Temperature rise testing device

Abstract

The utility model provides a temperature rise testing device which comprises a rack and a plurality of fin assemblies, the fin assemblies are arranged on the rack side by side, each fin assembly comprises a limiting part and fins, the limiting parts are movably arranged on the rack so that the distance between the adjacent fin assemblies can be adjusted, the fins are arranged on the limiting parts, and the limiting parts are movably arranged on the rack so that the distance between the adjacent fin assemblies can be adjusted. One end of the fin can abut against the heat dissipation surface of the to-be-tested piece and is in heat conduction connection with the heat dissipation surface of the to-be-tested piece. According to the setting mode, when whether the design parameters of the fins are reasonable or not is detected, the parameters of the fins can be adjusted according to the temperature data obtained in the detection process, the adjusted parameters of the fins are quickly verified by adjusting the limiting pieces, in the process, the verification cost is effectively reduced due to the fact that a first plate piece does not need to be prepared repeatedly, and meanwhile the verification efficiency is improved. And the verification efficiency can be effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of vehicle-mounted power amplifier production testing, and in particular to a temperature rise testing device. Background Art

[0002] When an automotive amplifier is operating, the chips on the PCBA generate a significant amount of heat. Therefore, suitable heat sink fins are required to dissipate the heat and ensure proper operation. When designing the fins for an automotive amplifier, multiple parameters must be considered, such as fin gap, fin height, and fin coverage.

[0003] In the related art, when designing the fins of vehicle-mounted power amplifier products, heat dissipation simulation plus baseline testing is generally used to ensure the reasonable design of the fins of vehicle-mounted power amplifier products. In order to obtain the most suitable fin design parameters, before the baseline test, the R&D personnel will make test first versions with different parameters, conduct baseline tests on the first versions, and read the temperature of each chip through thermocouples and compare it with the junction temperature to determine whether the design is reasonable. In this process, the production of test first versions with different parameters will incur huge costs. At the same time, the repeated disassembly and assembly of thermocouples will also take a high time cost. If the fin design of the current first version cannot meet the heat dissipation requirements, a new batch of first versions will need to be made for testing. This time often takes more than 10 days, which will have a great impact on the time node of the project. Utility Model Content

[0004] In view of this, the present application provides a temperature rise testing device, which can effectively reduce testing costs and improve testing efficiency.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A temperature rise testing device, comprising:

[0007] Stand;

[0008] Multiple groups of fin assemblies are arranged side by side on the platform, and the fin assemblies include a limiter and a fin. The limiter is movably arranged on the platform so that the distance between adjacent fin assemblies can be adjusted. The fin is arranged on the limiter, and one end of the fin can abut against the heat dissipation surface of the test piece and be thermally connected to the heat dissipation surface of the test piece.

[0009] Optionally, the fin is formed by splicing a plurality of heat dissipation blocks.

[0010] Optionally, the heat dissipation block includes:

[0011] The heat sink body comprises a first connecting surface and a second connecting surface which are arranged opposite to each other;

[0012] a first connecting protrusion, protruding from the first connecting surface;

[0013] a first connecting groove, provided on the second connecting surface;

[0014] The first connecting protrusion and the first connecting groove can be interference-fitted, so that the first connecting protrusion and the first connecting groove can be used to connect different heat dissipation blocks.

[0015] Optionally, the heat dissipation block body further includes a third connecting surface and a fourth connecting surface that are arranged opposite to each other;

[0016] The heat dissipation block further comprises:

[0017] a second connecting protrusion, protruding from the third connecting surface;

[0018] a second connecting groove, provided on the fourth connecting surface, wherein the second connecting groove and the second connecting protrusion are capable of interference fit, so that the second connecting protrusion and the second connecting groove can be used to connect different heat dissipation blocks;

[0019] Wherein, an extending direction of the second connecting protrusion is perpendicular to an extending direction of the first connecting protrusion, and an extending direction of the second connecting groove is perpendicular to an extending direction of the first connecting groove.

