Water-cooling heat dissipation system based on Micro LED module

By designing a water-cooled heat dissipation system and utilizing the reverse water transport technology of the heat-conducting support plate and cooling water channel structure, the problem of low heat dissipation efficiency of the Micro LED module was solved, achieving efficient and uniform heat dissipation effects, and improving the stability and reliability of the equipment.

CN223428757UActive Publication Date: 2025-10-10CHANGZHI CITY HUAJIE GUANG TECH CO LTD
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Patent Information

Application Number
CN202422756351.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2025-10-10
Estimated Expiration
2034-11-13

AI Technical Summary

Technical Problem

Micro LED modules generate a lot of heat when running at high power. Due to their miniaturization and high integration, heat easily accumulates, making heat dissipation difficult and air cooling efficiency low, affecting color stability.

Method used

A water-cooling heat dissipation system based on the Micro LED module is adopted, including a thermal support plate, a cooling water path structure, a water inlet three-way solenoid valve, a reversing three-way solenoid valve, a water pump and an air-cooled heat dissipation component. The cooling water path structure is regulated by a controller to transport water in reverse and forward directions. Combined with the design of the thermal support plate and the layout of the heat pipes, uniform cooling and efficient heat dissipation are achieved.

Benefits of technology

It achieves efficient heat dissipation of the Micro LED module, reduces local temperature differences, improves the stability and reliability of the equipment, reduces the frequency of maintenance, and has a more significant heat dissipation effect than air cooling.

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Abstract

The utility model relates to a Micro LED module-based water-cooling heat dissipation system, and the system comprises a Micro LED screen which comprises a PCB (Printed Circuit Board) and a Micro LED assembly; the Micro LED assembly is installed on the front face of the PCB. The back face, deviating from the Micro LED assembly, of the PCB is attached to the heat conduction supporting plate. The heat conduction supporting plate is provided with a strip-shaped cooling water path structure. The water inlet three-way electromagnetic valve comprises a first continuous communication end, a first selected communication end and a second selected communication end; wherein the first continuous communicating end is connected with a filtering piece; a reversing three-way electromagnetic valve A, a reversing three-way electromagnetic valve B, a three-way water outlet valve and a one-way water conveying pipeline; the water pump is connected to the section of the one-way water conveying pipeline and used for providing power for the one-way water conveying pipeline; and the air cooling heat removal assembly comprises a cooling fan and a cooling fin assembly, the cooling fin assembly is in heat conduction connection with the one-way water conveying pipeline, and the cooling fan is used for cooling the cooling fin assembly. According to the micro LED module, the technical effect of high-efficiency heat dissipation of the micro LED module is achieved.
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Description

Technical Field

[0001] The present application relates to the field of display screen technology, and in particular to a self-temperature-controlled liquid-cooling radiator system for a Micro LED module. Background Art

[0002] With the development of display technology, Micro LED technology has emerged. Micro LED is a technology that assembles micron-scale self-luminous LED chips onto a driving panel to form a high-density array, which has the advantages of high brightness, high resolution, and high contrast.

[0003] Because individual Micro LED chips are extremely small, when they are integrated in large numbers into a display panel, they generate a significant amount of heat during high-power operation. Furthermore, their miniaturization and high integration make it easy for heat to accumulate in confined spaces, making heat conduction more difficult. Furthermore, chips of different colors generate heat differently, which affects color stability. Therefore, Micro LEDs place very high demands on the heat dissipation system. Air cooling is used in related technologies to address Micro LED heat dissipation requirements, but air cooling suffers from low heat dissipation efficiency. Utility Model Content

[0004] Based on this, it is necessary to provide a Micro LED module self-controlling temperature liquid cooling radiator system to address the above problems, which can efficiently dissipate heat for the Micro LED module to solve the problem of low heat dissipation efficiency in air cooling.

[0005] The purpose of this application is achieved by the following technical solutions:

[0006] A water-cooling heat dissipation system based on a Micro LED module, comprising:

[0007] A Micro LED screen includes a PCB and Micro LED components. The Micro LED components are mounted on the front of the PCB.

[0008] A thermally conductive support plate is attached to the back of the PCB board facing away from the Micro LED assembly. The thermally conductive support plate is provided with a strip-shaped cooling water channel structure, which includes a first interface end, a water channel body, and a second interface end that are connected in sequence.

