Reaction chamber opening and closing control device

Abstract

The utility model discloses an opening and closing control device for a reaction chamber, which is applied to surface treatment of semiconductor wafers such as etching, film deposition and the like. The semiconductor processing equipment comprises a reaction cavity, a chassis and a lifting mechanism. The opening and closing control device comprises a sealing ring filled between the reaction cavity and the chassis, a pressure sensor embedded in the sealing ring, and three groups of position detection switches for detecting the position of the chassis. The three sets of position detection switches are arranged in an aligned mode in the vertical direction, when the chassis is located at the preset position, the top position detection switch detects the chassis, when the chassis is located at the discharging position, the middle position detection switch detects the chassis, and when the chassis is located at the lowest position, the bottom position detection switch detects the chassis. According to the utility model, the subsequent surface treatment of the semiconductor wafer can be started after the chassis reaches the preset position, namely the reaction cavity is completely closed, so that the operation safety is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a reaction chamber opening and closing control device. Background Art

[0002] Semiconductor wafers are placed in a reaction chamber via a wafer carrier for surface treatments such as etching and thin film deposition. During specific use, the reaction chamber is opened, and after the wafer is placed at the loading position, it moves upward. Subsequent processing can only be started after it has risen to the predetermined position (i.e., the reaction chamber is completely closed and sealed). However, how to determine whether it has risen to the predetermined position remains a key issue to be resolved. Utility Model Content

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a reaction chamber opening and closing control device to start subsequent surface processing of the semiconductor wafer only after determining that the chassis reaches a predetermined position, thereby ensuring the safety of the operation.

[0004] A reaction chamber opening and closing control device, a semiconductor processing equipment includes a reaction chamber, a chassis for closing the inlet and outlet of the reaction chamber, and a lifting mechanism for driving the chassis;

[0005] The opening and closing control device comprises:

[0006] A sealing ring filled between the reaction chamber and the chassis;

[0007] a pressure sensor embedded in the sealing ring; and

[0008] Three groups of position detection switches are used to detect the position of the chassis.

[0009] In one embodiment, the sealing ring is wrapped and fixed on the reaction chamber, and the detection end of the pressure sensor is arranged to face the chassis.

[0010] Furthermore, when the chassis is located at a predetermined position, the detection end of the pressure sensor and the chassis are in contact with each other.

[0011] In one embodiment, a bracket is installed between the three groups of position detection switches, the three groups of position detection switches are vertically aligned, and the position detection switches are located at corresponding sides of the lifting mechanism.

[0012] Furthermore, when the chassis is at a predetermined position, the top position detection switch detects the chassis, and the reaction chamber is in a closed state; when the chassis is at a discharge position, the middle position detection switch detects the chassis, and the reaction chamber is in an open state.

[0013] Furthermore, when the chassis is at the lowest position, the bottom position detection switch detects the chassis and the reaction chamber is in an open state.

[0014] In one embodiment, the position detection switch is a proximity switch; or the position detection switch is an optical infrared switch.

[0015] Compared with the prior art, the beneficial effect of the present invention is that the switch state of the reaction chamber is judged by three position signals, so that the subsequent surface treatment of the semiconductor wafer can be started only after it is determined that the chassis has reached the predetermined position, that is, the reaction chamber is completely closed, thereby ensuring the safety of the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a structural schematic diagram of a reaction chamber opening and closing control device provided in Example 1 of the present utility model.

[0017] Figure 2 Shown Figure 1 Schematic diagram of the mid-chassis in the intended position.

[0018] Figure 3 Shown Figure 1 Schematic diagram of the mid-chassis in the unloading position.

[0019] Figure 4 Shown Figure 1 Schematic diagram of the mid-chassis in its lowest position.

[0020] Figure 5 Shown is a structural schematic diagram of a reaction chamber opening and closing control device provided in Example 2 of the present utility model.

[0021] Description of main component symbols

[0022] 1. Reaction chamber; 2. Chassis; 3. Wafer carrier; 4. Sealing ring; 5. Pressure sensor; 6. Proximity switch; 7. Optical infrared switch.

[0023] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION

[0024] The present invention will be described in detail below with reference to the accompanying drawings. Example 1

[0025] See also Figure 1The present embodiment provides a reaction cavity opening and closing control device, which is applied to the surface treatment such as etching and thin film deposition of semiconductor wafer. The semiconductor processing equipment comprises a reaction cavity 1, a bottom plate 2 for closing the inlet and outlet of the reaction cavity 1, and a lifting mechanism for driving the bottom plate 2. The opening and closing control device comprises a sealing ring 4 filled between the reaction cavity 1 and the bottom plate 2, a pressure sensor 5 embedded in the sealing ring 4, and three sets of position detection switches for detecting the position of the bottom plate 2.

