Wafer bearing device and wet etching equipment

Abstract

The utility model relates to a wafer bearing device and wet etching equipment, the wafer bearing device comprises a transport device and a rotating device, the transport device is configured to drive a wafer to move so as to move the wafer in or out of etching liquid along a first direction, the rotating device comprises a loading assembly and a driving mechanism connected with the loading assembly, and the driving mechanism is configured to drive the wafer to move in or out of the etching liquid along the first direction. The loading assembly is used for loading a wafer, the driving mechanism is configured to drive the loading assembly to rotate around a preset axis extending in the second direction so as to drive the wafer to rotate in the etching liquid, and the first direction and the second direction intersect; wherein the conveying device comprises a first driving device and / or a second driving device, the first driving device is connected with the rotating device, the first driving device is configured to drive the rotating device to move in the first direction, and the second driving device is configured to load the wafer into the loading assembly or take the wafer out of the loading assembly in the first direction. The wet etching equipment comprises the wafer bearing device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer carrying device and wet etching equipment. Background Art

[0002] During the semiconductor integrated circuit manufacturing process, wafers are immersed in a chemical solution (i.e., an etchant) to selectively remove material from the wafer surface. During this process, it takes a certain amount of time for the wafer to enter the etchant and be completely immersed. This results in different immersion times for different areas of the wafer surface, leading to uneven etching, which ultimately affects the functionality and reliability of the chip.

[0003] It should be noted that the information disclosed in the background technology section of the present invention is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0004] The utility model provides a wafer carrying device and wet etching equipment, which can improve the etching uniformity of the wafer.

[0005] According to one aspect of the present invention, there is provided a wafer carrying device, comprising:

[0006] a transport device configured to drive the wafer to move the wafer into or out of the etching solution along a first direction; and

[0007] a rotating device comprising a loading assembly and a driving mechanism connected to the loading assembly, the loading assembly being used to load a wafer, the driving mechanism being configured to drive the loading assembly to rotate about a preset axis extending along a second direction to drive the wafer to rotate in the etching solution, the first direction and the second direction intersecting;

[0008] In which, the transport device includes a first drive device and / or a second drive device: the first drive device is connected to the rotating device, and the first drive device is configured to drive the rotating device to move along a first direction to move the wafer into or out of the etching liquid along the first direction; the second drive device is configured to load the wafer into or take it out of the loading assembly along the first direction to move the wafer into or out of the etching liquid along the first direction.

[0009] In some embodiments, the loading assembly includes a plurality of clamping rods arranged in parallel, the plurality of clamping rods extending along the second direction and arranged around a preset axis, and the plurality of clamping rods jointly define a loading space for loading wafers.

[0010] In some embodiments, the length of the clamping rod along the second direction is adjustable.

[0011] In some embodiments, the loading assembly further includes a first loading portion, and at least two clamping rods are movably disposed on the first loading portion to clamp or release the wafer by moving the at least two clamping rods closer to or farther from each other.

[0012] In some embodiments, a sliding groove is provided on the first loading portion, and one end of at least two clamping rods is inserted into the sliding groove and can slide along the extension direction of the sliding groove.

[0013] In some embodiments, the loading assembly further includes a connecting rod assembly connected to the at least two clamping rods, so that the movement of the connecting rod assembly drives the at least two clamping rods to move closer to or farther from each other.

[0014] In some embodiments, the loading assembly also includes a second loading part spaced apart from the first loading part in a second direction, and the connecting rod assembly includes a first connecting rod and a second connecting rod, the first end of the first connecting rod and the first end of the second connecting rod are movably provided on the second loading part, the second end of the first connecting rod is hinged to a clamping rod, and the second end of the second connecting rod is hinged to another clamping rod, so as to drive the second end of the first connecting rod and the second end of the second connecting rod to approach or move away from each other by moving the first end of the first connecting rod and the first end of the second connecting rod on the second loading part, thereby driving the two clamping rods to approach or move away from each other.

[0015] In some embodiments, the first driving device includes a telescopic rod and a first power source drivingly connected to the telescopic rod, the rotating device is installed on the telescopic rod, and the first power source is configured to drive the telescopic rod to extend and retract along a first direction to drive the rotating device to move along the first direction; and / or, the second driving device includes a robotic arm.

[0016] In some embodiments, the driving mechanism includes a rotating shaft and a second power source drivingly connected to the rotating shaft, the loading assembly is connected to the rotating shaft, the axis of the rotating shaft coincides with the preset axis, and the second power source is configured to drive the rotating shaft to rotate around the axis to drive the loading assembly to rotate around the preset axis.

[0017] According to another aspect of the present invention, a wet etching device is provided. The wet etching device includes the wafer carrying device described above.