[0009] The water inlet three-way solenoid valve is a one-inlet and two-outlet three-way solenoid valve, and the water inlet three-way solenoid valve has a first continuous communication end, a first selected communication end, and a second selected communication end;

[0010] When the water inlet three-way solenoid valve is in the first state, the first continuous communication end is connected to the first selected communication end;

[0011] When the water inlet three-way solenoid valve is in the second state, the first continuous communication end is connected to the second selected communication end;

[0012] The reversing three-way solenoid valve A is a one-inlet and two-outlet three-way solenoid valve. The reversing three-way solenoid valve A has a second continuous communication end, a third selected communication end, and a fourth selected communication end;

[0013] When the reversing three-way solenoid valve A is in the first state, the second continuous communication end is connected to the third selected communication end;

[0014] When the reversing three-way solenoid valve A is in the second state, the second continuous communication end is connected to the fourth selected communication end;

[0015] The reversing three-way solenoid valve B is a one-inlet and two-outlet three-way solenoid valve. The reversing three-way solenoid valve B has a third continuous communication end, a fifth selected communication end, and a sixth selected communication end;

[0016] When the reversing three-way solenoid valve B is in the first state, the third continuous communication end is connected to the fifth selected communication end;

[0017] When the reversing three-way solenoid valve B is in the second state, the third continuous communication end is connected to the sixth selected communication end;

[0018] a three-way water outlet valve, the three-way water outlet valve having a fourth continuous communication end, a seventh selected communication end, and an eighth selected communication end that are interconnected;

[0019] a one-way water transport pipeline, wherein both ends of the one-way water transport pipeline are respectively connected to the first continuous communication end and the fourth continuous communication end;

[0020] The first selected communication end is connected to the second continuous communication end, the third selected communication end is connected to the first interface end, the second interface end is connected to the third continuous communication end, and the fifth selected communication end is connected to the seventh selected communication end.

[0021] and, the second selected communication end is in communication with the sixth selected communication end, and the fourth selected communication end is in communication with the eighth selected communication end;

[0022] The first continuous communication end is connected to a filter element;

[0023] A water pump is connected to a segment of the one-way water transport pipeline and is used to provide power to the one-way water transport pipeline;

[0024] The controller, the water inlet three-way solenoid valve, the reversing three-way solenoid valve A, the reversing three-way solenoid valve B, the three-way water outlet valve, and the water pump are all electrically connected to the controller;

[0025] The air-cooled heat dissipation component includes a heat dissipation fan and a heat sink component. The heat sink component is heat-conductingly connected to a one-way water transport pipeline, and the heat dissipation fan is used to cool the heat sink component.

[0026] Furthermore, the back surface of the heat-conducting support plate is recessed in a direction close to the front surface of the heat-conducting support plate to form a continuous accommodating groove, and the water channel body is a heat-conducting pipe, which is embedded in the accommodating groove.

[0027] Further, the heat conducting pipe includes a plurality of first straight pipes, a plurality of first curved pipes, a second curved pipe, a second straight pipe, a third curved pipe and a third straight pipe;

[0028] A plurality of straight tubes are distributed in parallel and at intervals, and two adjacent first straight tubes are connected via one of the arc tubes;

[0029] The second straight tube is perpendicular to the first straight tube and is located on the same side of the plurality of first straight tubes. The third straight tube is parallel to the first straight tube and is located on the same side of the plurality of first straight tubes.

[0030] The first interface end is provided on the first straight pipe closest to the third straight pipe among the plurality of first straight pipes, and the second interface end is provided on the third straight pipe;

[0031] The first straight pipe, the second curved pipe, the second straight pipe, the third curved pipe, and the third straight pipe, which are farthest from the third straight pipe among the plurality of first straight pipes, are connected in sequence.

[0032] Furthermore, the water channel body is an internal channel formed inside the heat-conducting support plate.

[0033] Furthermore, the internal channel includes a plurality of segment channels connected in sequence, and at least two segment channels are arranged at intervals along the wall thickness direction of the heat-conducting support plate.

[0034] Furthermore, the thermal support plate includes a first thermal support plate and a second thermal support plate. The back of the PCB board facing away from the Micro LED component is attached to the first thermal support plate. The second thermal support plate is detachably attached to the second thermal support plate. The cooling water channel structure is provided on the second thermal support plate.

[0035] Furthermore, the PCB board and the first heat-conducting support plate are connected via a first soft heat-conducting plate.

[0036] Furthermore, the first heat-conducting support plate and the second heat-conducting support plate are connected via a second soft heat-conducting plate.

[0037] Furthermore, the water cooling system also includes a noise reduction box, the inner wall of the noise reduction box is covered with a noise absorption layer, and the water pump is arranged in the noise reduction box.

[0038] Furthermore, the three-way water outlet valve is a one-inlet and two-outlet three-way solenoid valve.

