Heat dissipation plate with bonding pad

Abstract

The utility model provides a heat dissipation plate with a bonding pad. The heat dissipation plate with the bonding pad comprises a substrate; the bonding pad is arranged on the upper surface of the substrate; the nickel layer covers the substrate and the groove in the upper surface of the bonding pad, and the groove is formed in the substrate and surrounds the edge of the bonding pad; the groove is filled with the solder resist ink layer, and the upper surface of the solder resist ink layer is lower than the upper surface of the bonding pad. The heat dissipation plate with the bonding pad can prevent soldering tin from flowing out of the bonding pad, and the stability of welding connection between the bonding pad and the chip is improved.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation plates, in particular to a heat dissipation plate with a welding pad. Background Art

[0002] In order to achieve better welding with the chip, the existing substrate will form a nickel layer on the pad.

[0003] The pad and the chip are connected by soldering, but the nickel layer and the solder have good wettability. When the chip and the pad squeeze the solder, the solder can easily flow out of the pad, resulting in a reduction in the solder between the pad and the chip, thereby causing poor stability in the connection between the pad and the chip. Utility Model Content

[0004] In view of the above problems in the prior art, the purpose of the present invention is to provide a heat dissipation plate with a solder pad, which can prevent solder from flowing out of the solder pad and increase the stability of the solder connection between the solder pad and the chip.

[0005] In order to solve the above problems, the present invention provides a heat dissipation plate with a soldering pad, wherein the heat dissipation plate with a soldering pad comprises:

[0006] substrate;

[0007] a soldering pad, the soldering pad being arranged on the upper surface of the substrate;

[0008] A nickel layer covering the upper surface of the substrate and the pad

[0009] a groove, the groove being arranged on the substrate and surrounding an edge of the pad;

[0010] A solder resist ink layer fills the groove, and an upper surface of the solder resist ink layer is lower than an upper surface of the pad.

[0011] Furthermore, the solder resist ink layer is a photosensitive ink layer.

[0012] Furthermore, the photosensitive ink is an ultraviolet curing ink.

[0013] Furthermore, the width of the groove is 0.5 mm to 3 mm.

[0014] Furthermore, the solder resist ink layer is formed by printing.

[0015] Furthermore, the solder resist ink layer is formed by piezoelectric inkjet printing.

[0016] Furthermore, the heat dissipation plate further includes:

[0017] A plurality of pin fins are arranged at intervals on the lower surface of the substrate.

[0018] Further, the needle fin is formed in a polygonal or elliptical cross section.

[0019] Further, the heat dissipation plate further comprises:

[0020] A plurality of protrusions are arranged on the solder pad and are arranged at intervals along the edge of the solder pad.

[0021] Further, the solder pad is formed in a rectangular shape, and the protrusions are four, which are arranged at four corners of the solder pad.

[0022] Due to the above technical scheme, the present application has the following beneficial effects:

[0023] According to the heat dissipation plate with a solder pad of the present application, the substrate has a large heat dissipation area, and the solder pad arranged on the substrate provides a space for soldering a chip. A nickel layer is covered on the substrate and the solder pad, and the nickel layer can realize good soldering of the solder pad and the chip and reduce thermal resistance. The groove is arranged around the edge of the solder pad, and the solder resist ink layer is filled (buried) in the groove. The solder resist ink layer has a high aspect ratio through the groove, and the upper surface of the solder resist ink layer is flat, which better prevents the solder tin from flowing, avoids the solder tin from flowing out of the solder pad, concentrates the solder tin on the surface of the solder pad, and increases the stability of the connection between the chip and the solder pad. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0025] Figure 1 is a structure diagram of the heat dissipation plate with a solder pad according to an embodiment of the present application;

[0026] Figure 2 is Figure 1 is a structure diagram of the heat dissipation plate with a solder pad of the embodiment in which the solder resist ink layer is removed;

[0027] Figure 3 is Figure 1 is a structure diagram of the back of the heat dissipation plate with a solder pad of the embodiment.

