Wafer transfer manipulator and wafer transfer cavity for semiconductor equipment
By building cooling channels into the wafer transfer robot, the problems of reduced chamber life and increased costs caused by high wafer temperatures are solved, achieving rapid and uniform wafer cooling, saving space and costs.
Patent Information
- Application Number
- CN202422613835.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-10-14
- Estimated Expiration
- 2034-10-28
AI Technical Summary
In the prior art, the temperature of the heated wafer is high, and entering the next process chamber will reduce the chamber life or affect the process uniformity, and a special cooling chamber is required, which takes up space and increases costs.
A wafer transfer robot for semiconductor equipment is designed, which has a built-in cooling passage, including a first passage and a second passage. The wafer temperature is quickly reduced through the cooling passage, avoiding the need to set up a dedicated cooling chamber.
It achieves fast and uniform wafer cooling, saves space and cost, avoids the occupation of the cooling chamber, and ensures the life and uniformity of the process chamber.
Smart Images
Figure CN223436503U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor equipment field, concretely relates to a wafer conveying manipulator for semiconductor equipment and wafer transmission cavity. BACKGROUND
[0002] In the semiconductor process, many processes need to heat the wafer, such as etching, CVD, epitaxy, heat treatment, but after heating the wafer, if the wafer is still very high temperature, enters the next process cavity and will cause the cavity life to reduce, or influence the next process, for example, influence its uniformity or heat distribution.
[0003] In the prior art, in order to cool the heated wafer, a special cooling chamber needs to be set, which wastes space and has high cost. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing a wafer cooling mode which can reduce the occupied space at low cost.
[0005] In order to realize the above-mentioned purpose, the utility model provides a wafer conveying manipulator for semiconductor equipment, which comprises:
[0006] The body is rectangular;
[0007] The body comprises a first side and a second side, the first side and the second side are opposite, the first side is provided with a wafer bearing area, and the second side is provided with a fixed part; the body further comprises a third side and a fourth side, and the third side and the fourth side are opposite;
[0008] The wafer bearing area is a concave part matched with the wafer and arranged on the upper surface of the body;
[0009] The body is internally provided with a cooling passage, the inlet and outlet of the cooling passage are arranged close to the second side; the cooling passage comprises a first passage and a second passage, the first passage extends along the third side, and the second passage partially extends along the fourth side.
[0010] Optionally, the body is provided with at least one first weight-reducing hole in the wafer bearing area.
[0011] Optionally, the body is provided with a second weight-reducing hole close to the fixed part at the edge of the wafer bearing area.
[0012] Optionally, the second passage comprises at least one branch, the branch extends from the fourth side to the third side and avoids the first weight-reducing hole and the second weight-reducing hole.
[0013] Optionally, the body is provided with a temperature measuring hole in the wafer bearing area, and the temperature measuring hole is opposite the center position of the wafer.
[0014] Optionally, the body is provided with a temperature measuring assembly at the wafer carrying area, the temperature measuring assembly comprising a transmission line and a temperature measuring head connected to the transmission line, the temperature measuring head being opposite to the center of the wafer.
[0015] Optionally, the transmission line is arranged inside the body, parallel to the first passage and close to the first passage, and the inlet of the transmission line is arranged at the second side surface.
[0016] Optionally, the inlet and the outlet of the cooling passage are arranged at the second side surface.
[0017] Optionally, the inlet and the outlet of the cooling passage are arranged at the lower surface close to the second side surface.
[0018] Optionally, the first side surface is further provided with a pin avoiding part.
[0019] The utility model also provides a wafer conveying cavity, comprising:
[0020] a cavity;
[0021] a driving part arranged in the middle of the cavity;
[0022] The second side surface of the wafer conveying mechanical hand is connected with the driving part.
[0023] Compared with the prior art, the utility model has the following advantages:
[0024] The mechanical hand of the utility model is provided with a cooling passage, can quickly reduce the temperature of the wafer, does not need to specially arrange a cooling cavity, avoids the occupation of space and reduces the cost. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 The wafer conveying cavity and the process cavity provided by the utility model are shown in the drawings.