[0039] Compared with the prior art, the beneficial effects of the present application are:

[0040] 1、In the application, the inlet three-way electromagnetic valve is defined as a one-in-two-out three-way electromagnetic valve, the reversing three-way electromagnetic valve A is defined as a one-in-two-out three-way electromagnetic valve, and the reversing three-way electromagnetic valve B is defined as a one-in-two-out three-way electromagnetic valve; by limiting the communication between the first selected communication end and the second continuous communication end, the communication between the third selected communication end and the first interface end, the communication between the second interface end and the third continuous communication end, and the communication between the fifth selected communication end and the seventh selected communication end, and by limiting the communication between the second selected communication end and the sixth selected communication end, and the communication between the fourth selected communication end and the eighth selected communication end, the controller can control the cooling waterway structure to perform reverse water transportation and reverse water transportation; when the cooling waterway structure is in forward water transportation, the first interface end of the cooling waterway structure serves as the water inlet, and the second interface end of the cooling waterway structure serves as the water outlet; when the cooling waterway structure is in reverse water transportation, the second interface end of the cooling waterway structure serves as the water inlet, and the first interface end of the cooling waterway structure serves as the water outlet. Thus, the bidirectional water transportation of the cooling waterway structure uniformly cools the heat-conducting support plate connected with the cooling waterway structure, thereby uniformly cooling the PCB connected with the heat-conducting support plate, which is especially suitable for cases where the PCB is not suitable for local temperature difference.

[0041] 2、Furthermore, regardless of whether the cooling waterway structure is in forward water transportation or reverse water transportation, the water flow is: one-way water transportation pipeline→filtering element, i.e., the filtering element always functions as a forward filter, thereby reducing the maintenance frequency of the cooling waterway structure, especially when the cooling waterway structure is arranged on the heat-conducting support plate, and the heat-conducting support plate is connected with the PCB, which is even less suitable for frequent installation and disassembly of the heat-conducting support plate to reduce the failure rate of the PCB.

[0042] 3、Compared with air cooling, water cooling has a more efficient and obvious heat reduction effect. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 FIG. 1 is a structural schematic diagram of a water-cooling heat dissipation system based on a Micro LED module according to an embodiment of the present application;

[0044] Figure 2 FIG. 4 is a partial enlarged view of A in FIG. 3; Figure 1

[0045] Figure 3 FIG. 7 is a structural schematic diagram of a Micro LED screen according to an embodiment of the present application;

[0046] Figure 4 FIG. 8 is a structural schematic diagram of a Micro LED screen mounted on a support plate according to an embodiment of the present application;

[0047] Figure 5 ​This is a schematic diagram showing the connection principle of the cooling water channel structure in the first embodiment of the present application;

[0048] Figure 6 for Figure 5 Schematic diagram of the middle cooling water channel structure when transporting water in the forward direction;

[0049] Figure 7 for Figure 5 Schematic diagram of the middle cooling water channel structure when water is transported in reverse;

[0050] Figure 8 This is a structural diagram of a water-cooling heat dissipation system based on a Micro LED module in the first embodiment of the present application;

[0051] Figure 9 for Figure 8 A local enlarged view of point B;

[0052] Figure 10 This is a structural diagram of a water-cooling heat dissipation system based on a Micro LED module in the first embodiment of the present application;

[0053] Figure 11 for Figure 10 A local enlarged view of point C;

[0054] Figure 12 This is a structural diagram of the cooling water channel structure in the second embodiment of the present application.

[0055] In the figure: 11. Micro LED screen; 111. Micro LED component; 112. PCB board; 12. First soft heat-conducting plate; 13. First heat-conducting support plate; 14. Second soft heat-conducting plate; 15. Second heat-conducting support plate; 151. Second straight tube; 152. First straight tube; 153. First curved tube; 154. Second curved tube; 155. Third curved tube; 156. Third straight tube; 157. First interface end; 158. Second interface end; 2. Cooling water channel structure; 21. Water channel body; 22. Segment channel; 3. Air-cooled heat dissipation component; 31. Cooling fan; 32. Heat sink component; 41. Water pump; 42. Noise reduction box; 5. Water Box; 61, reversing three-way solenoid valve A; 611, third selected communication end; 612, second continuous communication end; 613, fourth selected communication end; 62, reversing three-way solenoid valve B; 621, third continuous communication end; 622, fifth selected communication end; 623, sixth selected communication end; 63, water inlet three-way solenoid valve; 631, first continuous communication end; 632, first selected communication end; 633, second selected communication end; 64, three-way water outlet valve; 641, fourth continuous communication end; 642, seventh selected communication end; 643, eighth selected communication end; 7, controller. DETAILED DESCRIPTION

[0056] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0057] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0058] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0059] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0060] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0061] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0062] See Figure 1 and Figure 2 , Figure 1 and Figure 2 A schematic diagram of a water-cooling heat dissipation system based on a Micro LED module in one embodiment of the present application is shown. A water-cooling heat dissipation system based on a Micro LED module provided in one embodiment of the present application includes: a Micro LED screen 11, a heat-conducting support plate, a water inlet three-way solenoid valve 63, a reversing three-way solenoid valve A61, a reversing three-way solenoid valve B62, a three-way water outlet valve 64, a one-way water transport pipeline, a water pump 41, a controller 7 and an air-cooled heat dissipation component 3.

[0063] like Figure 3 As shown, the Micro LED screen 11 includes a PCB board 112 and a Micro LED component 111; the Micro LED component 111 is installed on the front side of the PCB board 112.