[0018] Based on the above technical solution, the utility model provides a transport device to drive the wafer to move along a first direction, immersing the wafer into the etching liquid, or taking the wafer out of the etching liquid; a rotating device is provided to realize the rotation of the wafer around a preset axis extending along the second direction, so that the wafer can be rotated in the etching liquid to change direction, that is, the orientation of the wafer can be adjusted by rotating it, and the etching time difference at different positions during the process of moving the wafer into and out of the etching liquid is balanced, so that the contact time of various parts on the wafer with the etching liquid is basically consistent, thereby ensuring the consistency of the etching degree of the wafer surface, and helping to improve the overall performance of the wafer after etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 The figure shows a structural diagram of an embodiment of a wafer carrying device of the present invention.

[0021] Figure 2 A schematic diagram showing a wafer rotating in an etching tank in an embodiment of the wet etching equipment of the present invention is shown.

[0022] Figure 3 The figure shows a schematic structural diagram of the first loading part in one embodiment of the wafer carrying device of the present invention.

[0023] Figure 4 A schematic diagram of the movement process of the clamping rod in one embodiment of the wafer carrying device of the present invention is shown.

[0024] In the picture:

[0025] 1. Etching groove; 2. Loading assembly; 21. Clamping rod; 22. First loading part; 221. Slide groove; 23. First connecting rod; 24. Second connecting rod; 25. Second loading part; 3. Wafer; 4. Telescopic rod; 5. Rotating shaft; 6. Drive module; 7. Gearbox; 8. Robotic arm. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "center", "lateral", "longitudinal", "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the scope of protection of the present invention.

[0028] refer to Figure 1As shown, in some embodiments of the wafer carrier provided by the present invention, the wafer carrier includes a transport device and a rotating device, the transport device is configured to drive the wafer 3 to move so as to move the wafer 3 into or out of the etching liquid along a first direction, the rotating device includes a loading assembly 2 and a driving mechanism connected to the loading assembly 2, the loading assembly 2 is used to load the wafer 3, and the driving mechanism is configured to drive the loading assembly 2 to rotate around a preset axis extending along a second direction to drive the wafer 3 to rotate in the etching liquid, and the first direction intersects with the second direction. Wherein, the transport device includes a first driving device and / or a second driving device. The first driving device is connected to the rotating device, and the first driving device is configured to drive the rotating device to move along the first direction so as to move the wafer 3 into or out of the etching liquid along the first direction. The second driving device is configured to load the wafer 3 into or remove it from the loading assembly 2 along the first direction so as to move the wafer 3 into or out of the etching liquid along the first direction.

[0029] The transport device moves the wafer 3 along a first direction (e.g., vertically) to immerse the wafer 3 in the etching solution or remove the wafer 3 from the etching solution. During this process, different parts of the wafer 3 contact the etching solution at different times, resulting in different degrees of etching in different parts.

[0030] For example, when the first direction is the vertical direction, the wafer 3 moves vertically downward into the etching liquid, and the lowest point of the wafer 3 always contacts the etching liquid first, while the highest point of the wafer 3 contacts the etching liquid last; after the immersion is completed, the wafer 3 moves vertically upward to leave the etching liquid, and the highest point of the wafer 3 leaves the etching liquid first, while the lowest point of the wafer 3 leaves the etching liquid last.

[0031] Therefore, during a complete etching process of wafer 3, the total time it is in contact with the etching solution gradually increases from the highest point to the lowest point, that is, the degree of etching on its surface gradually deepens from the highest point to the lowest point of wafer 3, resulting in the inability to achieve uniform etching on the surface of wafer 3.

[0032] Therefore, the present application sets a rotating device to realize the rotation of the wafer 3, so that the wafer 3 rotates around a preset axis extending along the second direction (for example, it can be a horizontal direction), and the wafer 3 can be rotated in the etching liquid to change its direction, so that after the wafer 3 is immersed in the etching liquid, the wafer 3 can be rotated to adjust its orientation (for example, the highest point and the lowest point of the wafer 3 are swapped with each other). Thus, in the process of the wafer 3 being immersed in the etching liquid and being taken out from the etching liquid, the position of the wafer 3 that first contacts the etching liquid during the immersion process can be taken out from the etching liquid first, and the position of the wafer 3 that last contacts the etching liquid during the immersion process can be taken out from the etching liquid last, that is, the contact time between each part on the wafer 3 and the etching liquid is basically the same, thereby ensuring that the degree of etching on the surface of the wafer 3 can remain consistent. For details, please refer to Figure 2 The change in the orientation of the triangular mark on the wafer 3 indicates the rotation of the wafer 3 in the etching solution (e.g., counterclockwise rotation). The mark is finally immersed in the etching solution, and by rotating the wafer 3, the mark is moved to the lowest point, so that the mark is finally out of the etching solution.

[0033] In addition, by rotating the wafer 3, the flow of the etching solution on the surface of the wafer 3 can be promoted, reducing the impact of uneven concentration of the etching solution or local bubbles on the etching degree of the wafer 3 surface, and further improving the consistency of the surface etching degree of the wafer 3.

