the stator unit. At the same time, the gas pipeline unit passes through the stator unit, the mover unit, and the heating unit, and the structure is more compact, meeting the requirements of dustproof and waterproof. A heating unit is installed at the bottom of the mover unit to realize the function of the heating patch.

[0059] In the description of the embodiments of the present invention, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0060] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used herein unless expressly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0061] Spatially relative terms, such as "inside," "outside," "below," "beneath," "down," "above," "on," etc., may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms may be intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as being "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0062] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A thermal mounting head for a chip mounter, characterized in that: include: A pressure collection unit (1), a stator unit (2), a mover unit (3), a heating unit (4) and a gas pipeline unit (5); wherein The pressure collection unit (1) is sleeved on the outside of the stator unit (2), and the stator unit (2), the mover unit (3), and the heating unit (4) are installed in sequence from top to bottom; The gas pipeline unit (5) passes through the stator unit (2), the mover unit (3), and the heating unit (4) in sequence to adsorb or release the element at the bottom of the heating unit (4).

2. The thermal bonding head for a chip mounter according to claim 1, wherein: The pressure acquisition unit (1) comprises: a pressure sensor (11); The pressure sensor (11) is provided with a first mounting hole (111) so that the pressure sensor (11) can be mounted on the stator unit (2); The pressure sensor (11) is electrically connected to the chip placement machine control system to collect corresponding pressure data.

3. The thermal bonding head for a chip mounter according to claim 2, wherein: The stator unit (2) comprises: a stator adapter (21) and a motor stator (22); The top of the stator adapter (21) extends into the first mounting hole (111) and is connected to the pressure sensor (11); The top of the motor stator (22) is connected to the bottom of the stator adapter (21), and the bottom of the motor stator (22) is connected to the mover unit (3).

4. The thermal bonding head for a chip mounter according to claim 3, wherein: The stator unit (2) further comprises: a slip ring (23); A limiting cavity (211) is provided in the stator adapter (21), the slip ring (23) is located in the limiting cavity (211), and the bottom of the slip ring (23) extends into the motor stator (22).

5. The thermal bonding head for a chip mounter according to claim 4, wherein: The mover unit (3) comprises: a motor mover (31); The motor mover (31) is connected to the motor stator (22) via a motor shaft.

6. The thermal bonding head for a chip mounter according to claim 5, characterized in that: The heating unit (4) comprises: a heating block (41); The heating block (41) is connected to the motor mover (31), and the heating block (41) is electrically connected to the slip ring (23).

7. The thermal bonding head for a chip mounter according to claim 6, wherein: At least one adsorption port (411) is provided at the bottom of the heating block (41), and each adsorption port (411) is in communication with a gas pipeline unit (5).

8. The thermal bonding head for a chip mounter according to claim 7, wherein: The gas pipeline unit (5) comprises: a vent pipe (51); The vent pipe (51) passes through the stator adapter (21), the slip ring (23), the motor stator (22), the motor mover (31), and the heating block (41) in sequence, and the vent pipe (51) is communicated with each adsorption port (411).

9. The thermal bonding head for a chip mounter according to claim 8, wherein: The gas pipeline unit (5) further comprises: a gas pipe rotary joint (52); The trachea rotating joint (52) is embedded in the top of the heating block (41), and the vent pipe (51) is connected to the trachea rotating joint (52).

10. A chip mounter, characterized in that: include: A machine table (6) and at least one thermal bonding head for a chip bonding machine according to any one of claims 1 to 9; in The thermal bonding heads of the chip mounters are respectively mounted on the machine platform (6).

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