[0064] Specifically, the PCB board 112 mainly plays the role of circuit connection and support in this system. It provides stable electrical connection for the Micro LED assembly 111, enabling the smooth transmission of current to each Micro LED pixel point to control their light emission. The Micro LED assembly 111 is the core part of image display. It is composed of numerous tiny LED chips that can emit different colors of light and combine various colors and images through precise control. Installing the Micro LED assembly 111 on the front surface of the PCB board 112 means that there is a close physical and electrical connection between them. The PCB board 112 provides the necessary power supply and signal transmission channel for the Micro LED assembly 111, while the Micro LED assembly 111 realizes image display function through light emission after receiving the signal. The entire Micro LED screen 11 is one of the main components that generate heat in this water-cooled cooling system, and needs to be cooled through a specific cooling method to ensure its normal work and stable performance.

[0065] As shown in Figure 4 , the back surface of the PCB board 112 away from the Micro LED assembly 111 is attached to the heat-conducting support plate; the heat-conducting support plate is provided with a strip-shaped cooling water channel structure 2, which includes a first interface end 157, a water channel main body 21 and a second interface end 158 connected in sequence.

[0066] Specifically, through the circulation of liquid in the cooling water channel structure 2, the heat absorption and heat transfer characteristics of the liquid are used to quickly conduct the heat generated by the PCB board 112 and the Micro LED assembly 111 installed on the front surface of the PCB board 112, thereby realizing effective heat dissipation of the Micro LED module and ensuring its stable operation and performance.

[0067] As shown in Figure 5-Figure 7 , the water inlet three-way electromagnetic valve 63 is a two-outlet three-way electromagnetic valve, and the water inlet three-way electromagnetic valve 63 has a first continuously connected end 631, a first selected connected end 632 and a second selected connected end 633.

[0068] When the water inlet three-way electromagnetic valve 63 is in the first state, the first continuously connected end 631 is connected with the first selected connected end 632;

[0069] When the water inlet three-way electromagnetic valve 63 is in the second state, the first continuously connected end 631 is connected with the second selected connected end 633. Specifically, the water inlet three-way electromagnetic valve 63 can switch the flow direction of the fluid by controlling its state, thereby realizing flexible control of the cooling liquid flow path in the water-cooled cooling system based on the Micro LED module to meet different cooling needs.

[0070] The three-way reversing solenoid valve A61 is a one-inlet, two-outlet three-way solenoid valve. It has a second continuous communication port 612, a third selected communication port 611, and a fourth selected communication port 613. When the three-way reversing solenoid valve A61 is in a first state, the second continuous communication port 612 is connected to the third selected communication port 611. When the three-way reversing solenoid valve A61 is in a second state, the second continuous communication port 612 is connected to the fourth selected communication port 613.

[0071] The three-way reversing solenoid valve B62 is a one-inlet, two-outlet three-way solenoid valve. It has a third continuous communication end 621, a fifth selected communication end 622, and a sixth selected communication end 623. When the three-way reversing solenoid valve B62 is in the first state, the third continuous communication end 621 is connected to the fifth selected communication end 622. When the three-way reversing solenoid valve B62 is in the second state, the third continuous communication end 621 is connected to the sixth selected communication end 623.

[0072] The three-way water outlet valve 64 has a fourth continuous communication end 641, a seventh selected communication end 642 and an eighth selected communication end 643 which are connected to each other;

[0073] Both ends of the one-way water transport pipeline are connected to the first continuous communication end 631 and the fourth continuous communication end 641 respectively.

[0074] The first continuous communication end 631 is connected to a filter element.

[0075] like Figure 6 As shown, when the cooling water channel structure 2 is transporting water in the forward direction, based on the first selected communication end 632 being connected to the second continuous communication end 612, the third selected communication end 611 being connected to the first interface end 157, the second interface end 158 being connected to the third continuous communication end 621, and the fifth selected communication end 622 being connected to the seventh selected communication end 642, under the control of the controller 7, the water flow direction is: one-way water transport pipeline → filter element → first continuous communication end 631 → first selected communication end 632 → second continuous communication end 612 → third selected communication end 611 → first interface end 157 → water channel body 21 → second interface end 158 → third continuous communication end 621 → fifth selected communication end 622 → seventh selected communication end 642 → fourth continuous communication end 641 → one-way water transport pipeline.

[0076] As well as Figure 7As shown, when the cooling water channel structure 2 is transporting water in the reverse direction, based on the second selected communication end 633 being connected to the sixth selected communication end 623, and the fourth selected communication end 613 being connected to the eighth selected communication end 643, under the control of the controller 7, the water flow direction is: one-way water transport pipeline → filter element → first continuous communication end 631 → second selected communication end 633 → sixth selected communication end 623 → third continuous communication end 621 → second interface end 158 → water channel body 21 → first interface end 157 → third selected communication end 611 → fourth selected communication end 613 → eighth selected communication end 643 → fourth continuous communication end 641 → one-way water transport pipeline.