[0020] Optionally, the first connecting groove is a dovetail groove, and the shape of the first connecting protrusion matches the first connecting groove; and / or

[0021] The second connecting groove is a dovetail groove, and the shape of the second connecting protrusion matches the second connecting groove.

[0022] Optionally, the stand includes:

[0023] A crossbeam, wherein an angle is formed between an extension direction of the crossbeam and a height direction of the platform, and the limiting member is movably provided on the crossbeam;

[0024] There are multiple support columns, and the two ends of the beam are respectively connected to different support columns, and a first adjustment mechanism is provided between the two ends of the beam and the support columns, so that the height of the beam can be adjusted and fixed on the platform.

[0025] Optionally, the first adjustment mechanism includes:

[0026] a first locking bolt;

[0027] A first hole is formed on the support column;

[0028] a second hole, formed at an end of the beam, and capable of being aligned with the first hole;

[0029] The first hole and the second hole both allow the first locking bolt to pass through, and at least one of the first hole and the second hole is an elongated hole, and the extension direction of the elongated hole is the height direction of the rack.

[0030] Optionally, the limiting piece is movably arranged on the cross beam through a second adjusting mechanism, and the second adjusting mechanism comprises:

[0031] A second locking bolt;

[0032] A third hole is arranged on the cross beam, and the third hole is an elongated hole and extends along the length direction of the cross beam;

[0033] A fourth hole is arranged on the limiting piece and can be aligned with the third hole;

[0034] The third hole and the fourth hole both allow the second locking bolt to pass through.

[0035] Optionally, the fin is movably arranged on the limiting piece, and the sliding direction of the fin relative to the limiting piece is the height direction of the rack.

[0036] Optionally, a fifth hole is arranged on the limiting piece and extends along the length direction of the limiting piece, and the fifth hole passes through the limiting piece in the height direction of the rack.

[0037] The fin is movably arranged in the fifth hole.

[0038] The application provides a temperature rise test device, which comprises a rack and a plurality of fin assemblies arranged side by side, wherein the fin is movably arranged on the rack through a limiting piece, so that the gap between adjacent fins and the position of the fin abutting against the test piece can be adjusted by moving the limiting piece; in this way, when verifying whether the design parameters of the fin are reasonable, the fin parameters can be adjusted according to the temperature data obtained in the detection process, and the adjusted fin parameters can be quickly verified by adjusting the limiting piece; in the above process, the verification cost is effectively reduced without repeatedly preparing the first edition, and the verification efficiency is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and those skilled in the art can obtain other drawings according to the provided drawings without any creative effort.

[0040] Figure 1A schematic structural diagram of a temperature rise test device provided in an embodiment of the present application;

[0041] Figure 2 A schematic structural diagram of a temperature rise test device in working state provided in an embodiment of the present application;

[0042] Figure 3 A schematic structural diagram of a heat dissipation block provided in an embodiment of the present application;

[0043] Figure 4 A schematic structural diagram of a fin provided in an embodiment of the present application;

[0044] Figure 5 A schematic structural diagram of a fin assembly is provided for an embodiment of the present application;

[0045] Figure 6 A structural schematic diagram of a limiter is provided for an embodiment of the present application.

[0046] exist Figures 1-6 middle:

[0047] 1-test bench, 2-limiting piece, 3-fin, 4-first locking bolt, 5-crossbeam, 6-heat sink, 7-second locking bolt, 8-test piece, 9-heat sink group in the same row;

[0048] 101-support column, 102-first hole, 201-fourth hole, 202-fifth hole, 501-third hole, 601-first connecting groove, 602-first connecting protrusion, 603-second connecting groove, 604-second connecting protrusion. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] First, it should be noted that the temperature rise test apparatus in the embodiments of this application is suitable for testing whether the fin parameters obtained through simulation or other means during the R&D and design phase of products with heat dissipation requirements (such as automotive power amplifiers) meet the heat dissipation requirements. These fin parameters include: fin height (i.e., the size of the fin in the direction away from the device under test), fin gap, and fin coverage position.

