Substrate detection device and substrate processing equipment
By using optical path detection components in substrate processing equipment, the problem of substrate damage caused by robot failure or wafer carrier position error is solved, the orderly and precise placement of substrates is achieved, the processing stability is improved and the loss is reduced.
Patent Information
- Application Number
- CN202422293556.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-09-20
AI Technical Summary
In chemical vapor deposition or metal organic chemical vapor deposition equipment, robot failure or incorrect wafer carrier position may result in no substrates being placed on some layers, while two substrates are placed on other layers, causing damage to the substrate surface or problems with the formation of deposited thin films.
An optical path detection component, including a light transmitter and a light receiver, is used to confirm the presence or absence of the substrate by emitting and receiving light, ensuring the orderly and precise placement of the substrate on the wafer carrier.
The use of the detection device avoids damage to the substrate due to robot failure or incorrect wafer support position, ensures accurate placement of the substrate, reduces substrate loss, and improves processing stability.
Smart Images
Figure CN223422767U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor processing, especially to a substrate detection device, and a substrate processing equipment provided with the substrate detection device. BACKGROUND
[0002] In a chemical vapor deposition (CVD) or metal organic chemical vapor deposition (MOCVD) equipment, the substrate is usually taken out from the substrate box and placed into the reaction cavity by the mechanical hand, and the reaction cavity is usually provided with a wafer carrier for placing multiple layers of substrates. In actual operation, mechanical hand failure or wafer carrier position error (for example, the distance of lifting or lowering is incorrect, so that the substrate is not correctly taken out from the substrate box or placed into the correct position after being taken out) causes no substrate to be placed on some layer positions, and two substrates can be placed on other layer positions, which can cause the surface of the substrate placed below to be damaged due to friction, or can cause the surface of the substrate placed below to form a deposition film if there is no detection program and the reaction process is directly performed. SUMMARY
[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a substrate detection device and a substrate processing equipment to confirm whether there is a substrate on the current layer position of the base.
[0004] To achieve the above-mentioned purpose, a substrate detection device is implemented according to the utility model, which is cooperatively arranged with a reaction cavity, and the detection device comprises:
[0005] A light path detection assembly is arranged outside the reaction cavity and distributed on both sides of the longitudinal axis of the reaction cavity; the light path detection assembly comprises a light emitter located at a position corresponding to one side of the reaction cavity and a light receiver located at a position corresponding to the other side of the reaction cavity.
[0006] When the light receiver cannot receive the light emitted by the corresponding light emitter, it is confirmed that the substrate does not exist; when the light emitted by the light emitter is reflected after irradiating the substrate, and the reflected light is received by the corresponding light receiver, it is confirmed that the substrate exists.
[0007] Or, when the light receiver receives the light emitted by the light emitter, it is confirmed that the substrate does not exist; when the light emitted by the light emitter is blocked by the substrate, and the reflected light cannot be received by the light receiver, it is confirmed that the substrate exists.
[0008] In one embodiment, the emitting end of the light emitter and the receiving end of the light receiver are both arranged to face the reaction cavity.
[0009] In one of the embodiments, the reaction cavity is provided with a wafer carrier for supporting the substrate, and the wafer carrier is provided with multiple layers, and the light emitter and the light receiver are each provided with three groups; or, the light emitter and the light receiver are each provided with one group.
[0010] Further, when the light emitter and the light receiver are each provided with one group, the detection device further comprises two groups of linear modules arranged at corresponding positions on opposite sides of the reaction cavity; the light emitter moves in the vertical direction under the drive of one group of linear modules, and the light receiver moves in the vertical direction under the drive of the other group of linear modules and cooperates with the light emitter.
[0011] Still further, each group of the linear modules comprises a guide rail, a motor built-in the guide rail, a screw rod rotatably installed on the guide rail, and a sliding table threadedly sleeved on the screw rod; the screw rod is fixedly connected to the output end of the motor.
[0012] In one of the embodiments, when the light emitter and the light receiver are each provided with three groups, the detection device further comprises two groups of load-bearing columns.
[0013] Further, the two groups of load-bearing columns are arranged in parallel at corresponding positions on opposite sides of the reaction cavity, and the load-bearing columns are vertically arranged; the light emitter is fixed on one group of load-bearing columns, and the light receiver is fixed on the other group of load-bearing columns.
