Adjustable wafer clamp and dispergation machine

Abstract

The utility model belongs to the technical field of dispergation machines, and particularly discloses an adjustable wafer clamp and a dispergation machine, the adjustable wafer clamp comprises a base, a first wafer suction cup, a second wafer suction cup, a first wafer positioner and a second wafer positioner, the first wafer suction cup and the second wafer suction cup have different sizes, so that the adjustable wafer clamp can flexibly adapt to different wafer sizes; according to the utility model, through the positioning bolt holes and the positioning through holes, the disassembly and assembly can be conveniently completed by using bolts, and the connection is stable; and meanwhile, the wafer positioner can further assist the wafer to realize accurate positioning, so that the adjustable wafer clamp and the dispergator can adapt to wafers with different sizes and realize stable installation.

Description

Technical Field

[0001] The utility model belongs to the technical field of adhesive dissolving machines, and particularly relates to an adjustable wafer clamp and an adhesive dissolving machine. Background Art

[0002] A thermal disintegrator is a device specifically designed for removing adhesives through a pyrolysis process. This machine is primarily used in industrial production, particularly in the semiconductor, microelectronics, and optical component manufacturing industries, to remove temporary protective adhesives used during the manufacturing process, such as photoresists and other types of heat-sensitive adhesives. The operating principle of a thermal disintegrator is based on the thermal instability of adhesives. When heated to a certain temperature, the adhesive's molecular chains break, causing it to decompose into gas or smaller solid particles, which can then be easily removed from the substrate surface.

[0003] Since wafers come in a variety of sizes, different disassembly machines are often required to accommodate wafers of different sizes, resulting in increased costs. Some existing disassembly machines use a single fixture to secure wafers of varying sizes, but this can be unstable. Other disassembly machines utilize interchangeable fixtures, allowing for flexible adaptation to various wafer sizes. However, assembly and disassembly are inconvenient, impacting work efficiency. Utility Model Content

[0004] The technical problem to be solved by the present invention is to overcome the technical problem that the wafer clamp of the disassembly machine in the prior art is unstable or inconvenient to assemble and disassemble, thereby proposing an adjustable wafer clamp and a disassembly machine.

[0005] An adjustable wafer clamp comprises a base, a first wafer suction cup, a second wafer suction cup, a first wafer positioner and a second wafer positioner; the first wafer positioner and the second wafer positioner are different in size; a plurality of first positioning bolt holes and a plurality of second positioning bolt holes are provided on the upper side of the base, for fixing the first wafer suction cup and the second wafer suction cup on the base through the first positioning through hole and the second positioning through hole respectively; mounting holes are provided at both ends of the first wafer positioner for mounting on two adjacent first positioning through holes of the first wafer suction cup, and mounting holes are provided at both ends of the second wafer positioner for mounting on two adjacent second positioning through holes of the second wafer suction cup.

[0006] Furthermore, it also includes a heating rod, which is fixed to the lower side of the base; a heating rod reserved hole is set on the side of the base for connecting the heating rod.

[0007] Furthermore, it also includes a thermocouple, which is fixed on the lower side of the base; a thermocouple reserved hole is set on the side of the base for connecting the thermocouple.

[0008] Furthermore, the first wafer positioner and the second wafer positioner are in the shape of curved bars, respectively fitting the edges of the first wafer suction cup and the second wafer suction cup.

[0009] Furthermore, six first positioning through holes are provided and are evenly distributed on the edge of the first wafer suction cup.

[0010] Furthermore, eight second positioning through holes are provided and are evenly distributed on the edge of the second wafer suction cup.

[0011] Furthermore, the first wafer suction cup is an eight-inch wafer suction cup.

[0012] Furthermore, the second wafer chuck is a twelve-inch wafer chuck.

[0013] A disintegrator, wherein the wafer clamp of the disintegrator is the above-mentioned adjustable wafer clamp.

[0014] Furthermore, it also includes a placement platform, the upper side of the platform is provided with a guide rail, the base is installed on the guide rail and can move along the guide rail.