[0077] Obviously, regardless of whether the cooling water channel structure 2 is flowing forward or backward, the water flow is: one-way water pipeline → filter element. This allows the filter element to continuously filter without any residue being flushed into the water channel body 21 due to the reverse flow of water in the cooling water channel structure 2, thus ensuring the smooth flow of the water channel body 21, the water inlet three-way solenoid valve 63, the reversing three-way solenoid valve A61, the reversing three-way solenoid valve B62, and the three-way outlet valve 64.

[0078] like Figure 8 and Figure 9 As shown, the water pump 41 is connected to a segment of the one-way water transport pipeline and is used to provide power to the one-way water transport pipeline.

[0079] Specifically, the function of the water pump 41 is to provide power to the one-way water transport pipeline, that is, to generate a pressure difference through operation, thereby promoting the flow of fluid in the pipeline. In this application, the operation of the water pump 41 allows the coolant to circulate in the pipeline, thereby continuously removing the heat generated by the Micro LED module, thereby achieving effective heat dissipation for the Micro LED module.

[0080] The water inlet three-way solenoid valve 63 , the reversing three-way solenoid valve A61 , the reversing three-way solenoid valve B62 , the three-way water outlet valve 64 , and the water pump 41 are all electrically connected to the controller 7 .

[0081] like Figure 10 and 11 As shown, the air-cooled heat dissipation component 3 includes a heat dissipation fan 31 and a heat sink component 32. The heat sink component 32 is heat-conductingly connected to the one-way water transport pipeline, and the heat dissipation fan 31 is used to cool the heat sink component 32.

[0082] Specifically, the air-cooled heat removal assembly 3 mainly consists of two parts: a heat dissipation fan 31 and a heat sink assembly 32. The heat sink assembly 32 plays an important role in heat conduction. It is thermally connected to the one-way water transport pipeline, which means that the heat in the one-way water transport pipeline can be transferred to the heat sink assembly 32. The main function of the heat dissipation fan 31 is to cool the heat sink assembly 32 by generating airflow. After the heat sink assembly 32 absorbs the heat from the one-way water transport pipeline, the air generated by the heat dissipation fan 31 can remove the heat from the heat sink assembly 32, thereby completing the entire air-cooled heat removal process, ensuring that the system temperature remains within an appropriate range and preventing the normal operation of the equipment from being affected by excessive temperatures.

[0083] Based on the definition that the water inlet three-way solenoid valve 63 is a one-inlet, two-outlet three-way solenoid valve, the three-way reversing solenoid valve A61 is a one-inlet, two-outlet three-way solenoid valve, and the three-way reversing solenoid valve B62 is a one-inlet, two-outlet three-way solenoid valve; by defining that the first selected communication end 632 is connected to the second continuous communication end 612, the third selected communication end 611 is connected to the first interface end 157, the second interface end 158 is connected to the third continuous communication end 621, and the fifth selected communication end 622 is connected to the seventh selected communication end 642. Furthermore, by defining that the second selected communication end 633 is connected to the sixth selected communication end 623, and the fourth selected communication end 613 is connected to the eighth selected communication end 643. In this way, through the control of controller 7, the cooling water channel structure 2 can be operated in both reverse and reverse directions. During forward water flow, the first interface end 157 of the cooling water channel structure 2 serves as the water inlet, and the second interface end 158 of the cooling water channel structure 2 serves as the water outlet. During reverse water flow, the second interface end 158 of the cooling water channel structure 2 serves as the water inlet, and the first interface end 157 of the cooling water channel structure 2 serves as the water outlet. In this way, the bidirectional water flow of the cooling water channel structure 2 uniformly cools the heat-conducting support plate connected to the cooling water channel structure 2, and further uniformly cools the PCB board 112 connected to the heat-conducting support plate. This is particularly suitable for situations where it is undesirable to have a large temperature difference on the PCB board 112. Furthermore, regardless of whether the cooling water channel structure 2 transports water in the forward or reverse direction, the water flow is: one-way water transport pipeline → filter element, that is, the filter element always plays a role of forward filtration, thereby reducing the maintenance frequency of the cooling water channel structure 2. In particular, the cooling water channel structure 2 is arranged on the heat-conducting support plate, and the heat-conducting support plate is connected to the PCB board 112. It is even less appropriate to frequently install and disassemble the heat-conducting support plate, thereby reducing the failure rate of the PCB board 112.

[0084] In one embodiment, the back surface of the heat-conducting support plate is recessed in a direction close to the front surface of the heat-conducting support plate to form a continuous receiving groove. The water channel body 21 is a heat-conducting pipe, which is embedded in the receiving groove.

