Auxiliary operation table for grinding machine

Through the design of an auxiliary operating table for the grinder, the U-shaped dust removal plate and a small vacuum cleaner are used to pre-clean the wafer surface, which solves the problem that the cleanliness of the wafer surface affects the grinding effect and improves the cleaning ability of the grinding table.

CN223419233UActive Publication Date: 2025-10-10JIYUAN CRYSTAL PHOTOELECTRIC FREQUENCY TECH CO LTD
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Patent Information

Application Number
CN202422752290.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-11
Publication Date
2025-10-10
Estimated Expiration
2034-11-11

AI Technical Summary

Technical Problem

In wafer processing, there is a lack of an operating table to effectively clean the wafer surface before grinding, resulting in surface cleanliness affecting the grinding effect.

Method used

An auxiliary operating table for a grinding machine is designed, which includes a grinding operating table, a wafer clamping bracket, a U-shaped dust removal plate and a small vacuum cleaner. The wafer surface is pre-cleaned through the dust suction port and a soft brush to ensure the surface is clean.

Benefits of technology

It effectively cleans the wafer surface, prevents dust and impurities from affecting the grinding effect, and improves the practicality of the grinding table.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an auxiliary operating platform for a grinding machine, which relates to the field of grinding, and comprises a grinding operating platform and a wafer clamping support, the wafer clamping support is fixed on the upper surface of the grinding operating platform through a fastening bolt, the upper surface of the grinding operating platform is connected with a sliding block through a limiting sliding groove, the upper end of the sliding block is welded with a fixed seat, and the fixed seat is connected with the wafer clamping support. A U-shaped dust removal plate is supported at the upper end of the fixing seat, the upper end and the lower end of the U-shaped dust removal plate are connected with a small dust collector through dust collection pipelines, a first dust collection opening and a second dust collection opening are symmetrically formed in the end face of the inner side of the U-shaped dust removal plate, and banister brushes are bonded to the middle of the first dust collection opening and the middle of the second dust collection opening. The utility model solves the problems that the cleanliness of the surface of the wafer directly affects the grinding effect, and an operation table for cleaning the surface of the wafer before grinding is lacked.
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Description

Technical Field

[0001] The utility model relates to the technical field of grinding, in particular to an auxiliary operating table for a grinding machine. Background Art

[0002] In chip processing, grinding is a very critical link, which is mainly used to remove surface defects and make the surface smoother. However, the cleanliness of the chip surface directly affects the grinding effect. There is a lack of an operating table to clean the chip surface before grinding. Utility Model Content

[0003] In order to overcome the defects of the existing technology, an auxiliary operating table for a grinder is now provided to solve the problem that the cleanliness of the wafer surface directly affects the grinding effect and there is a lack of an operating table to clean the wafer surface before grinding.

[0004] To achieve the above object, an auxiliary operating table for a grinding machine is provided, comprising: a grinding operating table and a wafer clamping bracket, wherein the wafer clamping bracket is fixed to the upper surface of the grinding operating table by fastening bolts.

[0005] The upper surface of the grinding operating table is connected to a slider through a limiting slide groove, the upper end of the slider is welded with a fixed seat, the upper end of the fixed seat supports a U-shaped dust removal plate, the upper and lower ends of the U-shaped dust removal plate are connected to a small vacuum cleaner through a dust suction pipe, and the inner end surface of the U-shaped dust removal plate is symmetrically provided with a first dust suction port and a second dust suction port, and soft brushes are glued to the middle of the first dust suction port and the second dust suction port.

[0006] Furthermore, a counterweight base pad is fixed on the lower surface of the grinding operating table, and a strip-shaped limiting sliding groove is provided on the upper surface of the grinding operating table.

[0007] Furthermore, a fixing hole is opened on the front side of the limiting slide; and a fastening bolt is connected in the fixing hole, and a tool frame is welded on the right side of the grinding operating table.

[0008] Furthermore, a diameter display screen is installed on the upper end of the wafer clamping bracket, and a small ultrasonic cleaner is bonded to the left edge surface of the grinding operating table.

[0009] Furthermore, a handle is welded on the upper surface of the U-shaped dust removal plate, a negative pressure chamber is provided inside the upper and lower ends of the U-shaped dust removal plate, and a small vacuum cleaner is provided at the rear end of the U-shaped dust removal plate.

