Overturning chip mounting device for wafer

Abstract

The utility model discloses a flip chip mounting device of a wafer, which comprises a longitudinal displacement mechanism, a vertical displacement mechanism and a flip mechanism, the longitudinal displacement mechanism is provided with a longitudinal displacement part which moves along the longitudinal direction, the vertical displacement mechanism is connected with the longitudinal displacement part, the vertical displacement mechanism is provided with a vertical displacement part which moves along the vertical direction, and the flip mechanism is connected with the vertical displacement part. The turnover mechanism is connected to the vertical displacement part and comprises a turnover driving part, a turnover arm and a suction cup, the turnover driving part is installed on the vertical displacement part, one end of the turnover arm is connected with the turnover driving part, the suction cup is connected to the other end of the turnover arm, and the suction cup is used for adsorbing a wafer. The longitudinal displacement mechanism is matched with the vertical displacement mechanism to realize wafer taking and moving actions, and the overturning mechanism is used for overturning a wafer onto a ceramic disc, so that the technological actions of overturning and chip mounting are realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing equipment technical field, especially in wafer's turnover SMD device. BACKGROUND

[0002] Wafer wax SMD process plays a vital role in semiconductor manufacturing, and its processing precision and stability directly affect the performance and quality of the final product. Before rough polishing, fine polishing and other key processing steps, it is crucial to ensure the stable positioning of the wafer. At present, the industry often adopts the method of coating the wafer with a wax layer, and then sticking the wafer to the ceramic disc through the wax layer.

[0003] The SMD process requires the wafer to be turned over so that the side with the glue can be accurately attached to the ceramic disc. This turning operation further increases the difficulty of wafer processing, as the position accuracy and surface state of the wafer need to be ensured during the turning process. In view of the above complex situation, it is urgent to design a device specifically for handling and turning wafers. SUMMARY

[0004] The embodiment of the present application provides a wafer turnover SMD device to solve the technical problem of how to handle and turn over the wax-coated wafer and stick it to the ceramic disc in the SMD process.

[0005] The embodiment of the present application provides a wafer turnover SMD device, which comprises:

[0006] A longitudinal displacement mechanism having a longitudinal displacement part moving in the longitudinal direction;

[0007] A vertical displacement mechanism connected to the longitudinal displacement part, the vertical displacement mechanism having a vertical displacement part moving in the vertical direction;

[0008] A turnover mechanism connected to the vertical displacement part, the turnover mechanism comprising:

[0009] A turnover driving member mounted on the vertical displacement part;

[0010] A turnover arm connected to one end of the turnover driving member;

[0011] A suction cup connected to the other end of the turnover arm, the suction cup being used to adsorb the wafer.

[0012] The above embodiment has the beneficial effect that the longitudinal displacement mechanism cooperates with the vertical displacement mechanism to realize the actions of picking up and moving the wafer, and the turnover mechanism realizes the action of turning over the wafer to the ceramic disc, thereby realizing the process actions of turnover and SMD.

[0013] On the basis of the above embodiment, the embodiment of the present application can also be improved as follows:

[0014] In one of the embodiments of the present application, the longitudinal displacement mechanism comprises a first guide assembly arranged longitudinally, a first platform slidingly arranged on the first guide assembly, the first platform being provided with the vertical displacement mechanism, and a first linear drive mechanism, the active end of which is connected with the first platform. The first linear drive mechanism drives the first platform to move along the first guide assembly.

[0015] In one of the embodiments of the present application, the longitudinal displacement mechanism further comprises a first position detection mechanism connected with the frame, the first position detection mechanism being used to detect the moving position of the first platform. The first position detection mechanism improves the positioning accuracy of the first platform in the longitudinal movement.

[0016] In one of the embodiments of the present application, the vertical displacement mechanism comprises a second guide assembly arranged vertically on the first platform, a second platform slidingly arranged on the second guide assembly, the second platform being provided with the turnover mechanism, and a second linear drive mechanism mounted on the first platform, the active end of the first linear drive mechanism being connected with the second platform. The second linear drive mechanism drives the second platform to move along the second guide assembly.

[0017] In one of the embodiments of the present application, the turnover mechanism further comprises a first buffer limiting piece connected with the vertical displacement mechanism, the first buffer limiting piece being used to position the turnover arm at the tray position, and a second buffer limiting piece connected with the vertical displacement mechanism, the second buffer limiting piece being used to position the turnover arm at the tray releasing position. The first and second buffer limiting pieces reduce the inertia of the turnover arm during rotation, and improve the positioning accuracy of the tray position and the tray releasing position.

[0018] In one of the embodiments of the present application, the turnover mechanism further comprises a second position detection mechanism connected with the vertical displacement mechanism, the second position detection mechanism being used to detect the turnover angle of the turnover arm. The second position detection mechanism improves the positioning accuracy of the turnover arm.

