Power supply device and cooking utensil
By introducing insulating heat-conducting parts and temperature detection parts into the power supply device, the problem of insufficient transformer temperature rise detection is solved, effective heat dissipation and over-temperature protection are achieved, and safety hazards are avoided.
Patent Information
- Application Number
- CN202422959925.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Existing power supply devices are unable to effectively detect the temperature rise of the transformer, which may cause the winding wire to melt, smoke, arc and fire, posing a safety risk.
By introducing an insulating heat conductor between the transformer and the semiconductor device, heat transfer is achieved and the heat dissipation area is increased. At the same time, a temperature detection component is set on the circuit board to achieve over-temperature protection and avoid safety hazards.
It improves the heat dissipation effect of the transformer, reduces the risk of melting and smoking, and automatically stops working when the over-temperature protection fails, avoiding safety hazards.
Smart Images
Figure CN223450659U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of household appliances, specifically to a power supply device and cooking utensil. BACKGROUND
[0002] At present, the power supply device can only take into account the temperature rise of the semiconductor device, but it is difficult to map the temperature rise of the transformer through the temperature detection piece. Moreover, in the scenario where the heat dissipation device fails, the temperature of the transformer is too high, which can cause the winding wire body to melt and smoke, arc to fire, and easily cause safety risks. SUMMARY
[0003] The utility model aims at least solve the prior art or related art in the transformer's temperature is too high and can cause the winding wire body to melt and smoke, arc to fire, and easily cause safety risks.
[0004] Therefore, the first aspect of the utility model provides a power supply device.
[0005] The second aspect of the utility model also provides a cooking utensil.
[0006] Therefore, the first aspect of the utility model provides a power supply device.
[0007] The power supply device provided by the utility model includes a circuit board, a transformer and a semiconductor device. The transformer is electrically connected to the circuit board to realize voltage conversion. The transformer and the semiconductor device are connected through an insulating heat conducting piece. When the power supply device is working, the heat of the transformer can be transferred to the semiconductor device through the insulating heat conducting piece, increasing the heat dissipation area of the transformer and improving the heat dissipation effect of the transformer. This reduces the risk of smoking and fire caused by high temperature melting of the transformer and effectively improves the problem of large temperature difference between components caused by uneven airflow in the heat dissipation air duct. At the same time, when the over-temperature protection of the power supply device fails, the temperature of the transformer is transferred to the semiconductor device, causing the semiconductor device to fail before the transformer smokes and catches fire, avoiding safety hazards.
[0008] The power supply device provided by the utility model can also have the following additional technical features:
[0009] In some embodiments, the semiconductor device includes a rectifier bridge and an insulated gate bipolar transistor. One of the rectifier bridge and the insulated gate bipolar transistor is connected to one end of the insulating heat conducting piece.
[0010] In the embodiment, the semiconductor device includes a rectifier bridge and an insulated gate bipolar transistor, one end of the insulating heat conductor is connected to any one of the rectifier bridge or the insulated gate bipolar transistor, so that the heat of the transformer can be transferred to the rectifier bridge or the insulated gate bipolar transistor, and the protection of the transformer can be realized through the failure of the rectifier bridge or the insulated gate bipolar transistor.
[0011] In some embodiments, optionally, the power supply device further includes a heat sink connected to the rectifier bridge and the insulated gate bipolar transistor for dissipating heat for the rectifier bridge and the insulated gate bipolar transistor; one of the heat sink, the rectifier bridge and the insulated gate bipolar transistor is connected to one end of the insulating heat conductor.
[0012] In the embodiment, the power supply device further includes a heat sink connected to the rectifier bridge and the insulated gate bipolar transistor, so as to dissipate heat for the rectifier bridge and the insulated gate bipolar transistor, and one of the heat sink, the rectifier bridge and the insulated gate bipolar transistor is connected to one end of the insulating heat conductor, so as to realize the heat conduction connection between the transformer and the semiconductor device. In addition, since one of the heat sink, the rectifier bridge and the insulated gate bipolar transistor is connected to the transformer, the heat of the transformer can also be transferred to the heat sink, and then the heat can be dissipated through the heat sink, so as to improve the heat dissipation effect of the transformer.