[0034] Compared with the problem of uneven etching caused by static immersion of wafers in related technologies, the present application helps to improve the overall performance of the etched wafers.

[0035] During the movement and rotation of the wafer 3, the loading assembly 2 can provide support for the wafer 3, helping to maintain a stable posture during movement and ensuring the stability of the wafer 3's position within the etching solution, thereby improving the accuracy and consistency of the etching. In addition, when multiple wafers 3 need to be etched at once, the loading assembly 2 can also prevent collisions between the multiple wafers 3 during movement, reducing etching deviations and ensuring the smooth progress of the etching process.

[0036] In some embodiments, the speed at which the wafer 3 moves along the first direction and / or the speed at which the wafer 3 rotates around a preset axis can be adjusted to match different working conditions, thereby adjusting the etching rate and etching degree of the wafer 3 and effectively improving the controllability of the wafer production process.

[0037] In practical applications, the specific settings of the first direction and the second direction can be adjusted according to production needs, for example, based on the layout of the various components of the wafer carrier. Specifically, a preset angle between the first direction and the second direction can be set, such as 60°, 70°, 90°, etc. As long as the wafer 3 can enter and exit the etching solution by moving in the first direction, and can be rotated about a preset axis extending along the second direction to achieve its orientation relative to the first direction, it will be sufficient.

[0038] In some embodiments, the first direction is perpendicular to the second direction.

[0039] Specifically, the first direction may be set as a vertical direction and the second direction may be set as a horizontal direction, so that the wafer 3 can achieve stable movement and rotation.

[0040] In an embodiment in which the first driving device is connected to the rotating device, the first driving device drives the rotating device to move along a first direction, thereby driving the wafer 3 loaded in the loading assembly 2 of the rotating device to be immersed in the etching liquid or to be lifted out of the etching liquid.

[0041] In some embodiments, an etching solution for wafer etching is loaded in the etching tank 1 .

[0042] In embodiments where a second drive mechanism is used to load or remove the wafer 3 into or from the loading assembly 2, the second drive mechanism can be used to directly immerse the wafer 3 in the etching solution or remove the wafer 3 from the etching solution. In embodiments where a second drive mechanism is provided, the loading assembly 2 can be directly placed in the etching tank 1, and the second drive mechanism can transport the wafer 3 directly to the loading assembly 2 for etching and loading. The drive mechanism drives the wafer 3 to rotate, and after etching is completed, the second drive mechanism removes the wafer 3 from the etching solution in the etching tank 1.

[0043] When the loading assembly 2 is located in the etching tank 1 , the driving mechanism can be arranged in the etching tank 1 , or it can be arranged outside the etching tank 1 , as long as the driving relationship between the driving mechanism and the loading assembly 2 can be guaranteed.

[0044] In an embodiment in which both a first drive device and a second drive device are provided, the first drive device and the second drive device can also be coordinated. For example, in the initial state, the loading assembly 2 is located outside the etching tank 1. At this time, the wafer 3 can be loaded into the loading assembly 2 first, and then the first drive device drives the rotating device to move along the first direction until the wafer 3 is immersed in the etching solution of the etching tank 1. After the etching of the wafer 3 is completed, the loading assembly 2 can be kept stationary in the etching solution of the etching tank 1, and the second drive device can be directly used to remove the wafer 3 from the loading assembly 2 (that is, to remove the wafer 3 from the etching solution). In the entire etching process of the wafer 3, the timing of using the first drive device and the second drive device can be flexibly selected. The movement of the wafer 3 along the first direction can be achieved by the first drive device or by the second drive device. This not only helps to coordinate the workflow of each component and improve production efficiency, but also plays a role in redundancy and improves the reliability of production work.

[0045] In the present application, there are various possible implementations of the first driving device and the second driving device.

[0046] refer to Figure 1 As shown, in some embodiments, the first driving device includes a telescopic rod 4 and a first power source driven by the telescopic rod 4, the rotating device is installed on the telescopic rod 4, and the first power source is configured to drive the telescopic rod 4 to extend and retract along a first direction to drive the rotating device to move along the first direction, thereby driving the wafer 3 to move in or out of the etching liquid.

[0047] The telescopic rod 4 can provide higher stability, so that the movement path of the wafer 3 in and out of the etching liquid can be limited by the extension and contraction direction of the telescopic rod 4, thereby reducing the shaking or deviation that may occur during the movement of the wafer 3.

[0048] The first power source can be a common power drive mechanism such as a motor, a hydraulic cylinder, or a pneumatic cylinder.

[0049] The second driving device may include a robot, a transfer vehicle, a drone, etc., as long as it can clamp, transfer and place the wafer 3.

[0050] refer to Figure 1 As shown, in some specific embodiments, the second driving device includes a robot arm 8, which can clamp the wafer 3 and transfer the wafer 3 to the loading assembly 2 through the movement of the robot arm 8 itself.