[0019] In one of the embodiments of the present application, the center of the suction disc is provided with a suction hole, and the surface of the suction disc is provided with a plurality of air flow grooves connected with the suction hole and radiating outward. The air flow grooves increase the negative pressure area in contact with the wafer surface, which can reduce the pressure and prevent the wafer from being damaged, and can also improve the adhesion of the wafer and the suction disc.

[0020] In one of the embodiments of the present application, the suction disc comprises a guide sleeve connected to the turnover arm, a guide column slidingly inserted into the guide sleeve, a suction disc head connected to the guide column, and an elastic member arranged between the guide sleeve and the suction disc head, which elastically floats the suction disc head on the guide sleeve. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual proportions.

[0022] Figure 1 FIG. 1 is a first perspective view of a turnover and patching device for a wafer;

[0023] Figure 2 FIG. 2 is a second perspective view of a turnover and patching device for a wafer;

[0024] Figure 3 FIG. 3 is a three-dimensional structure schematic view of a suction disc;

[0025] Figure 4 FIG. 4 is a front view of the suction disc;

[0026] Figure 5 FIG. 5 is a sectional view along A-A of the suction disc. Figure 4

[0027] In the drawings, 1 is a longitudinal displacement mechanism, 101 is a first guide assembly, 102 is a first platform, 103 is a first linear drive mechanism, and 104 is a first position detection mechanism.

[0028] 2 is a vertical displacement mechanism, 201 is a second guide assembly, 202 is a second platform, and 203 is a second linear drive mechanism.

[0029] 3 is a turnover mechanism, 301 is a turnover driving member, 302 is a turnover arm, 303 is a suction disc, 304 is a shaft rod, 305 is a first buffer limiting member, 306 is a second buffer limiting member, 307 is a second position detection mechanism, 308 is an air outlet hole, 309 is an air flow groove, 310 is a guide sleeve, 311 is a guide column, 312 is a suction disc head, and 313 is an elastic member.

[0030] 4 is a rack. DETAILED DESCRIPTION

[0031] ​In the present application, unless otherwise explicitly specified and limited, the terms in the present application should be understood in a broad sense, for example, the connection can be fixed connection, or detachable connection or integral, can be directly connected, or indirectly connected through intermediate medium; if related to power, electronic equipment, can also be electrical connection or communication signal connection, etc. For those skilled in the art, different terms in the present application can be understood according to the specific meaning, and the specific meaning should be limited to the function of the present application.

[0032] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the present application.

[0033] As shown in Figure 1 A wafer flipping device, comprising: a longitudinal displacement mechanism 1, a vertical displacement mechanism 2, a flipping mechanism 3, the longitudinal displacement mechanism 1 has a longitudinal displacement part moving along the longitudinal direction, the vertical displacement mechanism 2 is connected to the longitudinal displacement part, the vertical displacement mechanism 2 has a vertical displacement part moving along the vertical direction, the flipping mechanism 3 is connected to the vertical displacement part, the flipping mechanism 3 comprises: a flipping driving part 301, a flipping arm 302, a suction cup 303, the flipping driving part 301 is installed on the vertical displacement part, one end of the flipping arm 302 is connected to the flipping driving part 301, the suction cup 303 is connected to the other end of the flipping arm 302, and the suction cup 303 is used for adsorbing the wafer.

[0034] In some embodiments of the present application, as shown in Figure 1 The flipping device further comprises: a rack 4, the rack 4 is installed with the longitudinal displacement mechanism 1, the vertical displacement mechanism 2 and the flipping mechanism 3.

[0035] In some embodiments of the present application, as shown in Figure 1 The longitudinal displacement mechanism 1 comprises: a first guide assembly 101, a first platform 102, a first linear drive mechanism 103, the first guide assembly 101 is arranged along the longitudinal direction, the first platform 102 is slidingly arranged on the first guide assembly 101, the first platform 102 is installed with the vertical displacement mechanism 2, and the movable end of the first linear drive mechanism 103 is connected with the first platform 102.

[0036] In some embodiments of the present application, as shown in Figure 1As shown, the first guiding assembly 101 comprises a first guide rail, a first sliding block, the first guide rail is longitudinally mounted on the rack 4, the first sliding block is slidingly arranged on the first guide rail, and the first platform 102 is mounted on the first sliding block; the first linear driving mechanism 103 comprises a first motor, a lead screw, a nut, and a transmission assembly, the first motor is mounted on the rack 4, the lead screw is rotationally connected to the rack 4, the lead screw is connected to the output shaft of the first motor through the transmission assembly, the transmission assembly adopts synchronous belt transmission, the nut is drivingly connected to the lead screw, the nut is further connected to the first platform 102, the lead screw is driven to rotate by the motor, the nut moves along the lead screw, and the first platform 102 slides on the first guide rail.

