Packaging structure of photoelectric chip

Abstract

The utility model discloses a packaging structure of a photoelectric chip, which comprises a carrier and at least one chip, the chip is arranged on the carrier and is connected with the carrier through a metal wire, a light shielding body for blocking light is arranged between a transmitting module and a receiving module of the chip, a packaging body is arranged on the carrier, and the packaging body is arranged on the carrier. And the packaging body covers the carrier, the metal wires, the chip and the shading body. The receiving module and the transmitting module of the chip can be separated through the shading body, light is blocked, the effect of resisting light crosstalk is achieved, and the packaging body ensures that the light path of the chip is smooth and plays a role in protecting the chip. Wherein the shape and the thickness of the light shielding body can be randomly determined according to the number and the positions of the chips, and only the light shielding effect needs to be achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser radar chip technical field especially relates to a packaging structure of photoelectric chip. BACKGROUND

[0002] With the continuous progress of science, AI and intelligent driving technologies such as rapid development, laser radar chip is also constantly applied to various fields. With the increase of various applications of laser radar chip, the problem of crosstalk between its light emitting module and light receiving module frequently occurs, so how to improve the anti-light crosstalk capability of the chip during the chip packaging process has become a common problem.

[0003] The common packaging scheme of laser radar chip for resisting light crosstalk is mostly to paste a specially-made light-tight cover on the chip, and a barrier is made in the middle of the cover to separate the light receiving module / transmitting module of the chip, so as to avoid light crosstalk. The cover top is perforated for the light receiving module / transmitting module position and pasted with glass on the hole to ensure smooth light passage of the chip, so that the cover itself covers the surface of the carrier chip and is combined with the carrier to protect the chip.

[0004] But the above scheme, due to different laser radar chips, the size and the distribution position of the transceiver module will be different, resulting in that the light-blocking cover also needs to be customized according to the size and the position of the transceiver module, and the processing of the cover itself and the process of pasting glass make the manufacturing process of the laser radar chip more complicated, which increases the process difficulty and cost.

[0005] Therefore, the prior art still needs to be improved. UTILITY MODEL CONTENTS

[0006] In view of the above shortcomings of the prior art, the purpose of the utility model is to provide a packaging structure of photoelectric chip, which can effectively block light and prevent crosstalk.

[0007] To solve the above technical problems, the utility model adopts the following technical scheme:

[0008] A packaging structure of photoelectric chip, comprising a carrier, at least one chip, the chip is arranged on the carrier and connected with the carrier through a metal wire, a light-blocking body is arranged between the transmitting module and the receiving module of the chip, an encapsulating body is arranged on the carrier, and the encapsulating body covers the carrier, the metal wire, the chip and the light-blocking body.

[0009] In the packaging structure of the photoelectric chip, the number of the chip is one, the chip is provided with a transmitting module and a receiving module, and the light-blocking body is arranged on the chip and located between the transmitting module and the receiving module.

[0010] The packaging structure of the optoelectronic chip, the number of the chips is two, wherein one chip is provided with a transmitting module, and the other chip is provided with a receiving module, the light shielding body is arranged on one of the chips and between the two chips.

[0011] The packaging structure of the optoelectronic chip, the number of the chips is two, wherein one chip is provided with a transmitting module, and the other chip is provided with a receiving module, the light shielding body is arranged on the carrier and between the two chips.

[0012] The packaging structure of the optoelectronic chip, the number of the chips is three, wherein one or two chips are provided with a transmitting module, and the other two or one chip is provided with a receiving module, the light shielding body is arranged on two of the chips and on both sides of at least two adjacent chips.

[0013] The packaging structure of the optoelectronic chip, the number of the chips is three, wherein one or two chips are provided with a transmitting module, and the other two or one chip is provided with a receiving module, the light shielding body is arranged on the carrier and around both sides of at least two adjacent chips.

[0014] The packaging structure of the optoelectronic chip, the light shielding body is in a linear or L shape; or the light shielding body surrounds three sides of the transmitting module or the receiving module; or the light shielding body surrounds the transmitting module or the receiving module.

[0015] The packaging structure of the optoelectronic chip, the length of the light shielding body is greater than the length of the transmitting module and the receiving module.

[0016] The packaging structure of the optoelectronic chip, the height of the light shielding body is greater than the height of the transmitting module and the receiving module.

[0017] The packaging structure of the optoelectronic chip, the light shielding body is a light shielding adhesive strip, and the packaging body is a light-transmitting plastic packaging body.