[0026] The three sets of position detection switches are provided with a bracket, and in the present embodiment, the position detection switches are installed at a fixed height based on the bracket, so as to indicate the opening and closing state of the reaction cavity by detecting the position of the bottom plate 2. The three sets of position detection switches are vertically aligned and located at the corresponding side of the lifting mechanism. Please refer to Figure 2 When the bottom plate 2 is located at a predetermined position, the top position detection switch detects the bottom plate 2, and the reaction cavity is in a closed state. At this time, the pressure sensor 5 detects the pressure and sends a switch signal to perform the surface treatment of the semiconductor wafer. Please continue to refer to Figure 3 When the bottom plate 2 is located at a discharge position, the middle position detection switch detects the bottom plate 2, and the reaction cavity is in an open state. At this time, the discharge operation can be performed, that is, the semiconductor wafer is taken out or put into the wafer carrier 3. Please refer to Figure 4 When the bottom plate 2 is located at the lowest position, the bottom position detection switch detects the bottom plate 2, and the reaction cavity is in an open state. Based on the lowest position detection, it is indicated that the lifting mechanism has been operated to the lowest position, so as to avoid damage caused by too low position during operation.

[0027] The position detection switch of the present embodiment adopts a proximity switch 6, and a magnet is provided at the position of the bottom plate 2 facing the proximity switch 6. The magnet and the proximity switch 6 form a magnetic switch signal through magnetic induction, so as to indicate the opening and closing state of the reaction cavity and indirectly determine the position of the bottom plate 2.

[0028] The sealing ring 4 is fixedly covered on the reaction cavity 1, and the detection end of the pressure sensor 5 faces the bottom plate 2. When the bottom plate 2 is located at a predetermined position, the detection end of the pressure sensor 5 abuts against the bottom plate 2. In the present embodiment, when the pressure sensor 5 detects a pressure signal, it indicates that the bottom plate 2 is lifted to a predetermined position under the action of the lifting mechanism. At this time, the surface treatment of the semiconductor wafer can be performed. Embodiment 2

[0029] Please refer to Figure 5This embodiment provides a reaction chamber opening and closing control device, which differs from embodiment 1 in that the position detection switch of this embodiment adopts an optical infrared switch 7, and a light emitter is installed at the position of the chassis 2 facing the optical infrared switch 7. The light emitter and the optical infrared switch 7 cooperate to form an optical path to detect the position of the chassis 2, thereby indicating the opening and closing state of the reaction chamber and indirectly determining the position of the chassis 2.

[0030] In summary, this embodiment has the following advantages: the switch state of the reaction chamber is determined by three position signals, so that the subsequent surface treatment of the semiconductor wafer can be started only after it is determined that the chassis 2 has reached the predetermined position, that is, the reaction chamber is completely closed, thereby ensuring the safety of the operation.

[0031] The naming of the various components involved is based on the functions described in the specification, and is not limited to the specific nouns used in the present invention. Those skilled in the art may also choose other nouns to describe the names of the various components of the present invention.

Claims

1. A reaction chamber opening and closing control device, wherein the semiconductor processing equipment comprises a reaction chamber (1), a chassis (2) for closing an inlet and outlet of the reaction chamber (1), and a lifting mechanism for driving the chassis (2); It is characterized by: The opening and closing control device comprises: A sealing ring (4) filled between the reaction chamber (1) and the base plate (2); a pressure sensor (5) embedded in the sealing ring (4); and Three sets of position detection switches are used to detect the position of the chassis (2).

2. A reaction chamber opening and closing control device according to claim 1, characterized in that: The sealing ring (4) is wrapped and fixed on the reaction chamber (1), and the detection end of the pressure sensor (5) is arranged facing the chassis (2).

3. A reaction chamber opening and closing control device according to claim 2, characterized in that: When the chassis (2) is located at a predetermined position, the detection end of the pressure sensor (5) and the chassis (2) are in contact with each other.

4. A reaction chamber opening and closing control device according to claim 1, characterized in that: Brackets are installed between the three groups of position detection switches. The three groups of position detection switches are aligned vertically, and the position detection switches are located at corresponding side positions of the lifting mechanism.

5. A reaction chamber opening and closing control device according to claim 4, characterized in that: When the chassis (2) is located at a predetermined position, the top position detection switch detects the chassis (2), and the reaction chamber is in a closed state; When the chassis (2) is located at the discharge position, the detection switch at the middle position detects the chassis (2), and the reaction chamber is in an open state.

6. A reaction chamber opening and closing control device according to claim 5, characterized in that: When the chassis (2) is at the lowest position, the bottom position detection switch detects the chassis (2), and the reaction chamber is in an open state.

7. The reaction chamber opening and closing control device according to claim 1, characterized in that: The position detection switch adopts a proximity switch (6); or the position detection switch adopts an optical infrared switch (7).

Images