[0014] Still further, one group of the light emitter and the corresponding light receiver are used for detecting whether the substrate exists on the top layer of the base, another group of the light emitter and the corresponding light receiver are used for detecting whether the substrate exists on the middle layer of the base, and the remaining group of the light emitter and the corresponding light receiver are used for detecting whether the substrate exists on the bottom layer of the base.
[0015] A substrate processing device comprises:
[0016] A reaction cavity is provided with a base for supporting the substrate;
[0017] A base shaft is fixedly installed on the base;
[0018] A motor is used for driving the base shaft; and
[0019] A detection device is the substrate detection device.
[0020] Compared with the prior art, the substrate processing device has the following beneficial effects: by detecting whether the substrate is placed on the wafer carrier, the ordered and accurate placement of the substrate on the wafer carrier is ensured, and the problem of substrate damage caused by the fact that no substrate is placed on some layer positions and two substrates are placed on some other layer positions due to the mechanical hand failure or the wafer carrier position error is overcome. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 Shown is a structural schematic diagram of a substrate detection device provided in Example 1 of the present utility model.
[0022] Figure 2 Shown Figure 1 A three-dimensional view of the wafer holder.
[0023] Figure 3 The diagram shows a detection diagram of Example 1 of the present utility model, in which the arrow indicates the moving direction of the optical path detection component.
[0024] Figure 4 Shown is a detection diagram of a substrate detection device provided in Example 2 of the present utility model.
[0025] Figure 5 Shown is a structural schematic diagram of a substrate detection device provided in Example 3 of the present utility model.
[0026] Figure 6 Shown is a detection diagram of a substrate detection device provided in Example 4 of the present utility model.
[0027] Figure 7 Shown is a structural schematic diagram of a substrate processing device provided in Example 5 of the present utility model.
[0028] Description of main component symbols
[0029] 1. Reaction chamber; 2. Wafer support; 3. Light emitter; 4. Light receiver; 5. Load-bearing column; 6. Linear module; 7. Motor; 8. Wafer support shaft.
[0030] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION
[0031] The present invention will be described in detail below with reference to the accompanying drawings.
[0032] Example 1
[0033] See also Figure 1 This embodiment provides a substrate detection device, which is arranged at the periphery of the reaction chamber 1 and distributed on both sides of the longitudinal axis of the reaction chamber 1. The reaction chamber 1 is provided with a wafer support 2 for supporting the substrate, and the wafer support 2 is a multi-layer structure (three layers in this embodiment) for supporting multiple substrates. Please refer to Figure 2The dotted part in the figure indicates the injection of light. It can be seen that based on the wafer support seat 2 in this embodiment, it can be ensured that when performing the detection operation on the layer to be measured on the wafer support seat 2, the light is not interfered by the wafer support seat 2, and is directly injected through the interval space of the wafer support seat 2 to detect whether there is a substrate in the layer, thereby avoiding detection errors.
[0034] The detection device includes an optical path detection component and two sets of linear modules 6. The optical path detection component is arranged outside the reaction chamber 1 and is distributed on both sides of the longitudinal axis of the reaction chamber 1, and the optical path detection component includes a light emitter 3 located at a position corresponding to one side of the reaction chamber 1 and a light receiver 4 located at a position corresponding to the other side of the reaction chamber 1. The number of the light emitters 3 and the light receivers 4 is one group. In this embodiment, due to the obstruction of the substrate, the light reflected by the light emitter 3 is received by the light receiver 4, thereby achieving the purpose of confirming whether there is a substrate on the current layer, overcoming the problem of damage to the substrate caused by the failure of the robot or the error in the position of the wafer carrier, resulting in no substrate placed on some layers and two substrates placed on other layers.
[0035] The transmitting end of the light transmitter 3 and the receiving end of the light receiver 4 are both arranged facing the reaction chamber 1. Figure 3 When the substrate is present, the light (such as infrared light or laser) emitted by the light emitter 3 hits the substrate and is reflected, and the corresponding light receiver 4 receives the reflected light. When the substrate is not present, the light receiver 4 cannot receive the light emitted by the corresponding light emitter 3.
