Sucking disc and pump cavity cover body
By designing the suction cup structure, only the second fitting surface is deformed for fitting. Combined with the pressure-free design of the first fitting surface, the problem of loud suction cup noise is solved and the silent effect is improved.
Patent Information
- Application Number
- CN202422161666.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-09-03
AI Technical Summary
The suction cup in the existing diaphragm booster pump produces a lot of noise due to deformation and pressure difference between the contact surface when liquid flows, which affects the user experience.
A suction cup structure is designed, in which only the second bonding surface is bonded during the deformation process, and the first bonding surface is pressure-free. By setting the deformation coordination between the second bonding surface and the third bonding surface, one-way flow of liquid is achieved and noise is reduced.
It effectively reduces the noise generated during the deformation of the suction cup, maintains a good sealing effect, and at the same time reduces the area and frequency of noise generation, thereby improving the silent effect of use.
Smart Images

Figure CN223424783U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of diaphragm booster pumps, and particularly relates to a suction cup and a pump cavity cover. Background Art
[0002] The diaphragm booster pump includes a pump chamber cover, wherein the pump chamber cover includes a water outlet pressure plate and a suction cup installed on the water outlet pressure plate; wherein the water outlet pressure plate is provided with a water outlet cavity which is in contact with the suction cup, wherein the water outlet cavity is provided with a fitting surface which is in contact with one side of the suction cup, and the water outlet cavity is provided with a through hole for liquid circulation; the deformation of the suction cup is used to control whether the liquid flows through the through hole, thereby achieving the effect that the liquid can only flow in one direction, that is, the effect of a one-way valve; but in the prior art, during the operation of the suction cup, since one side of the suction cup is in contact with the fitting surface, when the liquid circulates, the liquid impacts one side of the suction cup, causing the suction cup to deform, and the fitting state between one side of the suction cup and the fitting surface becomes a non-fitting state. At this time, there will be a pressure difference between the suction cup and the fitting surface, thereby making a sound. Since the fitting area is large, a large noise will be generated during the deformation of the suction cup; therefore, it is necessary to develop a suction cup and a pump chamber cover. Utility Model Content
[0003] The purpose of the present utility model is to provide a suction cup and a pump chamber cover to solve the above-mentioned technical problems. During the bonding process of the suction cup bonding surface, only the second bonding surface is deformed and bonded. The sealing effect is good in the bonding state. At the same time, the area of the bonding position is small. During the deformation process, the small contact area makes the area that can emit noise smaller, which can avoid a larger bonding area and reduce noise. At the same time, the bonding pressure at the first bonding surface is 0, so the noise here is small, further reducing the noise.
[0004] In order to achieve the above-mentioned purpose of the utility model, the technical solution adopted by the utility model is as follows:
[0005] A suction cup includes a bonding block body, a suction cup bonding surface disposed on one side of the bonding block body, and the suction cup bonding surface includes a first bonding surface and a second bonding surface disposed adjacent to each other. The suction cup bonding surface is disposed on the side of the bonding block body facing the pressure plate. During bonding, only the second bonding surface is deformed and bonded. The sealing effect is excellent in the bonded state. The bonding area is small, and the small contact area during deformation reduces the area where noise can be emitted, thereby avoiding a large bonding area and reducing noise. Furthermore, the bonding pressure at the first bonding surface is zero, so the noise there is relatively low, further reducing noise.
[0006] Preferably, the second bonding surface is provided at the end of the bonding block body, so that the second bonding surface can be bonded to the end of the bonding block body, allowing the first bonding surface to solely shield the through-hole, while the second bonding surface blocks the liquid during deformation and resistance, preventing it from flowing from the end of the bonding block body to the first bonding surface and affecting the unidirectional flow effect; the liquid can only flow from the through-hole to the first bonding surface and then the second bonding surface in sequence.
