Wire harness rubber coating mold

CN223431923UActive Publication Date: 2025-10-14SUZHOU MEISI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202422116969.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-29
Publication Date
2025-10-14
Estimated Expiration
2034-08-29

AI Technical Summary

Technical Problem

The existing wire harness encapsulation mold has a complex structure, which leads to undesirable phenomena such as burrs and material shortages after encapsulation, affecting the sealing effect.

Method used

A wire harness overmolding mold is designed, which includes an upper mold plate and a lower mold plate. Multiple overflow grooves and runners are set to form a cavity when the mold is closed. After glue injection, the overflow grooves and runners are designed to allow the glue to flow fully, avoiding burrs and material shortages. Limit blocks are used to facilitate wire harness placement.

Benefits of technology

It achieves a burr-free and material-free encapsulation effect, ensures tightness, avoids residual rubber and bubble generation after molding, and simplifies the demoulding process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223431923U_ABST
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Abstract

The utility model relates to the field of wire harness encapsulation, in particular to a wire harness encapsulation mold which comprises an upper mold plate and a lower mold plate, the upper mold plate is provided with an upper cavity and an upper product groove connected with the upper cavity, and the lower mold plate is provided with a lower cavity and a lower product groove connected with the lower cavity; when the mold is closed, the upper cavity and the lower cavity are correspondingly connected to form a cavity, the upper product groove and the lower product groove are correspondingly connected, the wire harness is embedded in the upper product groove and the lower product groove at the same time, and at least part of the wire harness is arranged in the cavity. During glue injection, glue enters the cavity through the first runner and the first gap, after the cavity is filled, the glue is discharged through the second gap and the second runner, through the arrangement of the first gap and the second gap, after molding, only a small part of connection exists between a product and redundant materials, and the product and the redundant materials can be directly torn off; the situation that burrs are generated or the burrs are not easy to clean is avoided.
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Description

TECHNICAL FIELD

[0001] The utility model relates to harness encapsulation technical field, especially relates to a harness encapsulation mould. BACKGROUND

[0002] "Encapsulation" is actually a secondary forming, and the product generally comprises a main body part and an outer part, and the outer part (soft glue) mold design takes the main body part as a reference, and the secondary soft glue is wrapped together by the mold.

[0003] Some harnesses used in automobiles, mechanical equipment and the like have sealing or wear resistance requirements, and are usually encapsulated in some areas of the harness. The existing harness encapsulation mold is mostly complex in structure, and after encapsulation, burrs, material defects and the like are prone to occur, which leads to poor sealing in use. Therefore, how to make the encapsulated harness free of burrs, material defects and the like is a problem that needs to be considered by the person skilled in the art. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a harness encapsulation mold to solve the burr and material defect problems in the prior art.

[0005] The technical scheme of the utility model is a harness encapsulation mold, which comprises an upper mold plate and a lower mold plate, the upper mold plate is provided with an upper cavity and an upper product groove connected with the upper cavity, and the lower mold plate is provided with a lower cavity and a lower product groove connected with the lower cavity; when the mold is closed, the upper cavity and the lower cavity are connected correspondingly to form a forming cavity, and the upper product groove and the lower product groove are connected correspondingly, and the harness is embedded in the upper product groove and the lower product groove, and at least part of the harness is arranged in the forming cavity.

[0006] The lower end of the upper mold plate is provided with a first overflow groove, and the first overflow groove and the upper cavity are connected to form a first protrusion; the upper end of the lower mold plate is provided with a second overflow groove, and the second overflow groove and the lower cavity are connected to form a second protrusion; when the mold is closed, the first overflow groove and the second overflow groove are connected correspondingly to form a first flow channel, and the first protrusion and the second protrusion are connected correspondingly to form a first gap.

[0007] Preferably, the upper mold plate is provided with an injection hole, and the lower end of the injection hole is connected with the first overflow groove.

[0008] Preferably, the second overflow groove is provided with a buffer hole, and the buffer hole corresponds to the injection hole.