[0013] In some embodiments, optionally, the power supply device further includes a temperature detection member arranged on the circuit board, the temperature detection member is arranged close to the semiconductor device, and the temperature detection member can detect the temperature value of the semiconductor device.
[0014] In the embodiment, the power supply device further includes a temperature detection member arranged on the circuit board, and the temperature detection member is arranged close to the semiconductor device, so that the temperature detection member can detect the temperature of the semiconductor device, and feedback to the circuit board when the temperature value of the semiconductor device is too high, so that the power supply device stops working to realize the over-temperature protection of the semiconductor device. Wherein, the transformer is connected to the semiconductor device through the insulating heat conductor, so that the heat of the transformer can be transferred to the semiconductor device, and then the over-temperature protection of the transformer is realized through the arrangement of the temperature detection member, that is, the over-temperature protection of the transformer and the semiconductor device is realized at the same time without increasing the temperature detection member, and when the protection of the temperature detection member fails, the semiconductor device will overheat and stop working when the temperature is high, so that the power supply device stops working, and then the transformer stops working to realize the protection of the transformer.
[0015] In some embodiments, optionally, the semiconductor device includes a diode, and the diode is arranged on one side of the transformer and electrically connected to the transformer.
[0016] In this embodiment, the semiconductor device comprises a diode, and the diode is electrically connected with the transformer, thereby realizing functions such as rectification. The diode is connected with the transformer through the insulating heat-conducting piece, so that the heat of the transformer can be transmitted to the diode, the heat dissipation area of the transformer is increased, and the heat dissipation effect of the transformer is improved. Meanwhile, the diode can fail due to over-temperature under the condition of high temperature, thereby, under the condition of failure of over-temperature protection of the power supply device, the temperature of the diode is increased due to heat transmission of the transformer, and the diode fails before the transformer melts and smokes, thereby avoiding safety hazards.
[0017] In some embodiments, optionally, the transformer comprises: a magnetic core; a first coil wound on the magnetic core; and a second coil wound on the magnetic core and located on one side of the first coil; one of the magnetic core, the first coil and the second coil is connected with the other end of the insulating heat-conducting piece.
[0018] In this embodiment, the transformer comprises the magnetic core, the first coil and the second coil, and the principle of electromagnetic induction is used to realize the change of alternating voltage. One of the magnetic core, the first coil and the second coil is connected with the other end of the insulating heat-conducting piece, so that the connection position between the transformer and the semiconductor device has diversity, and a better heat transmission path can be set according to actual conditions.
[0019] In some embodiments, optionally, the insulating heat-conducting piece comprises a rubber strip or a ceramic strip.
[0020] In this embodiment, the insulating heat-conducting piece comprises a rubber strip or a ceramic strip, so that the insulating heat-conducting piece has good heat conduction effect and good insulation effect, thereby ensuring efficient heat conduction and insulation performance between the transformer and the semiconductor device, and improving the safety performance of the power supply device.
[0021] In some embodiments, optionally, the insulating heat-conducting piece is suspended on one side of the circuit board.
[0022] In this embodiment, the insulating heat-conducting piece is suspended on one side of the circuit board, so that the insulating heat-conducting piece does not contact the circuit board, thereby avoiding affecting the heat dissipation effect of the circuit board after the insulating heat-conducting piece covers the circuit board.
[0023] In some embodiments, optionally, the power supply device further comprises: a heat dissipation air duct, and the transformer is arranged in the heat dissipation air duct and used for dissipating heat for the transformer.
[0024] In this embodiment, the power supply device further comprises the heat dissipation air duct, and the heat dissipation air duct is used for dissipating heat for the transformer, thereby improving the performance of the power supply device.