[0018] Compared to the prior art, the optoelectronic chip packaging structure provided by the present invention includes a carrier and at least one chip. The chip is arranged on the carrier and connected to the carrier via metal wires. A light-blocking body is provided between the transmitting module and the receiving module of the chip to prevent light crosstalk between the transmitting module and the receiving module. A packaging body is provided on the carrier. The packaging body covers the carrier, metal wires, the chip and the light-blocking body to protect the metal wires, the chip and the light-blocking body from damage. The present invention can separate the receiving module from the transmitting module of the chip through the light-blocking body, and block light through the light-blocking body to achieve the effect of anti-light crosstalk. The packaging body ensures that the optical path of the chip is unobstructed and protects the chip. The shape and thickness of the light-blocking body can be randomly determined according to the number and position of the chips. It only needs to have a light-blocking effect, which effectively reduces production costs and process difficulty and improves the market competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the front structure of a first optional embodiment of the optoelectronic chip provided by the utility model.

[0020] Figure 2 This is a schematic cross-sectional structural diagram of a first optional embodiment of the optoelectronic chip provided by the present invention.

[0021] Figure 3 This is a schematic diagram of the front structure of a second optional embodiment of the optoelectronic chip provided by the present invention.

[0022] Figure 4 This is a schematic cross-sectional structural diagram of a second optional embodiment of the optoelectronic chip provided by the present invention.

[0023] Figure 5 This is a schematic diagram of the front structure of a third optional embodiment of the optoelectronic chip provided by the utility model.

[0024] Figure 6 This is a schematic cross-sectional structural diagram of a third optional embodiment of the optoelectronic chip provided by the present utility model.

[0025] Figure 7 This is a schematic diagram of the bottom structure of the optoelectronic chip provided by the utility model.

[0026] Description of Reference Numerals

[0027] Carrier 1, metal pad 11, chip 2, transmitter module 21, receiver module 22, metal wire 3, light shield 4, package 5, adhesive 6 DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] The packaging structure of the optoelectronic chip provided by the present invention can be used in a laser radar detection module. By setting a light-shielding body between different modules, the light receiving / transmitting modules of the chip are separated to achieve the effect of anti-light crosstalk, which greatly simplifies the process flow and relatively reduces the process difficulty and production cost.

[0030] See also Figure 1 and Figure 2 The packaging structure of the optoelectronic chip provided by the present invention includes a carrier 1 and at least one chip 2. The chip 2 can be set on the carrier 1 through an adhesive 6 and connected to the carrier 1 through a metal wire 3. The carrier 1 is a substrate, and the chip 2 is electrically connected to the substrate through the metal wire 3. After the optoelectronic chip is packaged, it can be mounted on the PCB board of the application product (such as a car, a sweeping robot, a drone, etc.) through SMT technology to perform ranging to determine the distance to the obstacle.

[0031] In a first optional embodiment of the present invention, the chip 2 is a single chip, and a transmitting module 21 and a receiving module 22 are provided on the front of the chip 2. The transmitting module 21 can be provided on the left side or the right side of the chip 2. On the chip 2, a light-blocking body 4 is provided between the transmitting module 21 and the receiving module 22. When making the light-blocking body 4, a dispensing machine can be used to dispense glue in the interval between the transmitting module 21 and the receiving module 22 to form a light-blocking adhesive strip (i.e., the light-blocking body 4). A package 5 is provided on the carrier 1. The package 5 covers the carrier 1, the metal wire 3, the chip 2, and the light-blocking body 4. The light-blocking body 4 can separate the receiving module 22 and the transmitting module 21 of the chip 2, thereby blocking the light between the receiving module 22 and the transmitting module 21 inside the optoelectronic chip to achieve the effect of anti-light crosstalk. The package 5 can be made of a transparent plastic package to ensure that the optical path of the chip 2 is unobstructed and protect the chip 2.

[0032] Preferably, the length of the light shielding body 4 is greater than the length of the transmitting module 21 and the receiving module 22. Figure 1 As shown, the length of the light shield 4 is at least greater than the length of the receiving module 22. The height of the light shield 4 is greater than the height of the transmitting module 21 and the receiving module 22 (as shown in FIG. Figure 2 As shown), its height is at least greater than the height of the receiving module 22 to ensure that the light shielding body 4 can block the light of different transmitting modules 21 and receiving modules 22 of the chip 2, thereby achieving the purpose of anti-light crosstalk.

[0033] In this embodiment, the light-shielding member 4 is a dark, opaque light-shielding adhesive strip, preferably a black light-shielding adhesive strip, which is applied to the surface of the chip 2 or carrier 1 by dispensing adhesive. Alternatively, the adhesive can be applied around the transmitting module 21 and / or receiving module 22 to completely block light. The specific shape and position of the adhesive strip can be determined as needed. There are no specific requirements for the shape and position of the adhesive strip, which greatly reduces the process difficulty. Only light blocking is required to improve production efficiency.

