Non-rectangular brushless motor chip packaging structure

Abstract

The utility model provides a non-rectangular brushless motor chip packaging structure which comprises a packaging frame and a plurality of chips integrated in the packaging frame, a redistribution layer (RDL) and a base material layer are arranged on the packaging frame, and the plurality of chips are integrated in the packaging frame through the RDL and the base material layer and are respectively connected with pins on the packaging frame. And the packaging frame is fan-shaped or circular. According to the embodiment of the invention, a plurality of chips and peripheral devices are packaged in the same integrated circuit, so that the integration level is greatly improved, and the integrated circuit can be directly installed in the motor.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a non-rectangular brushless motor chip packaging structure. Background Art

[0002] In the early days, integrated circuits were primarily packaged as single-chip packages (SCPs), where a single chip is encapsulated within a circuit board. However, as the functional requirements of electronic devices continue to increase, single-chip packages are unable to meet the integration needs of multiple functional modules. To address this issue, multi-chip packaging (MCP) technology emerged. This technology integrates multiple chip components with different functions onto a single circuit board, resulting in higher device integration and smaller package sizes.

[0003] In the prior art, brushless motors integrate the MCU chip, motor driver chip, and MOS chip into the same chip through the above-mentioned multi-chip packaging technology. However, the applicant found that in actual use, the space size of the packaged chip is usually limited by the size of the motor stator and the form of the mechanical design, so that the installation space often presents a non-rectangular area. In this way, the layout and wiring on the circuit board are affected by the shape of the board, and the more peripheral devices, the larger the board space required, which brings many restrictions and difficulties to the design. Summary of the Invention

[0004] In view of this, the present application provides a non-rectangular brushless motor chip packaging structure, which packages multiple chips and peripheral devices in the same integrated circuit, thereby greatly improving the integration and can be directly installed inside the motor.

[0005] The present application provides a non-rectangular brushless motor chip packaging structure, including a packaging frame and multiple chips integrated in the packaging frame, a redistribution layer RDL and a substrate layer are provided on the packaging frame, the multiple chips are integrated in the packaging frame through the redistribution layer RDL and the substrate layer, and are respectively connected to the pins on the packaging frame, and the shape of the packaging frame is fan-shaped or circular.

[0006] In some embodiments, the multiple chips include a motor driver chip, a MOS chip, and an MCU chip, and the packaging frame also includes resistors, capacitors, and diodes.

[0007] In some embodiments, the redistribution layer (RDL) is located between the multiple chips and the substrate layer, and the output pins of the multiple chips are arranged in the redistribution layer (RDL) and then placed on the substrate layer.

[0008] In some embodiments, the brushless motor chip packaging structure further includes a wire layer, which is disposed on the packaging frame and located between the packaging frame and the substrate layer. The wire layer is used to connect the output pins of the multiple chips to the pins on the packaging frame.

[0009] In some embodiments, the redistribution layer RDL forms metal wiring by depositing a metal layer and a dielectric layer, one end of the metal wiring is connected to the pad positions of the multiple chips, and the other end is connected to the substrate layer to serve as the output pins of the multiple chips.

[0010] In some embodiments, the brushless motor chip packaging structure further includes a through hole, which is arranged at the center of the brushless motor chip packaging structure, and the through hole is used to install the brushless motor chip packaging structure in the motor.

[0011] In some embodiments, the brushless motor chip packaging structure further includes a power supply contact, a program burning contact, and a UVW three-phase output contact.

[0012] In some embodiments, the packaging frame further includes an extension portion, on which an external capacitor contact is provided, the external capacitor contact being used to connect to an electrolytic capacitor, and an outer edge of the extension portion is an arc with the same curvature as that of the packaging frame.

[0013] In some embodiments, the brushless motor chip packaging structure further includes an external PCB board, which is bridged to the packaging frame and is used to install other components.

[0014] In some embodiments, the brushless motor chip packaging structure further includes a plastic package, which covers the packaging frame and the multiple chips.

[0015] This application provides a non-rectangular brushless motor chip package structure, comprising a package frame and multiple chips integrated within the package frame. A redistribution layer (RDL) and a substrate layer are provided on the package frame. The multiple chips are integrated within the package frame via the RDL and substrate layer and are connected to pins on the package frame. The package frame is fan-shaped or circular. This embodiment packages multiple chips and surrounding components within the same integrated circuit, significantly improving integration and enabling direct installation within a motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a structural schematic diagram of the non-rectangular brushless motor chip packaging structure provided by this application.