[0010] Furthermore, the lower end of the small vacuum cleaner is clamped on the surface of the fixing seat, and the dust suction pipe is respectively connected to the first dust suction port and the second dust suction port through the negative pressure chamber.

[0011] The beneficial effect of the present invention is that the auxiliary operating table for the grinding machine of the present invention utilizes a U-shaped dust removal plate and a small vacuum cleaner to form a pre-cleaning structure for wafer grinding, and the wafer is clamped and positioned by the wafer clamping bracket on the grinding operating table, so that the inner dust suction port and the soft brush of the reciprocating U-shaped dust removal plate can suck dust and lightly sweep the upper and lower surfaces of the wafer, so that the auxiliary operating table for grinding has a dust cleaning function, ensuring that the surface of the wafer is clean before grinding, avoiding dust and impurities from affecting the grinding effect of the grinder, and improving the practicality of the grinding operating table. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a front structural schematic diagram of an auxiliary operating table for a grinding machine according to an embodiment of the present utility model.

[0013] Figure 2 This is a schematic front cross-sectional structural diagram of an auxiliary operating table for a grinding machine according to an embodiment of the present utility model.

[0014] Figure 3 This is a schematic top view of the auxiliary operating table for a grinding machine according to an embodiment of the present utility model.

[0015] In the figure: 1. Grinding table; 11. Counterweight base pad; 12. Limiting slide; 13. Tool frame; 14. Fixing hole; 2. Small ultrasonic cleaner; 3. Wafer clamping bracket; 31. Diameter display screen; 32. Fastening bolt; 4. U-shaped dust removal plate; 41. Soft brush; 42. Handle; 43. Negative pressure chamber; 44. First dust suction port; 45. Second dust suction port; 46. Slider; 47. Fixed seat; 5. Small vacuum cleaner; 51. Dust suction duct. DETAILED DESCRIPTION

[0016] Reference Figures 1 to 3 As shown, the utility model provides an auxiliary operating table for a grinding machine, comprising: a grinding operating table 1 and a wafer clamping bracket 3. The wafer clamping bracket 3 is fixed to the upper surface of the grinding operating table 1 by fastening bolts 32.

[0017] The upper surface of the grinding operating table 1 is connected to a slider 46 through a limiting slide groove 12, and a fixed seat 47 is welded to the upper end of the slider 46. The upper end of the fixed seat 47 supports a U-shaped dust removal plate 4, and the upper and lower ends of the U-shaped dust removal plate 4 are connected to a small vacuum cleaner 5 through a dust suction pipe 51. The inner end surface of the U-shaped dust removal plate 4 is symmetrically provided with a first dust suction port 44 and a second dust suction port 45, and a soft brush 41 is glued to the middle of the first dust suction port 44 and the second dust suction port 45.

[0018] First, clamp and fix the wafer to be ground with the wafer clamping bracket 3, turn on the small vacuum cleaner 5, manually pull the U-shaped dust removal plate 4 to move left and right, so that when the U-shaped dust removal plate 4 moves to the wafer, the first dust suction port 44 and the second dust suction port 45 vacuum the upper and lower surfaces of the wafer, and at the same time, the soft brush 41 gently cleans the wafer surface. After cleaning is completed, remove the wafer and place it on the grinder for grinding.

[0019] In this embodiment, a counterweight pad 11 is fixed to the lower surface of the grinding table 1, and a strip-shaped limiting slot 12 is provided on the upper surface of the grinding table 1. A fixing hole 14 is provided in front of the limiting slot 12, and a fastening bolt 32 is connected to the fixing hole 14. A tool frame 13 is welded to the right side of the grinding table 1.

[0020] As a preferred embodiment, a counterweight base pad 1 ensures the stable placement of the grinding table 1. Multiple sets of fixing holes 14 are provided on the surface of the grinding table 1, making it easy to select the appropriate hole position to fix the wafer clamping bracket 3. A tool box 13 can be used to store tools such as tweezers used for wafer grinding.

[0021] In this embodiment, a diameter display screen 31 is installed on the upper end of the wafer holding bracket 3, and a small ultrasonic cleaner 2 is bonded to the left edge surface of the grinding operating table 1.

