Wafer detection device for 12-inch wafer full-automatic visual inspection machine

Abstract

The utility model relates to a wafer detection device for a 12-inch wafer full-automatic visual inspection machine, which comprises a wafer carrier used for loading wafers, a rotating mechanism used for driving the wafer carrier to rotate and an irradiation mechanism, and the irradiation mechanism comprises a light source capable of moving along the front-back direction; the wafer turnover device further comprises an adjusting mechanism, the adjusting mechanism comprises an adjusting seat and a power device, and the wafer carrier and / or the rotating mechanism can be arranged on the adjusting seat in a relative sliding mode in the front-back direction. The power device comprises a first power piece and a second power piece. According to the utility model, the wafer carrier and / or the rotating mechanism are / is arranged on the adjusting seat in a back-and-forth sliding manner, and the wafer is driven by the first power piece and the second power piece to perform back-and-forth overturning and left-and-right deflection adjustment, so that the wafer can be ensured to be in a proper visual inspection interval at any angle, visual inspectors can observe conveniently, and the visual inspection efficiency is improved. The accuracy of a detection result is improved.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment, and in particular relates to a wafer detection device for a 12-inch wafer fully automatic visual inspection machine. Background Art

[0002] Wafers refer to the silicon wafers used to make silicon semiconductor circuits. They are formed from silicon ingots through grinding, polishing, and slicing. In reality, the wafers produced by companies are not purely round, but have uniform notches or corners to facilitate wafer positioning. Only in this way can the direction be better determined during the subsequent production and cutting of CPU cores. Therefore, after the wafers are processed, they need to be inspected for microscopic particles, scratches, contamination, etc., which is why manual visual inspection machines have appeared on the market.

[0003] At present, the inspection system of the manual visual inspection machine mainly includes a wafer carrier and an online visual inspection mechanism, in which the wafer is loaded on the wafer carrier. The online visual inspection mechanism mainly includes a strong light that can illuminate the surface of the wafer. During inspection, the light from the strong light is illuminated on the surface of the wafer to observe particles, scratches, contamination, etc. on the surface of the wafer.

[0004] However, in the actual inspection process, it is necessary to rotate the wafer carrier or wafer online in real time to perform inspection at different angles. However, during rotation, the position of each inspection area on the wafer relative to the visual inspection window changes (for example, it moves away from the visual inspection window after being flipped), and at different angles, it is easy to be affected by the clamping structure on the wafer carrier, causing interference to the light beam, which makes it inconvenient for the visual inspector to perform inspection at the visual inspection window, affecting the accuracy of the final inspection results. Summary of the Invention

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved wafer detection device for a 12-inch wafer fully automatic visual inspection machine.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A wafer inspection device for a 12-inch wafer fully automatic visual inspection machine includes a wafer carrier for loading wafers, a rotating mechanism for driving the wafer carrier to rotate, and an irradiation mechanism, wherein the irradiation mechanism includes a light source that can be moved along the front-back direction; the wafer flipping device also includes an adjustment mechanism, the adjustment mechanism includes an adjustment seat and a power device, wherein the wafer carrier and / or the rotating mechanism can be relatively slid along the front-back direction on the adjustment seat; the power device includes a first power member and a second power member, wherein the first power member is used to drive the wafer carrier and / or the rotating mechanism to slide back and forth relative to the adjustment seat and drive the wafer to flip back and forth, and the second power member drives the adjustment seat to rotate around the vertical center line and drive the wafer to deflect left and right, so that the wafer keeps the part to be inspected within the irradiation area formed by the light source at any angle.

[0008] According to a specific implementation and preferred aspect of the present invention, a guide rail extending forward and backward is formed on the adjustment seat, the rotating mechanism is slidably connected to the guide rail, and the wafer carrier is connected to the top of the rotating mechanism and moves synchronously with the rotating mechanism.

[0009] Preferably, the guide rail is in a downwardly arched shape. As the rotating mechanism slides forward and backward along the guide rail, the wafer carrier simultaneously flips forward or backward around the center of the circle corresponding to the guide rail. Here, the forward or backward flipping of the wafer carrier achieves a tilted state to ensure that the light beam illuminates the area to be tested on the wafer, facilitating observation by the visual inspector.