[0026] Figure 2 The schematic diagram of the mechanical hand provided by the utility model is shown.
[0027] Figure 3 The plan view of the mechanical hand provided by the utility model is shown.
[0028] Figure 4 Another embodiment of the mechanical hand provided by the utility model is shown.
[0029] Figure 5 The plan view of another embodiment of the mechanical hand provided by the utility model is shown. DETAILED DESCRIPTION
[0030] The following is a further detailed description of a semiconductor device and a valve for a semiconductor device proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the implementation conditions of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose that can be achieved by the present invention.
[0031] Figure 1 The schematic diagram of the wafer transfer chamber and process chamber of the present invention is shown in FIG. Figure 1 As shown, the present invention provides a wafer transfer chamber, comprising: a chamber, a driving member 300 and a robot 200, wherein the chamber is a regular polygonal structure, such as a quadrilateral, a hexagon or an octagon. Figure 1 The octagonal structure is shown; the regular polygonal structure includes multiple sides, each housing a process chamber. Wafers are transferred to the process chamber by the robot through a wafer transfer port on the side. The drive element is located in the center of the chamber, and the fixed portion of one end of the robot 200 (shown as the second side below) is connected to the drive element 300.
[0032] Figure 2 Shown is a schematic diagram of the manipulator of the present utility model, Figure 3 Shown is a planing diagram of the manipulator of the present invention, as shown in FIG. Figure 2-Figure 3 As shown, the robot 200 includes: a main body, which is rectangular; wherein, the main body includes a first side 222 and a second side 221, the first side 222 and the second side 221 are opposite to each other, the first side 222 is provided with a wafer carrying area, and the second side 221 is provided with a fixing part; the main body also includes a third side 224 and a fourth side 223, and the third side 224 and the fourth side 223 are opposite to each other.
[0033] Among them, the wafer carrying area is a recessed portion arranged on the upper surface of the main body and adapted to the wafer; the recessed portion is provided with claws 201 and claws 202, and the claws 201 and claws 202 are arranged at two corners of the first side surface, and the recessed portion is also provided with an arc-shaped inclined surface 203 and an arc-shaped inclined surface 204. The claws 201, claws 202, the arc-shaped inclined surface 203 and the arc-shaped inclined surface 204 jointly define the position of the wafer.
[0034] The body is further provided with a cooling passage, an inlet 205 and an outlet 206 of the cooling passage are arranged close to the second side surface 221; the cooling passage comprises a first passage 231 and a second passage 232, the first passage extends along the third side surface 224, and the second passage extends along the fourth side surface 223 partially. The mechanical hand of the utility model is provided with a cooling passage, which can quickly reduce the temperature of the wafer, does not need to specially set a cooling cavity, avoids the occupation of space, and reduces the cost. In addition, the cooling passage is uniformly arranged, and can uniformly cool the wafer.
[0035] Continuing to refer to Figure 2-Figure 3 , the body is provided with at least one first lightening hole, such as lightening hole 213 and lightening hole 212, in the wafer bearing area, wherein the number can be selected according to requirements, and the shape can be, for example, circular, rectangular. The body is provided with a second lightening hole 214 close to the fixed part at the edge of the wafer bearing area.
[0036] The second passage 232 comprises at least one branch 233, which extends from the fourth side surface to the third side surface 224 and avoids the first lightening hole and the second lightening hole.
[0037] In addition, the body is provided with a temperature measuring hole 211 in the wafer bearing area, and the temperature measuring hole 211 is opposite the center position of the wafer. The temperature measuring hole is a through hole, and an optical temperature measuring assembly is arranged at the bottom of the cavity, and the light of the optical temperature measuring assembly passes through the temperature measuring hole, so that the temperature of the wafer is measured, the temperature of the wafer is monitored, and the effect of wafer cooling is determined.
