Chip socket structure

Abstract

The utility model discloses a chip socket structure which is used for reducing the damage risk of a chip and a mainboard. The socket comprises a socket bottom plate, a socket cover plate and socket probes. One side, facing the socket cover plate, of the socket bottom plate is provided with an accommodating area, and the accommodating area is used for accommodating a chip; a plurality of through holes are formed in the socket bottom plate, the socket probes are respectively arranged in the through holes, one end of each socket probe is propped against the chip, and the other end of each socket probe is propped against a bonding pad of the PCB when the socket bottom plate is connected with the PCB; and the socket cover plate is positioned on one side, facing the chip, of the socket bottom plate and is connected with the socket bottom plate, and the socket cover plate is used for fixing the chip in the accommodating area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to a chip socket structure. BACKGROUND

[0002] At present, integrated circuits (IC), especially chips adopting ball grid array (BGA) packaging, such as CMOS image sensors, CPU processors and FPGA (field programmable gate array), are widely used in electronic devices. Such chips have the characteristics of high density, high performance and miniaturization, and have become one of the indispensable core components in modern electronic devices.

[0003] The traditional chip adopting ball grid array (BGA) packaging is mainly fixed on the circuit board by means of patch welding. The welding process involves high-temperature reflow soldering technology. Although this technology can effectively realize the stable connection of the chip and the circuit board, it has very high requirements for the welding equipment, which will result in high production cost. Moreover, the high-temperature environment and repeated welding operation are easy to cause thermal stress damage to the chip and the circuit board.

[0004] In view of the problems of traditional patch welding, various chip sockets are used as an alternative solution in the prior art. However, the existing chip socket also needs to be fixed on the mainboard by welding. The welding difficulty is almost the same as that of directly welding the chip, and there is still a risk of damaging the mainboard due to improper welding.

[0005] Based on this, the present application provides a chip socket structure to solve the above technical problems. CONTENT OF THE INVENTION

[0006] In order to solve the above technical problems, the present application provides a chip socket structure which can reduce the damage risk of the chip and the mainboard.

[0007] The chip socket structure provided by the present application comprises:

[0008] a socket bottom plate, a socket cover plate and a socket probe;

[0009] The side of the socket bottom plate facing the socket cover plate is provided with an accommodation area for accommodating the chip.

[0010] The socket bottom plate is provided with a plurality of through holes, and the socket probe is arranged in the through hole. One end of the socket probe abuts against the chip, and the other end is used to abut against the solder pad of the PCB when the socket bottom plate is connected with the PCB.

[0011] The socket cover plate is located on the side of the socket bottom plate facing the chip and is connected with the socket bottom plate. The socket cover plate is used to fix the chip in the accommodation area.

[0012] Optionally, the through hole is a variable-diameter through hole, an inner diameter of one end close to the solder pad of the variable-diameter through hole is greater than an inner diameter of one end close to the chip.

[0013] Optionally, the socket probe comprises a probe body and a probe head, the probe head is arranged at two ends of the probe body respectively, and the probe head is controlled to reciprocate along an axial direction of the probe body.

[0014] Optionally, an outer diameter of the probe body is greater than an outer diameter of the probe head.

[0015] Optionally, the socket probe is a spring needle, a middle part of the spring needle has a greater diameter than two ends of the spring needle.

[0016] Optionally, the chip socket structure further comprises a socket back plate, the socket back plate is arranged on a side of the PCB plate away from the solder pad, and the socket back plate is used to be connected with the socket cover plate to fix the chip on the PCB plate.

[0017] Optionally, the socket cover plate, the socket bottom plate and the socket back plate are connected through fixing screws.

[0018] Optionally, the socket bottom plate and the socket back plate are connected through bolts, and the socket cover plate and the socket bottom plate are connected through a clamping structure.

[0019] Optionally, the socket bottom plate is provided with a positioning pin, the PCB plate is provided with a pin hole, and when the positioning pin is inserted into the pin hole, the socket probe is aligned with the solder pad.