[0018] Figure 2 This is a second structural schematic diagram of the non-rectangular brushless motor chip packaging structure provided by this application.

[0019] Figure 3 This is a third structural schematic diagram of the non-rectangular brushless motor chip packaging structure provided by this application. DETAILED DESCRIPTION

[0020] The following, in conjunction with the accompanying drawings, clearly and completely describes the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the description of this application, the meaning of "several" is at least one, such as one, two, etc., unless otherwise clearly and specifically defined.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items. The terms "connected", "electrically connected", and "electrically connected" as used herein include any direct and indirect electrical or structural connection means. Therefore, if the text describes a first device as being coupled / connected / electrically connected to a second device, it means that the first device can be directly electrically / structurally connected to the second device, or indirectly electrically / structurally connected to the second device through other devices or connection means.

[0023] The present application provides a non-rectangular brushless motor chip packaging structure, including a packaging frame and multiple chips integrated in the packaging frame, a redistribution layer RDL and a substrate layer are provided on the packaging frame, the multiple chips are integrated in the packaging frame through the redistribution layer RDL and the substrate layer, and are respectively connected to the pins on the packaging frame, and the shape of the packaging frame is fan-shaped or circular.

[0024] Please refer to Figure 1 , Figure 1 FIG1 is a schematic diagram of a non-rectangular brushless motor chip package structure provided in the present application. The non-rectangular brushless motor chip package structure 10 in the present application includes a package frame 100 and multiple chips integrated within the package frame 100. The multiple chips may include a motor driver chip 120, a MOS chip 160, and an MCU chip 110. In addition, the package frame 100 also includes a resistor 130, a capacitor 140, and a diode 150.

[0025] Furthermore, a redistribution layer RDL400 and a substrate layer 300 are provided on the packaging frame 100. The above-mentioned multiple chips can be integrated in the packaging frame 100 through the redistribution layer RDL400 and the substrate layer 300, and respectively connected to the pins 170 on the packaging frame 100. Among them, the shape of the packaging frame 100 is fan-shaped or circular. Through the above-mentioned setting method, the chip packaging structure can be directly installed in the internal circuit placement area of ​​the motor, which conforms to the shape of the motor mounting mechanism, and there is no need to design a PCB for transfer or make a small part of the PCB to connect peripheral devices.

[0026] Continue reading Figure 1 The redistribution layer RDL400 can be set between multiple chips and the substrate layer 300, and the output pins of multiple chips can be arranged in the redistribution layer RDL400 and then placed on the substrate layer 300. The above-mentioned redistribution layer RDL400 is used for intermediate connection and re-planning of lines, so that the above-mentioned multiple chips can be better electrically connected to the outside. Through the redistribution layer RDL400, according to the actual circuit design requirements, such as considering factors such as current direction, rationality of signal transmission, and convenience of connection with other components, the output pins of multiple chips can be optimized and rearranged, and the rearranged output pins can be connected to the substrate layer 300.

[0027] In one embodiment, the brushless motor chip packaging structure 10 may further include a wire layer 200 , which may be disposed on the packaging frame 100 and located between the packaging frame 100 and the substrate layer 300 . The wire layer 200 may be used to connect the output pins of multiple chips to the pins on the packaging frame 100 .

[0028] Specifically, the redistribution layer RDL400 can form metal wiring by depositing metal layers and dielectric layers. One end of the metal wiring can be connected to the pad positions of multiple chips, and the other end can be connected to the substrate layer 300 to serve as the output pins of multiple chips. Among them, the redistribution layer RDL is mainly used to redistribute the input / output (I / O) ports of the chip to realize the connection between the chip and the external circuit. For motor driver chips, MOS chips, and MCU chips, RDL can connect the pad positions of these chips to the pins on the package frame, so that effective signal transmission and power supply can be achieved between chips and between chips and external circuits. For example, a metal layer can be deposited on the chip surface or other substrate by physical vapor deposition (PVD), chemical vapor deposition (CVD) or electroplating. Commonly used metal materials include copper, aluminum, etc. These metals have good electrical and thermal conductivity. A dielectric layer is deposited between the metal layers or between the metal layer and the chip surface to achieve insulation and isolation. The dielectric layer can be an insulating material such as silicon dioxide or silicon nitride. Finally, the metal layer and the dielectric layer are patterned by processes such as photolithography and etching to form the required metal wiring. The photolithography process uses photoresist to transfer the designed pattern to the metal layer and dielectric layer, and then removes the unnecessary parts by etching, leaving the metal wiring.