[0051] like Figure 1 and Figure 2As shown, the temperature rise test device in the embodiment of the present application includes a stand 1 and multiple groups of fin assemblies, wherein the stand 1 is the supporting structure of the temperature rise test device, the fin assemblies are arranged side by side on the stand 1, and the fin assemblies include a limiter 2 and a fin 3, the limiter 2 is movably arranged on the stand 1 so that the distance between adjacent fin assemblies can be adjusted; the fin 3 is arranged on the limiter 2, and one end of the fin 3 can abut against the heat dissipation surface of the part to be tested 8 (for example, a car-mounted amplifier product) and be thermally connected to the heat dissipation surface of the part to be tested 8.

[0052] It should be noted that the aforementioned limiter 2 being movably disposed on the stand 1 means that the limiter 2 can be fixed to the stand 1, and the position of the limiter 2 relative to the stand 1 is adjustable. In this way, the distance between adjacent fin assemblies can be adjusted by adjusting the position of the limiter 2 in different fin assemblies relative to the stand 1.

[0053] When the above-mentioned temperature rise test device is in use, the test piece 8 is first placed in a preset position, where the preset position refers to the position where one end of the fin 3 can abut the heat dissipation area of ​​the test piece 8 and is thermally connected to the test piece 8; after the test piece 8 is in the preset position, the fin assembly is adjusted to the initial position according to the preset parameters (that is, the parameters about the gap between the fins 3 obtained by simulation or other means); the test piece 8 is started and the temperature rise of the test piece 8 under different working conditions is detected, and the temperature data is recorded; the distance between adjacent fin assemblies is adjusted according to the temperature data. For example, when the temperature data shows that the temperature of the test piece 8 exceeds the maximum allowable value during the test, it means that the fin 3 structure under the preset parameters cannot meet the heat dissipation requirements of the test piece 8. In this case, the distance between adjacent fin assemblies can be shortened to increase the number of fin assemblies thermally connected to the test piece 8, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0054] As mentioned above, since the fins 3 are movably arranged on the stand 1 through the limit members 2, the gaps between adjacent fins 3 and the positions of the fins 3 against the test piece 8 (i.e., the covering positions of the fins 3 mentioned above) can be adjusted by moving the limit members 2; when using the above-mentioned temperature rise test device to check whether the design parameters of the fins 3 are reasonable, the parameters of the fins 3 can be adjusted according to the temperature data obtained during the detection process, and the adjusted parameters of the fins 3 can be quickly verified by adjusting the limit members 2. In the above process, since there is no need to repeatedly prepare the first version, the verification cost is effectively reduced, and at the same time, the verification efficiency can be effectively improved.

[0055] In some embodiments, the fins 3 are formed by splicing a plurality of heat dissipation blocks 6. Under this setting direction, during the test process, the height of the fins 3 can be adjusted by changing the number of heat dissipation blocks 6, thereby adjusting the heat dissipation area of ​​the fins 3 and optimizing the heat dissipation efficiency of the fins 3. In this way, the number of fins 3 can be further reduced, which is conducive to further reducing costs and improving test efficiency.

[0056] On the basis that the fin 3 is formed by splicing a plurality of heat dissipation blocks 6, the splicing between the plurality of heat dissipation blocks 6 is realized by a convex-groove structure. Figure 3 As shown, the heat sink 6 includes a heat sink body, a first connecting protrusion 602, and a first connecting groove 601. The heat sink body is the main part of the heat sink 6 for achieving heat dissipation, and the first connecting protrusion 602 and the first connecting groove 601 are connecting structures for connecting multiple heat sinks 6. The heat sink body includes a first connecting surface and a second connecting surface arranged opposite each other. The first connecting protrusion 602 is protruding from the first connecting surface, and the first connecting groove 601 is arranged on the second connecting surface. The first connecting protrusion 602 and the first connecting groove 601 can be interference-fitted, so that different heat sinks 6 can be spliced ​​and fixed through the first connecting protrusion 602 and the first connecting groove 601. For example, a fin 3 is formed by splicing two heat sinks 6. For ease of description, the two heat sinks 6 are hereinafter referred to as heat sink No. 1 and heat sink No. 2. When splicing, the first connecting protrusion 602 of the heat sink No. 1 is controlled to interfere with the first connecting groove 601 of the heat sink No. 2, so that the splicing of the fin 3 can be completed. Of course, the above-mentioned fin 3 formed by splicing two heat dissipation blocks 6 is only an exemplary embodiment, which is not a limitation of the present application. In specific implementation, one fin 3 can be formed by splicing three or even more heat dissipation blocks 6, and under the same heat dissipation area, the more heat dissipation blocks 6 there are in the fin 3, the higher the flexibility of adjusting the height of the fin 3.