[0037] In some embodiments of the present application, as shown in Figure 1 As shown, the longitudinal displacement mechanism 1 further comprises a first position detection mechanism 104, the first position detection mechanism 104 is connected to the rack 4, and the first position detection mechanism 104 is used to detect the movement position of the first platform 102.

[0038] In some embodiments of the present application, as shown in Figure 1 As shown, the first position detection mechanism 104 adopts a groove type photoelectric sensor, the groove type photoelectric sensor is mounted on the rack 4, the first platform 102 is connected with a sensing sheet, when the sensing sheet moves to the detection position of the groove type photoelectric sensor, the groove type photoelectric sensor sends a signal to the control system to control the first platform 102 to stop moving, the groove type photoelectric sensor is used to detect the left and right limit movement positions of the first platform 102, and the control system can adopt a PLC controller, an industrial computer or a computer and the like having a control function.

[0039] In some embodiments of the present application, as shown in Figure 2 As shown, the vertical displacement mechanism 2 comprises a second guiding assembly 201, a second platform 202, and a second linear driving mechanism 203, the second guiding assembly 201 is arranged on the first platform 102 in the vertical direction, the second platform 202 is slidingly arranged on the second guiding assembly 201, the second platform 202 is mounted with the overturning mechanism 3, and the second linear driving mechanism 203 is mounted on the first platform 102, and the movable end of the first linear driving mechanism 103 is connected with the second platform 202.

[0040] In some embodiments of the present application, as shown in Figure 2 As shown, the second guiding assembly 201 comprises a second guide rail and a second sliding block, the second sliding block is fixedly connected to the first platform 102 in the vertical direction, and the second guide rail is slidingly arranged in the second sliding block in the vertical direction; the second linear driving mechanism 203 comprises a pneumatic cylinder, the pneumatic cylinder is connected to the first platform 102, and the second platform 202 is connected with the piston rod of the pneumatic cylinder and the second guide rail.

[0041] In some embodiments of the present application, as shown in Figure 1 , 2As shown in the figure, the overturning mechanism 3 further comprises a shaft 304 rotatably installed on the second platform 202, the overturning driving member 301 is a swing cylinder installed on the second platform 202, the output end of the swing cylinder is connected with the shaft 304, the overturning arm 302 is arranged along the radial direction of the shaft body, one end of the overturning arm 302 is connected with the middle part of the shaft body through a bolt, and the other end is provided with a suction cup 303.

[0042] In some embodiments of the present application, as shown in the figure, Figure 1 As shown in the figure, the overturning mechanism 3 further comprises a first buffer limiting member 305 and a second buffer limiting member 306, the first buffer limiting member 305 is connected with the vertical displacement mechanism 2, and the first buffer limiting member 305 is used for positioning the overturning arm 302 at a tray position; the second buffer limiting member 306 is connected with the vertical displacement mechanism 2, and the second buffer limiting member 306 is used for positioning the overturning arm 302 at a disc placing position. The tray position refers to the position of the overturning arm 302 for lifting the wafer, and the disc placing position refers to the position of the overturning arm 302 after being overturned by 180° so that the wafer waxing surface faces downward.

[0043] In some embodiments of the present application, the first buffer limiting member 305 and the second buffer limiting member 306 are both Misumi buffer, and the first buffer limiting member 305 and the second buffer limiting member 306 are installed on the second platform 202 and located on both sides of the shaft 304. Since the inertia of the overturning arm 302 is large during overturning, the buffer can better buffer the overturning arm 302.

[0044] In some embodiments of the present application, as shown in the figure, Figure 2 As shown in the figure, the overturning mechanism 3 further comprises a second position detection mechanism 307 connected with the vertical displacement mechanism 2, and the second position detection mechanism 307 is used for detecting the overturning angle of the overturning arm 302.

[0045] In some embodiments of the present application, as shown in the figure, Figure 1 , 2 As shown in the figure, two induction discs are installed at the end of the shaft body, the induction disc is provided with an induction gap, the two induction gaps are arranged at an interval of 180°, the second position detection mechanism 307 is a groove type photoelectric sensor, the groove type photoelectric sensor is two and corresponds to the induction disc one by one, the groove type photoelectric sensor is installed on the second platform 202, the corresponding induction gap is detected by the groove type photoelectric sensor, a control signal of overturning to position is sent to the control system, and the swing cylinder is controlled to stop moving by the control system.

[0046] In some embodiments of the present application, as shown in the figure, Figures 3-5As shown, the center of the chuck 303 has a suction hole 308, and the surface of the chuck 303 has a plurality of air flow grooves 309 which communicate with the suction hole 308 and radiate outward. The negative pressure area in contact with the wafer surface is increased through the air flow grooves 309, so as to improve the adhesion and stability of the wafer in contact with the chuck 303.