[0038] Of course, other ways can also be adopted, for example, as Figure 3 shown: the body is provided with a temperature measuring assembly in the wafer bearing area, the temperature measuring assembly comprises a transmission line 242 and a temperature measuring head 241 connected with the transmission line, and the temperature measuring head is opposite the center position of the wafer. Optionally, the temperature measuring head is a TC. The transmission line 242 is arranged inside the body, that is, is buried in the body, the transmission line is parallel to the first passage and is arranged close to the first passage, and the inlet of the transmission line is arranged on the second side surface. The parallel transmission line and the first passage close to the first passage can prevent the temperature of the transmission line from being too high.
[0039] Optionally, the inlet and the outlet of the cooling passage are arranged on the second side surface.
[0040] Figure 4 And Figure 5 shows another embodiment of the present embodiment, as Figure 4-Figure 5 , the inlet and the outlet of the cooling passage are arranged on the lower surface close to the second side surface.
[0041] Optionally, the first side surface is further provided with a pin avoiding part.
[0042] The second side surface 221 of the body is provided with a fixing part which can be a threaded hole.
[0043] The mechanical hand of the utility model sets up cooling passage, can reduce wafer temperature fast, need not specially set cooling cavity, avoided the occupation of space, reduced cost.
[0044] Although the content of the utility model has been introduced in detail through the above preferred embodiment, it should be recognized that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the appended claims.
Claims
1. A wafer transfer robot for semiconductor equipment, characterized in that: include: The main body is rectangular; The body includes a first side surface and a second side surface, the first side surface and the second side surface are opposite to each other, the first side surface is provided with a wafer carrying area, and the second side surface is provided with a fixing portion; the body also includes a third side surface and a fourth side surface, the third side surface and the fourth side surface are opposite to each other; The wafer carrying area is a concave portion provided on the upper surface of the body and adapted to the wafer; A cooling passage is also provided inside the body, and the inlet and outlet of the cooling passage are provided near the second side surface; the cooling passage includes a first passage and a second passage, the first passage extends along the third side surface, and the second passage portion extends along the fourth side surface.
2. The wafer transfer robot for semiconductor equipment according to claim 1, wherein: The main body is provided with at least one first weight-reducing hole in the wafer carrying area.
3. The wafer transfer robot for semiconductor equipment according to claim 2, wherein: The main body is provided with a second weight-reducing hole at a position close to the fixing portion at the edge of the wafer carrying area.
4. The wafer transfer robot for semiconductor equipment according to claim 3, wherein: The second passage includes at least one branch, and the branch extends from the fourth side surface to the third side surface and avoids the first weight-reducing hole and the second weight-reducing hole.
5. The wafer transfer robot for semiconductor equipment according to claim 1, wherein: The main body is provided with a temperature measuring hole in the wafer carrying area, and the temperature measuring hole is directly opposite to the center position of the wafer.
6. The wafer transfer robot for semiconductor equipment according to claim 1, wherein: The body is provided with a temperature measuring component in the wafer carrying area. The temperature measuring component includes a transmission line and a temperature measuring head connected thereto. The temperature measuring head is directly facing the center position of the wafer.
7. The wafer transfer robot for semiconductor equipment according to claim 6, wherein: The transmission line is arranged inside the body, parallel to the first passage, and close to the first passage. The inlet of the transmission line is arranged on the second side surface.
8. The wafer transfer robot for semiconductor equipment according to claim 1, wherein: The inlet and the outlet of the cooling passage are arranged on the second side surface.
9. The wafer transfer robot for semiconductor equipment according to claim 1, wherein: The inlet and the outlet of the cooling passage are arranged on the lower surface close to the second side surface.
10. The wafer transfer robot for semiconductor equipment according to claim 1, wherein: The first side surface is further provided with a pin avoidance portion.
11. A wafer transfer chamber, characterized in that: include: cavity; a driving member, the driving member being disposed in the middle of the cavity; According to the wafer transfer robot for semiconductor equipment as described in any one of claims 1-10, the fixing portion of the second side of the robot is connected to the driving member.