Process chamber and semiconductor process equipment

Abstract

The utility model discloses a process chamber and semiconductor process equipment, and relates to the field of semiconductors. The process chamber comprises a cavity, a bearing device, a lifting device, a limiting device, an adjusting device and a distance measuring device, the bearing device is arranged in the cavity, the lifting device is connected to the outer side of the cavity, and at least part of the bearing device extends out of the cavity and is connected with the lifting end of the lifting device; the limiting device comprises a limiting blocking piece and a first limiting piece, the limiting blocking piece is connected with the lifting end, and in the lifting direction, the first limiting piece is located on the side, close to the bearing device, of the limiting blocking piece; the adjusting device is connected to the outer side of the cavity, connected with the first limiting piece and used for driving the first limiting piece to move in the lifting direction; the distance measuring device is connected to the cavity and electrically connected with the lifting device and the adjusting device. The problems that in the prior art, the adjusting precision is low, the adjusting operation difficulty is high, and adjustment cannot be achieved without opening the cavity can be solved at least.

Description

Technical Field

[0001] The present application belongs to the field of semiconductors, and specifically relates to a process chamber and semiconductor process equipment. Background Art

[0002] With each technological advancement, dry cleaning equipment has increasingly stringent particle control requirements. Byproducts generated during the etching process can adhere to the susceptor's edges when cooled. As the number of wafers processed increases, excessive accumulation of byproducts on the susceptor surface can occur, leading to byproduct shedding and excessive particle levels within the chamber, impacting product yield. Therefore, a nozzle is required to bake off byproducts from the susceptor surface to achieve cleanliness, even at a certain wafer processing volume.

[0003] To remove process byproducts from the susceptor surface, the susceptor surface must be as close to the bottom surface of the showerhead as possible. The high temperature of the showerhead bottom surface bakes out the process byproducts, converting them from solid to gaseous, and then exhausting them through the chamber exhaust system. In actual processing, the distance between the susceptor surface and the bottom surface of the showerhead must be no more than 3mm.

[0004] In the related art, the oblong hole structure of the limit sensor is adjusted manually by opening a cavity. However, this adjustment method is cumbersome to operate and has low adjustment accuracy. There is a risk of collision between the base and the nozzle. Each time the chamber is opened, particles may be introduced, affecting the etching quality and reducing the product yield. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a process chamber and semiconductor process equipment that can at least solve the problems in the related art such as low adjustment accuracy, high difficulty in adjustment operation, and inability to adjust without opening the chamber.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] The embodiment of the present application provides a process chamber, comprising: a chamber, a carrying device, a lifting device, a limiting device, an adjusting device, and a distance measuring device;

[0008] The carrying device is disposed in the cavity, the lifting device is connected to the outside of the cavity, and the carrying device at least partially extends out of the cavity and is connected to the lifting end of the lifting device;

[0009] The limiting device includes a limiting stopper and a first limiting member, wherein the limiting stopper is connected to the lifting end, and in the lifting direction, the first limiting member is located on a side of the limiting stopper close to the carrying device;

[0010] The adjusting device is connected to the outside of the cavity, and the adjusting device is connected to the first limiting member, and is used to drive the first limiting member to move in the lifting direction;

[0011] The distance measuring device is connected to the cavity and is used to measure the distance between the distance measuring end of the distance measuring device and the end surface of the carrying device facing away from the carrying surface. The distance measuring device is electrically connected to the lifting device and the adjusting device respectively.

[0012] An embodiment of the present application also provides a semiconductor process equipment, including the above-mentioned process chamber.