[0025] According to the second aspect of the present application, a cooking appliance is also provided, which comprises the power supply device according to any one of the above embodiments.
[0026] The cooking utensil provided in the second aspect of the utility model has all the beneficial effects of the power supply device because it comprises the power supply device proposed in any of the above technical solutions.
[0027] The additional aspects and advantages of the utility model will become apparent in the following description, or be appreciated through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS
[0028] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:
[0029] Fig. 1 Fig. 1 shows a structural schematic diagram of a power supply device according to an embodiment of the utility model;
[0030] Fig. 2 Fig. 2 shows another structural schematic diagram of a power supply device according to an embodiment of the utility model;
[0031] Fig. 3 Fig. 3 shows a third structural schematic diagram of a power supply device according to an embodiment of the utility model.
[0032] In the drawings, Figs. 1 to 3 The correspondence between the reference signs and the component names in the drawings is as follows:
[0033] 1 circuit board, 2 transformer, 20 magnetic core, 22 first coil, 24 second coil, 3 semiconductor device, 30 rectifier bridge, 32 insulated gate bipolar transistor, 34 diode, 4 insulating heat-conducting member, 5 heat sink. DETAILED DESCRIPTION
[0034] In order to more clearly understand the above-mentioned purposes, features and advantages of the utility model, the utility model will be further described in detail below in combination with the drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0035] In the following description, many specific details are set forth in order to provide a thorough understanding of the utility model, but the utility model can also be implemented in other ways different from those described herein, therefore, the protection scope of the utility model is not limited by the specific embodiments disclosed below.
[0036] The following will be described with reference to Figs. 1 to 3 The power supply device and the cooking utensil according to some embodiments of the utility model are described.
[0037] As Fig. 1 , Fig. 2 and Fig. 3As shown, according to one embodiment of the utility model, the utility model provides a kind of power supply device, comprising: circuit board 1, transformer 2, semiconductor device 3 and insulating heat conducting piece 4.
[0038] Specifically, transformer 2 is electrically connected with circuit board 1;Semiconductor device 3 is electrically connected with circuit board 1;The two ends of insulating heat conducting piece 4 are connected with transformer 2 and semiconductor device 3 respectively.
[0039] The power supply device provided by the utility model includes circuit board 1, transformer 2 and semiconductor device 3, and transformer 2 is electrically connected with circuit board 1 to realize the step-up and step-down conversion of voltage. Among them, transformer 2 and semiconductor device 3 are connected by insulating heat conducting piece 4, and then when the power supply device works, the heat of transformer 2 can be transmitted to semiconductor device 3 through insulating heat conducting piece 4, the heat dissipation area of transformer 2 is increased, the heat dissipation effect of transformer 2 is improved, and then the risk of smoking and fire caused by high temperature melting of transformer 2 is reduced, and the problem of large temperature difference between each component caused by uneven airflow in the heat dissipation air duct can also be effectively improved. At the same time, when the over-temperature protection of the power supply device fails, the temperature of transformer 2 is transmitted to semiconductor device 3, so that semiconductor device 3 fails before transformer 2 smokes and catches fire, avoiding safety hazards.
[0040] It can be understood that the heat of transformer 2 will be transmitted to semiconductor device 3 through insulating heat conducting piece 4, and when the temperature of transformer 2 is relatively high, the temperature of semiconductor device 3 will also be relatively high, and when the temperature of semiconductor device 3 reaches the failure temperature, semiconductor device 3 will fail rapidly, so that the power supply device cannot continue to work, and then the temperature of transformer 2 is prevented from continuing to rise, and the risk of melting and smoking of transformer 2 is reduced.
[0041] It can be understood that the failure temperature of semiconductor device 3 is similar to the melting temperature of the primary winding or the secondary winding of transformer 2. Optionally, the difference between the melting temperature of the primary winding or the secondary winding of transformer 2 and the failure temperature of semiconductor device 3 is less than or equal to 5℃.