[0034] The packaging body 5 is a light-transmitting plastic package. Compared with the existing process and structure that requires the use of a special cover to open a hole and affix glass to the hole to ensure that the light path is unobstructed and to protect the structure, the light-transmitting plastic package can also ensure that the light path is unobstructed and to protect the structure. It can be manufactured through a molding process, which greatly simplifies the process flow and reduces production costs.

[0035] The packaging structure of the optoelectronic chip of the present invention is not limited to the first optional embodiment described above, and can be changed as needed. Figure 3 and Figure 4 In a second optional embodiment of the present invention, the number of the chips 2 is two, wherein one chip 201 is provided with a transmitting module 21, and the other chip 202 is provided with a receiving module 22, and the light shielding body 4 is provided on one of the chips (201 or 202) and is located between the two chips 201 and 202 (e.g. Figure 3 and Figure 4 shown).

[0036] Specifically, the light shielding body 4 is formed into a strip (i.e., a straight line) and is bonded to the Figure 3 On the left chip 201, a light shield 4 is located between the transmitter module 21 and the receiver module 22. This shield 4 isolates light from the adjacent sides of the transmitter module 21 and the receiver module 22 to prevent crosstalk. Alternatively, the light shield 4 can surround two, three, or four sides of the transmitter module 21 and / or the receiver module 22 (i.e., encircling the transmitter module 21 or the receiver module 22).

[0037] As can be seen, the present invention eliminates the need for a specialized cover to block light. Separating the receiving module 22 from the transmitting module 21 for different chip 2 configurations requires only adjusting the position and size of the adhesive (light shield 4). Furthermore, using the package 5 instead of a specialized cover simplifies the process, reducing both complexity and cost. This solution offers a simpler structure and enhanced resistance to light crosstalk.

[0038] In this embodiment, the shape of the light shielding body 4 can be adjusted according to the number of chips 2. In a third optional embodiment, the number of chips 2 is three, one chip (such as chip 201) or two chips (such as chips 201 and 202) are provided with a transmitting module 21, and the other two chips (such as chips 202 and 203) or one chip 2 (such as chip 203) are provided with a receiving module 22. The light shielding body 4 is provided on two of the chips 2 and is located on both sides of at least two adjacent chips 2 (such as chips 202 and 203). Figure 5 and Figure 6 shown).

[0039] Avoid such as Figure 5 As shown, a transmitter module 21 is provided on the chips 201 and 202 , and a receiver module 22 is provided on the chip 203 . The light shield 4 is provided on the chips 201 and 202 to prevent the light of the transmitter module 21 from being sensed by the receiver module 22 inside the optoelectronic chip.

[0040] Specifically, the light shield 4 is formed into an L-shape, forming a semi-enclosed shape, and is bonded to the chip 2. The light shield 4 is located between the transmitting module 21 and the receiving module 22. The light shield 4 can isolate the light from the adjacent sides of the transmitting module 21 and the receiving module 22 to prevent crosstalk. Of course, the light shield 4 can also be arranged around three or four sides of the transmitting module 21 and / or the receiving module 22.

[0041] In a fourth optional embodiment, the number of the chips 2 is two, one chip 201 is provided with a transmitting module 21, and the other chip 202 is provided with a receiving module 22. The light shielding body 4 is provided on the carrier 1 and is located between the two chips 2 (Note: The structure of this embodiment is not shown in the figure, but its structure is similar to Figure 3 and Figure 4 The structure shown is similar, the main difference being the position of the light shield 4. Specifically, the light shield 4 is formed into a long strip, adhered to the carrier 1, and located between the transmitting module 21 and the receiving module 22. The light shield 4 can separate the light on the side adjacent to the transmitting module 21 and the receiving module 22 to prevent crosstalk.

[0042] In the fifth optional embodiment, the number of the chips 2 is three. The only difference from the third optional embodiment is that the light shielding body 4 is provided on the carrier 1 and surrounds both sides of at least two adjacent chips 2 (Note: the structure of this embodiment is not shown in the figure, but its structure is similar to that of the third optional embodiment). Figure 5 and Figure 6The structure shown is similar, the main difference being the position of the light shield 4. Specifically, the light shield 4 is formed into an L-shape, forming a semi-enclosed shape, adhered to the carrier 1, and located between the transmitting module 21 and the receiving module 22. The light shield 4 can separate the light from the adjacent sides of the transmitting module 21 and the receiving module 22 to prevent crosstalk. Similarly, the light shield 4 can also be set to other shapes.

[0043] In a sixth optional embodiment, the number of the chips 2 is four or more, at least one chip 2 is provided with a transmitting module 21, and the other chips 2 are provided with a receiving module 22, or at least one chip 2 is provided with a receiving module 21, and the other chips 2 are provided with a transmitting module 21. The light shielding body 4 is provided on at least three chips 2, and is located on both sides, three sides and fully surrounds the chip 2 of at least three adjacent chips 2, and is located between adjacent transmitting modules 21 and receiving modules 22. The light shielding body 4 can separate the light on both sides adjacent to the transmitting module 21 and the receiving module 22 to avoid crosstalk.

