Assembly structure and beauty instrument comprising same

Abstract

The utility model provides an assembly structure and a beauty instrument comprising the same, relates to the technical field of beauty instruments, and solves the technical problems that the assembly structure is high in production difficulty, large in quantity and high in cost. The assembling structure comprises a plurality of supporting pressing pieces surrounding the peripheral side of a to-be-assembled part. All the supporting pressing pieces are arranged in a cantilever mode and connected with a to-be-assembled component in a small-area press fit mode. According to the assembling structure, the structure for fixing the semiconductor adopts a multi-point surface fixing mode, the plurality of supporting pressing sheets are designed to be thin cantilevers, the cantilevers are elastic, the semiconductor can be effectively limited, the semiconductor cannot be fractured, and under the condition that materials are not increased, the production difficulty is reduced, the production efficiency is improved, and the product quality is improved; the product cost competitive advantage is improved, the problems that the use amount of heat-conducting silicone grease is difficult to control and the production difficulty is high are effectively solved, and meanwhile, buffer rubber mat materials do not need to be added.

Description

Technical Field

[0001] The utility model relates to the technical field of beauty instruments, and in particular to an assembly structure and a beauty instrument comprising the same. Background Art

[0002] The beauty instrument has ice compress and hot compress functions, which are completed through the work of semiconductor refrigeration sheets. The surface of the semiconductor is a thin ceramic sheet, and the interior is a combination of many PN poles. The whole cannot be subjected to obvious force when assembled and fixed, otherwise it is easy to cause external cracks or internal cracks, resulting in weakened function and failure.

[0003] like Figure 1 As shown, the assembly structure of the semiconductor refrigeration plate in the beauty instrument in the prior art, the outer surface of the semiconductor 2 is contacted by the shell 1 (massage head) on all sides during the installation process. When the locking screw 3 fixes the shell 1 (massage head), the shell 1 (massage head) will sink due to the tightening tension of the screw 3, causing the entire shell 1 (massage head) to be tightly pressed on the semiconductor 2. When the screw 3 is tightened, the upper edge of the semiconductor 2 is subjected to overall force. Due to the accumulation of assembly tolerances, parts processing tolerances, etc., a certain proportion of semiconductor 2 is fractured during the production process, resulting in weakened function or failure.

[0004] The applicant has found that the existing technology has at least the following technical problems: To solve this problem, the force on the semiconductor can be reduced from the assembly structure to avoid the semiconductor being crushed during the screw tightening process, which will lead to weakened or ineffective functions. One method is to raise the support column of the locking screw so that the shell (massage head) will not be pressed tightly on the semiconductor when the screw is tightened. The upper and lower mounting surfaces of the semiconductor are in a loose state. The looseness in the upper and lower directions is filled with more thermal grease to fill the gap between the ice compress head and the semiconductor, so that the semiconductor will not loosen. However, the amount of thermal grease used is difficult to control. If too little is applied, it will not play a filling role. If too much is applied, it will overflow and cause the hot and cold surfaces of the semiconductor to be connected, making production quite difficult. Another method is to add a buffer pad. The product structure space needs to be increased, and the assembly process and parts need to be increased, resulting in increased costs.

[0005] In order to reduce the difficulty of production and avoid adding buffer pads, it is necessary to consider an assembly method with an elastic structure that can effectively assemble semiconductors while avoiding fracturing the semiconductors. Utility Model Content

[0006] The purpose of the present invention is to provide an assembly structure and a beauty instrument comprising the same, so as to solve the technical problems in the prior art of the assembly structure being difficult to produce, requiring a large number of parts and having a high cost.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] The utility model provides a kind of assembly structure, including the support pressing piece of being around in the component to be assembled peripheral side;All the support pressing piece is arranged in the form of cantilever, and with the small area pressing connection of component to be assembled.

[0009] The assembly structure provided by the utility model, the structure of the fixed semiconductor adopts the mode of multiple-point surface fixing, multiple support pressing pieces are designed as thin cantilevers, the cantilever is elastic, can effectively limit the semiconductor, but will not crack the semiconductor, without increasing material, reduce production difficulty, improve production efficiency, improve product quality, improve product cost competitive advantage, effectively solve the problem that the amount of heat-conducting silicone grease is difficult to control and the production difficulty is great, without increasing buffer rubber pad material.

[0010] As a further improvement of the utility model, the number of support pressing pieces is three, respectively located at the adjacent three edges of the component to be assembled.