[0020] Optionally, a hollow region is arranged at the center of the socket cover plate, and thus when the socket cover plate is connected with the socket bottom plate, part of the chip passes through the hollow region.

[0021] From the above technical solutions, the present application has the following effects:

[0022] The present application sets a socket probe on a socket base plate, sets a accommodating area for accommodating a chip on the socket base plate, passes one end of the socket probe through the socket base plate and abuts the chip in the accommodating area, and the other end abuts the soldering pad on the PCB board when the socket base plate is connected to the PCB board. By connecting the socket cover plate to the socket base plate, the chip is fixed in the accommodating area and kept abutting against the socket probe. Therefore, compared with the prior art method of fixing the chip socket or chip on the PCB board by welding, the present application eliminates the direct welding method, and connects the socket base plate to the PCB board, and abuts the two ends of the socket probe on the soldering pads of the chip and the PCB board respectively, which not only realizes the connection between the chip and the PCB board, but also reduces the risk of damage to the chip and the main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in this application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of a chip socket structure provided in this application;

[0025] Figure 2 Another schematic diagram of a chip socket structure provided by this application;

[0026] Figure 3 A schematic diagram of a socket probe in a chip socket structure provided in this application;

[0027] Figure 4 This is another schematic diagram of a socket probe in a chip socket structure provided by the present application;

[0028] Figure 5 A schematic diagram of a socket base plate in a chip socket structure provided in this application;

[0029] Figure 6 A schematic diagram of a socket cover plate in a chip socket structure provided in this application;

[0030] Figure 7 A schematic diagram of a variable diameter through hole in a chip socket structure provided in this application;

[0031] Figure 8 A schematic diagram of a card connection structure in a chip socket structure provided in this application;

[0032] The socket bottom plate 01, the socket cover plate 02, the socket probe 03, the chip 04, the PCB plate 05, the pad 06, the through hole 07, the probe main body 08, the probe head 09, the socket back plate 10, the fixed screw 11, the clamping structure 12, the pin hole 13, the positioning pin 14 and the spring needle 15. DETAILED DESCRIPTION

[0033] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "transverse", "longitudinal" and the like indicate the orientation or positional relationship shown in the drawings, and are used only to illustrate the relative positional relationship between the components or constituent parts, and do not particularly limit the specific installation orientation of the components or constituent parts.

[0034] In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0035] In addition, the terms "mounting", "setting", "provided with", "connection", "connected" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally configured; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two devices, elements or constituent parts. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0036] In addition, the structure, proportion, size and the like shown in the drawings attached in the present application are only used to cooperate with the content disclosed in the specification, so that those skilled in the art can understand and read, and do not have technical significance, any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and the purpose that can be achieved by the present application, still falls within the scope of the technical content disclosed by the present application.

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0038] The application provides a chip socket structure for reducing the damage risk of a chip and a mainboard.

[0039] Please refer to Figures 1 to 8 The application provides a chip socket structure, which comprises:

[0040] The socket bottom plate 01, the socket cover plate 02 and the socket probe 03; the side of the bottom plate facing the cover plate is provided with a containing area for containing the chip 04; the socket bottom plate 01 is provided with a plurality of through holes 07, and the socket probe 03 is arranged in each through hole 07; one end of the socket probe 03 abuts against the chip 04, and the other end is used for abutting against the pad 06 on the PCB 05 when the socket bottom plate 01 is connected with the PCB 05; the socket cover plate 02 is located on the side of the socket bottom plate 01 facing the chip 04 and is connected with the socket bottom plate 01, and the socket cover plate 02 is used for fixing the chip 04 in the containing area.

[0041] The socket bottom plate 01 is the base in the chip 04 socket structure of the application and can be made of durable materials such as metal or high-strength plastic to ensure sufficient mechanical strength and stability. The side of the socket bottom plate 01 facing the socket cover plate 02 is provided with a containing area, and the size of the containing area matches the size and shape of the chip 04, so that the chip 04 can be accurately and correctly placed in the containing area. The socket bottom plate 01 is provided with a plurality of through holes 07, and one socket probe 03 can be arranged in each through hole 07; the number and position of the through holes 07 are determined according to the number and layout of the pins (contacts) of the chip 04. The socket bottom plate 01 and the PCB 05 can be connected by screws or buckles, and the connection between the socket bottom plate 01 and the socket cover plate 02 can also be connected by using this connection mode.