[0085] Specifically, the heat-conducting support plate has such a structure: its back side is recessed in the direction close to the front side, thereby forming a continuous receiving groove. The water channel main body 21 here adopts a heat pipe. This heat pipe can be tightly embedded in the receiving groove on the back side of the heat-conducting support plate. Such a design makes the contact between the heat pipe and the heat-conducting support plate closer, which is conducive to the rapid conduction of heat. When the system generates heat during operation, the heat can be transferred to the heat pipe embedded in the receiving groove through the heat-conducting support plate, and the cooling medium in the heat pipe can quickly take away the heat, thereby achieving effective cooling and heat dissipation, wherein the cooling medium includes water and coolant. It can be understood that the design of the heat pipe is easy to implement in terms of process and the cost is relatively low.

[0086] In one embodiment, the heat pipe includes a plurality of first straight pipes 152 , a plurality of first curved pipes 153 , a second curved pipe 154 , a second straight pipe 151 , a third curved pipe 155 and a third straight pipe 156 ;

[0087] The plurality of straight tubes are distributed in parallel and at intervals, and two adjacent first straight tubes 152 are connected via one of the arc tubes;

[0088] The second straight tube 151 is perpendicular to the first straight tube 152 and is located on the same side of the plurality of first straight tubes 152 . The third straight tube 156 is parallel to the first straight tube 152 and is located on the same side of the plurality of first straight tubes 152 .

[0089] The first interface end 157 is disposed on the first straight tube 152 closest to the third straight tube 156 among the plurality of first straight tubes 152 , and the second interface end 158 is disposed on the third straight tube 156 ;

[0090] The first straight tube 152 , the second curved tube 154 , the second straight tube 151 , the third curved tube 155 , and the third straight tube 156 , which are farthest from the third straight tube 156 among the plurality of first straight tubes 152 , are connected in sequence.

[0091] Specifically, the heat pipe is composed of multiple straight pipes and arc pipes of different types. The multiple first straight pipes 152 are parallel and spaced apart, and each two adjacent first straight pipes 152 are connected by a first arc pipe 153, thus forming a set of parallel pipes connected with each other. The second straight pipe 151 is perpendicular to the first straight pipes 152 and is located on the same side of the multiple first straight pipes 152. The third straight pipe 156 is also parallel to the first straight pipes 152 and is located on the same side of the multiple first straight pipes 152. The first interface end 157 is arranged on the first straight pipe 152 closest to the third straight pipe 156 among the multiple first straight pipes 152, and the second interface end 158 is arranged on the third straight pipe 156. In addition, the first straight pipe 152 farthest from the third straight pipe 156 among the multiple first straight pipes 152 is connected with the third straight pipe 156 through a second arc pipe 154, a second straight pipe 151 and a third arc pipe 155 in sequence. Such a structure design enables the heat pipe to conduct heat in a specific shape and path, and fully contacts the parts to be cooled for heat conduction.

[0092] In one embodiment, the water channel body 21 is an internal channel formed in the heat-conducting support plate.

[0093] Specifically, the water channel body 21 of the cooling water channel structure 2 is directly arranged in the heat-conducting support plate, which can realize the close combination of the cooling water channel and the heat-conducting support plate, thereby greatly improving the heat conduction efficiency. At the same time, this design can save space and make the entire heat dissipation structure more compact. In addition, it can protect the cooling water channel to some extent, reduce the influence of external factors, and thus improve the reliability and stability of the cooling system.

[0094] In one embodiment, referring to Figure 12The internal channel includes a plurality of segment channels 22 connected end to end in sequence, and at least two segment channels 22 are arranged at intervals along the wall thickness direction of the heat-conducting support plate. In this way, the same part of the PCB board 112 can be cooled twice through at least two segment channels 22. That is, when there are more LED chips locally in the PCB board 112, which generate more heat, the local high temperature of the PCB board 112 can be cooled multiple times through more segment channels 22, so that the temperature of each part of the PCB board 112 is more balanced, which has unique advantages compared to air cooling. In other words, this embodiment further optimizes the layout of the heat pipe. The heat pipes are arranged multiple times in an area with different thicknesses. The purpose of this design is to achieve more effective cooling in areas where local heat is too high. When a certain area on the heat-conducting support plate experiences excessive heat, the heat-conducting pipes arranged crosswise multiple times can allow the cooling medium to flow through the area more fully, thereby improving the efficiency of heat exchange and removing the excessive local heat more quickly, ensuring that the temperature of the entire heat-conducting support plate and the PCB board 112 remains within a relatively reasonable range, thereby improving the performance and reliability of the entire heat dissipation system.

[0095] In one embodiment, the thermal support plate includes a first thermal support plate 13 and a second thermal support plate 15. The back of the PCB board 112 facing away from the Micro LED component 111 is attached to the first thermal support plate 13. The second thermal support plate 15 is detachably attached to the first thermal support plate 13. The cooling water channel structure 2 is provided on the second thermal support plate 15.