[0009] Preferably, a third overflow groove is provided at the lower end of the upper template, and the third overflow groove is provided on the side of the first overflow groove opposite to the upper cavity, and a third protrusion is formed at the connection between the third overflow groove and the upper cavity; a fourth overflow groove is provided on the lower template, and the fourth overflow groove is provided on the side of the second overflow groove opposite to the lower cavity, and a fourth protrusion is formed at the connection between the fourth overflow groove and the lower cavity; when the mold is closed, the third overflow groove and the fourth overflow groove are correspondingly connected to form a second flow channel, and the third protrusion and the fourth protrusion are connected to form a second gap.

[0010] Preferably, a fifth overflow groove is provided on the lower template, the fifth overflow groove is connected to the fourth overflow groove, and the depth of the fifth overflow groove is smaller than that of the fourth overflow groove.

[0011] Preferably, a sixth overflow groove is provided on the lower template, the sixth overflow groove is connected to the fifth overflow groove, and the depth of the sixth overflow groove is greater than that of the fifth overflow groove.

[0012] Preferably, a seventh overflow trough is provided on the lower template, and the seventh overflow trough is connected to the sixth overflow trough through the eighth overflow trough, and the depth of the eighth overflow trough is smaller than that of the seventh overflow trough and the sixth overflow trough.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] (1) When injecting glue, the glue enters the cavity through the first flow channel and the first gap. After filling the cavity, the glue is discharged through the second gap and the second flow channel. By setting the first gap and the second gap, after molding, there is only a very small connection between the product and the excess material, which can be directly torn off, avoiding the generation of burrs or the occurrence of burrs that are difficult to clean;

[0015] (2) The second flow channel, the fifth overflow trough, the sixth overflow trough and the seventh overflow trough are provided to ensure that the excess rubber material flows out in time and has sufficient accommodation space, thereby avoiding the impact on the encapsulation operation; in addition, the rubber material can flow fully, avoiding the generation of bubbles in the cavity, thereby avoiding defects such as material shortage after molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0017] Figure 1 This is a structural diagram of the wire harness rubber coating mold of the utility model;

[0018] Figure 2 This is a schematic diagram of the top view of the wire harness rubber coating mold of the utility model;

[0019] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle;

[0020] Figure 4 For Figure 3 Structure schematic view amplified in B;

[0021] Figure 5 For Figure 3 Structure schematic view amplified in C;

[0022] Figure 6 Structure schematic view of the upper mold plate of the utility model;

[0023] Figure 7 Structure schematic view of the lower mold plate of the utility model.

[0024] Among them: the upper mold plate 1, the first flow channel 1a, the second flow channel 1b, the upper cavity 11, the upper product groove 12, the injection hole 13, the first overflow groove 14, the first protrusion 15, the third overflow groove 16, the third protrusion 17;

[0025] The lower mold plate 2, the first gap 2a, the second gap 2b, the lower cavity 21, the lower product groove 22, the buffer hole 23, the second overflow groove 24, the second protrusion 25, the fourth overflow groove 26, the fourth protrusion 27, the fifth overflow groove 28, the sixth overflow groove 29, the seventh overflow groove 291, the eighth overflow groove 292;

[0026] Cavity 3;

[0027] Wire harness 4;

[0028] Limiting block 5, notch 51. DETAILED DESCRIPTION

[0029] The content of the utility model will be further described in detail in combination with specific embodiments:

[0030] As Figures 1-7 Indicated, the utility model is applied to the outer circle rubber coating of wire harness, when using, the wire harness is placed in the lower product groove, and at least part is placed in the lower cavity. When clamping, the upper product groove and the lower product groove are connected wire harness simultaneously and form sealing. After filling the cavity, the glue material flows into the second flow channel via the second gap, and the excess glue material flows into the sixth overflow groove via the fifth overflow groove, and if there is more glue material, it can also flow into the seventh overflow groove via the eighth overflow groove. After forming, when opening the mold, the wire harness is taken out, and the excess glue material can be directly torn off. Specifically:

