Hard sealing valve clack for semiconductor clean gas

Abstract

The utility model relates to the technical field of valve clacks, in particular to a hard sealing valve clack for semiconductor clean gas, which mainly comprises a valve core rod, a limit groove is arranged below the valve core rod, the axis of the limit groove and the axis of the valve core rod are on the same axis, the lower end of the valve core rod is connected with a valve clack shell, and the valve clack shell is connected with a valve rod. A limiting groove is formed in the valve clack shell, the limiting groove is adjacent to the valve clack shell, a sealing cover is installed below the valve clack shell, a clack body is arranged on the sealing cover, the valve element rod is located at the top end of the valve clack, and the clack body is located at the bottom end of the valve clack. The hard sealing valve clack for the semiconductor clean gas can effectively prevent leakage, is good in sealing performance and is convenient to maintain and clean.

Description

Technical Field

[0001] The utility model relates to the technical field of valve flaps, in particular to a sealing valve flap for semiconductor clean gas. Background Art

[0002] Semiconductor clean air valve flaps are designed specifically for semiconductor manufacturing and other high-purity environments. They are primarily used to control the flow of clean air and gases. Their design and material selection are intended to minimize the introduction of contaminants and ensure the cleanliness of the production environment. The valve flaps utilize high-performance sealing materials (such as PTFE and EPDM) to ensure leak-free operation and maintain the purity of the clean air. Their surfaces are typically smoothed to reduce surface roughness and the likelihood of particle generation. The valve flaps are typically constructed of corrosion-resistant materials such as stainless steel and aluminum alloys to resist erosion by chemical gases, ensuring the valve flap's sealing performance and the proper operation of mechanical components, preventing leaks and malfunctions. These valve flaps play a critical role in operation.

[0003] Many semiconductor clean air valves are equipped with electric or pneumatic drives to precisely control flow and opening and closing status. Integrated sensors monitor valve position and flow to ensure real-time feedback and adjustment of the system. This ensures the sealing performance of the valve and the normal operation of mechanical components to avoid leakage and failure.

[0004] Semiconductor clean air valve flaps present the following technical issues during use: 1. Aging and wear: After prolonged use, the sealing material of the valve flap may age and wear, leading to leakage. 2. Poor sealing: Under extreme conditions, the valve flap may not maintain a complete seal, affecting cleanliness. 3. Valve flap design issues: Improper design can lead to fluid stagnation, resulting in particulate contamination. 4. Maintenance and cleaning: In high-cleanliness environments, valve flap maintenance and cleaning require specialized procedures, increasing operational complexity. Utility Model Content

[0005] (1) Technical issues to be resolved

[0006] In response to the above problems, the utility model provides a hard-sealed valve disc for semiconductor clean gas, especially a sealing valve disc for semiconductor clean gas, which aims to solve the problems of poor sealing effect, easy leakage, and complicated maintenance and cleaning operations of the current sealing valve disc for semiconductor clean gas.

[0007] (2) Technical solution

[0008] In order to solve the technical problem, the utility model provides a hard-sealed valve flap for semiconductor clean gas, including a valve core rod, a limiting groove is provided below the valve core rod, the axis of the limiting groove is on the same axis as the axis of the valve core rod, the lower end of the valve core rod is connected to the valve flap housing, the limiting groove is adjacent to the valve flap housing, a sealing cover is installed below the valve flap housing, a flap body is provided on the sealing cover, the valve core rod is located at the top end of the valve flap, and the flap body is located at the bottom end of the valve flap.

[0009] Preferably, a chamfer of 0° is provided on the top of the valve core rod, and the valve core rod is located at the center of the valve disc housing.

[0010] Preferably, the valve core rod is located above the sealing cover, and the valve core rod is detachably connected to the valve disc housing.

[0011] Preferably, the limiting groove is in a ring T-shape, and the limiting groove is located above the valve disc housing.

[0012] Preferably, the cross section of the valve flap housing is circular, and the valve flap housing is located between the valve core rod and the sealing cover.

[0013] Preferably, the sealing cover is located between the valve flap housing and the flap body, and the sealing cover and the valve flap housing are detachably connected.

[0014] Preferably, the axis of the flap body coincides with the axis of the valve core rod, and the flap body and the sealing cover are detachably connected.