[0044] In the above optional embodiment, after the light-shielding body 4 is set, the packaging body 5 is then covered on the exposed parts of the chip 2, the metal wire 3, the light-shielding body 4 and the adhesive 6, leaving no cavity in the middle. The packaging body 5 protects and supports these structures and also ensures that the optical path between the transmitting module 21 and the receiving module 22 is unobstructed.

[0045] In addition, the bottom of the chip 2 is fixed to the carrier 1 by an adhesive 6, and the chip 2 and the carrier 1 are electrically connected by welding with a metal wire 3. The carrier 1 is located at the bottom of the chip 2, the metal wire 3, the light shield 4 and the adhesive 6, and plays a supporting and protective role for each structure. In addition, it is connected to the metal wire 3 to lead the electrical signals of each chip 2 to the metal pad 11 at the bottom of the carrier 1 (such as Figure 7 shown).

[0046] All of the above embodiments can be used. The position and shape of the light shield 4 are determined based on the number of chips 2, as long as they can isolate the light and avoid crosstalk. Through the above embodiments, it can be found that the light shield 4 is a light shielding strip, which can be black light shielding strip. The position, shape, and thickness of the light shield 4 can be randomly determined based on the number and position of the chips 2. It only needs to provide a light blocking effect, which greatly reduces the process difficulty. Only light blocking is required, thereby improving production efficiency and the qualified rate of finished products.

[0047] In summary, the packaging structure of the optoelectronic chip provided by the present invention includes a carrier and at least one chip. The chip is arranged on the carrier and connected to the carrier through metal wires. A light-blocking body is provided between the transmitting module and the receiving module of the chip. A package is provided on the carrier, and the package covers the carrier, the metal wires, the chip and the light-blocking body. The light-blocking body can separate the receiving module and the transmitting module of the chip to block light to achieve the effect of anti-light crosstalk. The package ensures that the optical path of the chip is unobstructed and protects the chip. The shape and thickness of the light-blocking body can be randomly determined according to the number and position of the chips, and it only needs to have a light-blocking effect.

[0048] The packaging structure of the optoelectronic chip of the present invention ensures smooth optical paths and anti-crosstalk capabilities, while simplifying the design and material selection, effectively reducing production costs and process difficulty, and improving the market competitiveness of the product.

[0049] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and utility model concept of the present invention, and all these changes or substitutions should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A packaging structure for an optoelectronic chip, comprising a carrier and at least one chip, wherein the chip is arranged on the carrier and connected to the carrier via metal wires, characterized in that: A light shielding body for blocking light is arranged between the transmitting module and the receiving module of the chip, and a packaging body is arranged on the carrier, and the packaging body covers the carrier, metal wires, the chip and the light shielding body.

2. The packaging structure of the optoelectronic chip according to claim 1, characterized in that: The number of the chip is one, and the chip is provided with a transmitting module and a receiving module. The light shielding body is provided on the chip and is located between the transmitting module and the receiving module.

3. The packaging structure of the optoelectronic chip according to claim 1, characterized in that: There are two chips, one of which is provided with a transmitting module and the other is provided with a receiving module. The light shield is provided on one of the chips and is located between the two chips.

4. The packaging structure of the optoelectronic chip according to claim 1, characterized in that: There are two chips, one of which is provided with a transmitting module, and the other is provided with a receiving module. The light shielding body is provided on the carrier and is located between the two chips.

5. The optoelectronic chip packaging structure according to claim 1, characterized in that: There are three chips, one or two of which are provided with a transmitting module, and the other two or one chip are provided with a receiving module. The light shielding body is provided on two of the chips and is located on both sides of at least two adjacent chips.

6. The packaging structure of the optoelectronic chip according to claim 1, characterized in that: There are three chips, one or two of which are provided with a transmitting module, and the other two or one chip are provided with a receiving module. The light shield is provided on the carrier and surrounds two sides of at least two adjacent chips.

7. The optoelectronic chip packaging structure according to claim 1, characterized in that: The light shielding body is in a straight line or L-shape; or the light shielding body surrounds three sides of the transmitting module or the receiving module; or the light shielding body surrounds the transmitting module or the receiving module.

8. The optoelectronic chip packaging structure according to any one of claims 1 to 6, characterized in that: The length of the light shield is greater than the length of the transmitting module and the receiving module.

9. The optoelectronic chip packaging structure according to any one of claims 1 to 6, characterized in that: The height of the light shielding body is greater than the height of the transmitting module and the receiving module.

10. The optoelectronic chip packaging structure according to any one of claims 1 to 6, characterized in that: The light-shielding body is a light-shielding rubber strip, and the packaging body is a light-transmitting plastic packaging body.

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