[0047] In some embodiments of the present application, as shown in Figure 5 As shown, the chuck 303 comprises a guide sleeve 310, a guide column 311, a chuck head 312, and an elastic member 313. The guide sleeve 310 is connected to the turnover arm 302, the guide column 311 is slidingly inserted into the guide sleeve 310, the chuck head 312 is connected to the guide column 311, and the elastic member 313 is a cylindrical compression spring which is sleeved on the guide column 311 and arranged between the guide sleeve 310 and the chuck head 312. The elastic member 313 elastically and floatingly connects the chuck head 312 to the guide sleeve 310. When the chuck 303 performs a downward pressing action on the wafer on the ceramic disc, the elastic and floating connection structure avoids rigid pressure on the wafer by the chuck 303, thereby protecting the wafer.

[0048] The working process of the wafer turnover and pasting device is as follows: the wafer is coated with wax in a previous process and placed on a workbench. The workbench has a notch corresponding to the turnover arm 302 and the chuck 303, so as to avoid interference during movement. The longitudinal displacement mechanism 1 drives the chuck 303 to displace to the position directly below the wafer, the vertical displacement mechanism 2 drives the chuck 303 to move upward, the chuck 303 contacts the wafer, and the surface of the chuck 303 generates negative pressure to adsorb the wafer. The vertical displacement mechanism 2 drives the wafer to separate from the surface of the workbench, the longitudinal displacement mechanism 1 moves toward the other side and is in position, the turnover arm 302 drives the wafer to turn over so that the surface of the wax coating layer of the wafer is turned over to be directly above the ceramic disc, the vertical displacement mechanism 2 drives the wafer to move downward and press onto the ceramic disc, and the chuck 303 separates from the wafer, thereby completing a turnover and pasting action of the wafer.

[0049] The above is only an embodiment of the present application, and the common knowledge of specific structures and properties in the scheme is not described in detail. The ordinary skilled person in the art knows all the ordinary technical knowledge in the technical field of the present application before the application date or the priority date, can know all the prior art in the field, and has the ability to apply conventional experimental means before that date. The ordinary skilled person in the art can improve and implement the present scheme based on their own ability under the guidance of the present application. Some typical known structures or methods should not be an obstacle for the ordinary skilled person in the art to implement the present application. It should be noted that, for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered within the protection scope of the present application. These will not affect the effect and practicality of the present application.

Claims

1. A chip flipping and patching device, characterized in that: include: A longitudinal displacement mechanism having a longitudinal displacement portion that moves in the longitudinal direction; a vertical displacement mechanism connected to the longitudinal displacement portion, wherein the vertical displacement mechanism has a vertical displacement portion that moves vertically; A flipping mechanism is connected to the vertical displacement portion, and the flipping mechanism includes: A flip driving member, mounted on the vertical displacement portion; a flip arm, one end of which is connected to the flip driving member; A suction cup connected to the other end of the flip arm, the suction cup being used to absorb the wafer; The longitudinal displacement mechanism comprises: A first guide assembly is arranged in the longitudinal direction; a first platform, slidably disposed on the first guide assembly, the first platform being equipped with the vertical displacement mechanism; a first linear drive mechanism, wherein a movable end of the first linear drive mechanism is connected to the first platform; a first position detection mechanism connected to the frame, the first position detection mechanism being used to detect the movement position of the first platform; The turning mechanism further comprises: a first buffer limiter connected to the vertical displacement mechanism, the first buffer limiter being used to position the flip arm at the pallet position; a second buffering limiter connected to the vertical displacement mechanism, the second buffering limiter being used to position the flip arm at the disk placing position; The second position detection mechanism is connected to the vertical displacement mechanism, and the second position detection mechanism is used to detect the flip angle of the flip arm.

2. The flip patch device according to claim 1, characterized in that: The vertical displacement mechanism comprises: a second guide assembly, vertically arranged on the first platform; a second platform, slidably disposed on the second guide assembly, the second platform being equipped with the flipping mechanism; The second linear drive mechanism is installed on the first platform, and the movable end of the first linear drive mechanism is connected to the second platform.

3. The flip patch device according to claim 1, wherein: The suction cup has an air extraction hole at its center, and the surface of the suction cup has a plurality of air flow grooves connected to the air extraction hole and radiating outward.

4. The flip patch device according to claim 1, characterized in that: The suction cup comprises: A guide sleeve connected to the flip arm; A guide post, slidably inserted into the guide sleeve; a suction cup head connected to the guide post; An elastic member is provided between the guide sleeve and the suction cup head, and the elastic member enables the suction cup head to be elastically floatingly connected to the guide sleeve.

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