[0029] Furthermore, the motor driver chip 120, the MOS chip 160 and the MCU chip 110 have multiple pads for connecting to external circuits. One end of the metal wiring of the RDL is connected to the pad position of these chips to realize the connection between the internal circuit of the chip and the external circuit. The connection method can be direct contact or through a connection structure such as a bump. Direct contact means that the metal wiring directly contacts the chip pad and realizes electrical connection through welding or other connection methods. Bump connection is to form a bump on the chip pad, and then contact the bump through the metal wiring to realize connection. The pin 170 on the package frame 100 is an interface for connecting to an external circuit board. The other end of the metal wiring of the RDL is connected to the substrate layer 300 to serve as the output pin of multiple chips and is finally connected to the pin 170 on the package frame 100 through the wire layer 200 to transmit the chip signal and power to the external circuit board. The connection method can be welding, crimping or other reliable connection methods. RDL can form finer metal wiring on the chip surface, thereby increasing the package density and reducing the package size. By reallocating the chip's I / O ports, RDL can optimize the signal transmission path, reduce signal delay and interference, and improve signal integrity.

[0030] In an embodiment, the motor drive chip 120, the MOS chip 160 and the MCU chip 110 can be integrated on the same base island within the packaging frame 100. By such arrangement, the MCU chip can be packaged with the motor drive chip and the MOS chip in high integration, and by packaging multiple chips into one chip, the overall space utilization of the chip is improved, and the production cost of the semiconductor device is reduced. In the embodiment, the brushless motor integrates at least three or more integrated circuit chips. Further, since the base island 200 needs to integrate multiple chips, the selected base island 200 can be expanded in area by etching or stamping according to the actual size of the motor drive chip 300, the MOS chip 300 and the MCU chip 500.

[0031] In an embodiment, the motor drive chip 120, the MOS chip 160 and the MCU chip 110 can generate crystal pillars at the pad positions by electrolytic deposition process to connect the metal wiring. The electrolytic deposition is a method of depositing metal on the surface of the electrode by using electrochemical principle. In this process, the electrolyte containing metal ions to be deposited is contacted with the pad positions of the motor drive chip, the MOS chip and the MCU chip, and the metal ions are reduced to metal crystals on the pads by applying current, thereby forming crystal pillars. These crystal pillars serve as connecting structures to achieve reliable connection between the chip pads and the RDL metal wiring. The crystal pillars have a certain height and diameter, which can ensure sufficient contact area and good conductivity between the metal wiring. The presence of the crystal pillars makes the connection between the chip and the metal wiring more stable, which can withstand mechanical and thermal stress during packaging process, and ensure stable transmission of signals and power.

[0032] In an embodiment, the chip packaging structure can further include a plastic package 500 covering the packaging frame 100, the motor drive chip 120, the MOS chip 160 and the MCU chip 110. The pins 170 can be arranged on the other side of the packaging frame 100 opposite to the wire layer 200. Further, the pins 170 can include multiple pins with different widths to meet different functional requirements. The pins can include a soldering area and multiple pins connected to the soldering area, and the multiple pins are arranged at intervals.

[0033] Please continue to review Figure 2, wherein the brushless motor chip packaging structure 10 may further include a through hole 600, which is arranged at the center of the brushless motor chip packaging structure 10, and the through hole 600 is used to install the brushless motor chip packaging structure 10 in the motor. Specifically, the above-mentioned through hole 600 can cooperate with the shaft or other mounting components in the motor, so that the chip packaging structure can be accurately installed at a specific position inside the motor, ensuring that the chip and other components of the motor are physically correctly connected, thereby realizing the chip's effective control and drive of the motor. For example, in the motor of a cooling fan, when installing the brushless motor chip packaging structure, the through hole can correspond to the fan shaft hole, so that the chip packaging structure can be stably installed in the installation space of the motor, and work in conjunction with other components of the motor to ensure the normal operation of the motor and the realization of the cooling fan function.