[0015] Preferably, the flap body is provided with a chamfer, and the axis of the flap body and the axis of the valve flap housing are on the same straight line.

[0016] Beneficial effects

[0017] 1. The utility model provides a hard-sealed valve disc for semiconductor clean gas, the lower end of the valve core rod of the semiconductor clean gas valve disc is connected to the valve disc housing, a sealing cover is installed under the valve disc housing, a flap body is provided on the sealing cover, a limiting groove is provided on the valve core rod, the axis of the limiting groove is on the same axis as the axis of the valve core rod, the valve core rod is arranged at the top end of the valve disc, and the flap body is arranged at the lower end of the valve disc. The overall structure of the semiconductor clean gas valve disc is simple and easy to install, which is convenient for staff to disassemble and replace the valve disc.

[0018] 2. The utility model provides a kind of hard seal valve flap for semiconductor clean gas, the structure designed to this sealing valve flap can minimize the introduction of pollutants in the clean air and gas flow process of semiconductor, ensure the neatness of production environment, valve flap uses high-performance, surface is treated with smooth sealing material, it helps to reduce surface roughness, reduce the possibility of particle generation, the inner diameter of flap body set in valve flap bottom can be adjusted according to actual needs, to control the flow and volume of semiconductor into gas, ensure the normal operation of mechanical components, avoid malfunction, prolong the service life of sealing valve flap in semiconductor clean gas process etc.

[0019] 3. The utility model provides a kind of hard seal valve flap for semiconductor clean gas, sealing cover is provided below the valve flap shell of this sealing valve flap, the center of sealing cover is equipped with flap body, keep the complete sealing of valve flap when semiconductor into gas, prevent valve flap from leaking, affect the cleanliness of semiconductor into gas, in addition, the valve flap is made of corrosion-resistant metal material, can resist the erosion of chemical gas after long time use, not prone to aging and wear, and sealing performance is good.

[0020] 4. The utility model provides a kind of hard seal valve flap for semiconductor clean gas, the valve core rod of the sealing valve flap designed is detachably connected with valve flap shell, and the detachable connection structure between valve flap shell and sealing cover, the design of the valve flap structure, it is convenient for staff to clean and maintain valve flap periodically after a certain working time of valve flap, reduces the complexity of operation, improves work efficiency, guarantees the high efficiency of semiconductor clean gas process using this sealing valve flap. ACCURACY OF DRAWINGS

[0021] Figure 1 It is the first perspective drawing of the utility model of a kind of hard seal valve flap for semiconductor clean gas;

[0022] Figure 2 It is the second perspective drawing of the utility model of a kind of hard seal valve flap for semiconductor clean gas;

[0023] Figure 3 It is the third perspective drawing of the utility model of a kind of hard seal valve flap for semiconductor clean gas;

[0024] Figure 4 It is the fourth perspective drawing of the utility model of a kind of hard seal valve flap for semiconductor clean gas;

[0025] Figure 5 It is the fifth perspective drawing of the utility model of a kind of hard seal valve flap for semiconductor clean gas.

[0026] The corresponding component name of each reference numeral in the drawing is: 1, valve core rod;2, limit slot;3, valve flap shell;4, sealing cover;5, flap body. DETAILED DESCRIPTION

[0027] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the features in the following embodiments and embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of this application.

[0029] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on this application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this apparatus and / or practice this method.

[0030] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0031] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples, however, one skilled in the art will appreciate that the examples can be practiced without these specific details.

[0032] The following describes the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0033] See Figures 1 to 5The present invention provides a hard-sealed valve disc for semiconductor clean gas. In order to make the practical purpose, technical solution and advantages of the present invention clearer, the specific operation process of the present invention is introduced in detail below in combination with the accompanying drawings and the working process of the device.

[0034] The utility model provides a hard-sealed valve disc for semiconductor clean gas, comprising a valve core rod 1, a limiting groove 2 being provided below the valve core rod 1, the axis of the limiting groove 2 being on the same axis as the axis of the valve core rod 1, the lower end of the valve core rod 1 being connected to a valve disc housing 3, the limiting groove 2 being adjacent to the valve disc housing 3, a sealing cover 4 being installed below the valve disc housing 3, a flap body 5 being provided on the sealing cover 4, the valve core rod 1 being located at the top end of the valve disc, and the flap body 5 being located at the bottom end of the valve disc.