[0042] Optionally, insulating heat conducting piece 4 is connected with transformer 2 and semiconductor device 3 through insulating connecting pieces respectively.
[0043] In some embodiments, optionally, semiconductor device 3 includes rectifier bridge 30 and insulated gate bipolar transistor 32;One of rectifier bridge 30 and insulated gate bipolar transistor 32 is connected with one end of insulating heat conducting piece 4.
[0044] In this embodiment, the semiconductor device 3 comprises a rectifier bridge 30 and an insulated gate bipolar transistor 32, and one end of the insulating heat-conducting member 4 is connected to any one of the rectifier bridge 30 or the insulated gate bipolar transistor 32, so that the heat of the transformer 2 can be transferred to the rectifier bridge 30 or the insulated gate bipolar transistor 32, and the protection of the transformer 2 can be realized through the failure of the rectifier bridge 30 or the insulated gate bipolar transistor 32.
[0045] In some embodiments, optionally, the power supply device further comprises a heat sink 5 connected to the rectifier bridge 30 and the insulated gate bipolar transistor 32 for dissipating heat of the rectifier bridge 30 and the insulated gate bipolar transistor 32, and one of the heat sink 5, the rectifier bridge 30 and the insulated gate bipolar transistor 32 is connected to one end of the insulating heat-conducting member 4.
[0046] In this embodiment, the power supply device further comprises a heat sink 5 connected to the rectifier bridge 30 and the insulated gate bipolar transistor 32 for dissipating heat of the rectifier bridge 30 and the insulated gate bipolar transistor 32, and one of the heat sink 5, the rectifier bridge 30 and the insulated gate bipolar transistor 32 is connected to one end of the insulating heat-conducting member 4, thereby realizing the heat-conducting connection between the transformer 2 and the semiconductor device 3. In addition, since one of the heat sink 5, the rectifier bridge 30 and the insulated gate bipolar transistor 32 is connected to the transformer 2, the heat of the transformer 2 can also be transferred to the heat sink 5, thereby realizing heat dissipation through the heat sink 5, and improving the heat dissipation effect of the transformer 2.
[0047] Optionally, the heat sink 5 comprises a finned heat sink.
[0048] In some embodiments, optionally, the power supply device further comprises a temperature detection member arranged on the circuit board 1, and the temperature detection member is arranged close to the semiconductor device 3, and the temperature detection member can detect the temperature value of the semiconductor device 3.
[0049] In this embodiment, the power supply device further comprises a temperature detection member arranged on the circuit board 1, and the temperature detection member is arranged close to the semiconductor device 3, and the temperature detection member can detect the temperature value of the semiconductor device 3, so as to feed back to the circuit board 1 when the temperature value of the semiconductor device 3 is too high, so that the power supply device stops working, thereby realizing the over-temperature protection of the semiconductor device 3. In this embodiment, the transformer 2 and the semiconductor device 3 are connected through the insulating heat-conducting member 4, so that the heat of the transformer 2 can be transferred to the semiconductor device 3, and the over-temperature protection of the transformer 2 is realized through the arrangement of the temperature detection member, that is, the over-temperature protection of the transformer 2 and the semiconductor device 3 is realized at the same time without increasing the temperature detection member, and when the protection of the temperature detection member fails, the semiconductor device 3 will overheat and stop working when the temperature is high, so that the power supply device stops working, and then the transformer 2 stops working, thereby realizing the protection of the transformer 2.
[0050] As Fig. 2 shown, in some embodiments, the semiconductor device 3 optionally includes a diode 34, which is located on one side of the transformer 2 and is electrically connected with the transformer 2.
[0051] In this embodiment, the semiconductor device 3 includes the diode 34, which is electrically connected with the transformer 2 to realize functions such as rectification. The diode 34 is connected with the transformer 2 through the insulating heat-conducting member 4, so that the heat of the transformer 2 can be transferred to the diode 34, increasing the heat dissipation area of the transformer 2 and improving the heat dissipation effect of the transformer 2. At the same time, the diode 34 can fail due to over-temperature in a high-temperature condition, so that in the case of failure of the over-temperature protection of the power supply device, the temperature of the diode 34 is increased by the heat transfer of the transformer 2, and then the diode 34 fails before the transformer 2 melts and smokes, avoiding potential safety hazards.