[0096] Specifically, in this particular structure, the thermal support plate is divided into a first thermal support plate 13 and a second thermal support plate 15. The side of the PCB board 112 that is opposite to the Micro LED component 111 is tightly attached to the first thermal support plate 13. The second thermal support plate 15 can be attached to the first thermal support plate 13 in a detachable manner. The cooling water channel structure 2 is arranged on the second thermal support plate 15. Such a design has many functions. On the one hand, the heat generated by the PCB board 112 during operation can be more effectively conducted away, thereby improving the heat dissipation effect. On the other hand, the detachable design of the second thermal support plate 15 makes it more convenient when maintenance or replacement of the cooling water channel structure 2 is required.

[0097] In one embodiment, the PCB board 112 and the first heat-conducting support plate 13 are connected via the first soft heat-conducting plate 12 .

[0098] Specifically, the first soft heat-conducting plate 12 has excellent thermal conductivity, enabling it to quickly transfer heat generated by the PCB 112 during operation to the first heat-conducting support plate 13. This softness allows it to better adapt to any uneven surfaces between the PCB 112 and the first heat-conducting support plate 13, ensuring close contact and thus improving heat transfer efficiency. Furthermore, the soft material can also act as a buffer, reducing damage to the PCB 112 caused by external vibrations and other factors.

[0099] In one embodiment, the first heat-conducting support plate 13 and the second heat-conducting support plate 15 are connected via a second soft heat-conducting plate 14 .

[0100] Specifically, the second soft heat-conducting plate 14 has excellent thermal conductivity, capable of transferring heat from the first heat-conducting support plate 13 to the second heat-conducting support plate 15. Due to its soft nature, it can effectively fill the gap between the first and second heat-conducting support plates 13, 15, ensuring close contact between the two, thereby improving heat transfer efficiency. Furthermore, the soft material can also, to a certain extent, accommodate any relative displacement or slight deformation of the two support plates, providing a buffering and protective effect, preventing damage to the connection caused by external forces or temperature fluctuations, thereby ensuring the stability and reliability of the entire heat dissipation structure.

[0101] like Figure 8 and Figure 9 As shown, in one embodiment, the water cooling system further includes a noise reduction box 42, the inner wall of which is covered with a noise absorption layer, and a water pump 41 is disposed within the noise reduction box 42. A water tank 5 is connected to the water pump 41, is located outside the noise reduction box 42, and is disposed on a one-way water transport pipeline.

[0102] Specifically, the inner wall of the noise reduction box 42 is covered with a noise absorption layer. This noise absorption layer is generally made of a sound-absorbing material that effectively absorbs and reduces the spread of noise. The water pump 41 is placed within this noise reduction box 42. Since the water pump 41 generates a certain amount of noise during operation, placing it in the noise reduction box 42 can reduce the noise generated by the water pump 41 during operation with the help of the noise absorption layer, thereby reducing the noise generated by the entire water cooling system during operation, creating a quieter environment for use.

[0103] In one embodiment, the three-way water outlet valve 64 is a one-inlet, two-outlet three-way solenoid valve.

[0104] Specifically, a one-inlet, two-outlet valve has one inlet and two outlets. A three-way solenoid valve is an electromagnetically controlled valve that opens and closes by energizing or de-energizing the solenoid coil, thereby controlling the flow of fluid. In this specific water-cooling system, a one-inlet, two-outlet, three-way solenoid valve can direct the incoming coolant to different outlet channels as needed to meet the cooling requirements of the system under different operating conditions.

[0105] The control system may be a single chip microcomputer or a control element integrated into the PCB board 112 .