[0013] In the embodiment of the present application, the distance between the distance measuring end and the end face of the carrying device facing away from the carrying face can be measured by a distance measuring device, and the position of the first limit member can be adjusted in the lifting direction by an adjustment device located outside the cavity. On this basis, when the above distance does not meet the process requirements, the limit stopper can be driven to move up and down by the lifting carrying device, so that the limit stopper can be limited by the first limit member. Based on the above settings, the embodiment of the present application can realize automatic detection of the distance without opening the cavity, and automatically adjust the first limit member to ensure its position accuracy, and the first limit member can ensure the limiting accuracy of the limit stopper, thereby ensuring the position accuracy of the carrying device when it is raised to the highest point, so as to prevent the first limit member from colliding due to incorrect position adjustment. At the same time, there is no need to open the cavity for adjustment, so as to effectively prevent the situation where particles enter the cavity due to particle contamination and affect the product yield, which is beneficial to the product process quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of an adjustment mechanism in the related art;

[0015] Figure 2 Schematic diagram of the structure of a limit sensor in the related art;

[0016] Figure 3 A schematic structural diagram of a process chamber disclosed in an embodiment of the present application;

[0017] Figure 4 This is a schematic structural diagram of the lifting device and the carrying device disclosed in the embodiment of the present application;

[0018] Figure 5 This is a schematic structural diagram of the regulating device disclosed in an embodiment of the present application;

[0019] Figure 6 A schematic structural diagram of a distance measuring device disclosed in an embodiment of the present application;

[0020] Figure 7 This is a partial schematic diagram of a cavity and a carrying device disclosed in an embodiment of the present application.

[0021] BRIEF DESCRIPTION OF DRAWINGS

[0022] 01-chamber; 02-nozzle; 031-carrier disc; 032-support shaft; 04-lifting mechanism; 05-flap; 06-upper limit sensor; 061-long circular hole; 07-lower limit sensor;

[0023] 100-cavity; 110-channel; 120-groove;

[0024] 200-carrier device; 210-base; 211-carrier surface; 220-connection column;

[0025] 300-lifting device; 310-second linear module; 320-lifting moving part;

[0026] 400-limiting device; 410-limiting stop; 420-first limiting part; 430-second limiting part;

[0027] 500-adjusting device; 510-first linear module; 511-first servo motor; 512-first screw rod; 513-first sliding block; 514-first sliding rail; 520-moving part; 530-connection plate;

[0028] 600-distance measuring device; 610-distance measuring sensor; 620-light transmitting element;

[0029] 710-first sealing part;

[0030] 800-air inlet device; 810-uniform flow plate; 820-nozzle. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0032] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0033] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0034] refer to Figure 1 and Figure 2 Related art proposes a process chamber in which a showerhead 02 is mounted on top of chamber 01. A carrier plate 031 is arranged within chamber 01 so that it can be raised and lowered. The carrier plate 031 extends out of chamber 01 via a support shaft 032 and is connected to a lifting mechanism 04. The lifting mechanism 04 drives carrier plate 031 up and down within chamber 01 via support shaft 032. After the process, to clean process byproducts from carrier plate 031, carrier plate 031 is raised to a position closer to showerhead 02. The high temperature of showerhead 02 allows the byproducts on carrier plate 031 to be baked, thereby cleaning carrier plate 031.

[0035] Furthermore, a baffle 05 is provided at the lifting end of the lifting mechanism 04. An upper limit sensor 06 is located above baffle 05, and a lower limit sensor 07 is located below baffle 05. Both upper and lower limit sensors 06 and 07 are mounted to the bottom of the chamber 01 via brackets. When the lifting mechanism 04 raises the carrier plate 031, the baffle 05 rises with it. When the baffle 05 touches the upper limit sensor 06, it triggers the upper limit sensor 06, causing the lifting mechanism 04 to stop. At this point, the distance between the upper surface of the carrier plate 031 and the lower surface of the nozzle 02 reaches its minimum.

[0036] However, because the distance between the upper surface of the carrier plate 031 and the lower surface of the nozzle 02 is relatively small (generally required to be no more than 3mm), and the required distance accuracy is high (generally ±0.2mm), the accuracy of the upper limit sensor 06's installation position cannot be guaranteed due to processing and assembly errors among various components. Therefore, when the upper limit sensor 06 is triggered by the baffle 05, it is necessary to open a cavity and use a tool such as a depth gauge to measure the distance (i.e., the Spacing value) between the upper surface of the carrier plate 031 and the lower surface of the nozzle 02 in this state. The position of the upper limit sensor 06 is then manually adjusted using the oblong hole 061 provided in the upper limit sensor 06. If the position does not meet the requirements, the upper limit sensor 06 is adjusted and the Spacing value is remeasured, repeating this cycle until the requirements are met. If the upper limit sensor 06 is not adjusted accurately enough, not only will the process requirements not be met, but there is also a risk of collision between the carrier plate 031 and the nozzle 02.