[0015] Beneficial effects: The utility model discloses an adjustable wafer clamp and disassembly machine, comprising a base, a first wafer suction cup, a second wafer suction cup, a first wafer positioner and a second wafer positioner. The first wafer suction cup and the second wafer suction cup have different sizes, so that they can flexibly adapt to different wafer sizes; the utility model uses positioning bolt holes and positioning through holes, and can easily complete disassembly and assembly using bolts, and the connection is firm; at the same time, the wafer positioner can further assist the wafer to achieve precise positioning, so that the adjustable wafer clamp and disassembly machine can adapt to wafers of different sizes and achieve firm installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic diagram of the installation structure of the first wafer suction cup of the present invention;

[0018] Figure 2 This is a schematic diagram of the installation structure of the second wafer suction cup of the present invention;

[0019] Figure 3 This is a schematic diagram of the base structure of the utility model;

[0020] Figure 4It is a schematic diagram of the base guide rail installation structure of the present invention.

[0021] Description of reference numerals:

[0022] 1. Base; 11. First positioning bolt hole; 12. Second positioning bolt hole; 2. First wafer suction cup; 21. First positioning through hole; 22. First wafer locator; 3. Second wafer suction cup; 31. Second positioning through hole; 32. Second wafer locator; 4. Guide rail. DETAILED DESCRIPTION

[0023] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0024] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0025] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0026] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0028] Example 1:

[0029] This embodiment discloses an adjustable wafer clamp, including a base 1, a first wafer suction cup 2, a second wafer suction cup 3, a first wafer positioner 22 and a second wafer positioner 32; the first wafer positioner 22 and the second wafer positioner 32 are different in size; a plurality of first positioning bolt holes 11 and a plurality of second positioning bolt holes 12 are provided on the upper side of the base 1, for fixing the first wafer suction cup 2 and the second wafer suction cup 3 on the base 1 through the first positioning through hole 21 and the second positioning through hole 31 respectively; mounting holes are provided at both ends of the first wafer positioner 22 for being installed on the two adjacent first positioning through holes 21 of the first wafer suction cup 2, and mounting holes are provided at both ends of the second wafer positioner 32 for being installed on the two adjacent second positioning through holes 31 of the second wafer suction cup 3.

[0030] The present embodiment discloses an adjustable wafer clamp and disassembly machine, comprising a base 1, a first wafer suction cup 2, a second wafer suction cup 3, a first wafer positioner 22 and a second wafer positioner 32. The first wafer suction cup 2 and the second wafer suction cup 3 have different sizes, so that they can flexibly adapt to different wafer sizes. The utility model uses positioning bolt holes and positioning through holes to easily complete disassembly and assembly using bolts, and the connection is firm. At the same time, the wafer positioner can further assist the wafer in achieving precise positioning, so that the adjustable wafer clamp and disassembly machine can adapt to wafers of different sizes and achieve firm installation.

[0031] As a further improvement to this embodiment, the present invention further includes a heating rod fixed to the underside of the base 1; a hole for the heating rod is provided on the side of the base 1 for connecting the heating rod. A thermocouple is also included, fixed to the underside of the base 1; a hole for the thermocouple is provided on the side of the base 1 for connecting the thermocouple.

[0032] Specifically, the first wafer positioner 22 and the second wafer positioner 32 are curved bars that fit over the edges of the first wafer chuck 2 and the second wafer chuck 3, respectively. In this embodiment, only one of each of the first wafer positioner 22 and the second wafer positioner 32 is provided, and positioning the wafer by placing it against its edges is achieved. In other implementations of this embodiment, multiple first wafer positioners 22 and multiple second wafer positioners 32 are provided, enabling more precise wafer positioning.

[0033] There are six first positioning holes 21 evenly distributed along the edge of the first wafer chuck 2. There are eight second positioning holes 31 evenly distributed along the edge of the second wafer chuck 3. In this embodiment, a first positioning bolt hole 11 and a plurality of second positioning bolt holes 12 are provided on the upper side of the base 1, corresponding to the first positioning holes 21 and the second positioning holes 31. The first positioning bolt hole 11 is located inside the plurality of second positioning bolt holes 12.