[0057] Further, such as Figure 3 and Figure 4 As shown, the heat sink 6 further includes a second connecting protrusion 604 and a second connecting groove 603. Specifically, the heat sink body includes a third connecting surface and a fourth connecting surface disposed opposite each other, wherein the second connecting protrusion 604 is protrudingly disposed on the third connecting surface; the second connecting groove 603 is disposed on the fourth connecting surface, and the second connecting groove 603 and the second connecting protrusion 604 are capable of an interference fit, so that the second connecting protrusion 604 and the second connecting groove 603 can be used to connect different heat sinks 6. The method of connecting different heat sinks 6 via the second connecting protrusion 604 and the second connecting groove 603 is similar to the method of connecting the first connecting protrusion 602 and the first connecting groove 601 described above, and therefore, will not be repeated here.

[0058] When fins 3 are formed by splicing different heat sinks 6 together via first connecting protrusions 602, first connecting grooves 601, second connecting protrusions 604, and second connecting grooves 603, the splicing method of the multiple heat sinks 6 can be adjusted according to the contour of the heat dissipation surface of the device under test 8, so that the shape of the end of the fin 3 that is thermally connected to the device under test 8 is consistent or similar to the contour of the heat dissipation surface, thereby ensuring a thermal connection between the fin 3 and the device under test 8. Because the fins 3 do not need to be specially manufactured for the device under test 8, the applicability of the temperature rise test device can be effectively improved, the production cost of the fins 3 can be reduced, and verification efficiency can be improved.

[0059] Furthermore, if Figure 3 As shown, the extension direction of the second connecting protrusion 604 is perpendicular to the extension direction of the first connecting protrusion 602, and the extension direction of the second connecting groove 603 is perpendicular to the extension direction of the first connecting groove 601; under this setting, when the fin 3 is formed by splicing the first connecting protrusion 602, the first connecting groove 601, the second connecting protrusion 604 and the second connecting groove 603, the heat sink 6 used to form the above-mentioned fin 3 can only be disassembled after being moved in a specific direction. In this way, the integrity of the fin 3 can be effectively improved, and the structural strength of the fin 3 can be improved.

[0060] This application does not specifically limit the shapes of the first connecting protrusion 602, the first connecting groove 601, the second connecting protrusion 604, and the second connecting groove 603. In practice, these shapes can be adapted to meet specific needs. For example, the first connecting groove 601 is a dovetail groove, and the shape of the first connecting protrusion 602 matches that of the first connecting groove 601; and / or the second connecting groove 603 is a dovetail groove, and the shape of the second connecting protrusion 604 matches that of the second connecting groove 603.

[0061] In some embodiments, the preset position of the test piece 8 is located on the circumference of the fin 3, specifically on the left or right side of the fin 3. In this arrangement, to ensure a thermally conductive connection between the test piece 8 and the fin 3, a clamping fixture can be provided to apply a force to the test piece 8 toward the fin 3.

[0062] In other embodiments, the preset position of the test piece 8 is located below the fin 3. Compared with the previous embodiment, in this embodiment, due to the existence of gravity, the thermal connection between the fin 3 and the test piece 8 can be guaranteed, thereby omitting the use of clamping tooling.

[0063] Of course, the above description is merely an exemplary description of the preset position of the DUT 8, but the present application is not limited thereto. In a specific embodiment, the preset position of the DUT 8 can be on either side of the fin 3, as long as an effective thermal connection between the DUT 8 and the fin 3 is ensured. For example, the preset position of the DUT 8 can also be above the fin 3.