[0011] As a further improvement of the utility model, the support pressing piece is made of elastic sheet.

[0012] As a further improvement of the utility model, the pressing distance between the end of the support pressing piece and the component to be assembled is 0.7-1mm.

[0013] As a further improvement of the utility model, the thickness of the support pressing piece is 0.8-1.2mm, the width is 2-6mm, and the length is 3-8mm.

[0014] As a further improvement of the utility model, the support pressing piece is made of plastic material ABS or PC material.

[0015] The utility model provides a kind of beauty instrument, including semiconductor, shell, detection plate and the assembly structure;Wherein:

[0016] The shell top has installation port;

[0017] The detection plate is located at the bottom of the installation port, and is fixedly connected with the shell by a plurality of fastening screws;

[0018] The semiconductor is placed in the installation port;

[0019] The assembly structure is arranged at the peripheral side of the installation port to form multiple-point pressing fixation to the semiconductor.

[0020] The cosmetic instrument has three-point fixed surface structure, three suspension arm supporting pressing pieces, and the suspension arm supporting pressing pieces are thin and elastic, can effectively limit the semiconductor, and will not crack the semiconductor, and can reduce production difficulty, improve production efficiency, improve product quality, improve product cost competition advantage, effectively solve the problem of difficult control of the amount of heat-conducting silicone grease, and do not need to increase the buffer rubber pad material.

[0021] As a further improvement of the utility model, the installation opening is provided with an anti-pressure groove corresponding to the position between adjacent fastening screws.

[0022] As a further improvement of the utility model, the supporting pressing piece is formed on the side of the anti-pressure groove away from the fastening screw.

[0023] As a further improvement of the utility model, the fastening screw is three, and is arranged at the first edge, the second edge and the third edge of the installation opening respectively, and the number of the supporting pressing piece is three, and is arranged at the first edge, the third edge and the fourth edge of the installation opening respectively.

[0024] The cosmetic instrument has three-point fixed surface structure, three suspension arm supporting pressing pieces, and the suspension arm supporting pressing pieces are thin and elastic, can effectively limit the semiconductor, and will not crack the semiconductor, and can reduce production difficulty, improve production efficiency, improve product quality, improve product cost competition advantage, effectively solve the problem of difficult control of the amount of heat-conducting silicone grease, and do not need to increase the buffer rubber pad material. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0026] Figure 1 It is the assembly structure diagram of the semiconductor in the cosmetic instrument in the prior art;

[0027] Figure 2 It is the structure schematic view of the assembly structure of the utility model;

[0028] Figure 3 is the explosion structure schematic diagram of the cosmetic instrument of the utility model;

[0029] Figure 4 is the local section view of the cosmetic instrument of the utility model;

[0030] Figure 5 is the structure schematic diagram of the cosmetic instrument from the oblique upper side;

[0031] Figure 6 is the overhead structure schematic diagram of the cosmetic instrument.

[0032] In the figure, 1, shell; 2, semiconductor; 3, screw; 4, support pressing piece; 5, pressure-avoiding groove; 6, mounting port; 7, fastening screw; 8, detection plate. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the utility model more clear, the technical scheme of the utility model will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope protected by the utility model.

[0034] Embodiment 1:

[0035] As shown in Figures 2-6 The utility model provides an assembly structure, comprising a plurality of support pressing pieces 4 around the circumference of the component to be assembled; all support pressing pieces 4 are arranged in the form of a cantilever, and are connected to the component to be assembled in small area compression.

[0036] It should be noted that in this embodiment, the component to be assembled is a semiconductor 2 in the cosmetic instrument, the semiconductor 2 is installed on the top of the shell 1 through the assembly structure, and then an ice compress head is installed on the top of the semiconductor 2.

[0037] The assembly structure provided by the utility model adopts a multi-point plane fixing mode for the structure of the semiconductor 2, and the plurality of support pressing pieces 4 are designed as thin cantilevers. The cantilever is elastic, can effectively limit the semiconductor 2, but will not crack the semiconductor 2, reduces the production difficulty, improves the production efficiency, improves the product quality, improves the product cost competitive advantage, effectively solves the problem of difficult control of the amount of heat-conducting silicone grease and difficult production, and does not need to increase the buffer rubber pad material.