[0022] As a preferred embodiment, diameter display 31 conveniently displays the diameter of the wafer held by wafer holder 3. Wafer holder 3 is a conventional wafer holding fixture, and again, no further details are provided. Small ultrasonic cleaner 2 conveniently cleans stubborn stains adhering to the wafer surface and can also clean polished wafers to remove polishing debris from the wafer surface.

[0023] In this embodiment, a handle 42 is welded to the upper surface of the U-shaped dust removal plate 4. Negative pressure chambers 43 are provided within the upper and lower ends of the U-shaped dust removal plate 4. A small vacuum cleaner 5 is provided at each rear end of the U-shaped dust removal plate 4. The lower end of the small vacuum cleaner 5 is clamped to the surface of a fixing seat 47. A dust collection duct 51 is connected to a first dust collection port 44 and a second dust collection port 45 through the negative pressure chamber 43.

[0024] As a preferred embodiment, the handle 42 facilitates pulling the U-shaped dust removal plate 4 to move left and right. The small vacuum cleaner 5 vacuums the upper and lower surfaces of the wafer clamped by the first and second dust suction ports 44, 45 through the first and second dust suction ports 44, 45, to ensure that the wafer surface is clean before grinding and prevent dust and impurities from affecting the grinding effect of the grinder.

[0025] The auxiliary operating table for the grinding machine of the present invention can effectively solve the problem that the cleanliness of the wafer surface directly affects the grinding effect, and there is a lack of an operating table to clean the wafer surface before grinding. The auxiliary operating table for grinding is convenient to have a dust cleaning function, which ensures the cleanliness of the wafer surface before grinding, avoids dust and impurities from affecting the grinding effect of the grinder, improves the practicality of the grinding operating table, and is suitable for the auxiliary operating table for grinding machines.

Claims

1. An auxiliary operating table for a grinding machine, comprising: A grinding operation table (1) and a wafer clamping bracket (3), wherein the wafer clamping bracket (3) is fixed to the upper surface of the grinding operation table (1) by fastening bolts (32), and is characterized in that: The upper surface of the grinding operation table (1) is connected to a slider (46) through a limiting slide groove (12), the upper end of the slider (46) is welded with a fixed seat (47), the upper end of the fixed seat (47) supports a U-shaped dust removal plate (4), the upper and lower ends of the U-shaped dust removal plate (4) are connected to a small dust collector (5) through a dust collection pipe (51), and the inner end surface of the U-shaped dust removal plate (4) is symmetrically provided with a first dust collection port (44) and a second dust collection port (45), and the middle parts of the first dust collection port (44) and the second dust collection port (45) are both bonded with soft brushes (41).

2. The auxiliary operating table for a grinding machine according to claim 1, characterized in that: A counterweight base pad (11) is fixed on the lower surface of the grinding operation table (1), and a strip-shaped limiting sliding groove (12) is opened on the upper surface of the grinding operation table (1).

3. The auxiliary operating table for a grinding machine according to claim 1, characterized in that: A fixing hole (14) is provided on the front side of the limiting slide groove (12); a fastening bolt (32) is connected in the fixing hole (14); and a tool frame (13) is welded on the right side of the grinding operating table (1).

4. The auxiliary operating table for a grinding machine according to claim 1, characterized in that: A diameter display screen (31) is installed on the upper end of the wafer clamping bracket (3), and a small ultrasonic cleaning device (2) is bonded to the left edge surface of the grinding operation table (1).

5. The auxiliary operating table for a grinding machine according to claim 1, characterized in that: A handle (42) is welded on the upper surface of the U-shaped dust removal plate (4), negative pressure chambers (43) are provided inside the upper and lower ends of the U-shaped dust removal plate (4), and small vacuum cleaners (5) are respectively provided at the rear ends of the U-shaped dust removal plate (4).

6. The auxiliary operating table for a grinding machine according to claim 5, characterized in that: The lower end of the small vacuum cleaner (5) is clamped on the surface of the fixing seat (47), and the dust suction pipe (51) is respectively connected to the first dust suction port (44) and the second dust suction port (45) through the negative pressure chamber (43).