[0064] Furthermore, depending on the preset position of the test piece 8, the arrangement of the fin assembly and the specific structure of the stand 1 need to be adaptively adjusted. For ease of understanding, the following uses the preset position of the test piece 8 located below the fin 3 as an example to provide an illustrative description of the "arrangement of the fin assembly and the specific structure of the stand 1."

[0065] like Figure 1 and Figure 2 As shown, the stand 1 includes a crossbeam 5 and a plurality of support columns 101, wherein the crossbeam 5 is used to connect the limiter 2. That is, in this embodiment, the limiter 2 is movably arranged on the crossbeam 5 to achieve the connection between the fin assembly and the stand 1. In addition, there is an angle between the extension direction of the crossbeam 5 and the height direction of the stand 1. Exemplarily, there is an angle of 90° between the extension direction of the crossbeam 5 and the height direction of the stand 1. The two ends of the crossbeam 5 are respectively connected to different support columns 101, and a first adjustment mechanism is provided between the two ends of the crossbeam 5 and the support columns 101, so that the crossbeam 5 can be fixed to the stand 1 in an adjustable manner.

[0066] When the temperature rise test device is in use, after the test piece 8 is placed in a preset position, the setting height of the beam 5 can be adjusted according to the height of the test piece 8. For example, when the height of the test piece 8 is higher than the setting height of the beam 5, or when the height of the test piece 8 is close to the setting height of the beam 5, the setting height of the beam 5 can be adjusted to facilitate the fixed connection between the fin assembly and the beam 5.

[0067] As described above, since the arrangement height of the crossbeam 5 can be adaptively adjusted according to the height of the test piece 8, the temperature rise test device in this embodiment is suitable for test pieces 8 of different heights, thereby effectively improving the applicability of the temperature rise test device.

[0068] In an exemplary embodiment, Figure 1 and Figure 2As shown, the first adjustment mechanism includes a first locking bolt 4, a first hole 102, and a second hole, wherein the first hole 102 is opened on the support column 101, and the second hole is opened at the end of the beam 5 and the second hole can be aligned with the first hole 102; in addition, the first hole 102 and the second hole both allow the first locking bolt 4 to pass through, and the first hole 102 is an elongated hole, and the extension direction of the elongated hole is the height direction of the platform 1. Under the above structure, when assembling the beam 5 on the support column 101, it is only necessary to align the second hole at the end of the beam 5 with the first hole 102 on the support column 101, control the first locking bolt 4 to pass through the first hole 102 and the second hole, and then tighten the first locking bolt 4. When it is necessary to adjust the setting height of the beam 5, loosen the first locking bolt 4, control the beam 5 to rise or lower to the adjustment position, and then tighten the first locking bolt 4. Of course, in the specific implementation, the second hole can also be set as a long strip hole, and the extension direction of the long strip hole is the height direction of the stand 1; or, the first hole 102 and the second hole can also be set as long strip holes, and the extension direction of the long strip hole is the height direction of the stand 1.

[0069] It should be understood that the above is only an exemplary implementation of the first adjustment mechanism, but the present application is not limited thereto. For example, the first adjustment mechanism can also be a threaded adjustment mechanism; specifically, of the two support columns 101 connected to the two ends of the beam 5, one is provided with a rotatable threaded column, and the other is provided with a guide column. The threaded column extends in the length direction of the support column 101 and can rotate around its axis; one end of the beam 5 is provided with a threaded hole that can be threadedly connected to the threaded column, and the other end is provided with a guide hole that can cooperate with the guide column. In this way, by rotating the threaded column, the height adjustment of the beam 5 can be achieved.

