Soldering paste quantitative conveying device

Abstract

The utility model relates to the field of soldering paste spraying, and discloses a soldering paste quantitative conveying device which comprises a shell, an electric push rod is installed on the front surface of the shell, a moving block is slidably connected to the inner wall of the shell, an extrusion block is rotatably connected to the inner wall of the moving block, and a sliding plate is slidably connected to the inner wall of the moving block. The inner wall of the moving block is slidably connected with an extrusion plate, the sliding plate is elastically connected with the extrusion plate through a spring, the top of the moving block is provided with a photoelectric sensor, the right end of the shell is fixedly connected with a fixed block, and the inner wall of the fixed block is fixedly connected with a soldering paste barrel. According to the device, by arranging the moving block and the extrusion plate, soldering paste can be quantitatively subpackaged and conveyed, the precision and consistency of spraying soldering paste points are guaranteed, meanwhile, the photoelectric sensor and the extrusion block can detect whether the soldering paste which is quantitatively subpackaged is full or not, the accuracy of quantitative conveying is guaranteed, and the using effect of the device is further improved.

Description

Technical Field

[0001] The utility model relates to the field of solder paste spraying, in particular to a solder paste quantitative conveying device. Background Art

[0002] As microelectronic components continue to evolve toward miniaturization, precision, and integration, surface mount technology (SMT) demands higher levels of integration, reliability, and precision. Solder paste dispensing, the first step in SMT, directly impacts the reliability of microelectronic components. Currently, solder paste dispensing technologies can be categorized as printing, dripping, and inkjet printing.

[0003] Solder paste printing, as a non-contact solder paste dispensing method, is gradually being adopted by more and more manufacturers due to its advantages such as good dispensing consistency, high dispensing accuracy and high efficiency.

[0004] In the existing technology, solder paste printing usually adopts non-contact impact of a needle to achieve spraying. Therefore, it is necessary to strictly control the amount of solder paste delivered to the area to be sprayed before each spraying to ensure the accuracy and consistency of the sprayed solder paste points. At the same time, since the solder paste is sprayed by non-contact impact, manual addition is required after the solder paste inside the spray cylinder is used up. Therefore, a solder paste quantitative delivery device is proposed to solve the above problems. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a solder paste quantitative delivery device, which aims to improve the problem in the existing technology that "the amount of solder paste delivered to the area to be sprayed before each spraying cannot be accurately controlled, and manual addition is required after the solder paste inside the spray tube is used up."

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a solder paste quantitative conveying device, comprising a shell, an electric push rod is installed on the front surface of the shell, the inner wall of the shell is slidably connected to a moving block, the inner wall of the moving block is rotatably connected to an extrusion block, the inner wall of the moving block is slidably connected to a sliding plate, the inner wall of the moving block is slidably connected to an extrusion plate, the sliding plate and the extrusion plate are elastically connected by a spring, a photoelectric sensor is installed on the top of the moving block, the right end of the shell is fixedly connected to a fixed block, the inner wall of the fixed block is fixedly connected to a solder paste bucket, and the lower surface of the shell is fixedly connected to a nozzle.

[0007] As a further description of the above technical solution:

[0008] The output shaft of the electric push rod is fixedly connected to the front surface of the moving block, and the solder paste barrel is fixedly connected to the shell through a delivery tube, one end of the delivery tube is fixedly connected to the bottom of the solder paste barrel, and the other end of the delivery tube is fixedly connected to the outer wall of the shell.

[0009] As a further description of the above technical solutions:

[0010] The left end of the moving block is provided with a feeding hole, and the inner wall lower surface of the moving block is provided with a discharging hole.

[0011] As a further description of the above technical solutions:

[0012] One end of the spring is fixedly connected to the lower surface of the sliding plate, and the other end of the spring is fixedly connected to the upper surface of the extrusion plate.

[0013] As a further description of the above technical solutions:

[0014] The rear surface of the moving block is fixedly connected with a shielding plate, and the shielding plate is slidingly connected to the inner wall of the shell.

[0015] As a further description of the above technical solutions:

[0016] The shape of the extrusion block is set to be a fan shape.

[0017] As a further description of the above technical solutions:

[0018] The shape of the moving block is set to be a trapezoidal shape.