[0034] In one embodiment, the brushless motor chip packaging structure 10 may further include a power supply contact 700, a program burning contact 800, and a UVW three-phase output contact 900. Specifically, the power supply contact 700 provides power to the chip packaging structure, and the program burning contact 800 is used to burn the written program code into the storage unit inside the chip during the development, debugging, or updating process of the chip. For example, after the initial design of the chip is completed, the developer can transfer the algorithm, logic, and other programs that control the operation of the motor into the chip through the program burning contact, so that the chip can accurately control the motor according to the predetermined program. In the brushless motor, the UVW three-phase output contact 900 is the key signal output point for driving the motor to operate. The chip transmits the control signal to the three-phase winding of the motor through these three output contacts, thereby controlling the motor's rotation direction, speed, and other operating states.

[0035] In one embodiment, if Figure 3 As shown, the package frame 100 may further include an extension portion 180, on which an external capacitor contact 181 may be provided. The external capacitor contact 181 may be used to connect to an electrolytic capacitor 182. The outer edge of the extension portion 180 is an arc having the same curvature as the package frame 100, thereby ensuring that the chip package structure can adapt to the corresponding installation position of the motor.

[0036] In other embodiments, the brushless motor chip packaging structure 10 may further include an external PCB board, which may be bridged with the packaging frame 100. The external PCB board may be used to install other components, such as electrolytic capacitors, variable knob resistors, etc., which are relatively large in small motor applications and require additional placement in previous designs and cannot be directly integrated into the chip.

[0037] Therefore, the present invention provides a non-rectangular brushless motor chip package structure based on panel-level package (PLP) technology. This next-generation packaging technology utilizes multiple dies and surrounding components, such as diodes, resistors, and compact capacitors, within a single integrated circuit, resulting in a fully integrated chip with minimal external components. The final package structure in this embodiment is designed to have a non-rectangular shape, facilitating post-production installation within the motor body and reducing back-end development costs and time.

[0038] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, such as the mutual combination of technical features between the embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A non-rectangular brushless motor chip packaging structure, characterized in that: It includes a packaging frame and multiple chips integrated in the packaging frame, a redistribution layer RDL and a substrate layer are set on the packaging frame, the multiple chips are integrated in the packaging frame through the redistribution layer RDL and the substrate layer, and are respectively connected to the pins on the packaging frame, and the shape of the packaging frame is fan-shaped or circular.

2. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The multiple chips include a motor driver chip, a MOS chip and an MCU chip, and the packaging frame also includes resistors, capacitors and diodes.

3. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The redistribution layer RDL is located between the multiple chips and the substrate layer, and the output pins of the multiple chips are arranged in the redistribution layer RDL and then placed on the substrate layer.

4. The non-rectangular brushless motor chip packaging structure according to claim 3, characterized in that: The brushless motor chip packaging structure further includes a wire layer, which is arranged on the packaging frame and located between the packaging frame and the substrate layer. The wire layer is used to connect the output pins of the multiple chips to the pins on the packaging frame.

5. The non-rectangular brushless motor chip packaging structure according to claim 3, characterized in that: The redistribution layer RDL forms metal wiring by depositing a metal layer and a dielectric layer. One end of the metal wiring is connected to the pad positions of the multiple chips, and the other end is connected to the substrate layer to serve as the output pins of the multiple chips.

6. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The brushless motor chip packaging structure further includes a through hole, which is arranged at the center of the brushless motor chip packaging structure. The through hole is used to install the brushless motor chip packaging structure in the motor.

7. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The brushless motor chip packaging structure also includes a power supply contact, a program burning contact and a UVW three-phase output contact.

8. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The packaging frame further includes an extension portion, on which an external capacitor contact is provided. The external capacitor contact is used to connect to an electrolytic capacitor, and an outer edge of the extension portion is an arc with the same curvature as that of the packaging frame.

9. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The brushless motor chip packaging structure further includes an external PCB board, which is bridged to the packaging frame and is used to install other components.

10. The non-rectangular brushless motor chip packaging structure according to claim 1, characterized in that: The brushless motor chip packaging structure further includes a plastic package body, which covers the packaging frame and the multiple chips.

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