[0042] The socket probe 03 is used for connecting the chip 04 and the PCB 05, and the socket probe 03 is arranged in the through hole 07 of the socket bottom plate 01; one end of the socket probe 03 abuts against the pin (contact) of the chip 04 to ensure smooth transmission of electrical signals; the other end abuts against the corresponding pad 06 on the PCB 05 when the socket bottom plate 01 is fixedly connected to the PCB 05, so that the electrical connection between the chip 04 and the PCB 05 is realized through the socket probe 03. The probe is made of a metal material with high conductivity and high elasticity, such as beryllium copper alloy, to ensure good conductivity and long-term stability.

[0043] The socket cover plate 02 is used to firmly fix the chip 04 in the accommodating area of the socket bottom plate 01, prevent the chip 04 from moving or falling off during use, and ensure the close contact between the chip 04 and the socket probe 03; in actual use, part of the socket cover plate 02 is in contact with the chip 04, and when connected with the socket bottom plate 01, the chip 04 is pressed into the accommodating area, thereby ensuring the contact connection between the chip 04 and the socket probe 03.

[0044] In the embodiment, the socket bottom plate 01 is connected with the PCB board 05, the accommodating area for placing the chip 04 is arranged on the socket bottom plate 01, a plurality of through holes 07 are arranged in the socket bottom plate 01, the socket probe 03 is arranged in the through hole 07, one end of the socket probe 03 is in abutment with the pin (contact point) of the chip 04, and the other end is in abutment with the solder pad 06 on the PCB board 05, thereby connecting the chip 04 and the PCB board 05, the chip 04 is fixed in the accommodating area by the socket cover plate 02, and the close contact between the chip 04 and the socket probe 03 is ensured, so that the connection and fixation between the chip 04 and the PCB board 05 can be realized without high-temperature welding technology, the damage of the chip 04 / PCB board 05 caused by welding is reduced, the damage risk of the chip 04 and the mainboard is reduced, and the maintenance difficulty and maintenance cost are also reduced.

[0045] Please continue to refer to Figure 7 In an optional embodiment, the through hole 07 is a variable-diameter through hole, the inner diameter of one end of the variable-diameter through hole close to the solder pad 06 is greater than the inner diameter of one end close to the chip 04, and in the embodiment, two hole diameters of large and small are arranged in the variable-diameter through hole, the hole diameter close to the chip 04 is a small hole diameter, when the socket probe 03 is inserted into the variable-diameter through hole from the solder pad 06 to the chip 04, the socket probe 03 is limited through the small hole diameter, so that when the socket bottom plate 01 is fixed on the PCB board 05 and the chip 04 is not assembled, the socket probe 03 can be fixed between the socket bottom plate 01 and the PCB board 05, so as to achieve the effect of clamping the socket probe 03.

[0046] Please continue to refer to Figure 3In this optional embodiment, the socket probe 03 includes a probe body 08 and a probe head 09. The probe heads 09 are respectively arranged at both ends of the probe body 08. The probe heads 09 are controlled to move back and forth along the axial direction of the probe body 08. In this embodiment, the two probe heads 09 are electrically connected through the probe body 08. Each probe head 09 is in a movable connection with the probe body 08. That is, when a force is applied, the probe head 09 can be retracted into the probe body 08. When the force is released, the probe head 09 pops out. Therefore, when the chip 04 is fixed in the accommodation area, the chip 04 squeezes the probe head 09 and shrinks it into the probe body 08. Under the action of the elastic force, the probe head 09 maintains a tendency to move toward the chip 04, thereby maintaining close contact with the chip 04.

[0047] In this optional embodiment, the outer diameter of the probe body 08 is larger than the outer diameter of the probe head 09. In this embodiment, combined with the above-mentioned variable diameter through hole, part of the probe body 08 is inserted into the large through hole end of the variable diameter through hole, while the probe head 09 passes through the small through hole end and abuts against the chip 04, and the probe body 08 cannot pass through the small through hole end.