[0019] As a further description of the above technical solutions:

[0020] The shape of the extrusion plate is set to be an L shape, and the lower surface of the extrusion plate is provided with a groove.

[0021] The utility model has the advantages of the following beneficial effects:

[0022] 1、The utility model discloses a device for quantitative packaging and conveying solder paste, which comprises a shell, a moving block, an extrusion plate, a light and electricity inductor, a spring, a shielding plate and a conveying pipe.

[0023] 2、The utility model discloses a device for quantitative packaging and conveying solder paste, which comprises a shell, a moving block, an extrusion plate, a light and electricity inductor, a spring, a shielding plate and a conveying pipe. DRAWINGS

[0024] Figure 1 It is the three-dimensional structure schematic diagram of the whole device in the utility model;

[0025] Figure 2 It is the three-dimensional structure section schematic diagram of the whole device in the utility model;

[0026] Figure 3 This is a schematic cross-sectional view of the three-dimensional structure of the moving block in the present utility model;

[0027] Figure 4 It is a partial cross-sectional schematic diagram of the three-dimensional structure of the moving block in the utility model.

[0028] Legend:

[0029] 1. Housing; 2. Electric push rod; 3. Fixed block; 4. Solder paste bucket; 5. Delivery pipe; 6. Moving block; 7. Extrusion block; 8. Photoelectric sensor; 9. Sliding plate; 10. Spring; 11. Extrusion plate; 12. Feed hole; 13. Discharge hole; 14. Shielding plate; 15. Nozzle. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Reference Figure 1 - Figure 3 The utility model provides an embodiment of a solder paste quantitative delivery device, comprising a shell 1 for mounting other components, an electric push rod 2 mounted on the front surface of the shell 1, the electric push rod 2 being used to control the movement of a moving block 6, the inner wall of the shell 1 being slidably connected to a moving block 6 for mounting other components, the inner wall of the moving block 6 being rotatably connected to an extrusion block 7 for pushing a sliding plate 9, the inner wall of the moving block 6 being slidably connected to a sliding plate 9 for squeezing a spring 10, the inner wall of the moving block 6 being slidably connected to an extrusion block 7 for squeezing out the solder paste The pressure plate 11, the sliding plate 9 and the extrusion plate 11 are elastically connected by a spring 10. The spring 10 provides elastic force for the extrusion plate 11 to extrude the solder paste. A photoelectric sensor 8 is installed on the top of the moving block 6. The photoelectric sensor 8 can detect the position of the extrusion block 7 to determine whether the solder paste is full. The right end of the shell 1 is fixedly connected to a fixed block 3 for fixing the solder paste barrel 4. The inner wall of the fixed block 3 is fixedly connected to the solder paste barrel 4 for storing solder paste. The lower surface of the shell 1 is fixedly connected to a nozzle 15 for spraying solder paste.

[0032] Reference Figure 1 、 Figure 2The output shaft of the electric push rod 2 is fixedly connected to the front surface of the moving block 6. The electric push rod 2 provides power for the movement of the moving block 6. The solder paste barrel 4 is fixedly connected to the shell 1 through the delivery pipe 5. The delivery pipe 5 delivers the solder paste from the inside of the solder paste barrel 4 to the inside of the moving block 6. One end of the delivery pipe 5 is fixedly connected to the bottom of the solder paste barrel 4, and the other end of the delivery pipe 5 is fixedly connected to the outer wall of the shell 1. The delivery pipe 5 delivers the solder paste into the inside of the moving block 6 through the feed hole 12.

[0033] Reference Figure 3 、 Figure 4 The left end of the moving block 6 is provided with a feed hole 12 for feeding the solder paste into the interior of the moving block 6, and the lower surface of the inner wall of the moving block 6 is provided with a discharge hole 13 for feeding the solder paste into the nozzle 15. One end of the spring 10 is fixedly connected to the lower surface of the sliding plate 9, and the other end of the spring 10 is fixedly connected to the upper surface of the extrusion plate 11. The rear surface of the moving block 6 is fixedly connected with a shielding plate 14 for preventing the solder paste from entering the interior of the housing 1. The shielding plate 14 is slidably connected to the inner wall of the housing 1. The shielding plate 14 will block the delivery pipe when the moving block 6 moves. 5 conveys solder paste, the shape of the extrusion block 7 is set to be fan-shaped, and when being squeezed, it will rotate and retract into the interior of the moving block 6. The shape of the moving block 6 is set to be trapezoidal and fits with the inner wall of the shell 1. The shape of the extrusion plate 11 is set to be L-shaped, which can prevent the feed hole 12 from feeding the solder paste to the upper surface of the extrusion plate 11 when the extrusion plate 11 moves to the bottom. The lower surface of the extrusion plate 11 is provided with a groove, and the groove provided on the extrusion plate 11 can convey the solder paste to the space formed by the extrusion plate 11 and the moving block 6 when the extrusion plate 11 moves to the bottom.