[0028] Reference signs:

[0029] 100, substrate; 200, solder resist ink layer; 300, protrusion; 400, groove; 500, needle fin; 600, solder pad. DETAILED DESCRIPTION

[0030] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0031] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar items and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0032] Next, a heat dissipation plate with a soldering pad according to an embodiment of the present invention will be described.

[0033] like Figures 1 to 3 As shown, the heat dissipation plate with solder pads according to the embodiment of the present invention includes a substrate 100 , a solder pad 600 , a nickel layer, a groove 400 and a solder resist ink layer 200 .

[0034] First, the substrate 100, the pad 600, and the nickel layer are described. The pad 600 is provided on the upper surface of the substrate 100. The nickel layer covers the upper surfaces of the substrate 100 and the pad 600.

[0035] Substrate 100 provides a large heat dissipation area. Pad 600 provides space for chip soldering. A nickel layer is applied to substrate 100 and pad 600. The nickel layer allows for better soldering between pad 600 and the chip, reducing thermal resistance.

[0036] Next, the groove 400 and the solder resist ink layer 200 are described. The groove 400 is provided on the substrate 100 and is provided around the edge of the pad 600. The solder resist ink layer 200 fills the groove 400, and the upper surface of the solder resist ink layer 200 is lower than the upper surface of the pad 600.

[0037] like Figure 1 and Figure 2 As shown, a groove 400 is formed around the edge of the pad 600, and the solder resist ink layer 200 is filled (buried) in the groove 400. The groove 400 can achieve a higher aspect ratio of the solder resist ink layer 200 and make the upper surface of the solder resist ink layer 200 smooth, thereby better preventing the solder from flowing out of the pad 600.

[0038] The solder resist ink layer 200 can significantly limit / block the flow of solder, concentrate the solder on the surface of the pad 600 , and increase the stability of the connection between the chip and the pad 600 .

[0039] The solder resist ink layer 200 is no higher than the height of the pad 600 , which can avoid interference with the contact between the chip and the pad 600 .

[0040] In the above heat sink with solder pads, the substrate 100 increases the heat dissipation area, and the solder pad 600 provided on the substrate 100 provides space for chip soldering. The substrate 100 and the solder pad 600 are covered with a nickel layer, which can achieve better soldering between the solder pad 600 and the chip, reducing thermal resistance. The groove 400 is set around the edge of the solder pad 600, and the solder resist ink layer 200 is filled (buried) in the groove 400. The groove 400 can achieve a higher aspect ratio of the solder resist ink layer 200, and make the upper surface of the solder resist ink layer 200 smooth, better prevent the flow of solder, avoid the solder from flowing out of the solder pad 600, concentrate the solder on the surface of the solder pad 600, and increase the stability of the connection between the chip and the solder pad 600.

[0041] In some embodiments of the present invention, the solder resist ink layer 200 is a photosensitive ink layer.

[0042] Photosensitive ink cures under light conditions to form a photosensitive ink layer. Compared to thermosetting ink (which requires heating in a furnace or oven to cure), photosensitive ink does not require a high-temperature drying process. This prevents contamination and oxidation of the nickel layer on the surface of the pad 600 and prevents deformation of the pad 600, thereby increasing the stability of the chip-to-pad connection.

[0043] Furthermore, the photosensitive ink is an ultraviolet curing ink.

[0044] Ultraviolet curing inks (UV inks) have a short curing time, some of which can be cured in less than 1 minute, which can improve efficiency.

[0045] In some embodiments of the present invention, the width of the groove 400 is 0.5 mm to 3 mm.

[0046] In other words, the width of the groove limits the width of the solder resist ink layer 200 to 0.5 mm to 3 mm. The solder resist ink layer 200 of this width can better limit / stop the flow of solder and save the material consumption of the solder resist ink.

[0047] In some embodiments of the present invention, the solder resist ink layer 200 is formed by printing.