[0037] It can be seen that the above-mentioned measurement and adjustment methods are not only cumbersome to operate, but also have low adjustment accuracy, a risk of collision, and require repeated opening of the cavity.

[0038] Based on the above situation, the embodiment of the present application discloses a process chamber that can achieve high-precision and adaptive adjustment of Spacing without opening the chamber. Figures 3 to 7 The disclosed process chamber includes a cavity 100, a carrying device 200, a lifting device 300, a limiting device 400, an adjusting device 500 and a distance measuring device 600.

[0039] The cavity 100 is the basic installation component of the process chamber. It can provide an installation basis for the carrying device 200, the lifting device 300, the adjustment device 500 and the distance measuring device 600, and can also provide a sealed environment for the process; the carrying device 200 is used to carry the wafer and carry the wafer to be lifted and lowered in the cavity 100 to meet the process requirements.

[0040] In some embodiments, the carrier device 200 is disposed within the chamber 100, and the lifting device 300 is connected to the outside of the chamber 100. At least a portion of the carrier device 200 extends out of the chamber 100 and is connected to the lifting end of the lifting device 300. Based on this, under the driving action of the lifting device 300, the carrier device 200 can move in the chamber 100 along the lifting direction to change the position of the wafer in the chamber 100, thereby meeting the requirements for the wafer position under different working conditions. For example, at least a portion of the carrier device 200 extends from the bottom wall of the chamber 100 and is connected to the lifting end of the lifting device 300 located below the chamber 100.

[0041] The limiting device 400 includes a limiting stopper 410 and a first limiting member 420. Figure 3The limit stopper 410 is connected to the lifting end, so that when the lifting device 300 drives the carrying device 200 to move up and down through the lifting end, the limit stopper 410 can be lifted and lowered along with the lifting end, so that the limit stopper 410 and the carrying device 200 can be lifted and lowered synchronously, so that the lifting and lowering of the carrying device 200 can be limited by limiting the position of the limit stopper 410, thereby effectively preventing the carrying device 200 from being lifted or lowered excessively.

[0042] In the lifting direction, the first limit member 420 is located on the side of the limit block 410 close to the supporting device 200. In this way, the limit block 410 can be limited by the first limit member 420 to prevent the limit block 410 from exceeding the preset position when moving toward the side close to the supporting device 200, thereby effectively preventing the supporting device 200 from moving excessively and colliding with other components in the cavity 100.

[0043] Under actual working conditions, when the lifting direction is vertical, the first limit member 420 is located above the limit block 410, so as to limit the minimum distance between the supporting device 200 and the top structure of the cavity 100 by limiting the upward movement of the limit block 410, thereby effectively preventing the supporting device 200 from colliding with the top structure of the cavity 100.

[0044] Considering that in some cases, due to factors such as manufacturing and assembly errors, the positional accuracy of the first stopper 420 cannot be guaranteed, resulting in the carrier device 200 not reaching the preset position when the stopper 410 contacts the first stopper 420, thereby failing to meet process requirements. For example, if the carrier device 200 exceeds the highest position during its ascent, there is a risk of collision with the top structure of the chamber 100. If it falls below the highest position, the heating effect is affected, which is not conducive to the removal of process byproducts accumulated on the carrier device 200.

[0045] Based on the above situation, an adjustment device 500 is added to the embodiment of the present application. The adjustment device 500 is connected to the outside of the cavity 100 and is connected to the first limit member 420, and is used to drive the first limit member 420 to move in the lifting direction. In this way, the position accuracy of the first limit member 420 can be guaranteed by adjusting the position in the lifting direction.