[0036] Two sets of linear modules 6 are positioned on opposite sides of the reaction chamber 1. These modules serve as mounting points for the optical path detection assembly. Each set of linear modules 6 comprises a guide rail, a motor built into the rail, a screw rotatably mounted on the rail, and a slide threaded onto the screw. The screw is fixedly connected to the output end of the motor. In this embodiment, the light emitter 3 and light receiver 4 are both secured to their respective slides via snap fasteners.
[0037] The light emitter 3 is driven by one set of linear modules 6 to move vertically (e.g., perform uniform reciprocating linear motion), and the light receiver 4 is driven by the remaining set of linear modules 6 to move vertically in conjunction with the light emitter 3 (e.g., perform uniform reciprocating linear motion). The light emitter 3 and the light receiver 4 move in the same direction and at the same speed.
[0038] In summary, the detection device of this embodiment has the following advantages: by detecting whether the substrate is placed on the base, it ensures the orderly and precise placement of the substrate on the base, overcoming the problem of no substrate placed on some layers and two substrates placed on other layers due to robot failure or base position error, causing damage to the substrate.
[0039] Example 2
[0040] Please continue reading Figure 4 This embodiment provides a substrate detection device, which differs from Embodiment 1 in that: in this embodiment, when a substrate exists, the light emitted by the light emitter 3 is blocked when it hits the substrate. At this time, the light receiver 4 does not receive the reflected light. When the light receiver 4 receives the light emitted by the light emitter 3, it is confirmed that the substrate does not exist.
[0041] Example 3
[0042] Please refer to Figure 5 This embodiment provides a substrate detection device, which differs from Embodiment 1 in that: in this embodiment, the number of the light emitters 3 and the number of the light receivers 4 are both three, and the two groups of linear modules 6 are replaced by two groups of load-bearing columns 5. It should be noted that in order to adapt to the three-layer structure of the wafer support 2, this embodiment is described using three groups of light emitters 3 and three groups of light receivers 4 as an example. In other embodiments, in order to improve the processing efficiency of substrate treatments such as thin film deposition, the wafer support 2 can be set to multiple layers to orderly place more substrates. Accordingly, the number and installation positions of the light emitters 3 and light receivers 4 are consistent with the layer positions of the wafer support 2, and will not be elaborated here.
[0043] Two sets of load-bearing columns 5 are arranged in parallel at corresponding positions on both sides of the reaction chamber 1, and the load-bearing columns 5 are arranged vertically. The light emitter 3 is fixed to one set of load-bearing columns 5 (e.g., by buckling), and the light receiver 4 is fixed to the other set of load-bearing columns 5 (e.g., by buckling).
[0044] One group of light emitters 3 and corresponding light receivers 4 are used to detect whether there is a substrate on the top layer of the wafer support 2, another group of light emitters 3 and corresponding light receivers 4 are used to detect whether there is a substrate on the middle layer of the wafer support 2, and the remaining group of light emitters 3 and corresponding light receivers 4 are used to detect whether there is a substrate on the bottom layer of the wafer support 2.
[0045] Example 4
[0046] Please refer to Figure 6The embodiment provides a substrate detection device, which is different from the embodiment 3 in that: in the embodiment, when the substrate exists, the light emitted by the light emitter 3 is blocked from irradiating the substrate, at this time, the corresponding light receiver 4 cannot receive the reflected light, and when the light receiver 4 receives the light emitted by the corresponding light emitter 3, it is confirmed that the substrate does not exist.
[0047] Embodiment 5
[0048] Please refer to Figure 7 The embodiment provides a substrate processing device, which comprises a reaction cavity 1, a wafer carrier shaft 8, a motor 7 used for driving the wafer carrier shaft 8 and the detection device as shown in the embodiment 2. The reaction cavity 1 is provided with a wafer carrier 2 used for supporting a substrate, the wafer carrier shaft 8 is fixedly installed on the wafer carrier 2, and the output end of the motor 7 is fixed with the wafer carrier shaft 8.
[0049] It should be noted that the substrate processing device in the embodiment can also use the motor 7 to drive the wafer carrier 2 to move vertically to adjust different layers to be aligned with the feeding window so as to place the substrate into the process, and the detection is performed in the process of vertical movement of the wafer carrier 2, so that only one set of light emitter 3 and the corresponding light receiver 4 are needed, and the position adjustment measures of the light emitter 3 and the light receiver 4 are not needed, which will not be described herein.