[0048] Compared to forming the solder resist ink layer 200 by traditional printing (the screen contacts the nickel layer on the surface of the pad 600, which easily causes contamination of the nickel layer on the pad 600), forming the solder resist ink layer 200 by printing (the print head does not directly contact the nickel layer on the surface of the pad 600) can avoid contamination of the nickel layer on the surface of the pad 600.

[0049] Moreover, the printing efficiency is high, which can improve work efficiency.

[0050] Furthermore, the solder resist ink layer 200 is formed by piezoelectric inkjet printing.

[0051] The solder resist ink layer 200 is formed by a piezoelectric inkjet printing method based on a piezoelectric valve, so as to achieve non-contact with the nickel layer on the surface of the pad 600 , with a fast proofing speed, adjustable ink volume, and adjustable width.

[0052] In some embodiments of the present invention, the heat dissipation plate further includes a plurality of pin fins 500 . The plurality of pin fins 500 are arranged on the lower surface of the substrate 100 at intervals.

[0053] like Figure 3 As shown, a plurality of pin fins 500 are formed on the lower surface of the substrate 100 , which can increase the heat dissipation area and thus improve the heat dissipation efficiency of the chip.

[0054] Optionally, the cross section of the pin fin 500 is formed into a polygonal or elliptical shape.

[0055] The pin-fin 500 with a polygonal or elliptical cross section can increase the heat dissipation area while reducing the flow resistance.

[0056] In some embodiments of the present invention, the heat dissipation plate further includes a plurality of protrusions 300. The plurality of protrusions 300 are disposed on the soldering pad 600 and are spaced apart along the edge of the soldering pad 600.

[0057] like Figure 1 and Figure 2 As shown, a plurality of protrusions 300 are provided on the pad 600. During soldering, the chip is placed on the protrusions 300. The protrusions 300 create a gap between the pad 600 and the chip. This gap can accommodate solder, so that the solder has a certain thickness, increasing the amount of solder between the chip and the pad 600, thereby increasing the stability of the soldering between the chip and the pad 600 and reducing thermal resistance.

[0058] Furthermore, the pad 600 is formed in a rectangular shape, and there are four protrusions 300 , which are arranged at four corners of the pad 600 .

[0059] like Figure 1As shown, four protrusions 300 are provided at the four corners of the pad 600 , which can support the chip more stably, so that more solder can be accommodated between the chip and the pad 600 , thereby achieving a more stable welding connection between the chip and the pad 600 .

[0060] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation plate having a pad, characterized in that: The heat dissipation plate comprises: substrate; a soldering pad, the soldering pad being arranged on the upper surface of the substrate; A nickel layer covering the upper surface of the substrate and the pad a groove, the groove being arranged on the substrate and surrounding an edge of the pad; A solder resist ink layer fills the groove, and an upper surface of the solder resist ink layer is lower than an upper surface of the pad.

2. The heat dissipation plate with a solder pad according to claim 1, wherein: The solder resist ink layer is a photosensitive ink layer.

3. The heat dissipation plate with a solder pad according to claim 2, wherein: The photosensitive ink is ultraviolet curing ink.

4. The heat dissipation plate with a solder pad according to claim 1, wherein: The width of the groove is 0.5 mm to 3 mm.

5. The heat dissipation plate with a solder pad according to claim 1, wherein: The solder resist ink layer is formed by printing.

6. The heat dissipation plate with a solder pad according to claim 5, characterized in that: The solder resist ink layer is formed by piezoelectric inkjet printing.

7. The heat dissipation plate with a solder pad according to claim 1, wherein: The heat sink further comprises: A plurality of pin fins are arranged at intervals on the lower surface of the substrate.

8. The heat dissipation plate with a solder pad according to claim 7, wherein: The cross section of the pin fin is formed in a polygonal or elliptical shape.

9. The heat dissipation plate with a solder pad according to claim 1, wherein: The heat sink further comprises: A plurality of protrusions are provided on the pad and spaced apart along the edge of the pad.

10. The heat dissipation plate with a solder pad according to claim 9, wherein: The pad is formed in a rectangular shape, and there are four protrusions, which are arranged at four corners of the pad.

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