[0046] To achieve distance measurement, the process chamber may further include a distance measuring device 600, such as Figure 3 As shown, the distance measuring device 600 is connected to the cavity 100 and is used to measure the distance between the distance measuring end of the distance measuring device 600 and the end surface of the carrying device 200 facing away from the carrying surface 211.

[0047] Specifically, the distance measuring device 600 can emit a signal into the cavity 100 through the distance measuring end, and make the signal hit the carrying device 200, so as to realize distance measurement. In addition, the carrying device 200 has a carrying surface 211 for carrying a wafer, and the signal emitted by the distance measuring end hits an end surface opposite to the carrying surface 211. Exemplarily, the distance measuring device 600 can be an infrared distance measuring device, and of course, can also be other types, which are not limited here.

[0048] In addition, the distance measuring device 600 is also electrically connected with the lifting device 300 and the adjusting device 500 respectively, so that the distance measuring device 600 can transmit a measured distance signal to the lifting device 300 and the adjusting device 500 respectively, so as to make the lifting device 300 and the adjusting device 500 make adaptive adjustment respectively according to the measured distance signal.

[0049] In the embodiment of the application, the distance measuring device 600 can measure the distance between the distance measuring end and the end surface of the carrying device 200 away from the carrying surface 211, the adjusting device 500 located outside the cavity 100 can adjust the position of the first limiting piece 420 in the lifting direction, and on this basis, when the above distance does not meet the process requirement, the carrying device 200 can be lifted to drive the limiting stop piece 410 to move up and down, so as to limit the limiting stop piece 410 by the first limiting piece 420. Based on the above setting, the embodiment of the application can realize automatic detection of the distance without opening the cavity, and automatically adjust the first limiting piece 420 to ensure its position accuracy, and the first limiting piece 420 can ensure the limiting accuracy of the limiting stop piece 410, so as to ensure the lifting accuracy of the carrying device 200, so as to prevent the situation that the carrying device 200 has low lifting accuracy and is easy to collide. At the same time, there is no need to open the cavity for adjustment, so as to effectively prevent the situation that the opening of the cavity causes particles to enter and cause particle pollution, which affects the product yield, which is beneficial to the product process quality.

[0050] Reference Figure 5 In some embodiments, the adjusting device 500 can include a first linear module 510 and a moving piece 520. The moving piece 520 is connected to the first linear module 510, and the first limiting piece 420 is connected to the moving piece 520. Thus, the first linear module 510 can drive the moving piece 520 to move in the lifting direction, and the moving piece 520 can drive the first limiting piece 420 to lift, so as to change the position of the first limiting piece 420 in the lifting direction, to change the limiting position of the limiting stop piece 410, and then the final position of the carrying device 200 can be changed accordingly, so that the distance between the carrying device 200 and the top structure of the cavity 100 (such as the air inlet device 800) reaches the distance that meets the process requirement (such as the requirement of cleaning process by-products).

[0051] Exemplarily, the moving piece 520 can be a plate piece; in addition, the first limiting piece 420 can be fixed to the moving piece 520 by using a fastener to ensure the firmness of the first limiting piece 420, thereby ensuring the position accuracy of the first limiting piece 420.

[0052] With reference to the foregoing Figure 5 In some embodiments, the first linear module 510 can include a first servo motor 511, a first screw rod 512, a first sliding block 513, and a first sliding rail 514 extending in the lifting direction. The first screw rod 512 is in transmission connection with the output shaft of the first servo motor 511, the first sliding block 513 is in threaded connection with the first screw rod 512, and the first sliding block 513 is in sliding connection with the first sliding rail 514. The moving piece 520 is connected with the first sliding block 513.

[0053] Based on the foregoing arrangement, the first servo motor 511 can drive the first screw rod 512 to rotate, and the rotation of the first screw rod 512 can drive the first sliding block 513 to move in the lifting direction. At the same time, the first sliding rail 514 can guide the first sliding block 513 to ensure the movement accuracy of the first sliding block 513 and ensure that the first sliding block 513 moves in the lifting direction without tilting. In the embodiments of the present application, the mechanical accuracy of the first sliding rail 514 can reach the micron level, which can be beneficial to improve the high-precision adjustment of the first limiting piece 420.

