Chip packaging pickup device

Abstract

The utility model relates to the technical field of chip packaging and picking devices, in particular to a chip packaging and picking device which comprises a base, a vertical frame is fixed to the top of the base, a top frame is fixed to the top end of the vertical frame, a reciprocating assembly is installed on the top frame, and a lifting assembly is fixed to the bottom of the moving end of the reciprocating assembly. An adsorption assembly is fixed to the lifting end of the lifting assembly and comprises a driving motor fixed to the lifting end of the bottom of the lifting assembly, a rotating plate is fixed to an output shaft of the driving motor, and an adsorption part capable of elastically moving up and down is fixed to one side of the rotating plate. According to the utility model, after the sucker abuts against the top end of the chip, the convex ring compresses the spring, and the spring can buffer the abutting acting force, so that the chip is prevented from being damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip package pickup device technical field, specifically is a chip package pickup device. BACKGROUND

[0002] In the production, processing and packaging process of semiconductor chips, the chips need to be transported and transferred, and currently the chips on the transmission equipment are picked up by vacuum nozzles, suction cups or mechanical hands.

[0003] The utility model with publication number CN215815829U discloses a chip package pickup device, which comprises a cabinet body, a box body and a base with brake wheels. The box body and the base are respectively installed at the upper and lower ends of the cabinet body. A first air cylinder is arranged at the top of the box body. The bottom of the first air cylinder is rotationally connected to the box body through a rotating shaft. The pushing end of the first air cylinder faces upwards and is provided with a cantilever. A second air cylinder is installed at the top of the other end of the cantilever. The pushing end of the second air cylinder extends below the cantilever and is provided with a connecting plate. A connecting rod is fixedly sleeved to the end of the connecting plate away from the first air cylinder. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a chip package pickup device to solve the problems in the background art.

[0005] The technical solution of the utility model is a chip package pickup device, which comprises a base, a stand fixed to the top of the base, a top frame fixed to the top end of the stand, a reciprocating assembly installed on the top frame, a lifting assembly fixed to the bottom of the moving end of the reciprocating assembly, a suction assembly fixed to the lifting end of the lifting assembly, a driving motor fixed to the bottom lifting end of the lifting assembly, an output shaft of the driving motor, a rotating plate fixed to one side of the output shaft, and a suction piece capable of moving up and down elastically.

[0006] The above components achieve the following effects: the reciprocating assembly and the lifting assembly can drive the suction assembly to displace until the suction piece moves above the chip. When the lifting assembly drives the suction piece to contact the top of the chip and then moves upward relatively, the elastic force is used to buffer the initial contact force, thereby avoiding damage caused by contact during the process of picking up the chip.

[0007] Preferably, the suction member comprises a U-shaped frame fixed on the rotating plate, a vacuum suction pen is slidingly inserted on the rotating plate, a suction disc is connected to the bottom end of the vacuum suction pen, a convex ring is fixed outside the vacuum suction pen, a spring is arranged on the convex ring and sleeved outside the vacuum suction pen, and the top end of the spring is connected to the top end of the U-shaped frame.

[0008] The above components achieve the effect that the vacuum suction pen can cooperate with the suction disc to pick up the chip, and when the suction disc is in contact with the top end of the chip, the convex ring compresses the spring, and the spring can buffer the contact force to avoid damaging the chip.

[0009] Preferably, the reciprocating assembly comprises a sliding block slidingly installed on the top frame, end plates are fixed on the top frame and the sliding block, an electric telescopic rod is fixed between the two end plates, and the bottom of the sliding block is connected to the top end of the lifting assembly.

[0010] The above components achieve the effect that the electric telescopic rod can drive the sliding block to slide along the top frame, and then drive the picked chip to displace.

[0011] Preferably, a sliding rod is fixed on the top frame, and the sliding block is slidingly sleeved on the sliding rod.

[0012] The above components achieve the effect that the sliding rod can guide the sliding of the sliding block, improving the motion stability.