[0038] As an optional embodiment of the utility model, the number of the supporting pressing sheet 4 can be two, three, four or more, the simplest fixing mode is to set the supporting pressing sheet 4 on the opposite sides of the semiconductor 2 respectively, thereby forming a two-point fixing mode, but this mode has the problem of unstable fixing, therefore, considering the simple structure, the processing difficulty and the cost, as shown in the figure, the embodiment adopts the technical scheme that the number of the supporting pressing sheet 4 is three, thereby setting the supporting pressing sheet 4 on the three edges of the semiconductor 2 respectively, and the three edges are three edges in turn. Figure 2

[0039] Through the three-point fixing structure, not only the characteristics of simple structure, convenient operation, easy processing and low cost are possessed, but also the enough stability of the assembly structure can be guaranteed, and the semiconductor 2 can not be displaced after being assembled.

[0040] In order to reduce the pressure as much as possible on the basis of guaranteeing the fixing effect, in the embodiment, the supporting pressing sheet 4 is made of a flexible sheet.

[0041] Specifically, the thickness of the supporting pressing sheet 4 is 0.8-1.2mm, the width is 2-6mm, and the length is 3-8mm.

[0042] In order to realize good pressing of the semiconductor 2, in the embodiment, the end of the supporting pressing sheet 4 should exceed the edge of the semiconductor 2, thereby forming an overlapping pressing cover area, and the size of the pressing cover area determines the pressure, and in the embodiment, the pressing cover area is small, and the size of the pressing cover area is that the pressing cover distance between the end of the supporting pressing sheet 4 and the component to be assembled is 0.7-1mm.

[0043] The pressing cover area can be calculated through the width of the supporting pressing sheet 4 and the pressing cover distance, the supporting pressing sheet 4 only presses the semiconductor 2 in a range less than 1mm of the edge, on the basis of realizing the pressing of the semiconductor 2 for fixing, small-area pressing is also realized, and the pressure applied is small.

[0044] As an optional embodiment of the utility model, the supporting pressing sheet 4 is made of plastic material ABS or PC material.

[0045] Embodiment 2:

[0046] In the embodiment, as shown in the figure, the utility model provides a beauty instrument, which comprises a semiconductor 2, a shell 1, a detection plate 8 and the assembly structure in embodiment 1; wherein: Figures 2-6

[0047] The shell 1 has a mounting port 6 at the top;

[0048] The detection plate 8 is located at the bottom of the mounting port 6 and is fixedly connected with the shell 1 through a plurality of fastening screws 7; ​​

[0049] Specifically, as shown in Figure 3 the first edge, the second edge and the third edge of the mounting port 6, and the support pressing pieces 4 are arranged at the first edge, the third edge and the fourth edge of the mounting port 6; wherein, the principle of the arrangement position of the support pressing pieces 4 is that the support pressing pieces 4 are arranged far away from the fastening screws 7 so as to prevent the force of the fastening screws 7 from being transmitted to the support pressing pieces 4;

[0050] The semiconductor 2 is placed in the mounting port 6;

[0051] The assembly structure is arranged at the side of the mounting port 6 so as to form multi-point pressing and fixing of the semiconductor 2.

[0052] Specifically, the mounting port 6 is provided with the pressure-avoiding grooves 5 corresponding to the positions between the adjacent fastening screws 7, and the support pressing pieces 4 are formed in the pressure-avoiding grooves 5.

[0053] As shown in Figures 2-6 the first edge, the third edge and the fourth edge of the mounting port 6; and each pressure-avoiding groove 6 is vertically extended to form a cantilevered support pressing piece 4.

[0054] The cosmetic instrument provided by the utility model adopts the three-point surface fixing mode to fix the semiconductor 2, the three support pressing pieces 4 are designed as thin cantilevers, the cantilevers are elastic, can effectively limit the semiconductor 2, but will not crack the semiconductor 2, under the condition of not increasing the material, reduce the production difficulty, improve the production efficiency, improve the product quality, improve the product cost competition advantage, effectively solve the problem that the amount of the heat-conducting silicone grease is difficult to control and the production difficulty is great, and the buffer rubber pad material is not needed to be increased.

[0055] Further, the support pressing pieces 4 are formed at the side of the pressure-avoiding grooves 5 far away from the fastening screws 7. As shown in Figure 2 the support pressing piece 4 located at the first edge is located at the left side of the pressure-avoiding groove 5 and far away from the fastening screw 7 on the right side, the support pressing piece 4 located at the third edge is located at the left side of the pressure-avoiding groove 5 and far away from the fastening screw 7 on the right side, and the support pressing piece 4 located at the fourth edge is located at the middle of the pressure-avoiding groove 5 at the position so as to be far away from the fastening screws 7 on the left and right sides.