[0010] Specifically, the wafer carrier can flip forward and backward at an angle ranging from 0° to 60°. It should be noted that in some embodiments, the two ends of the curved guide rail are respectively at the lowest and highest points. When the rotating mechanism flips to the lowest point of the curved guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 0°. When the rotating mechanism flips to the highest end of the curved guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 60°.

[0011] Preferably, the adjustment base includes a base plate, and two side plates fixedly mounted on the base plate and spaced apart from each other, wherein the top surface of each side plate is an arc-shaped surface matching the guide rail, and a guide rail is fixedly mounted on the inner wall or outer wall of each side plate, thereby avoiding interference with the movement of the flip structure.

[0012] Preferably, the first power member includes a power screw extending forward and backward, a movable seat sleeved on the power screw and moving forward and backward along the power screw, and a transmission rod, wherein the transmission rod is rotated and connected to the movable seat and the rotating mechanism from both ends.

[0013] Preferably, the rotating mechanism comprises a connecting seat connected with the guide rail, a first driving member for driving the wafer carrier to rotate around the wafer radial direction, and a second driving member for driving the wafer carrier to rotate around the vertical direction center line, wherein the rotation axis of the first driving member intersects with the rotation axis of the second driving member.

[0014] Preferably, the second driving member comprises a motor fixedly arranged on the connecting seat, and a rotating disc connected with the motor output shaft, and the first driving member is arranged on the rotating disc.

[0015] Preferably, the rotation axis of the second driving member coincides with the rotation axis of the second driving member.

[0016] In addition, the irradiation mechanism further comprises a track extending horizontally forward and backward, the light source comprises a lamp holder slidingly connected with the track, a turnover seat rotatingly connected with the lamp holder around the center line extending forward and backward, and a spotlight arranged on the turnover seat.

[0017] Compared with the prior art, the wafer detection device has the following advantages due to the above technical solutions:

[0018] The prior art needs to rotate the wafer carrier or the wafer in real time to implement detection at different angles, but during the rotation, the positions of the detection areas on the wafer relative to the visual inspection window change (for example, move away from the visual inspection window after being turned over), and the light beams are easily disturbed by the clamping structure on the wafer carrier at different angles, which is inconvenient for the visual inspector to perform detection at the visual inspection window and affects the accuracy of the final detection result. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main view of the wafer inspection device used in the 12-inch wafer fully automatic visual inspection machine of the present invention;

[0020] Figure 2 for Figure 1 A magnified schematic diagram of the local structure;

[0021] Figure 3 for Figure 2 Schematic diagram of the right side;

[0022] Figure 4 for Figure 2 Schematic top view of

[0023] Among them: 1. Wafer carrier;

[0024] 2. Rotating mechanism; 20. Connecting seat; 21. First driving member; 210. Connecting bracket; 211. Turning motor; 22. Second driving member; 220. Motor; 221. Turntable;

[0025] 3. Illumination mechanism; 30. Track; 31. Light source; 310. Lamp holder; 311. Flip holder; 312. High-intensity lamp; 313. Yellow light assembly;

[0026] 4. Adjustment mechanism; 40. Adjustment seat; 400. Bottom plate; 401. Side plate; g. Guide rail; 41. Power unit; 411. First power member; a0. Power screw; a1. Moving seat; a2. Transmission rod; 412. Second power member;

[0027] Y. Wafer. DETAILED DESCRIPTION

[0028] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0032] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher horizontal height than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower horizontal height than the second feature. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0033] like Figures 1 to 4 As shown, the wafer inspection device for the 12-inch wafer fully automatic visual inspection machine of this embodiment includes a wafer carrier 1 for loading wafer Y, a rotating mechanism 2 for driving the wafer carrier 1 to rotate, an irradiation mechanism 3 and an adjustment mechanism 4.

[0034] Specifically, the wafer carrier 1 adopts the wafer carrier involved in another patent of the applicant with publication number CN111863671A, so it will not be described here in detail.