[0034] When using the first wafer suction cup 2, six bolts pass through the first positioning through holes 21 from the upper side and are connected to the corresponding first positioning bolt holes 11 to fix the first wafer suction cup 2 on the base 1. When using the first wafer positioner 22, the bolts pass through the positioning holes of the first wafer positioner 22 and the first positioning through holes 21 of the first wafer suction cup 2 from the upper side in sequence and are connected to the corresponding first positioning bolt holes 11 to fix the first wafer positioner 22 on the first wafer suction cup 2; when using the second wafer suction cup 3, eight bolts pass through the second positioning through holes 31 from the upper side and are connected to the corresponding second positioning bolt holes 12 to fix the second wafer suction cup 3 on the base 1. When using the second wafer positioner 32, the bolts pass through the positioning holes of the second wafer positioner 32 and the second positioning through holes 31 of the second wafer suction cup 3 from the upper side in sequence and are connected to the corresponding second positioning bolt holes 12 to fix the second wafer positioner 32 on the second wafer suction cup 3.

[0035] As a preference of this embodiment, the first wafer chuck 2 is an eight-inch wafer chuck, and the second wafer chuck 3 is a twelve-inch wafer chuck.

[0036] Example 2:

[0037] This embodiment discloses a disintegrator, wherein the wafer clamp of the disintegrator is the adjustable wafer clamp described in the first embodiment.

[0038] Reference Figure 4 As shown, as a further improvement of this embodiment, a placement platform is further included, and a guide rail 4 is provided on the upper side of the platform. The base 1 is installed on the guide rail 4 and can move along the guide rail 4.

[0039] Each technical feature of the above-described embodiments can be combined with any other technical feature, and for the sake of brevity, not all possible combinations are described, but it is understood that the scope of the present disclosure encompasses all such possible combinations.

[0040] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be understood as limiting the scope of the patent application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of the patent of the present application should be subject to the appended claims.

Claims

1. An adjustable wafer clamp, characterized in that: The invention comprises a base (1), a first wafer suction cup (2), a second wafer suction cup (3), a first wafer positioner (22) and a second wafer positioner (32); the first wafer positioner (22) and the second wafer positioner (32) are of different sizes; a plurality of first positioning bolt holes (11) and a plurality of second positioning bolt holes (12) are provided on the upper side of the base (1), for fixing the first wafer suction cup (2) and the second wafer suction cup (3) on the base (1) through the first positioning through hole (21) and the second positioning through hole (31) respectively; mounting holes are provided at both ends of the first wafer positioner (22) for mounting on two adjacent first positioning through holes (21) of the first wafer suction cup (2); mounting holes are provided at both ends of the second wafer positioner (32) for mounting on two adjacent second positioning through holes (31) of the second wafer suction cup (3).

2. The adjustable wafer clamp according to claim 1, characterized in that: It also includes a heating rod, which is fixed to the lower side of the base (1); a heating rod reserved hole is provided on the side of the base (1) for connecting the heating rod.

3. The adjustable wafer clamp according to claim 1, characterized in that: It also includes a thermocouple, which is fixed to the lower side of the base (1); a thermocouple reserved hole is provided on the side of the base (1) for connecting the thermocouple.

4. The adjustable wafer clamp according to claim 1, characterized in that: The first wafer positioner (22) and the second wafer positioner (32) are in the shape of curved bars, and fit the edges of the first wafer suction cup (2) and the second wafer suction cup (3), respectively.

5. The adjustable wafer clamp according to claim 1, wherein: Six first positioning through holes (21) are provided and are evenly distributed on the edge of the first wafer suction cup (2).

6. The adjustable wafer clamp according to claim 1, characterized in that: Eight second positioning through holes (31) are provided and are evenly distributed on the edge of the second wafer suction cup (3).

7. The adjustable wafer clamp according to claim 1, characterized in that: The first wafer suction cup (2) is an eight-inch wafer suction cup.

8. The adjustable wafer clamp according to claim 1, characterized in that: The second wafer suction cup (3) is a twelve-inch wafer suction cup.

9. A dissolving machine, characterized in that: The wafer clamp of the disintegrator is an adjustable wafer clamp as described in any one of claims 1 to 8.

10. A dissolving machine according to claim 9, characterized in that: It also includes a placement platform, wherein a guide rail (4) is provided on the upper side of the platform, and the base (1) is mounted on the guide rail (4) and can move along the guide rail (4).

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