[0054] In other embodiments, the first linear module 510 can also be a pneumatic cylinder, a hydraulic cylinder, etc.

[0055] In addition, the first servo motor 511 and the first screw rod 512 can also be in transmission connection through a shaft coupling.

[0056] In order to connect the adjustment device 500 to the outside of the cavity 100, the adjustment device 500 can further include a connecting plate 530 fixed to the outer wall of the cavity 100, and the first linear module 510 is fixed to the connecting plate 530.

[0057] In the embodiments of the present application, the first limiting piece 420 is used to limit the upper position of the limiting piece 410, and in order to limit the lower position of the first limiting piece 410, the limiting device 400 can further include a second limiting piece 430 as shown in Figure 3 and Figure 5 Considering that the distance between the bearing device 200 and the air inlet device 800 is the largest when the bearing device 200 is lowered to the lowest position, and there is no risk of collision, the second limiting piece 430 can be fixed in the embodiments of the present application. Exemplarily, the second limiting piece 430 can be fixed to the connecting plate to ensure that it is fixed.

[0058] With reference to the foregoing Figure 3In some embodiments, an air intake device 800 may be provided at the top of the chamber 100. During the ascent of the carrier 200, it is necessary to maintain an appropriate distance between the upper surface of the carrier 200 (i.e., the carrying surface 211) and the lower surface of the air intake device 800. Excessive distance will affect the heating effect of the air intake device 800 on the carrier 200, thereby affecting the removal of byproducts from the surface of the carrier 200. Excessive distance can easily cause a collision between the carrier 200 and the air intake device 800 due to manufacturing and assembly errors. Therefore, in this embodiment of the present application, the final position of the stopper 410 after its ascent is limited to ensure that the carrier 200 is raised to the appropriate position, thereby maintaining an appropriate distance between the carrying surface 211 and the lower surface of the air intake device 800.

[0059] Considering that after the air intake device 800 is installed in the cavity 100, the distance between the lower surface of the air intake device 800 and the bottom wall of the cavity 100 does not change, and the thickness of the supporting device 200 in the lifting direction is also fixed, the distance between the lower surface of the air intake device 800 and the supporting surface 211 can be controlled by simply controlling the distance between the end surface of the supporting device 200 facing away from the supporting surface 211 and the bottom wall of the cavity 100.

[0060] In addition, after the distance measuring device 600 is installed in the cavity 100 , the distance between the distance measuring end of the distance measuring device 600 and the bottom wall of the cavity 100 no longer changes.

[0061] Based on the above configuration, the distance between the lower surface of the air inlet device 800 and the carrying surface 211 can be controlled by controlling the distance between the distance measuring end and the end surface of the carrying device 200 facing away from the carrying surface 211 .

[0062] For example, Figure 7 As shown, the distance between the lower surface of the air intake device 800 and the distance measuring end is A, the thickness of the support device 200 in the lifting direction is B, and the distance between the distance measuring end and the end surface of the support device 200 facing away from the support surface 211, as measured by the distance measuring device 600, is X. Therefore, the distance between the lower surface of the air intake device 800 and the support surface 211 is Spacing = ABX. This allows for indirect calculation of the distance between the lower surface of the air intake device 800 and the support surface 211, providing a data basis for adjusting the distance between the lower surface of the air intake device 800 and the support surface 211.

[0063] Therefore, it can be determined whether the distance X measured by the distance measuring device 600 is within the preset range. When the distance X is not within the preset range, the distance measuring device 600 can send a control signal to the adjustment device 500 to enable the adjustment device 500 to drive the first limit member 420 to move in the lifting direction.