[0051] refer to Figure 1As shown, in some embodiments, the driving mechanism includes a rotating shaft 5 and a second power source drivingly connected to the rotating shaft 5, the loading assembly 2 is connected to the rotating shaft 5, and the second power source is configured to drive the rotating shaft 5 to rotate around a preset axis to drive the loading assembly 2 to rotate around the preset axis, thereby driving the wafer 3 to rotate in the etching liquid.

[0052] In addition to the rotating shaft structure, other structures capable of achieving rotation may also be used to drive the rotation of the loading assembly 2, such as a crank structure, a belt structure, a gear structure, etc.

[0053] refer to Figure 1 As shown, in some embodiments, the driving mechanism further includes a gear box 7 , the second power source is used to drive the gear box 7 to move, and the output end of the gear box 7 is connected to the rotating shaft 5 to drive the rotating shaft 5 to rotate.

[0054] By setting up the gearbox 7, the output torque, output speed and other parameters of the gearbox 7 can be adjusted by adjusting the type of transmission components in the gearbox 7, the specifications of each component, the matching relationship, etc., thereby improving the controllability of the rotation of the wafer 3.

[0055] In some embodiments, the wafer carrying device includes a driving module 6, and the first power source of the first driving device and the second power source of the rotating device are integrated on the driving module 6. This arrangement helps to simplify the structure of the power system, reduce the installation space required for the equipment, and help improve the overall compactness of the equipment.

[0056] refer to Figure 1 As shown, a bevel gear is mounted on the output end of the drive module 6 and on the end of the telescopic rod 4 near the drive module 6, respectively. The two bevel gears mesh with each other. The drive module 6 outputs torque through the output end and transmits the torque to the telescopic rod 4 via the two bevel gears. The other end of the telescopic rod 4 is connected to the gearbox 7 to further transmit the torque to the gearbox 7. The gearbox 7 then transmits the torque to the rotating shaft 5, thereby driving the rotation of the loading assembly 2.

[0057] At the same time, the driving module 6 provides the telescopic power for the telescopic rod 4. For example, the driving module 6 can be connected to the inside of the telescopic rod 4 through a pipeline, thereby realizing the telescopic movement of the telescopic rod 4 by controlling the air pressure inside the telescopic rod 4.

[0058] In some embodiments, the first power source and the second power source may be the same, for example, both are motors.

[0059] refer to Figure 1 As shown, in some embodiments, the loading assembly 2 includes a plurality of parallel clamping rods 21 , the plurality of clamping rods 21 extend along the second direction, and the plurality of clamping rods 21 are arranged around a preset axis to jointly define a loading space for loading the wafer 3 .

[0060] The multiple parallel clamping rods 21 can provide a more stable support structure for the wafer 3, so that the wafer 3 will not deviate or tilt during the etching process, which helps to improve the etching uniformity of the surface of the wafer 3.

[0061] In response to different production requirements (eg, different quantities and specifications of wafers 3 to be processed), the size of the clamping rod 21 can be adjusted to ensure that the loading assembly 2 can adapt to different loading requirements.

[0062] When the wafer 3 is loaded on the loading assembly 2, the axis of the wafer 3 can be extended along the second direction, so that when the loading assembly 2 drives the wafer 3 to rotate, the wafer 3 rotates around its own axis, which can ensure that it is uniformly etched in the circumferential direction.

[0063] To further improve the loading stability of the wafers 3, in some embodiments, the clamping rod 21 is provided with a plurality of spaced-apart stoppers, which are used to limit the position of the wafers 3. In particular, when the loading assembly 2 needs to load multiple wafers 3, the plurality of spaced-apart stoppers help maintain a predetermined spacing between adjacent wafers 3, thereby ensuring that each wafer 3 is in full and uniform contact with the etching solution.

[0064] The limiting portion can have various forms. For example, in some feasible embodiments, the limiting portion includes a slot.

[0065] In addition, the specifications and quantity of the clamping rods 21 can also be adjusted according to actual needs to ensure the loading and unloading stability of the wafer 3, or to reduce the loading and unloading time of the wafer 3 and improve the overall efficiency of the production line.

[0066] By setting the extension direction of the clamping rod 21 to be consistent with the direction of the rotation axis of the loading assembly 2, the support force received by the wafer 3 from the clamping rod 21 during the rotation process is perpendicular to the second direction, so that the wafer 3 can be provided with circumferential support through multiple clamping rods 21, thereby ensuring the stability of the wafer 3 during the rotation process.

[0067] In some embodiments, the length of the clamping rod 21 is adjustable along the second direction.

[0068] By adjusting the length of the clamping rods 21, the size of the loading space enclosed between the multiple clamping rods 21 can be changed. Thus, the size of the loading space can be adjusted according to actual needs, making the loading assembly 2 suitable for loading different numbers of wafers 3, thereby improving its versatility.