[0106] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A water-cooling heat dissipation system based on a Micro LED module, characterized in that: include: A Micro LED screen (11) comprises a PCB board (112) and a Micro LED component (111); the Micro LED component (111) is mounted on the front side of the PCB board (112); a heat-conducting support plate, wherein the back surface of the PCB board (112) facing away from the Micro LED assembly (111) is attached to the heat-conducting support plate; the heat-conducting support plate is provided with a strip-shaped cooling water channel structure (2), and the cooling water channel structure (2) includes a first interface end (157), a water channel body, and a second interface end (158) that are connected in sequence; A water inlet three-way solenoid valve (63), the water inlet three-way solenoid valve (63) is a one-inlet two-outlet three-way solenoid valve, the water inlet three-way solenoid valve (63) having a first continuous communication end (631), a first selected communication end (632), and a second selected communication end (633); When the water inlet three-way solenoid valve (63) is in the first state, the first continuous communication end (631) is connected to the first selected communication end (632); When the water inlet three-way solenoid valve (63) is in the second state, the first continuous communication end (631) is connected to the second selected communication end (633); A reversing three-way solenoid valve A (61), the reversing three-way solenoid valve A (61) is a one-inlet-two-outlet three-way solenoid valve, the reversing three-way solenoid valve A having a second continuous communication end (612), a third selected communication end (611), and a fourth selected communication end (613); When the reversing three-way solenoid valve A (61) is in the first state, the second continuous communication end (612) is connected to the third selected communication end (611); When the reversing three-way solenoid valve A (61) is in the second state, the second continuous communication end (612) is connected to the fourth selected communication end (613); A reversing three-way solenoid valve B (62), the reversing three-way solenoid valve B (62) is a one-inlet-two-outlet three-way solenoid valve, the reversing three-way solenoid valve B having a third continuous communication end (621), a fifth selected communication end (622), and a sixth selected communication end (623); When the reversing three-way solenoid valve B (62) is in the first state, the third continuous communication end (621) is connected to the fifth selected communication end (622); When the reversing three-way solenoid valve B (62) is in the second state, the third continuous communication end (621) is connected to the sixth selected communication end (623); A three-way water outlet valve (64), wherein the three-way water outlet valve (64) has a fourth continuous communication end (641), a seventh selected communication end (642), and an eighth selected communication end (643) that are interconnected; a one-way water transport pipeline, wherein both ends of the one-way water transport pipeline are respectively connected to the first continuous communication end (631) and the fourth continuous communication end (641); wherein the first selected communication end (632) is in communication with the second continuous communication end (612), the third selected communication end (611) is in communication with the first interface end (157), the second interface end (158) is in communication with the third continuous communication end (621), and the fifth selected communication end (622) is in communication with the seventh selected communication end (642); Furthermore, the second selected communication end (633) is in communication with the sixth selected communication end (623), and the fourth selected communication end (613) is in communication with the eighth selected communication end (643); The first continuous communication end (631) is connected to a filter element; a water pump (41), connected to a segment of the one-way water transport pipeline and used to provide power to the one-way water transport pipeline; The controller (7), the water inlet three-way solenoid valve (63), the reversing three-way solenoid valve A (61), the reversing three-way solenoid valve B (62), the three-way water outlet valve (64), and the water pump (41) are all electrically connected to the controller; The air-cooled heat dissipation component (3) comprises a heat dissipation fan (31) and a heat sink component (32). The heat sink component (32) is heat-conductingly connected to the one-way water transport pipeline, and the heat dissipation fan (31) is used to cool the heat sink component (32).

2. The water cooling system based on the Micro LED module according to claim 1, characterized in that: The back surface of the heat-conducting support plate is recessed in a direction close to the front surface of the heat-conducting support plate to form a continuous accommodating groove; the water channel main body (21) is a heat-conducting pipe, and the heat-conducting pipe is embedded in the accommodating groove.

3. The water cooling system based on the Micro LED module according to claim 2, characterized in that: The heat conducting pipe comprises a plurality of first straight pipes (152), a plurality of first curved pipes (153), a second curved pipe (154), a second straight pipe (151), a third curved pipe (155) and a third straight pipe (156); A plurality of straight tubes are distributed in parallel and at intervals, and two adjacent first straight tubes (152) are connected via one of the arc-shaped tubes; The second straight tube (151) is perpendicular to the first straight tube (152), and the second straight tube (151) is located on the same side of the plurality of first straight tubes (152). The third straight tube (156) is parallel to the first straight tube (152) and is located on the same side of the plurality of first straight tubes (152). The first interface end (157) is provided on the first straight tube (152) closest to the third straight tube (156) among the plurality of first straight tubes (152), and the second interface end (158) is provided on the third straight tube (156); The first straight tube (152) farthest from the third straight tube (156) among the plurality of first straight tubes (152), the second arc tube (154), the second straight tube (151), the third arc tube (155), and the third straight tube (156) are connected in sequence.

4. The water cooling system based on the Micro LED module according to claim 1, characterized in that: The water channel body (21) is an internal channel formed inside the heat-conducting support plate.

5. The water cooling system based on the Micro LED module according to claim 4, characterized in that: The internal channel comprises a plurality of segment channels (22) connected in sequence, and at least two segment channels are arranged at intervals along the wall thickness direction of the heat-conducting support plate.

6. The water cooling system based on the Micro LED module according to claim 1, characterized in that: The heat-conducting support plate comprises a first heat-conducting support plate (13) and a second heat-conducting support plate (15); the back surface of the PCB (112) facing away from the Micro LED component (111) is attached to the first heat-conducting support plate (13); the second heat-conducting support plate (15) is detachably attached to the first heat-conducting support plate (13); and the cooling water channel structure is provided on the second heat-conducting support plate (15).

7. The water cooling system based on the Micro LED module according to claim 6, characterized in that: The PCB board (112) and the first heat-conducting support plate (13) are connected via a first soft heat-conducting plate (12).

8. The water cooling system based on the Micro LED module according to claim 6, characterized in that: The first heat-conducting support plate (13) and the second heat-conducting support plate (15) are connected via a second soft heat-conducting plate (14).

9. The water cooling system based on Micro LED module according to claim 1, characterized in that: The water cooling and heat dissipation system further comprises a noise reduction box (42), the inner wall of the noise reduction box (42) is covered with a noise absorption layer, and the water pump (41) is arranged in the noise reduction box (42).

10. The water cooling system based on Micro LED module according to claim 1, characterized in that: The three-way water outlet valve (64) is a one-inlet, two-outlet three-way electromagnetic valve.