[0007] Preferably, along the suction cup bonding surface, the second bonding surface is arranged at a height greater than that of the first bonding surface. The suction cup bonding surface is arranged toward the pressure plate; the second bonding surface is deformable to contact the third bonding surface, while the first bonding surface is only pressed against the third bonding surface with zero pressure, thereby preventing liquid above the bonding block body from entering the through-hole from the point where the second bonding surface deforms and contacts, thereby achieving a better sealing effect; when liquid needs to flow from the through-hole to the first bonding surface, the second bonding surface, and the top of the bonding block body, the second bonding surface deforms to separate the second bonding surface from the third bonding surface. Since the second bonding surface is provided with a smaller area, the noise generated during the separation of the second bonding surface is relatively small.
[0008] Preferably, the second bonding surface is provided with a rounded corner at a position where it meets the first bonding surface.
[0009] Preferably, along the suction cup contact surface, the thickness cc of the contact block body at the first contact surface is 1.5mm-2mm. The contact block body at the first contact surface is provided with a certain thickness to reduce the vibration frequency at that location, thereby achieving a noise reduction effect. By increasing the thickness, the deformation frequency during deformation is reduced, thereby reducing the vibration frequency at that location and achieving a noise reduction effect. The low frequency avoids large deformations that would otherwise generate large noise.
[0010] Preferably, along the suction cup contact surface, starting from the first contact surface, the second contact surface is provided with a height dd of 0.1 mm to 0.3 mm. While the second contact surface is provided with a height greater than the first contact surface, the deformation resistance of the second contact surface is maintained to achieve a sealing effect and reduce noise during separation.
[0011] Preferably, a flat surface is provided on the side of the bonding block body away from the bonding surface of the suction cup;
[0012] A circular arc surface is provided on one side of the bonding block body away from the suction cup bonding surface, and the circular arc surface and the flat surface are coaxially arranged on the bonding block body from inside to outside.
[0013] A pump chamber cover comprising any of the suction cups described above, the pump chamber cover further comprising a pressure plate connected to the suction cup, the pressure plate being provided with a water flow cavity connected to the suction cup, the water flow cavity comprising a third mating surface mating with the suction cup mating surface, and a through hole for liquid circulation, the through hole being provided within the range provided by the third mating surface. The suction cup further comprises a connecting block fixedly provided below the location of the suction cup mating surface on the mating block body, the connecting block being provided at the axis of the mating block body; the connecting block being fixedly connected to the water flow cavity, so that the suction cup mating surface is in contact with the third mating surface.
[0014] Preferably, the third bonding surface is bonded to the first bonding surface; along the vertical projection of the pressure plate, the projection of the through hole is located within the projection range of the first bonding surface. The bonding pressure only exists at the bonding point between the second and third bonding surfaces; the bonding pressure between the first and third bonding surfaces is zero, so the noise here is relatively low, achieving the effect of reducing the overall noise generated.
[0015] Preferably, the second fitting surface is deformed to contact the third fitting surface; and along the vertical projection of the pressure plate, the projection of the second fitting surface does not intersect with the projection of the through hole. During the bonding process of the suction cup bonding surface, only the second bonding surface is deformed and bonded, the bonding position is small, and the sealing effect is good when the bonding state is reached. At the same time, the contact area is small during the deformation process and the position where noise can be emitted is small, so that it can reduce noise; at the same time, the through hole is only provided within the projection range of the first bonding surface, so that the second bonding surface can be deformed and contacted with the third bonding surface, thereby achieving the goal of blocking the liquid from flowing from the top of the bonding block body to the through hole, and having a better sealing effect. The bonding pressure between the first bonding surface and the third bonding surface is 0MPa, so that the first bonding surface can be impacted by the liquid in the through hole and deformed, thereby driving the second bonding surface to deform and release the seal, so that the liquid can flow from the through hole to the first bonding surface, the second bonding surface and the top of the bonding block body in turn, completing the liquid transmission; the operations of the first bonding surface and the second bonding surface are performed in sequence without crossing each other, so that the second bonding surface has a better sealing effect and a lower noise operation level.