[0034] Working principle: When in use, fill the solder paste barrel 4 with solder paste, use an inflation or extrusion device to allow the solder paste barrel 4 to maintain a certain pressure on the solder paste and enter the moving block 6. The solder paste enters the moving block 6 through the delivery pipe 5 and the feed hole 12. The extrusion plate 11 uses the L-shaped shape and the groove on the lower surface to allow the solder paste to enter the space formed by the moving block 6 and the extrusion plate 11. When the solder paste fills the space, the extrusion block 7 will be detected by the photoelectric sensor 8. At this time, the electric push rod 2 is started, and the electric push rod 2 drives the moving block 6 to move, and the squeezing block 7 contacts the inner wall of the housing 1. When the moving block 6 moves to the rear surface of the inner wall of the housing 1, the squeezing block 7 is retracted into the moving block 6, and the squeezing block 7 presses the sliding plate 9. The sliding plate 9 compresses the spring 10, and the moving block 6 delivers the solder paste into the nozzle 15 through the discharge hole 13 opened at the bottom. The nozzle 15 sprays the solder paste. When it is necessary to stop, the electric push rod 2 is extended and retracted to stagger the discharge hole 13 and the nozzle 15. After the solder paste is used up, the above operation can be repeated.

[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A solder paste quantitative delivery device, comprising a housing (1), characterized in that: The front surface of the shell (1) is equipped with an electric push rod (2), the inner wall of the shell (1) is slidably connected to a moving block (6), the inner wall of the moving block (6) is rotatably connected to an extrusion block (7), the inner wall of the moving block (6) is slidably connected to a sliding plate (9), the inner wall of the moving block (6) is slidably connected to an extrusion plate (11), the sliding plate (9) and the extrusion plate (11) are elastically connected via a spring (10), a photoelectric sensor (8) is equipped on the top of the moving block (6), the right end of the shell (1) is fixedly connected to a fixed block (3), the inner wall of the fixed block (3) is fixedly connected to a solder paste bucket (4), and the lower surface of the shell (1) is fixedly connected to a nozzle (15).

2. The solder paste quantitative delivery device according to claim 1, characterized in that: The output shaft of the electric push rod (2) is fixedly connected to the front surface of the moving block (6), and the solder paste barrel (4) is fixedly connected to the shell (1) via a delivery pipe (5), one end of the delivery pipe (5) is fixedly connected to the bottom of the solder paste barrel (4), and the other end of the delivery pipe (5) is fixedly connected to the outer wall of the shell (1).

3. The solder paste quantitative delivery device according to claim 1, characterized in that: A feed hole (12) is provided at the left end of the moving block (6), and a discharge hole (13) is provided on the lower surface of the inner wall of the moving block (6).

4. The solder paste quantitative delivery device according to claim 1, characterized in that: One end of the spring (10) is fixedly connected to the lower surface of the sliding plate (9), and the other end of the spring (10) is fixedly connected to the upper surface of the extrusion plate (11).

5. The solder paste quantitative delivery device according to claim 1, characterized in that: A shielding plate (14) is fixedly connected to the rear surface of the moving block (6), and the shielding plate (14) is slidably connected to the inner wall of the housing (1).

6. The solder paste quantitative delivery device according to claim 1, characterized in that: The shape of the extrusion block (7) is set to be fan-shaped.

7. The solder paste quantitative delivery device according to claim 1, characterized in that: The shape of the moving block (6) is set to be trapezoidal.

8. The solder paste quantitative delivery device according to claim 1, characterized in that: The shape of the extrusion plate (11) is set to be L-shaped, and a groove is provided on the lower surface of the extrusion plate (11).

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