[0035] In this example, the rotating mechanism 2 includes a connecting seat 20, a first driving member 21 for driving the wafer carrier 1 to rotate radially around the wafer Y, and a second driving member 22 for driving the wafer carrier 1 to rotate around the vertical center line, wherein the rotation axis of the first driving member 21 and the rotation axis of the second driving member 22 are arranged to intersect.

[0036] In some specific embodiments, the first driving member 21 includes a connecting bracket 210, a flip motor 211 connected to the top of the connecting bracket 210 and arranged on one side of the wafer carrier 1, and a transmission member for connecting the flip motor 211 to a pivot on one side of the wafer carrier 1, wherein the transmission member is a gear or a pulley.

[0037] The second driving member 22 includes a motor 220 fixedly mounted on the connecting base 20, a turntable 221 connected to the output shaft of the motor 220, wherein the bottom of the turntable 221 is horizontal and the side extends obliquely upward from the bottom edge. The connecting bracket 210 is fixedly mounted on the turntable 221. The structure is simple and easy to install and implement.

[0038] In this example, the illumination mechanism 3 comprises a horizontal track 30 extending forward and backward, and a light source 31 movable along the forward and backward direction. The light source 31 comprises a lamp holder 310 slidably connected to the track 30, a tilting base 311 pivotally connected to the lamp holder 310 about a centerline extending forward and backward, and a high-intensity lamp 312 mounted on the tilting base 311. This allows the high-intensity lamp's illumination area to be adjusted vertically, flexibly matching wafers at any angle.

[0039] For ease of implementation, during testing, the lamp holder 310 is fixedly connected to the track 30 by bolts; during adjustment, the lamp holder 310 is adjusted after loosening the bolts; at the same time, the rotational connection structure between the flip seat 311 and the lamp holder 310 can be any conventional rotation structure, which will not be elaborated here.

[0040] At the same time, the light source 31 further includes a yellow light group 313 disposed above the wafer carrier 1 .

[0041] In this example, the adjustment mechanism 4 includes an adjustment seat 40 and a power device 41, wherein the wafer carrier 1 and / or the rotating mechanism 2 can be relatively slidably arranged on the adjustment seat 40 along the front and rear directions; the power device 41 includes a first power member 411 and a second power member 412, wherein the first power member 411 is used to drive the wafer carrier 1 and / or the rotating mechanism 2 to slide back and forth relative to the adjustment seat 40 and drive the wafer to flip back and forth, and the second power member 412 drives the adjustment seat 40 to rotate around the vertical center line and drives the wafer to deflect left and right, so that the wafer keeps the part to be detected within the irradiation area formed by the light source 31 at any angle.

[0042] In some specific embodiments, the adjustment seat 40 includes a base plate 400, two side plates 401 fixedly set on the base plate 400 and spaced side by side, wherein a guide rail g extending forward and backward is formed on the adjustment seat 40, the rotating mechanism 2 is slidably connected to the guide rail g through the connecting seat 20, and the wafer carrier 1 is connected to the top of the rotating mechanism 2 and moves synchronously with the rotating mechanism 2.

[0043] A guide rail g is fixedly mounted on the inner or outer wall of each side panel 401. The guide rail g is curved downward, and the top surface of each side panel 401 is a curved surface that matches the guide rail g. As the rotating mechanism 2 slides back and forth along the guide rail g, the wafer carrier 1 simultaneously flips forward or backward around the center of the circle corresponding to the guide rail. This tilting of the wafer carrier forward or backward ensures that the light beam illuminates the area to be tested on the wafer, facilitating observation by the inspector.

[0044] At the same time, the wafer carrier 1 can be flipped forward and backward at an angle ranging from 0° to 60°. It should be noted that in some embodiments, the two ends of the curved guide rail are respectively at the lowest and highest points. When the rotating mechanism flips to the lowest point of the curved guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 0°. When the rotating mechanism flips to the highest end of the curved guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 60°.

[0045] In addition, the first power member 411 includes a power screw a0 extending forward and backward, a movable seat a1 sleeved on the power screw a0 and moving forward and backward along the power screw a0, and a transmission rod a2, wherein the transmission rod a2 is rotated and connected to the movable seat a1 and the connecting seat 20 at both ends respectively; the second power member 412 adopts a motor, and the output shaft is connected to the base plate 400, and the rotation axis centerline of the second power member 412 coincides with the rotation axis centerline of the second driving member 22.