[0016] This application has achieved beneficial technical effects:
[0017] During the bonding process of the suction cup bonding surface of the utility model, only the second bonding surface is deformed and bonded, so the sealing effect is good in the bonding state. At the same time, the area of the bonding position is small. During the deformation process, the small contact area makes the area that can emit noise smaller, which can avoid a large bonding area and reduce noise. At the same time, the bonding pressure at the first bonding surface is 0, so the noise here is small, further reducing noise. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 Shown is a schematic diagram of the structure of the suction cup;
[0019] Figure 2 Shown Figure 1 AA-direction cross-sectional structural diagram;
[0020] Figure 3 Shown is a schematic diagram of the assembly structure of the suction cup and the pressure plate;
[0021] Figure 4 Shown is another schematic diagram of the assembly structure of the suction cup and the pressure plate;
[0022] Figure 5 Shown is a schematic top view of the assembly structure of the suction cup and the pressure plate;
[0023] Figure 6 Shown Figure 5 BB-direction cross-sectional structural diagram;
[0024] Figure 7 Shown is a schematic diagram of the explosion structure of the suction cup and pressure plate.
[0025] Reference numerals
[0026] 1-fitting block body; 11-suction cup fitting surface; 111-first fitting surface; 112-second fitting surface; 113-rounded corner; 114-flat surface; 115-arc surface; 2-pressure plate; 21-water passage cavity; 211-third fitting surface; 212-through hole; 3-connecting block. DETAILED DESCRIPTION
[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without inventive work.
[0028] The technical solution of the present utility model is described in detail below with reference to specific embodiments.
[0029] Reference Figures 1 to 7A suction cup comprises a bonding block body 1, wherein a suction cup bonding surface 11 is provided on one side of the bonding block body 1, and the suction cup bonding surface 11 comprises a first bonding surface 111 and a second bonding surface 112 which are adjacently provided. The suction cup bonding surface 11 is provided on the side of the bonding block body 1 facing the pressure plate 2, and during the bonding process of the suction cup bonding surface 11, only the second bonding surface 112 is deformed and bonded, and the sealing effect is good in the bonded state. At the same time, the area of the bonding position is small, and the small contact area during the deformation process makes the area that can emit noise small, which can avoid a large bonding area and reduce noise; at the same time, the bonding pressure at the location where the first bonding surface 111 is provided is 0, so the noise here is small, further reducing noise. The ratio between the length AO of the first bonding surface 111 and the length OB of the second bonding surface 112 is 2.5:1-3:1.
[0030] The second bonding surface 112 is provided at the end of the bonding block body 11. The second bonding surface 112 can be bonded to the end of the bonding block body 11, so that the first bonding surface 111 alone blocks the through hole 212. The second bonding surface 112 blocks the liquid during the deformation and resistance process, preventing it from flowing from the end of the bonding block body 1 to the first bonding surface 111 and affecting the unidirectional flow effect; the liquid can only flow from the through hole 212 to the first bonding surface 111 and the second bonding surface 112 in sequence.
[0031] Along the suction cup bonding surface 11 , the second bonding surface 112 is arranged at a height greater than the first bonding surface 111 . Specifically, the second bonding surface 112 is arranged along the suction cup bonding surface 11 toward the protruding first bonding surface 111; the suction cup bonding surface 11 is arranged toward the pressure plate 2; so that the second bonding surface 112 can be deformed to contact the third bonding surface 211, and the first bonding surface 111 is only pressed against the third bonding surface 211 with zero pressure, so that the liquid above the bonding block body 1 cannot enter the through hole 212 from the deformation contact point of the second bonding surface 112, and has a better sealing effect; when it is necessary to flow from the through hole 212 to the first bonding surface 111, the second bonding surface 112 and the top of the bonding block body 1, the second bonding surface 112 is deformed to separate the second bonding surface 112 from the third bonding surface 211. Since the area of the second bonding surface 112 is small, the noise generated during the separation of the second bonding surface 112 is small.
[0032] The second bonding surface 112 is provided with a rounded corner 113 at a position where it meets the first bonding surface 111 .