[0031] The mould for wire harness encapsulation comprises an upper die plate 1 and a lower die plate 2, the upper die plate 1 is provided with an upper cavity 11 and an upper product groove 12 connected with the upper cavity 11, the lower die plate 2 is provided with a lower cavity 21 and a lower product groove 22 connected with the lower cavity 21; when the mould is closed, the upper cavity 11 and the lower cavity 21 are connected correspondingly to form a forming cavity 3, the upper product groove 12 and the lower product groove 22 are connected correspondingly, the wire harness 4 is embedded in the upper product groove 12 and the lower product groove 22 at the same time, and at least part of the wire harness 4 is placed in the forming cavity 3. It should be noted that the encapsulation of the wire harness 4 generally has two kinds, one is to encapsulate the end of the wire harness 4 entirely, and the other is to encapsulate a section of the wire harness 4. In the embodiment, the second case is taken as an example for description, wherein the upper product groove 12 is provided with two sections and is arranged at two ends of the upper cavity 11 respectively; correspondingly, the lower product groove 22 is also provided with two sections and is arranged at two ends of the lower cavity 21 respectively. When the mould is closed, the wire harness 4 passes through the forming cavity 3, both ends of the wire harness 4 are connected with the upper product groove 12 and the lower product groove 22, and are sealed. In addition, in order to facilitate the placement of the wire harness 4, a limiting block 5 can be connected to the lower die plate 2, the limiting block 5 is provided with a notch 51 corresponding to the lower product groove 22, and the wire harness 4 can be placed directly through the notch 51, thereby facilitating the rapid placement of the wire harness 4.

[0032] The upper die plate 1 is provided with an injection hole 13, the lower end of the injection hole 13 is connected with a first overflow groove 14. The second overflow groove 24 is provided with a buffer hole 23 corresponding to the injection hole 13. In the embodiment, the diameter of the injection hole 13 near the first overflow groove 14 is larger than the diameter of the upper end of the injection hole 13, so as to facilitate the separation of the glue at the injection hole 13 during demoulding. When the glue is injected, the buffer hole 23 is used for buffering to avoid splashing and bubbles formed by directly impacting the lower die plate 2.

[0033] The lower end of the upper die plate 1 is provided with the first overflow groove 14, the first overflow groove 14 is connected with the upper cavity 11 to form a first protrusion 15; the upper end of the lower die plate 2 is provided with the second overflow groove 24, the second overflow groove 24 is connected with the lower cavity 21 to form a second protrusion 25; when the mould is closed, the first overflow groove 14 and the second overflow groove 24 are connected correspondingly to form a first flow channel 1a, and the first protrusion 15 and the second protrusion 25 are connected correspondingly to form a first gap 2a.

[0034] The lower end of the upper die plate 1 is provided with a third overflow groove 16, the third overflow groove 16 is arranged on the side opposite to the first overflow groove 14 relative to the upper cavity 11, and the third overflow groove 16 is connected with the upper cavity 11 to form a third protrusion 17; the lower die plate 2 is provided with a fourth overflow groove 26, the fourth overflow groove 26 is arranged on the side opposite to the second overflow groove 24 relative to the lower cavity 21, and the fourth overflow groove 26 is connected with the lower cavity 21 to form a fourth protrusion 27; when the mould is closed, the third overflow groove 16 and the fourth overflow groove 26 are connected correspondingly to form a second flow channel 1b, and the third protrusion 17 and the fourth protrusion 27 are connected to form a second gap 2b.

[0035] In this embodiment, during glue injection, the glue flows sequentially from the first flow channel 1a and the first gap 2a into the mold cavity 3. After filling the mold cavity 3, it flows into the second flow channel 1b through the second gap 2b. The spacing and width of the first gap 2a and the second gap 2b are relatively small, allowing the glue entering the mold cavity 3 to fully flow and fill the mold cavity 3 before flowing out through the second gap 2b, thus avoiding the occurrence of material shortages. After molding, the connection between the glue-encapsulated portion and the excess glue at the first flow channel 1a and the second flow channel 1b is relatively thin and narrow. When removing, the excess glue can be directly torn off, thus avoiding the residual burrs.