[0056] The beauty instrument of the present invention adopts plastic materials such as ABS and PC for the shell (massage head). The contact between the shell 1 (massage head) and the upper surface of the semiconductor 2 is changed from the four-circular contact in the prior art to the cantilever three-point contact. Only three cantilever support pressing pieces 4 are pressed on the semiconductor 2. The cantilever design is relatively thin, with a thickness of 0.8-1.2mm, a width of about 2-6mm, and a length of about 3-8mm. The three cantilever support pressing pieces 4 are away from the fastening screws 7, thereby reducing the force transmitted to the cantilever support pressing piece 4. The screw locking force is strong, and the disconnection form is adopted near the fastening screw 7, that is, a pressure-avoiding groove 5 is set between the fastening screws 7 (a larger incision is designed near the cantilever support pressing piece 4 and the fastening screw 7), so that it is not an integral connection, and the cantilever is disconnected from the screw hole to form an independent support point. Except for the cantilever position, the rest of the places above the semiconductor are avoided and do not contact the shell (massage head). Only the cantilever support pressing piece 4 position above the semiconductor 2 is under force, and the contact overlap between the cantilever support pressing piece 4 and the semiconductor 2 is roughly 0.7-1.0mm. After locking the fastening screws, the screw locking force transmitted to the cantilever support pressing piece 4 can be reduced, thereby reducing the pressing force of the cantilever support pressing piece 4 on the semiconductor. The cantilever support pressing piece 4 with a plastic structure has certain toughness and elasticity. During the screw tightening process, the cantilever support pressing piece 4 will not sink due to the screw locking force and crack the semiconductor. The accumulated tolerances in the assembly process can also be compensated by the rebound deformation of the cantilever, which completely solves the problem of the semiconductor locking screw being cracked due to the accumulation of processing tolerances and assembly tolerances, and improves product quality without increasing costs.

[0057] First of all, it should be noted that “inward” refers to the direction toward the center of the accommodating space, and “outward” refers to the direction away from the center of the accommodating space.

[0058] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate directions or positional relationships based on the attached figures. Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0060] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0061] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0062] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0063] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An assembly structure, characterized in that: It comprises a plurality of supporting pressing sheets surrounding the periphery of the component to be assembled; all the supporting pressing sheets are arranged in a cantilever form and are press-fitted and connected with the component to be assembled in a small area.

2. The assembly structure according to claim 1, characterized in that: There are three supporting pressing sheets, which are respectively located at three adjacent sides of the component to be assembled.

3. The assembly structure according to claim 1, characterized in that: The supporting pressing sheet is made of an elastic thin sheet.

4. The assembly structure according to claim 1, wherein: The pressure covering distance between the end of the supporting pressing sheet and the component to be assembled is 0.7-1 mm.

5. The assembly structure according to claim 1, characterized in that: The supporting pressing sheet has a thickness of 0.8-1.2 mm, a width of 2-6 mm, and a length of 3-8 mm.

6. The assembly structure according to claim 1, characterized in that: The supporting pressing sheet is made of plastic material ABS or PC material.

7. A beauty instrument, characterized in that: The device comprises a semiconductor, a housing, a detection board, and an assembly structure as claimed in any one of claims 1 to 6; wherein: The top of the housing is provided with a mounting opening; The detection plate is located at the bottom of the installation opening and is fixedly connected to the housing by a plurality of fastening screws; The semiconductor is placed in the installation opening; The assembly structure is arranged on the peripheral side of the mounting opening to form a multi-point pressing fixation for the semiconductor.

8. The beauty instrument according to claim 7, characterized in that: A pressure-avoiding groove is provided on the installation opening at a position corresponding to a position between adjacent fastening screws, and the supporting pressing piece is formed in the pressure-avoiding groove.

9. The beauty instrument according to claim 8, characterized in that: The supporting pressing sheet is formed on a side of the pressure-avoiding groove away from the fastening screw.

10. The beauty instrument according to claim 7, characterized in that: There are three fastening screws, which are respectively arranged at the first side, the second side and the third side of the installation opening; there are three supporting pressing plates, which are respectively arranged at the first side, the third side and the fourth side of the installation opening.

Images