[0048] Please continue reading Figure 4 In another optional embodiment, the socket probe 03 is a spring-loaded pin 15, whose center diameter is larger than its end diameters. In this embodiment, the spring-loaded pin 15 is elastic and is typically made of a highly resilient metal alloy, such as beryllium copper or stainless steel. This material not only provides excellent electrical conductivity but also maintains stable elastic properties over long-term use, making it less susceptible to plastic deformation or breakage. Furthermore, to enhance wear and corrosion resistance, the spring-loaded pin 15 can be surface-treated with gold or nickel plating.

[0049] Combined with the above-mentioned variable diameter through hole, the diameters of the two ends of the spring pin 15 are smaller, and the end facing the chip 04 can partially pass through the variable diameter through hole. As the diameter of the middle part of the spring pin 15 increases, the spring is stuck in the variable diameter through hole.

[0050] In an optional embodiment, the chip 04 socket structure provided in the present application further includes a socket backplate 10, which is disposed on the side of the PCB board 05 facing away from the solder pads 06. The socket backplate 10 is used to cooperate with the socket cover plate 02 to secure the chip 04 to the PCB board 05. To achieve connection between the socket base plate 01 and the PCB board 05, the socket backplate 10 is additionally provided on the back side of the PCB board 05 (the side facing away from the solder pads 06). The socket base plate 01 is connected to the socket backplate 10 by screws and bolts to secure the socket base plate 01.

[0051] In this optional embodiment, the socket cover plate 02, the socket bottom plate 01 and the socket back plate 10 are connected by the fixing screw 11, the fixing screw 11 has a certain length and can penetrate the socket cover plate 02, the socket bottom plate 01, the PCB plate 05 and the socket back plate 10 at the same time. In specific use, aligned through holes are arranged on the socket cover plate 02, the socket bottom plate 01 and the PCB plate 05, and threaded holes are arranged on the socket back plate 10. The fixing screw 11 is inserted into the through holes on the socket cover plate 02, the socket bottom plate 01 and the PCB plate 05 from the position of the socket cover plate 02, and then is screwed into the threaded holes on the socket back plate 10. The depth of screwing is adjusted to adjust the extrusion degree of the chip 04, so as to further ensure the contact strength between the two ends of the socket probe 03 and the chip 04 and the pad 06.

[0052] Please continue to refer to Figure 3 In another optional embodiment, the socket bottom plate 01 and the socket back plate 10 are connected by a bolt, and the socket cover plate 02 and the socket bottom plate 01 are connected by a clamping structure 12. In this embodiment, the bolt penetrates the socket bottom plate 01, the PCB plate 05 and the socket back plate 10 to connect them, so as to ensure the stability of the connection between the socket bottom plate 01, the socket back plate 10 and the PCB plate 05, and prevent the socket bottom plate 01 from moving or falling off the PCB plate 05 at will. The socket cover plate 02 and the socket bottom plate 01 are connected by the clamping structure 12 to realize the detachable connection between the socket cover plate 02 and the socket bottom plate 01, so as to facilitate the assembly or replacement of the chip 04. Specifically, a lock catch is arranged on the side surface of the socket bottom plate 01, and a lock column is arranged on the socket cover plate 02. When the socket cover plate 02 is arranged on the socket bottom plate 01, the lock column is inserted into the lock catch, so as to realize the connection between the socket cover plate 02 and the socket bottom plate 01. The cooperation between the lock catch and the lock column belongs to one of the clamping structures 12, as shown in Figure 8 .