[0064] Therefore, through real-time detection of the distance measuring device 600 and real-time adjustment of the adjusting device 500 and the limiting device 400, the distance between the bearing surface 211 and the lower surface of the air inlet device 800 can meet the actual working condition requirements, so that the process requirements can be met, and the collision between the bearing device 200 and the air inlet device 800 can be avoided.

[0065] To realize the installation of the distance measuring device 600, the bottom wall of the cavity 100 can be provided with a channel 110 communicating with the inner cavity of the cavity 100. The distance measuring device 600 includes a distance measuring sensor 610, which is arranged in the channel 110, so as to emit a distance measuring signal to the end surface of the bearing device 200 through the distance measuring sensor 610. The distance measuring signal can be infrared, laser, ultrasonic wave, etc.

[0066] Alternatively, the end of the distance measuring sensor 610 is the distance measuring end, and the end surface of the distance measuring sensor 610 can be flush with the bottom wall of the cavity 100. At this time, the distance between the measured distance measuring end and the end surface of the bearing device 200 away from the bearing surface 211 is the distance between the bottom wall of the cavity 100 and the end surface of the bearing device 200 away from the bearing surface 211. Of course, the end surface of the distance measuring sensor 610 can also be non-coplanar with the bottom wall of the cavity 100, such as protruding from the bottom wall of the cavity 100 or retracting into the bottom wall of the cavity 100. In this case, when the distance measuring sensor 610 is installed, the distance between the end surface of the distance measuring sensor 610 and the bottom wall of the cavity 100 no longer changes, and whether it is zero or not will not affect.

[0067] In the embodiment of the application, the channel 110 and the inner cavity are sealingly connected with a light-transmitting element 620, such as shown in Figure 3 and Figure 6 The distance measuring end of the distance measuring sensor 610 is arranged opposite to the light-transmitting element 620. In this way, the distance measuring sensor 610 and the process environment in the cavity 100 can be separated by the light-transmitting element 620, so as to realize vacuum sealing and ensure the sealing property of the cavity 100. At the same time, the light-transmitting element 620 will not block the distance measuring signal emitted by the distance measuring sensor 610, so as to ensure the normal use of the distance measuring sensor 610, thereby realizing distance measurement.

[0068] Further, as shown in Figure 6As shown, the bottom wall of the cavity 100 may be provided with a groove 120, the channel 110 is provided in the bottom wall of the groove 120, the light-transmitting element 620 is provided in the groove 120, and the light-transmitting element 620 and the bottom wall of the groove 120 are sealed by a first sealing member 710. Based on this arrangement, the light-transmitting element 620 can be embedded in the groove 120 to prevent the light-transmitting element 620 from protruding from the bottom wall of the cavity 100, thereby ensuring that the bottom wall of the cavity 100 is flush with the surface of the light-transmitting element 620, preventing the installation area of ​​the light-transmitting element 620 from protruding or recessing relative to the bottom wall of the cavity 100, and effectively avoiding the accumulation of process by-products.

[0069] In addition, the provision of the first sealing member 710 can improve the sealing performance between the light-transmitting element 620 and the bottom wall of the groove 120, thereby ensuring the sealing performance of the cavity 100 and preventing the leakage of process by-products.

[0070] To improve the installation stability, the light-transmitting element 620 can also be mounted to the bottom wall of 100 using fastening screws to prevent the light-transmitting element 620 from moving at will.

[0071] Considering that process gas needs to be input into the chamber 100 during the process so that the process gas reaches the surface of the wafer carried by the carrier 200 to react, the process chamber in the embodiment of the present application may further include an air inlet device 800, such as Figure 3 As shown, the gas inlet device 800 can be installed on the top of the chamber 100 and opposite to the carrier device 200 , so that the process gas can be input into the chamber 100 through the gas inlet device 800 .

[0072] To improve the diffusion effect of the process gas, the air inlet device 800 may include a flow plate 810. The flow plate 810 is disposed within the chamber 100. The carrying surface 211 of the carrier 200 is disposed opposite the flow plate 810, and the carrying surface 211 can be moved closer to or further away from the flow plate 810. Based on this arrangement, when a process is required, the position of the carrier 200 can be controlled by the lifting device 300, and the process gas can be diffused above the carrying surface 211 through the flow plate 810. This can expand the diffusion area of ​​the process gas and improve the uniformity of the process gas diffusion, thereby improving the uniformity of the reaction in various areas of the wafer surface and improving product quality.