[0069] Specifically, the clamping rod 21 can be configured as a telescopic structure or a slide rail structure.

[0070] refer to Figure 1 and Figure 3As shown, in some embodiments, the loading assembly 2 further includes a first loading part 22, and at least two clamping rods 21 are movably provided on the first loading part 22, so as to clamp the wafer 3 or release the clamping of the wafer 3 by moving the at least two clamping rods 21 closer to or farther away from each other.

[0071] At least two clamping rods 21 can be moved closer to or further away from each other, that is, the distance between at least two clamping rods 21 is adjustable. Thus, on the one hand, by adjusting the distance, wafers 3 of different sizes can be conveniently positioned and clamped, allowing the device to adapt to processing wafers 3 of different specifications and batches, thereby improving the versatility and flexibility of the device. On the other hand, by clamping or unclamping the wafers 3, the wafers 3 can be conveniently loaded into or removed from the installation space, thereby improving the loading and unloading efficiency of the wafers 3.

[0072] In some embodiments, two adjacent clamping rods 21 form a group around the loading space. By moving the two clamping rods 21 in any group closer together or further apart, the loading assembly 2 can clamp or release the wafer 3, while the other clamping rods 21 in the loading assembly 2 support the wafer 3. By opening a group of clamping rods 21 located at different positions around the loading space, wafers 3 can be loaded into or removed from the installation space from different positions.

[0073] There are various options for the connection between the first loading portion 22 and the clamping rod 21. For example, a certain number of positioning holes can be provided on the first loading portion 22, and the clamping rod 21 can be installed in each of the positioning holes. By installing the clamping rod 21 in different positioning holes, the distance between one clamping rod 21 and another can be adjusted. Alternatively, a limiting slot can be provided on the first loading portion 22, and the distance between the clamping rod 21 and the other clamping rods 21 can be adjusted by changing the position of the clamping rod 21 in the positioning slot.

[0074] In some possible embodiments, reference Figure 1 and Figure 3 As shown, the first loading portion 22 is provided with a slide groove 221, and one end of at least two clamping rods 21 is inserted into the slide groove 221 and can slide along the extension direction of the slide groove 221. Therefore, the distance between the at least two clamping rods 21 can be adjusted by sliding the clamping rods 21 in the slide groove 221.

[0075] In some embodiments, the extending direction of the sliding groove 221 is perpendicular to the first direction and / or the second direction.

[0076] Specifically, refer to Figure 1As shown, in some possible embodiments, the first direction is the x direction in the figure, the second direction is the y direction in the figure, and the extension direction of the sliding groove 221 is the z direction in the figure. That is, the clamping rod 21 is arranged perpendicularly to the first loading part 22, and the two clamping rods 21 can be opened or clamped in the horizontal direction relative to the first loading part 22.

[0077] The number and arrangement of the sliding grooves 221 can be flexibly adjusted.

[0078] For example, a sliding groove 221 corresponding to the number of clamping rods 21 can be arranged, and each clamping rod 21 slides in the corresponding sliding groove 221.

[0079] For details, refer to Figure 3 As shown, the first loading part 22 is provided with four sliding grooves 221 extending in the horizontal direction, and the four clamping rods 21 are correspondingly inserted into the four sliding grooves 221. In the vertical direction, the two clamping rods 21 located above are a first group, and the two clamping rods 21 located below are a second group. The two clamping rods 21 in each group can be independently opened or clamped in the horizontal direction. Therefore, before etching the wafer 3, the two clamping rods 21 in the first group can be opened to load the wafer 3, and after the wafer 3 is etched (that is, the loading assembly 2 has been rotated once), the two clamping rods 21 in the second group can be opened to take out the wafer 3.

[0080] Alternatively, only the sliding grooves 221 corresponding to the two movable clamping rods 21 can be arranged, and the remaining clamping rods 21 can be arranged in fixed connection with the first loading part 22 to support the wafer 3. In this case, after the wafer 3 is etched (the loading assembly 2 has been rotated once), the wafer 3 is removed from the etching liquid, and the loading assembly 2 is rotated again until the two movable clamping rods 21 are rotated to a position facilitating the removal of the wafer 3 (for example, the opening of the two clamping rods 21 is at least directed obliquely upward), and then the wafer 3 is removed from the loading space.

[0081] Figure 3 The multiple dots along the sliding groove 221 in the figure show the positioning points of the clamping rod 21 in the sliding groove 221. Different positioning points correspond to the clamping positions of wafers 3 of different specifications. For example, as shown in the figure, Figure 3 As shown, several positioning points located on the same circle correspond to the clamping positions of wafers 3 of one specification.

[0082] The positioning points can be physical engagement points arranged on the sliding groove 221, or movement points of the clamping rod 21 controlled by other mechanisms. The number of positioning points can be set according to actual production needs to meet the clamping of wafers 3 of different specifications.