[0033] Along the suction cup contact surface 11, the thickness cc of the contact block body 1 at the first contact surface 111 is between 1.5mm and 2mm. In this embodiment, the thickness is 1.8mm. The contact block body 1 at the first contact surface 111 is provided with a certain thickness to reduce the vibration frequency at this location, thereby achieving a noise reduction effect. By increasing the thickness, the deformation frequency during deformation is reduced, thereby reducing the vibration frequency at this location and achieving a noise reduction effect. The low frequency avoids large deformations that would otherwise generate large noise.
[0034] Along the suction cup contact surface 11, starting from the first contact surface 111, the second contact surface 112 has a height dd of 0.1mm-0.3mm, meaning the second contact surface 112 protrudes from the first contact surface 111 by 0.1mm-0.3mm along the suction cup contact surface 11. In this embodiment, the height is 0.2mm; while making the second contact surface 112 higher than the first contact surface 111, the deformation resistance of the second contact surface 112 maintains a sealing effect and minimizes noise during separation.
[0035] A flat surface 114 is provided on the side of the bonding block body 1 away from the suction cup bonding surface 11;
[0036] A circular arc surface 115 is provided on a side of the bonding block body 1 away from the suction cup bonding surface 11 . The circular arc surface 115 and the flat surface 114 are coaxially provided on the bonding block body 1 from the inside to the outside.
[0037] A pump chamber cover including the suction cup described above, the pump chamber cover also including a pressure plate 2 connected to the suction cup, the pressure plate 2 being provided with a water passage cavity 21 connected to the suction cup, the water passage cavity 21 including a third fitting surface 211 fitted with the suction cup fitting surface 11, and a through hole 212 for liquid circulation, the through hole 212 being provided within the range of the third fitting surface 211. The suction cup also includes a connecting block 3 fixedly provided below the location of the suction cup fitting surface 11 on the fitting block body 1, the connecting block 3 being provided at the axis of the fitting block body 1; the connecting block 3 being fixedly connected to the water passage cavity 21, so that the suction cup fitting surface 11 fits against the third fitting surface 211.
[0038] The third bonding surface 211 is bonded to the first bonding surface 111, and the pressure at the bonding point between the third bonding surface 211 and the first bonding surface 111 is less than the pressure at the bonding point between the third bonding surface 211 and the second bonding surface 112. Preferably, the pressure at the bonding point between the third bonding surface 211 and the first bonding surface 111 is 0 MPa. Preferably, a gap is provided between the third bonding surface 211 and the first bonding surface 111, i.e., the two are not in contact. Vertically projected along the pressure plate 2, the projection of the through hole 212 is located within the projection range of the first bonding surface 211. The bonding pressure only exists at the bonding point between the second bonding surface 112 and the third bonding surface 211; the bonding pressure between the first bonding surface 111 and the third bonding surface 211 is 0, so the noise here is relatively low, achieving the effect of reducing the overall noise generated.
[0039] The second bonding surface 112 is deformed and contacts the third bonding surface 211; along the vertical projection of the pressure plate 2, the projection of the second bonding surface 112 does not intersect with the projection of the through hole 212. During the bonding process of the suction cup bonding surface 11, only the second bonding surface 112 is deformed and bonded, and the bonding position is small, so the sealing effect is good when the bonding state is reached. At the same time, the contact area is small during the deformation process, and the position where noise can be emitted is small, so that the noise can be reduced; at the same time, the through hole 212 is only set within the projection range of the first bonding surface 111, so that the second bonding surface 112 can be deformed and contact the third bonding surface 211, thereby preventing liquid from flowing from the top of the bonding block body 1 to the through hole, and having a good sealing effect. The first bonding surface 111 The bonding pressure between the first bonding surface 111 and the third bonding surface 211 is 0 MPa, causing the first bonding surface 111 to be impacted by the liquid in the through-hole 212, thereby deforming the second bonding surface 112 and releasing the seal. This allows the liquid to flow from the through-hole 212 to the first bonding surface 111, the second bonding surface 112, and the top of the bonding block body 1 in sequence, completing the liquid transfer. The first bonding surface 111 and the second bonding surface 112 operate sequentially without intersecting each other, ensuring that the second bonding surface 112 has a good sealing effect and a low noise level. The through-hole 212 is arranged in a circular array with the axis of the water passage cavity 21 as the center.