[0073] Illustratively, the flow plate 810 may be distributed with a plurality of air holes, and the plurality of air holes are respectively opposite to different areas of the wafer carried on the carrying surface 211 to improve the uniformity of gas diffusion in various areas above the wafer.

[0074] In addition, the air inlet device 800 may further include a nozzle 820, which is arranged above the flow plate 810. Thus, the process gas can be sprayed in through the nozzle 820 and diffused through the flow plate 810, thereby improving the uniformity of the diffusion of the process gas in the cavity 100.

[0075] refer to Figure 3 and Figure 4 In some embodiments, the carrying device 200 may include a base 210 and a connecting post 220. The base 210 has a carrying surface 211, and the connecting post 220 is connected to the side of the base 210 facing away from the carrying surface 211. The end of the connecting post 220 facing away from the base 210 extends out of the chamber 100 and is connected to the lifting end. Based on this configuration, the lifting device 300 can be raised and lowered by the lifting end, and the connecting shaft can be used to drive the base 210 up and down, thereby changing the position of the base 210 and the wafer carried by the carrying surface 211.

[0076] refer to Figure 4 In some embodiments, the lifting device 300 may include a second linear module 310 and a lifting motion component 320. The lifting motion component 320 is connected to the second linear module 310, at least a portion of the carrier 200 is connected to the lifting motion component 320, and the limit stop 410 is connected to the lifting motion component 320. Based on this configuration, the lifting motion component 320 is driven to rise and fall by the second linear module 310, and the lifting motion component 320 drives the carrier 200 and the limit stop 410 to rise and fall synchronously.

[0077] In the embodiment of the present application, the cavity 100 may include a cavity cover, which is installed at the opening at the top of the cavity 100. A sealing ring may be provided at the connection between the cavity cover and the opening to achieve sealing. In addition, the air inlet device 800 may be provided at the bottom of the cavity cover.

[0078] Taking the process setting Spacing value of 3mm as an example, the specific process of adjusting Spacing is as follows:

[0079] The second linear module 310 is activated, driving the base 210 upward via the connecting column 220, and causing the stopper 410 to rise with it until the first stopper 420 is triggered. At this point, the distance X between the distance measuring end and the bottom surface of the base 210 is measured by the distance sensor 610. The device's host software reads this value X via a signal line and automatically calculates the distance between the lower surface of the air intake device 800 (i.e., the lower surface of the flow plate 810) and the supporting surface 211 using the formula Spacing = ABX.

[0080] If H>3, the host computer software drives the first linear module 510 to start, causing the first limit member 420 to rise a distance of (H-3) mm. At this time, the first linear module 510 stops working; when the second linear module 310 moves again to the limit stop 410 triggering the first limit member 420, Spacing reaches the set value of 3 mm.

[0081] When H=3, the first linear module 510 does not move and the first limiting member 420 maintains its current position. At this time, Spacing satisfies the set value of 3 mm.

[0082] When H<3, the host computer software drives the first linear module 510 to move, causing the first limiter 420 to drop a distance of (3-M), and the first linear module 510 stops moving; when the second linear module 310 drives the limit stopper again to trigger the first limiter 420, Spacing reaches the set value of 3mm.

[0083] Based on the above-mentioned process chamber, an embodiment of the present application further discloses a semiconductor process equipment, including the above-mentioned process chamber.

[0084] In summary, the embodiments of the present application can achieve high-precision adjustment, real-time adjustment and adaptive adjustment of Spacing without opening a cavity, and also realize automatic ranging, thereby simplifying the adjustment process and making the adjustment more convenient.