[0050] The substrate processing device in the embodiment has the function of confirming whether the substrate exists on the current layer, and overcomes the problem that some layers do not place the substrate due to the failure of the mechanical arm or the position error of the wafer carrier, and some layers place two substrates, so that the substrate is damaged, the substrate loss is reduced, and the stable processing of the substrate surface is ensured.
[0051] The names of the various components involved are taken as the standard of the functions described in the specification, and are not limited by the specific terms used in the utility model, and the skilled in the art can also select other terms to describe the names of the various components of the utility model.
Claims
1. A substrate detection device, which is arranged in conjunction with a reaction chamber (1), characterized in that: The detection device comprises: an optical path detection component, which is arranged outside the reaction chamber (1) and distributed on both sides of the longitudinal axis of the reaction chamber (1); the optical path detection component comprises a light emitter (3) located at a position corresponding to one side of the reaction chamber (1) and a light receiver (4) located at a position corresponding to the other side of the reaction chamber (1); When the light receiver (4) cannot receive the light emitted by the corresponding light emitter (3), it is confirmed that the substrate does not exist; when the light emitted by the light emitter (3) is irradiated on the substrate and then reflected, and the corresponding light receiver (4) receives the reflected light, it is confirmed that the substrate exists; Alternatively, when the light receiver (4) receives the light emitted by the light transmitter (3), it is confirmed that the substrate does not exist; when the light emitted by the light transmitter (3) is blocked when irradiating the substrate and the light receiver (4) does not receive the reflected light, it is confirmed that the substrate exists.
2. The substrate detection device according to claim 1, characterized in that The transmitting end of the light transmitter (3) and the receiving end of the light receiver (4) are both arranged facing the reaction chamber (1).
3. The substrate detection device according to claim 2, characterized in that: A wafer support seat (2) for supporting a substrate is provided in the reaction chamber (1), and the wafer support seat (2) is provided with multiple layers, and the light emitters (3) and light receivers (4) are each provided with three groups; Alternatively, the light emitter (3) and the light receiver (4) are each provided in a group.
4. The substrate detection device according to claim 3, characterized in that: When both the light emitter (3) and the light receiver (4) are provided with a group, the detection device further comprises two groups of linear modules (6), and the two groups of linear modules (6) are arranged at positions on two corresponding sides of the reaction chamber (1); The light emitter (3) moves in a vertical direction under the drive of one set of linear modules (6), and the light receiver (4) moves in a vertical direction in cooperation with the light emitter (3) under the drive of the other set of linear modules (6).
5. The substrate detection device according to claim 4, characterized in that: Each set of the linear modules (6) comprises a guide rail, a motor built into the guide rail, a screw rotatably mounted on the guide rail, and a slide screwed onto the screw; the screw is fixedly connected to the output end of the motor.
6. The substrate detection device according to claim 3, characterized in that: When three groups of the light emitters (3) and the light receivers (4) are provided, the detection device further comprises two groups of load-bearing columns (5).
7. The substrate detection device according to claim 6, characterized in that: The two groups of load-bearing columns (5) are arranged in parallel at corresponding positions on both sides of the reaction chamber (1), and the load-bearing columns (5) are arranged vertically; the light emitter (3) is fixed on one group of load-bearing columns (5), and the light receiver (4) is fixed on the other group of load-bearing columns (5).
8. The substrate detection device according to claim 7, characterized in that: One group of light emitters (3) and corresponding light receivers (4) are used to detect whether a substrate exists on the top layer of the wafer support seat (2), another group of light emitters (3) and corresponding light receivers (4) are used to detect whether a substrate exists on the middle layer of the wafer support seat (2), and the remaining group of light emitters (3) and corresponding light receivers (4) are used to detect whether a substrate exists on the bottom layer of the wafer support seat (2).
9. A substrate processing device, characterized in that: include: A reaction chamber (1) is provided with a wafer support seat (2) for supporting a substrate; A base shaft (8) fixedly mounted on the wafer support seat (2); a motor (7) for driving the base shaft (8); and A detection device, which is the substrate detection device according to any one of claims 1 to 8.