[0046] In summary, after adopting the wafer detection device, the wafer is loaded on the wafer carrier, and the wafer carrier is driven to rotate by the rotating mechanism to obtain the required detection angle, and then according to the state of the wafer at the current angle, the visual inspector uses the first power member to make the wafer carrier and / or the rotating mechanism slide on the adjustment seat and drive the wafer to flip back and forth, and drives the adjustment seat to rotate around the vertical direction and drive the wafer to deflect left and right through the drive of the second power member, so that the wafer is in a suitable visual inspection range, and ensures that the part of the wafer to be inspected is in the irradiation area formed by the light source. Therefore, compared with the prior art, the utility model is based on the wafer carrier and / or the rotating mechanism sliding back and forth on the adjustment seat, and the wafer is flipped back and forth and deflected left and right under the drive of the first power member and the second power member, so as to ensure that the wafer can be in a suitable visual inspection range at any angle, which is convenient for the visual inspector to observe and improves the accuracy of the detection results.

[0047] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.

Claims

1. A wafer inspection device for a 12-inch wafer fully automatic visual inspection machine, comprising a wafer carrier for loading wafers, a rotating mechanism for driving the wafer carrier to rotate, and an irradiation mechanism, characterized in that: The irradiation mechanism includes a light source that can be moved along the front-back direction; the wafer flipping device also includes an adjustment mechanism, and the adjustment mechanism includes an adjustment seat and a power device, wherein the wafer carrier and / or rotating mechanism can be relatively slidably arranged on the adjustment seat along the front-back direction; the power device includes a first power member and a second power member, wherein the first power member is used to drive the wafer carrier and / or rotating mechanism to slide back and forth relative to the adjustment seat and drive the wafer to flip back and forth, and the second power member drives the adjustment seat to rotate around the vertical center line and drives the wafer to deflect left and right, and the wafer then keeps the part to be detected within the irradiation area formed by the light source at any angle.

2. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 1, characterized in that: A guide rail extending forward and backward is formed on the adjustment seat, the rotating mechanism is slidably connected to the guide rail, and the wafer carrier is connected to the top of the rotating mechanism and moves synchronously with the rotating mechanism.

3. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 2, characterized in that: The guide rail is in the shape of a downwardly arched arc. As the rotating mechanism slides forward and backward along the guide rail, the wafer carrier is synchronously flipped forward or backward around the center of a circle corresponding to the guide rail.

4. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 3, characterized in that: The wafer carrier can be flipped forward and backward at an angle ranging from 0° to 60°.

5. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 3, characterized in that: The adjustment seat includes a base plate, and two side plates fixedly arranged on the base plate and spaced side by side, wherein the top surface of each side plate is an arc-shaped surface matching the guide rail, and a guide rail is fixedly provided on the inner wall or outer wall of each side plate.

6. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 5, characterized in that: The first power member includes a power screw extending forward and backward, a movable seat sleeved on the power screw and moving forward and backward along the power screw, and a transmission rod, wherein the transmission rod is rotatably connected to the movable seat and the rotating mechanism at both ends.

7. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 2, characterized in that: The rotating mechanism includes a connecting seat connected to the guide rail, a first driving member for driving the wafer carrier to rotate around the radial direction of the wafer, and a second driving member for driving the wafer carrier to rotate around the vertical center line, wherein the rotation axis of the first driving member and the rotation axis of the second driving member are arranged to intersect.

8. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 7, characterized in that: The second driving member includes a motor fixedly arranged on the connecting seat and a turntable connected to the output shaft of the motor, and the first driving member is arranged on the turntable.

9. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 7 or 8, characterized in that: The rotation axis of the second power member coincides with the rotation axis of the second driving member.

10. The wafer inspection device for a 12-inch wafer fully automatic visual inspection machine according to claim 1, characterized in that: The illumination mechanism also includes a track extending horizontally forward and backward, and the light source includes a lamp holder slidably connected to the track, a flip seat rotatably connected to the lamp holder around a center line extending in the forward and backward directions, and a strong light set on the flip seat.

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