[0040] The connecting block 3 is fixedly connected to the water passage cavity 21. The connection between the connecting block 3 and the water passage cavity 21 is located at the axis of the water passage cavity 21. The connecting block 3 is coaxially connected to the water passage cavity 21.
[0041] During the lamination process, the second lamination surface 112 is deformed and lamination is performed on the surface of the third lamination surface 211. The sealing effect is good in the lamination state. At the same time, the lamination area is small. The small contact area during the deformation process reduces the area where noise can be emitted, thereby reducing noise.
[0042] At the same time, the bonding pressure between the first bonding surface 111 and the third bonding surface 211 is 0, so the noise here is relatively small.
[0043] The bonding block body 1 is provided with a certain thickness at the location where the first bonding surface 111 is provided, so as to reduce the vibration frequency at that location, thereby achieving a noise reduction effect;
[0044] In this technical solution, by increasing the thickness, the deformation frequency during the deformation process is reduced, thereby achieving the effect of noise reduction; the low frequency avoids large deformations that would generate large noise;
[0045] This structure can achieve a good noise reduction effect, avoiding the problem of large noise during operation in the prior art; at the same time, the structure is simple and easy to implement, which can effectively avoid the problem of large noise.
[0046] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0047] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.
[0048] The above is a detailed description of an embodiment of a suction cup and a pump chamber cover provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only intended to help understand the core idea of the present invention. It should be pointed out that, for those skilled in the art, without departing from the principles of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.
Claims
1. A suction cup, comprising a fitting block body (1), a suction cup fitting surface (11) being provided on one side of the fitting block body (1), the suction cup being used to be connected to a pressure plate (2) in a pump chamber cover, the pressure plate (2) being provided with a water passage cavity (21) connected to the suction cup, characterized in that: The suction cup fitting surface (11) comprises a first fitting surface (111) and a second fitting surface (112) arranged adjacent to each other; The water passage cavity (21) comprises a third bonding surface (211) bonded to the suction cup bonding surface (11) and a through hole (212) for liquid circulation, wherein the through hole (212) is arranged within the setting range of the third bonding surface (211).
2. The suction cup according to claim 1, wherein The second bonding surface (112) is arranged at the end of the bonding block body (1).
3. The suction cup according to claim 1, wherein Along the suction cup bonding surface (11), the second bonding surface (112) is arranged at a height greater than the first bonding surface (111).
4. The suction cup according to claim 1, wherein The second bonding surface (112) is provided with a rounded corner (113) at a position where it meets the first bonding surface (111).
5. The suction cup according to claim 1, wherein Along the suction cup bonding surface (11), the thickness cc of the bonding block body (1) at the location where the first bonding surface (111) is set is 1.5mm-2mm.
6. The suction cup according to claim 1, wherein Along the suction cup bonding surface (11), with the first bonding surface (111) being the starting point, the height dd of the second bonding surface (112) is set to be 0.1 mm-0.3 mm.
7. The suction cup according to claim 1, wherein A flat surface (114) is provided on the side of the bonding block body (1) away from the suction cup bonding surface (11); A circular arc surface (115) is provided on the side of the bonding block body (1) away from the suction cup bonding surface (11), and the circular arc surface (115) and the flat surface (114) are coaxially arranged on the bonding block body (1) from the inside to the outside.
8. The suction cup according to claim 1, wherein The third fitting surface (211) is fitted with or not in contact with the first fitting surface (111); and along the vertical projection of the pressure plate (2), the projection of the through hole (212) is arranged within the projection range of the first fitting surface (111).
9. The suction cup according to claim 1, wherein: The second fitting surface (112) is deformed to contact the third fitting surface (211); along the vertical projection of the pressure plate (2), the projection of the second fitting surface (112) does not intersect with the projection of the through hole (212).