[0036] The lower template 2 is provided with a fifth overflow groove 28, which is connected to the fourth overflow groove 26 and has a depth less than that of the fourth overflow groove 26. The lower template 2 is provided with a sixth overflow groove 29, which is connected to the fifth overflow groove 28 and has a depth greater than that of the fifth overflow groove 28. The lower template 2 is provided with a seventh overflow groove 291, which is connected to the sixth overflow groove 29 via an eighth overflow groove 292 and has a depth less than that of the seventh overflow groove 291 and the sixth overflow groove 29.

[0037] In this embodiment, excess rubber can flow out of the fifth overflow trough 28. If more rubber is available, it can flow into the sixth overflow trough 29 and the seventh overflow trough 291. The sixth overflow trough 29 and the seventh overflow trough 291 provide a larger accommodation space. Furthermore, the arrangement of multiple overflow troughs in combination can also increase air flow during mold closing. Poor air flow can cause bubbles to remain in the mold cavity 3 during molding.

[0038] In this embodiment, two wiring harnesses can be encapsulated with rubber at the same time in the same mold, and the injection hole can be set between the cavities where the two wiring harnesses are located.

[0039] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they are not intended to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A wire harness overmolding mold, characterized by: The mold comprises an upper mold plate and a lower mold plate, wherein the upper mold plate is provided with an upper cavity and an upper product groove connected to the upper cavity, and the lower mold plate is provided with a lower cavity and a lower product groove connected to the lower cavity; when the mold is closed, the upper cavity and the lower cavity are correspondingly connected to form a mold cavity, and the upper product groove and the lower product groove are correspondingly connected, and the wiring harness is embedded in the upper product groove and the lower product at the same time, and at least partially placed in the mold cavity; A first overflow groove is provided at the lower end of the upper template, and a first protrusion is formed at the connection between the first overflow groove and the upper cavity; a second overflow groove is provided at the upper end of the lower template, and a second protrusion is formed at the connection between the second overflow groove and the lower cavity; when the mold is closed, the first overflow groove and the second overflow groove are correspondingly connected to form a first flow channel, and the first protrusion and the second protrusion are correspondingly connected to form a first gap.

2. The wire harness overmolding mold according to claim 1, characterized in that: The upper template is provided with an injection hole, and the lower end of the injection hole is connected to the first overflow trough.

3. The wire harness overmolding mold according to claim 2, characterized in that: The second overflow trough is provided with a buffer hole, and the buffer hole corresponds to the injection hole.

4. The wire harness overmolding mold according to claim 1, characterized in that: A third overflow groove is provided at the lower end of the upper template, and the third overflow groove is provided on the side of the first overflow groove opposite to the upper cavity, and a third protrusion is formed at the connection between the third overflow groove and the upper cavity; a fourth overflow groove is provided on the lower template, and the fourth overflow groove is provided on the side of the second overflow groove opposite to the lower cavity, and a fourth protrusion is formed at the connection between the fourth overflow groove and the lower cavity; when the mold is closed, the third overflow groove and the fourth overflow groove are correspondingly connected to form a second flow channel, and the third protrusion and the fourth protrusion are connected to form a second gap.

5. The wire harness overmolding mold according to claim 4, characterized in that: A fifth overflow groove is provided on the lower template, the fifth overflow groove is connected to the fourth overflow groove, and the depth of the fifth overflow groove is smaller than that of the fourth overflow groove.

6. The wire harness overmolding mold according to claim 5, characterized in that: A sixth overflow groove is provided on the lower template, and the sixth overflow groove is connected to the fifth overflow groove. The depth of the sixth overflow groove is greater than that of the fifth overflow groove.

7. The wire harness overmolding mold according to claim 6, characterized in that: A seventh overflow trough is provided on the lower template, and the seventh overflow trough is connected to the sixth overflow trough through the eighth overflow trough, and the depth of the eighth overflow trough is smaller than that of the seventh overflow trough and the sixth overflow trough.