[0083] Alternatively, fewer slide grooves 221 can be provided, and at least two clamping rods 21 can be provided in the same slide groove 221, so that at least two clamping rods 21 can slide toward both ends of the slide groove 221 to move away, or slide toward the middle of the slide groove 221 to move closer.

[0084] In other embodiments, the slide groove 221 extends at an angle of 45 degrees or 60 degrees relative to the horizontal direction, as long as the distance between at least two clamping rods 21 can be increased or decreased when sliding along the slide groove 221 .

[0085] There are many ways to achieve the movement of the clamping rod 21, such as a spring drive mechanism, a connecting rod drive mechanism, etc.

[0086] In some feasible embodiments, the loading assembly 2 further includes a connecting rod assembly, which is connected to the at least two clamping rods 21 so as to drive the at least two clamping rods 21 to move closer to or away from each other through the movement of the connecting rod assembly.

[0087] Specifically, in some embodiments, the loading assembly 2 also includes a second loading part 25, the connecting rod assembly includes a first connecting rod 23 and a second connecting rod 24, the first end of the first connecting rod 23 and the first end of the second connecting rod 24 are movably provided on the second loading part 25, the second end of the first connecting rod 23 is hinged to a clamping rod 21, and the second end of the second connecting rod 24 is hinged to another clamping rod 21, and the second loading part 25 is spaced apart from the first loading part 22, so as to drive the second end of the first connecting rod 23 and the second end of the second connecting rod 24 to approach or move away from each other by moving the first end of the first connecting rod 23 and the first end of the second connecting rod 24 on the second loading part 25, thereby driving the two clamping rods 21 to approach or move away from each other.

[0088] That is, by controlling the movement of the first end of the first connecting rod 23 and the first end of the second connecting rod 24, the second end of the first connecting rod 23 and the second end of the second connecting rod 24 are driven to move, thereby adjusting the distance between the two clamping rods 21. The first end of the first connecting rod 23 and the first end of the second connecting rod 24 can move in a variety of ways, and can move separately or synchronously.

[0089] In some possible embodiments, reference Figure 1As shown, the second loading portion 25 is arranged parallel to the first loading portion 22, and the first end of the first connecting rod 23 and the first end of the second connecting rod 24 are hinged, so that the hinge point of the first connecting rod 23 and the second connecting rod 24, the second end of the first connecting rod 23, and the second end of the second connecting rod 24 respectively form the three vertices of a triangle, and the first connecting rod 23 and the second connecting rod 24 respectively form two sides of the triangle. Therefore, while the distance between the second loading portion 25 and the first loading portion 22 remains unchanged, changing the position of the hinge point on the second loading portion 25 can change the size of the angle between the first connecting rod 23 and the second connecting rod 24, and simultaneously change the distance between the second end of the first connecting rod 23 and the second end of the second connecting rod 24 (the length of the other side of the triangle), thereby changing the distance between the corresponding two clamping rods 21.

[0090] That is, one set of connecting rods (the first connecting rod 23 and the second connecting rod 24 ) corresponds to one set of movable clamping rods 21 (two clamping rods 21 that can move closer to or farther from each other). Specifically, the number of connecting rods in the connecting rod assembly corresponds to the number of movable clamping rods 21 .

[0091] A specific embodiment of the wafer carrier device of the present invention is described below:

[0092] In this embodiment, the wafer carrier is applied to a wet etching device.

[0093] refer to Figure 1 As shown, the wafer carrier device of the present application includes a transport device and a rotation device. The transport device is configured to drive the wafer 3 to move in a first direction to move the wafer 3 into or out of the etching liquid, and the rotation device is configured to drive the wafer 3 to rotate about a preset axis extending in a second direction to drive the wafer 3 to rotate in the etching liquid, with the first direction and the second direction intersecting.

[0094] In this embodiment, the wet etching equipment includes a wafer carrying device and an etching tank 1 for containing etching liquid.

[0095] In this embodiment, the transport device includes a first drive device and a second drive device. The first drive device includes a telescopic rod 4 and a first power source drivingly connected to the telescopic rod 4. The rotating device is mounted on the telescopic rod 4. The first power source is configured to drive the telescopic rod 4 to extend and retract in a first direction, thereby driving the rotating device to move in the first direction.

[0096] In the embodiment, the rotating device comprises a gear box 7, a loading assembly 2 for loading the wafer 3, a rotating shaft 5, a second power source in driving connection with the rotating shaft 5, the gear box 7 being connected to one end of the telescopic rod 4 away from the driving module 6, the output end of the gear box 7 being in driving connection with the rotating shaft 5, and the loading assembly 2 being connected with the rotating shaft 5. The second power source is configured to drive the gear box 7 to operate, thereby driving the rotating shaft 5 to rotate around the preset axis, so as to drive the loading assembly 2 to rotate around the preset axis.