[0085] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A process chamber, characterized in that: include: A cavity (100), a carrying device (200), a lifting device (300), a limiting device (400), an adjusting device (500), and a distance measuring device (600); The carrying device (200) is arranged in the cavity (100), the lifting device (300) is connected to the outside of the cavity (100), and the carrying device (200) at least partially extends out of the cavity (100) and is connected to the lifting end of the lifting device (300); The limiting device (400) comprises a limiting stopper (410) and a first limiting member (420), wherein the limiting stopper (410) is connected to the lifting end, and in the lifting direction, the first limiting member (420) is located on a side of the limiting stopper (410) close to the carrying device (200); The adjusting device (500) is connected to the outside of the cavity (100), and the adjusting device (500) is connected to the first limiting member (420) and is used to drive the first limiting member (420) to move in the lifting direction; The distance measuring device (600) is connected to the cavity (100) and is used to measure the distance between the distance measuring end of the distance measuring device (600) and the end surface of the carrying device (200) facing away from the carrying surface (211), and the distance measuring device (600) is electrically connected to the lifting device (300) and the adjusting device (500) respectively.

2. The process chamber according to claim 1, wherein: The adjusting device (500) comprises a first linear module (510) and a moving part (520); The moving member (520) is connected to the first linear module (510), and the first limiting member (420) is connected to the moving member (520).

3. The process chamber according to claim 2, wherein: The first linear module (510) comprises a first servo motor (511), a first screw (512), a first slider (513), and a first slide rail (514) extending along the lifting direction; The first screw (512) is drivingly connected to the output shaft of the first servo motor (511); the first slider (513) is threadedly connected to the first screw (512) and slidably connected to the first slide rail (514); The moving member (520) is connected to the first sliding block (513).

4. The process chamber according to claim 1, wherein: The bottom wall of the cavity (100) is provided with a channel (110) communicating with the inner cavity of the cavity (100), and a light-transmitting element (620) is sealedly connected between the channel (110) and the inner cavity; The distance measuring device (600) comprises a distance measuring sensor (610), the distance measuring sensor (610) is arranged in the channel (110), and the distance measuring end of the distance measuring sensor (610) is arranged opposite to the light-transmitting element (620).

5. The process chamber according to claim 4, wherein: The bottom wall of the cavity (100) is provided with a groove (120), and the channel (110) is provided on the bottom wall of the groove (120); The light-transmitting element (620) is disposed in the groove (120), and the light-transmitting element (620) is sealed to the bottom wall of the groove (120) via a first sealing member (710).

6. The process chamber according to claim 1, wherein: The process chamber further comprises an air intake device (800), wherein the air intake device (800) comprises a flow equalizer plate (810), and the flow equalizer plate (810) is arranged in the cavity (100); The bearing surface (211) of the bearing device (200) is arranged opposite to the flow equalizer plate (810), and the bearing surface (211) can be close to or away from the flow equalizer plate (810).

7. The process chamber according to claim 1, wherein: The carrying device (200) comprises a base (210) and a connecting column (220), wherein the base (210) has a carrying surface (211), and the connecting column (220) is connected to a side of the base (210) facing away from the carrying surface (211); One end of the connecting column (220) facing away from the base (210) extends out of the cavity (100) and is connected to the lifting end.

8. The process chamber according to claim 1, wherein: The lifting device (300) comprises a second linear module (310) and a lifting motion component (320); The lifting motion component (320) is connected to the second linear module (310), the carrying device (200) is at least partially connected to the lifting motion component (320), and the limit stopper (410) is connected to the lifting motion component (320).

9. The process chamber according to claim 2 or 3, characterized in that: The regulating device (500) further comprises a connecting plate (530), wherein the connecting plate (530) is fixed to the outer wall of the cavity (100), and the first linear module (510) is fixed to the connecting plate (530); The limiting device (400) further includes a second limiting member (430), the second limiting member (430) being fixed to the connecting plate (530) and spaced apart from the first limiting member (420) in the lifting direction, and the limiting stopper (410) being located between the first limiting member (420) and the second limiting member (430).

10. A semiconductor process equipment, characterized in that: A process chamber comprising the process chamber according to any one of claims 1 to 9.

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