[0052] Optionally, the diode 34 includes a high-voltage diode.
[0053] As Fig. 1 shown, in some embodiments, the transformer 2 optionally includes a magnetic core 20, a first coil 22 wound around the magnetic core 20, and a second coil 24 wound around the magnetic core 20 and located on one side of the first coil 22. One of the magnetic core 20, the first coil 22, and the second coil 24 is connected with the other end of the insulating heat-conducting member 4.
[0054] In this embodiment, the transformer 2 includes the magnetic core 20, the first coil 22, and the second coil 24, which realize the change of alternating voltage by the principle of electromagnetic induction. One of the magnetic core 20, the first coil 22, and the second coil 24 is connected with the other end of the insulating heat-conducting member 4, so that the connection position between the transformer 2 and the semiconductor device 3 has diversity, and then a better heat transfer path can be set according to the actual situation.
[0055] Optionally, in actual application, the best heat transfer path can be found according to the actual working parameters of the power supply device and the heat dissipation design of the whole system.
[0056] Optionally, the first coil 22 is a primary winding, and the second coil 24 is a secondary winding.
[0057] Optionally, the transformer 2 further includes a support, the magnetic core 20 is arranged in a channel in the middle of the support, and the first coil 22 and the second coil 24 are wound around the outer side of the support, respectively.
[0058] In some embodiments, the insulating heat-conducting member 4 optionally includes a rubber strip or a ceramic strip.
[0059] In the embodiment, the insulating heat-conducting member 4 comprises a rubber strip or a ceramic strip, so that the insulating heat-conducting member 4 has good heat-conducting effect and good insulation effect, to ensure efficient heat conduction and insulation performance between the transformer 2 and the semiconductor device 3, and to improve the safety performance of the power supply device.
[0060] In some embodiments, optionally, the insulating heat-conducting member 4 is suspended on one side of the circuit board 1.
[0061] In the embodiment, the insulating heat-conducting member 4 is suspended on one side of the circuit board 1, so that the insulating heat-conducting member 4 does not contact the circuit board 1, thereby avoiding affecting the heat dissipation effect of the circuit board 1 after the insulating heat-conducting member 4 covers the circuit board 1.
[0062] In some embodiments, optionally, the power supply device further comprises: a heat dissipation air duct, the transformer 2 is arranged in the heat dissipation air duct, and the heat dissipation air duct is used for heat dissipation of the transformer 2.
[0063] In the embodiment, the power supply device further comprises a heat dissipation air duct, and the heat dissipation air duct is used for heat dissipation of the transformer 2, thereby improving the performance of the power supply device.
[0064] Optionally, the power supply device is a variable frequency power supply.
[0065] According to one embodiment of the utility model, a cooking utensil is further provided, which comprises the power supply device according to any one of the above embodiments.
[0066] The cooking utensil provided by the utility model has all the beneficial effects of the power supply device.
[0067] In specific application, the embodiment provided by the application effectively solves the problem of lack of detection protection of temperature rise of the transformer 2 without additional NTC (Negative Temperature Coefficient) circuit, realizes that when the temperature rise of the transformer 2 is too high, the whole variable frequency power supply enters the protection state, and when the software protection fails, if the temperature of the transformer 2 exceeds the safety value, the semiconductor device 3 in the circuit will overheat and fail to work, thereby avoiding the problem of continuous rise of the temperature rise of the transformer 2 due to lack of detection, and the reliability is better.