[0097] In the embodiment, the second driving device comprises a mechanical arm 8. The mechanical arm 8 can perform the clamping action on the wafer 3 and can move after clamping the wafer 3.

[0098] In the embodiment, the wafer carrying device is further provided with the driving module 6, and the first power source and the second power source are integrally arranged on the driving module 6.

[0099] The driving module 6 outputs driving force, which is transmitted to the above-mentioned components and drives the loading assembly 2 to move, thereby realizing the up-and-down movement and rotation of the wafer 3 in the etching groove 1.

[0100] In the embodiment, the first direction is the vertical direction, and the second direction is the horizontal direction.

[0101] The loading assembly 2 comprises a first loading part 22 and four clamping rods 21 arranged in parallel. The first loading part 22 is arranged in the vertical direction, and the four clamping rods 21 each extend in the horizontal direction. The four clamping rods 21 form a loading space for loading the wafer 3. The first loading part 22 is provided with four sliding grooves 221 extending in the horizontal direction. The four sliding grooves 221 are distributed in the circumferential direction of the loading space, and the four clamping rods 21 are correspondingly inserted into the four sliding grooves 221.

[0102] The loading assembly 2 further comprises a linkage assembly and a second loading part 25. The linkage assembly comprises a first linkage rod 23 and a second linkage rod 24. The first end of the first linkage rod 23 and the first end of the second linkage rod 24 are hingedly connected to form a hinge part, and the hinge part is movably arranged on the second loading part 25. The second end of the first linkage rod 23 is hingedly connected to one clamping rod 21, and the second end of the second linkage rod 24 is hingedly connected to another clamping rod 21. In the horizontal direction, the second loading part 25 is arranged in parallel with and spaced apart from the first loading part 22, so as to drive the second ends of the first linkage rod 23 and the second linkage rod 24 to move inward or outward relative to each other by moving the hinge part on the second loading part 25 in the vertical direction, thereby driving the two clamping rods 21 to move closer to or farther away from each other.

[0103] In the embodiment, the driving module 6 is further in driving connection with the hinge part, so as to control the movement of the first linkage rod 23 and the second linkage rod 24.

[0104] In the embodiment, the four clamping rods 21 include two clamping rods 21a located at the upper initial position and two clamping rods 21b located at the lower initial position.

[0105] Next, referring to Figure 1 and Figure 4 , the working process of the wafer carrying device of the present application is introduced, which at least includes the following steps:

[0106] (1) The loading assembly 2 of the rotating device carries the wafer 3, the driving module 6 drives the telescopic rod 4 to extend so that the loading assembly 2 is lowered into the etching tank 1, and the wafer 3 is completely immersed in the etching liquid, as shown in the state diagram ① in Figure 4 ;

[0107] (2) The driving module 6 drives the first connecting rod 23 and the second connecting rod 24 to move, so that the two clamping rods 21a slowly push in and clamp the wafer 3, as shown in the state diagram ② in Figure 4 ;

[0108] (3) The driving module 6 drives the loading assembly 2 to rotate 180°, so that the wafer 3 is rotated, as shown in the state diagram ③ in Figure 4 ;

[0109] (4) The driving module 6 drives the first connecting rod 23 and the second connecting rod 24 to move, so that the two clamping rods 21b located at the upper position in this state are pushed out to the two sides to release the contact with the wafer 3, as shown in the state diagram ④ in Figure 4 ;

[0110] (5) The loading assembly 2 keeps supporting the wafer 3, after the preset etching time is over, the driving module 6 drives the telescopic rod 4 to retract, so that the loading assembly 2 is raised and the wafer 3 is taken out, as shown in the state diagram ⑤ in Figure 4 .

[0111] In the embodiment, the four clamping rods 21 only clamp the wafer 3 in the process of rotating the wafer 3. At other times, only the two clamping rods 21 located at the lower position are used for supporting, and the other two clamping rods 21 located at the upper position are in the open state, so as to ensure that each part of the wafer 3 can contact the etching liquid as much as possible, and ensure the uniformity of etching,

[0112] Through the description of the plurality of embodiments of the wafer carrying device of the present application, it can be seen that the wafer carrying device of the present application at least has the following advantages:

[0113] The first driving device and the second driving device are arranged to realize the movement of the wafer in the first direction, which helps to improve the production efficiency, and also plays a role of redundancy guarantee, and improves the reliability of production work;

[0114] The rotating device is arranged to realize the rotation of the wafer in the etching liquid,

[0115] On the one hand, the position that contacts the etching liquid firstly is made to leave the etching liquid last (or vice versa), so as to ensure that the time for each position on the wafer surface to contact the etching liquid is consistent, and the uniformity of etching on the wafer surface can be improved,

[0116] On the other hand, the rotation of the wafer can also promote the flow of the etching liquid, which helps to achieve uniform distribution of the etching liquid on the wafer surface and reduce the etching unevenness caused by uneven concentration of the etching liquid or bubbles in the liquid;

[0117] The distance between the plurality of clamping rods of the loading assembly is variable, and the length of the clamping rod is adjustable, so that the loading assembly can adapt to the clamping of wafers of different sizes and quantities, thereby improving the versatility and flexibility of the equipment;

[0118] The driving module is provided, the first power source and the second power source are arranged integrally, the structure of the power system is simplified, and the space required by the equipment is reduced.