[0035] See Figures 1 to 5 A 45° chamfer is provided at the top of the valve core rod 1 , and the valve core rod 1 is located at the center of the valve disc housing 3 .

[0036] See Figures 1 to 5 The valve core rod 1 is located above the sealing cover 4, and the valve core rod 1 and the valve disc housing 3 are detachably connected.

[0037] See Figures 1 to 5 The limiting groove 2 is in a ring T-shape and is located above the valve disc housing 3.

[0038] See Figures 1 to 5 The cross section of the valve disc housing 3 is circular, and the valve disc housing 3 is located between the valve core rod 1 and the sealing cover 4.

[0039] See Figures 3 to 5 The sealing cover 4 is located between the valve disc housing 3 and the valve body 5, and the sealing cover 4 and the valve disc housing 3 are detachably connected.

[0040] See Figures 3 to 5 The axis of the flap body 5 coincides with the axis of the valve core rod 1, and the flap body 5 and the sealing cover 4 are detachably connected.

[0041] See Figures 3 to 5 The flap body 5 is provided with a chamfer, and the axis of the flap body 5 and the axis of the valve flap housing 3 are on the same straight line.

[0042] The working principle and specific working process of the hard seal valve disc for semiconductor clean gas are as follows: the valve core rod 1 of the valve disc is connected with the valve rod inside the hydraulic valve, the driving device is opened, when the driving device receives a signal, the valve rod moves up or down, driving the valve disc to open, and the gas starts to flow; when the signal stops, the valve rod returns to the original position, the valve disc is closed, and the gas flow of the disc body 5 at the bottom of the valve disc is cut off; the opening degree of the valve disc can be adjusted by adjusting the inner diameter of the disc body 5 at the bottom of the valve disc, so as to realize the precise control of the gas flow, and the flow can be adjusted in real time through the control signal; the sensor installed above the valve disc monitors the position and flow of the valve disc, ensures that the system can feedback in real time, and optimizes the operation; during the working process, the valve disc is regularly checked and cleaned to ensure its sealing performance and working performance, prevent particle pollution, ensure the efficient and reliable gas delivery in the semiconductor manufacturing process, and maintain the cleanliness of the environment.

[0043] In the specification, the same or similar parts among various embodiments can be referred to each other, and each embodiment focuses on the difference from other embodiments.

[0044] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A hard-sealed valve disc for semiconductor clean gas, characterized by: The invention comprises a valve core rod (1), a limiting groove (2) is provided below the valve core rod (1), the axis of the limiting groove (2) is on the same axis as the axis of the valve core rod (1), the lower end of the valve core rod (1) is connected to a valve flap housing (3), the limiting groove (2) is adjacent to the valve flap housing (3), a sealing cover (4) is installed below the valve flap housing (3), a flap body (5) is provided on the sealing cover (4), the valve core rod (1) is located at the top end of the valve flap, and the flap body (5) is located at the bottom end of the valve flap.

2. A semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: A 45° chamfer is provided at the top end of the valve core rod (1), and the valve core rod (1) is located at the center of the valve disc housing (3).

3. The semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: The valve core rod (1) is located above the sealing cover (4), and the valve core rod (1) and the valve disc housing (3) are detachably connected.

4. The semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: The limiting groove (2) is in a ring T-shape, and the limiting groove (2) is located above the valve disc housing (3).

5. The semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: The cross section of the valve flap housing (3) is circular, and the valve flap housing (3) is located between the valve core rod (1) and the sealing cover (4).

6. The semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: The sealing cover (4) is located between the valve flap housing (3) and the flap body (5), and the sealing cover (4) and the valve flap housing (3) are detachably connected.

7. The semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: The axis of the flap body (5) coincides with the axis of the valve core rod (1), and the flap body (5) and the sealing cover (4) are detachably connected.

8. The semiconductor clean gas hard seal valve disc according to claim 1, characterized in that: The flap body (5) is provided with a chamfer, and the axis of the flap body (5) and the axis of the valve flap housing (3) are on the same straight line.

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