[0053] In an optional embodiment, a positioning pin 14 is arranged on the socket bottom plate 01, and a pin hole 13 is arranged on the PCB plate 05. When the positioning pin 14 is inserted into the pin hole 13, the socket probe 03 is aligned with the pad 06. The two ends of the positioning pin 14 are respectively located on the two sides of the socket bottom plate 01, and the positioning pin 14 can move on the socket bottom plate. The positions of the positioning pin 14 and the pin hole 13 correspond to each other, so as to ensure the accurate alignment between the socket probe 03 on the socket bottom plate 01 and the pad 06 on the PCB plate 05 when the socket bottom plate 01 is assembled on the PCB plate 05. In addition, the length of the positioning pin 14 is less than the distance between the socket cover plate 02 and the socket back plate 10, and the two ends of the positioning pin 14 are blocked by the socket cover plate 02 and the socket back plate 10 respectively, so as to prevent the positioning pin 14 from falling off.

[0054] In an alternative embodiment, the center of the socket cover plate 02 is provided with a hollowed-out area, so that when the socket cover plate 02 is connected with the socket bottom plate 01, part of the chip 04 passes through the hollowed-out area. The center of the socket cover plate 02 is hollowed out, the size of the hollowed-out area matches the size of the chip 04, specifically, the center part of the chip 04 is upwardly protruding, so when the socket cover plate 02 is connected with the socket bottom plate 01, the upwardly protruding part of the chip 04 is located in the hollowed-out area, so as to facilitate subsequent assembly of the heat sink on the chip 04, and smearing of the heat-conducting material.

[0055] It is to be understood that the above description is illustrative of the application and not in any sense defining the scope of the application. The application is therefore not to be limited to the embodiments described herein, but is amenable to various modifications, which will occur to those skilled in the art. In particular, various modifications can be made to adapt a particular situation or material to the teachings of the application without departing from the scope of the application. Therefore, although the application has been described in detail with reference to particular embodiments, it is not intended to limit or restrict the application to the specific form or form of disclosure herein, for these embodiments are to be considered in a descriptive sense only and not intended to limit the intended scope of the application.

Claims

1. A chip socket structure, characterized in that: include: Socket base plate, socket cover plate and socket probe; A receiving area is provided on one side of the socket bottom plate facing the socket cover plate, and the receiving area is used to receive the chip; The socket base plate is provided with a plurality of through holes, and the socket probes are respectively provided in the through holes. One end of the socket probe abuts against the chip, and the other end is used to abut against the pad of the PCB when the socket base plate is connected to the PCB. The socket cover is located on a side of the socket base facing the chip and is connected to the socket base. The socket cover is used to fix the chip in the accommodating area.

2. The chip socket structure according to claim 1, characterized in that: The through hole is a variable diameter through hole, and the inner diameter of one end of the variable diameter through hole close to the pad is larger than the inner diameter of the other end close to the chip.

3. The chip socket structure according to claim 2, characterized in that: The socket probe includes a probe body and a probe head. The probe heads are respectively arranged at two ends of the probe body. The probe heads are controlled to move back and forth along the axial direction of the probe body.

4. The chip socket structure according to claim 3, characterized in that: The outer diameter of the probe body is greater than the outer diameter of the probe head.

5. The chip socket structure according to claim 2, characterized in that: The socket probe is a spring pin, and the diameter of the middle portion of the spring pin is larger than the diameters of the two ends.

6. The chip socket structure according to any one of claims 1 to 5, characterized in that: The chip socket structure further includes a socket back plate, which is arranged on a side of the PCB board facing away from the solder pad. The socket back plate is used to cooperate with the socket cover plate to fix the chip on the PCB board.

7. The chip socket structure according to claim 6, characterized in that: The socket cover plate, the socket bottom plate and the socket back plate are connected by fixing screws.

8. The chip socket structure according to claim 6, characterized in that: The socket base plate and the socket back plate are connected via bolts, and the socket cover plate and the socket base plate are connected via a clamping structure.

9. The chip socket structure according to any one of claims 1 to 5, characterized in that: The socket bottom plate is provided with a positioning pin, and the PCB board is provided with a pin hole. When the positioning pin is inserted into the pin hole, the socket probe is aligned with the pad.

10. The chip socket structure according to any one of claims 1 to 5, characterized in that: A hollow area is provided at the center of the socket cover plate, so that when the socket cover plate is connected to the socket bottom plate, part of the chip passes through the hollow area.

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