[0068] The application adds an insulating heat-conducting strip (for example, insulating heat-conducting member 4) between the transformer 2 and the semiconductor device 3 of the variable frequency power supply, which can be ceramic or other materials; the insulating heat-conducting strip can be placed on the magnetic core 20 of the transformer 2 or the primary side or the secondary side of the transformer 2. The part of the semiconductor device 3, for example, the rectifier bridge 30 and the IGBT (Insulate-Gate Bipolar Transistor, 32) connected to the insulating heat-conducting strip, can be the external heat dissipation device (for example, heat sink 5) of the semiconductor device 3.
[0069] The transformer 2 and the semiconductor device 3 each have three thermal connection points, which can be combined to select 9 thermal communication paths, and in actual application, the optimal heat transfer path can be found according to the actual working parameters of the variable frequency power supply and the heat dissipation design of the whole system.
[0070] The embodiment of the application realizes over-temperature detection, heat equalization, and heat transfer to the power device under abnormal working conditions to cause the power device to fail due to over-temperature, thereby avoiding the safety problem caused by over-temperature combustion of the winding. Specifically, without additional NTC and temperature rise detection circuits, the over-temperature protection of the transformer 2 of the microwave variable frequency power supply is realized; in the case of software failure, the protection of the wire melting and smoking caused by the continuous work of the transformer 2 with high temperature rise is realized; the heat equalization of multiple devices can effectively reduce the temperature difference caused by the uneven heat dissipation air duct and improve the reliability of the whole system.
[0071] Optionally, the primary or secondary winding of the transformer 2 is thermally connected to other devices (such as high-voltage diodes), which cannot realize over-temperature protection but can increase the heat dissipation area. In the case of software protection failure, the winding temperature rise of the transformer 2 can be transferred to the high-voltage diode, so that the high-voltage diode fails before the winding of the transformer 2 melts and smokes, thereby avoiding potential safety hazards.
[0072] In the utility model, the term "a plurality of" refers to two or more than two, unless otherwise explicitly limited. The terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, "connection" can be fixed connection, or detachable connection, or integrally connected; "connection" can be directly connected, or indirectly connected through an intermediate medium. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0073] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "a specific embodiment", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0074] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A power supply device, characterized in that: include: circuit boards; a transformer, electrically connected to the circuit board; a semiconductor device electrically connected to the circuit board; An insulating heat-conducting member, two ends of which are respectively connected to the transformer and the semiconductor device.
2. The power supply device according to claim 1, wherein: The semiconductor device includes a rectifier bridge and an insulated gate bipolar transistor; One of the rectifier bridge and the insulated gate bipolar transistor is connected to one end of the insulating thermal conductor.
3. The power supply device according to claim 2, wherein: Also includes: a heat sink connected to the rectifier bridge and the insulated gate bipolar transistor, and configured to dissipate heat for the rectifier bridge and the insulated gate bipolar transistor; One of the heat sink, the rectifier bridge and the insulated gate bipolar transistor is connected to one end of the insulating heat conductor.
4. The power supply device according to claim 1, wherein: Also includes: A temperature detection component is provided on the circuit board. The temperature detection component is provided close to the semiconductor device and can detect the temperature value of the semiconductor device.
5. The power supply device according to claim 1, wherein: The semiconductor device includes a diode located at one side of the transformer and electrically connected to the transformer.
6. The power supply device according to any one of claims 1 to 5, characterized in that: The transformer comprises: Magnetic core; a first coil, wound around the magnetic core; a second coil, wound around the magnetic core and located on one side of the first coil; One of the magnetic core, the first coil, and the second coil is connected to the other end of the insulating thermal conductor.
7. The power supply device according to any one of claims 1 to 5, characterized in that: The insulating heat-conducting member includes a rubber strip or a ceramic strip.
8. The power supply device according to any one of claims 1 to 5, characterized in that: The insulating heat-conducting component is suspended on one side of the circuit board.
9. The power supply device according to any one of claims 1 to 5, characterized in that: Also includes: A heat dissipation duct, wherein the transformer is arranged in the heat dissipation duct, is used to dissipate heat for the transformer.
10. A cooking utensil, characterized in that: include: The power supply device according to any one of claims 1 to 9.