[0070] In an exemplary embodiment, the stopper 2 is movably mounted on the crossbeam 5 via a second adjustment mechanism. The second adjustment mechanism includes a second locking bolt 7, a third hole 501, and a fourth hole 201. The third hole 501 is formed on the crossbeam 5 and is an elongated hole extending along the length of the crossbeam 5 (the length of the crossbeam 5 refers to the direction of the longest side of the crossbeam 5). The fourth hole 201 is formed on the stopper 2 and is aligned with the third hole 501. Both the third hole 501 and the fourth hole 201 allow the second locking bolt 7 to pass through. Under the above structure, when assembling the stopper 2 on the crossbeam 5, it is only necessary to align the fourth hole 201 at the end of the stopper 2 with the third hole 501 on the crossbeam 5, control the second locking bolt 7 to pass through the third hole 501 and the fourth hole 201, and tighten the second locking bolt 7. When the setting height of the limiting member 2 needs to be adjusted, the second locking bolt 7 is loosened, and the limiting member 2 is controlled to move to the adjustment position along the length direction of the beam 5, and then the second locking bolt 7 is tightened.

[0071] It should be understood that the above is only an exemplary implementation of the second adjustment mechanism, and the present application is not limited thereto. For example, the second adjustment mechanism may also be a sliding structure composed of a protrusion and a slide groove, and the stopper 2 and the crossbeam 5 can be kept stationary by the friction between the protrusion and the slide groove, or the stopper 2 and the crossbeam 5 can be kept stationary by a separately provided limiting structure (e.g., a limiting pin).

[0072] Furthermore, in some embodiments, the fins 3 are slidably mounted on the stopper 2, and the sliding direction of the fins 3 relative to the stopper 2 is the height direction of the stand 1. In this arrangement, the height of some fins 3 in the multiple fin assemblies can be individually adjusted, thereby facilitating thermal connection between the fins 3 and the test piece 8.

[0073] In an exemplary embodiment, Figure 5 and Figure 6 As shown, the limiting member 2 is provided with a fifth hole 202 extending along the length direction of the limiting member 2 . In the height direction of the stand 1 , the fifth hole 202 passes through the limiting member 2 . Moreover, the fin 3 is slidably arranged inside the fifth hole 202 .

[0074] Furthermore, on the basis that the fin 3 is slidably set on the limiter 2, and the fin 3 is formed by splicing different heat sinks 6 through the first connecting protrusion 602, the first connecting groove 601, the second connecting protrusion 604 and the second connecting groove 603, the connection protrusions (the first connecting protrusion 602 and the second connecting protrusion 604) in all the heat sinks 6 used to splice to form the fin 3 are all in the same direction, and the extension direction of the connection protrusions (the first connecting protrusion 602 or the second connecting protrusion 604) located on the side of the heat sink group 9 in the same column (that is, a collection of heat sinks 6 in a certain column in the height direction of the fin 3) is consistent with the height direction of the fin 3. With such a configuration, the height of any heat sink group 9 in the same column of the fin 3 can be adjusted individually, so that the fin 3 can better fit the heat dissipation surface of the device under test 8, so as to improve the thermal connection effect between the fin 3 and the device under test 8. For example, as Figure 3 and Figure 4 As shown, multiple heat sinks 6 in the same column of heat sink group 9 are connected by second connecting protrusions 604 and second connecting grooves 603; the second connecting protrusions 604 of all heat sinks 6 in the same column of heat sink group 9 are located on the same side of the same column of heat sink group 9, and the extension direction of the second connecting protrusions 604 is the height direction of the fins 3.

[0075] Furthermore, based on the above structure, the principle of verifying the parameters of the fin 3 by the temperature rise test device is as follows:

[0076] Place the test piece 8 at a preset position;

[0077] Adjust the horizontal position of the fin assembly and fix it, that is, adjust the position of the limiter 2 relative to the crossbeam 5 by adjusting the second adjustment mechanism;

[0078] Adjust the vertical position of the fins 3 so that the fins 3 abut against the DUT 8 to achieve a thermal connection between the fins 3 and the DUT 8; that is, adjust the height of the heat dissipation block groups 9 in the same row of each fin 3 so that all the heat dissipation block groups 9 in the same row can abut against the DUT 8 to ensure a thermal connection between the fins 3 and the DUT 8;

[0079] According to the test requirements, remove the heat dissipation blocks 6 on some of the fins 3 to keep the heights of different heat dissipation fins 3 consistent or close;

[0080] The heat dissipation effect of the test piece 8 is tested; during the test, the operating conditions of the test piece 8 can be changed, and the height of the fins 3, the number of fins 3 and the distance between different fins 3 can also be adjusted according to the test data.