[0119] Based on the wafer bearing device described above, the utility model also provides a kind of wet etching equipment, and the wet etching equipment includes the wafer bearing device described above.The positive technical effect of wafer bearing device in each embodiment described above is also applicable to wet etching equipment, which will not be repeated here.

[0120] Finally, it should be noted that: the above examples are only used to illustrate the technical scheme of the utility model and not to limit it; Although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that: without departing from the principles of the utility model, the specific implementation of the utility model can still be modified or some technical features can be replaced, and these modifications and equivalent replacements should be covered in the technical scheme range of the utility model claimed.

Claims

1. A wafer carrying device, characterized in that: include: A transport device configured to drive the wafer (3) to move so as to move the wafer (3) into or out of the etching liquid along a first direction; and A rotating device, comprising a loading assembly (2) and a driving mechanism connected to the loading assembly (2), the loading assembly (2) being used to load the wafer (3), the driving mechanism being configured to drive the loading assembly (2) to rotate around a preset axis extending along a second direction, so as to drive the wafer (3) to rotate in the etching liquid, the first direction and the second direction intersecting; The transport device includes a first drive device and / or a second drive device: the first drive device is connected to the rotating device, the first drive device is configured to drive the rotating device to move along the first direction to move the wafer (3) into or out of the etching liquid along the first direction, and the second drive device is configured to load the wafer (3) into or out of the loading assembly (2) along the first direction to move the wafer (3) into or out of the etching liquid along the first direction.

2. The wafer carrier device according to claim 1, wherein: The loading assembly (2) comprises a plurality of clamping rods (21) arranged in parallel, the plurality of clamping rods (21) extending along the second direction, and the plurality of clamping rods (21) arranged around the preset axis, and the plurality of clamping rods (21) jointly define a loading space for loading the wafer (3).

3. The wafer carrier device according to claim 2, characterized in that: Along the second direction, the length of the clamping rod (21) is adjustable.

4. The wafer carrying device according to claim 2, wherein: The loading assembly (2) further comprises a first loading portion (22), on which at least two clamping rods (21) are movably arranged, so as to clamp the wafer (3) or release the clamping of the wafer (3) by moving the at least two clamping rods (21) closer to or farther from each other.

5. The wafer carrying device according to claim 4, characterized in that: A sliding groove (221) is provided on the first loading portion (22), and one end of at least two clamping rods (21) is inserted into the sliding groove (221) and can slide along the extension direction of the sliding groove (221).

6. The wafer carrying device according to claim 4, characterized in that: The loading assembly (2) further comprises a connecting rod assembly, wherein the connecting rod assembly is connected to at least two of the clamping rods (21) so as to drive the at least two clamping rods (21) to move closer to or farther from each other through the movement of the connecting rod assembly.

7. The wafer carrying device according to claim 6, characterized in that: The loading assembly (2) further includes a second loading portion (25) spaced apart from the first loading portion (22) in the second direction, and the connecting rod assembly includes a first connecting rod (23) and a second connecting rod (24), wherein the first end of the first connecting rod (23) and the first end of the second connecting rod (24) are movably arranged on the second loading portion (25), the second end of the first connecting rod (23) is hinged to one of the clamping rods (21), and the second end of the second connecting rod (24) is hinged to the other of the clamping rods (21), so as to drive the second end of the first connecting rod (23) and the second end of the second connecting rod (24) to move closer to or farther from each other by moving the first end of the first connecting rod (23) and the first end of the second connecting rod (24) on the second loading portion (25), thereby driving the two clamping rods (21) to move closer to or farther from each other.

8. The wafer carrying device according to claim 1, wherein: The first driving device comprises a telescopic rod (4) and a first power source drivingly connected to the telescopic rod (4); the rotating device is mounted on the telescopic rod (4); the first power source is configured to drive the telescopic rod (4) to extend and retract along the first direction, so as to drive the rotating device to move along the first direction; and / or the second driving device comprises a robotic arm.

9. The wafer carrying device according to claim 1, wherein: The driving mechanism comprises a rotating shaft (5) and a second power source drivingly connected to the rotating shaft (5); the loading assembly (2) is connected to the rotating shaft (5); the axis of the rotating shaft (5) coincides with the preset axis; the second power source is configured to drive the rotating shaft (5) to rotate around the axis, thereby driving the loading assembly (2) to rotate around the preset axis.

10. A wet etching device, characterized in that: It comprises the wafer carrying device according to any one of claims 1 to 9.

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