[0081] After the test is completed, the position of the fin 3 is restored to prepare for the test of other identical or different test pieces 8.

[0082] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0083] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0084] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0085] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0086] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly illustrate the technical solutions and cannot be used to limit the scope of protection of the present application.

[0087] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A temperature rise test device, characterized in that: include: Stand; Multiple groups of fin assemblies are arranged side by side on the platform, and the fin assemblies include a limiter and a fin. The limiter is movably arranged on the platform so that the distance between adjacent fin assemblies can be adjusted. The fin is arranged on the limiter, and one end of the fin can abut against the heat dissipation surface of the test piece and be thermally connected to the heat dissipation surface of the test piece.

2. The temperature rise test device according to claim 1, characterized in that: The fins are formed by splicing a plurality of heat dissipation blocks.

3. The temperature rise test device according to claim 2, characterized in that: The heat dissipation block comprises: The heat sink body comprises a first connecting surface and a second connecting surface which are arranged opposite to each other; a first connecting protrusion, protruding from the first connecting surface; a first connecting groove, provided on the second connecting surface; The first connecting protrusion and the first connecting groove can be interference-fitted, so that the first connecting protrusion and the first connecting groove can be used to connect different heat dissipation blocks.

4. The temperature rise test device according to claim 3, characterized in that: The heat dissipation block body further includes a third connecting surface and a fourth connecting surface that are arranged opposite to each other; The heat dissipation block further comprises: a second connecting protrusion, protruding from the third connecting surface; a second connecting groove, provided on the fourth connecting surface, wherein the second connecting groove and the second connecting protrusion are capable of interference fit, so that the second connecting protrusion and the second connecting groove can be used to connect different heat dissipation blocks; Wherein, an extending direction of the second connecting protrusion is perpendicular to an extending direction of the first connecting protrusion, and an extending direction of the second connecting groove is perpendicular to an extending direction of the first connecting groove.

5. The temperature rise test device according to claim 4, characterized in that: The first connecting groove is a dovetail groove, and the shape of the first connecting protrusion matches the first connecting groove; and / or The second connecting groove is a dovetail groove, and the shape of the second connecting protrusion matches the second connecting groove.

6. The temperature rise test device according to any one of claims 1 to 5, characterized in that: The stand comprises: A crossbeam, wherein an angle is formed between an extension direction of the crossbeam and a height direction of the platform, and the limiting member is movably provided on the crossbeam; There are multiple support columns, and the two ends of the beam are respectively connected to different support columns, and a first adjustment mechanism is provided between the two ends of the beam and the support columns, so that the height of the beam can be adjusted and fixed on the platform.

7. The temperature rise test device according to claim 6, characterized in that: The first adjustment mechanism includes: a first locking bolt; A first hole is formed on the support column; a second hole, formed at an end of the beam, and capable of being aligned with the first hole; The first hole and the second hole both allow the first locking bolt to pass through, and at least one of the first hole and the second hole is an elongated hole, and the extending direction of the elongated hole is the height direction of the stand.

8. The temperature rise test device according to claim 6, characterized in that: The limiting member is movably arranged on the beam through a second adjusting mechanism, and the second adjusting mechanism includes: a second locking bolt; a third hole, formed on the crossbeam, wherein the third hole is an elongated hole and extends along the length direction of the crossbeam; a fourth hole, formed on the limiting member and capable of being aligned with the third hole; The third hole and the fourth hole both allow the second locking bolt to pass through.

9. The temperature rise test device according to claim 6, characterized in that: The fin is slidably arranged on the limiting member, and the sliding direction of the fin relative to the limiting member is the height direction of the platform.

10. The temperature rise test device according to claim 9, characterized in that: The limiting member is provided with a fifth hole extending along the length direction of the limiting member, and the fifth hole passes through the limiting member in the height direction of the stand; Furthermore, the fin is slidably disposed inside the fifth hole.

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