[0013] Preferably, the lifting assembly comprises a lifting frame fixed on the bottom of the sliding block, an electric lifting rod is fixed on the lifting frame, and a lifting plate is fixed to the bottom end of the electric lifting rod.

[0014] The above components achieve the effect that the electric lifting rod on the lifting frame can drive the lifting plate to lift, and then drive the picked chip to lift in height.

[0015] The chip packaging pickup device provided by the utility model has the following improvements and advantages compared with the prior art.

[0016] The reciprocating assembly and the lifting assembly can drive the adsorption assembly to displace until the suction member moves above the chip, when the lifting assembly drives the suction member to be in contact with the top of the chip and then moves upward, the vacuum suction pen can cooperate with the suction disc to pick up the chip, and when the suction disc is in contact with the top end of the chip, the convex ring compresses the spring, and the spring can buffer the contact force to avoid damaging the chip. BRIEF DESCRIPTION OF DRAWINGS

[0017] The utility model will be explained further in combination with the drawings and examples:

[0018] Fig. 1 is the first perspective view of the structure of the utility model;

[0019] Fig. 2 is the second perspective view of the structure of the utility model;

[0020] Fig. 3 is the perspective view of the adsorption assembly in the utility model.

[0021] Explanation of reference signs:

[0022] 1, base; 2, stand; 3, top frame; 4, reciprocating assembly; 41, end plate; 42, sliding block; 43, slide rod; 44, electric telescopic rod; 5, lifting assembly; 51, lifting frame; 52, electric lifting rod; 53, lifting plate; 6, adsorption assembly; 61, driving motor; 62, rotating plate; 63, suction piece; 631, U-shaped frame; 632, vacuum suction pen; 633, convex ring; 634, spring; 635, suction disc. DETAILED DESCRIPTION

[0023] The utility model will be described in detail below, and the technical scheme in the embodiment of the utility model is clearly and completely described. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of protection of the utility model.

[0024] The utility model improves a kind of chip packaging pickup device, and the technical scheme of the utility model is:

[0025] In the embodiment of the utility model, as Figs. 1-3As shown, a chip packaging pickup device, including base 1, the top of base 1 is fixed with stand 2, the top end of stand 2 is fixed with top frame 3, reciprocating assembly 4 is installed on top frame 3, reciprocating assembly 4 includes sliding block 42 slidingly installed on top frame 3, end plate 41 is fixed on top frame 3 and sliding block 42, electric telescopic rod 44 is fixed between two end plates 41, the bottom of sliding block 42 is connected with the top end of lifting assembly 5, sliding block 42 can be driven to slide along top frame 3 by electric telescopic rod 44, in turn, the picked chip can be driven to displace, sliding rod 43 is fixed on top frame 3, sliding block 42 is slidingly sleeved on sliding rod 43, sliding block 42 can be slidingly guided by sliding rod 43, lifting assembly 5 is fixed at the bottom of the moving end of reciprocating assembly 4, lifting assembly 5 includes lifting frame 51 fixed at the bottom of sliding block 42, electric lifting rod 52 is fixed on lifting frame 51, lifting plate 53 is fixed at the bottom end of electric lifting rod 52, lifting plate 53 can be driven to lift by electric lifting rod 52 on lifting frame 51, in turn, the picked chip can be driven to lift, suction assembly 6 is fixed on the lifting end of lifting assembly 5, suction assembly 6 includes driving motor 61 fixed on the lifting end of lifting assembly 5, rotating plate 62 is fixed on the output shaft of driving motor 61, suction piece 63 capable of elastically moving up and down is fixed on one side of rotating plate 62, suction piece 63 includes U-shaped frame 631 fixed on rotating plate 62, vacuum suction pen 632 is slidingly inserted on rotating plate 62, suction disc 635 is connected at the bottom end of vacuum suction pen 632, convex ring 633 is fixed outside vacuum suction pen 632, spring 634 sleeved outside vacuum suction pen 632 is arranged on convex ring 633, the top end of spring 634 is connected with the top end of U-shaped frame 631, the picked chip can be picked by vacuum suction pen 632 in cooperation with suction disc 635, and when suction disc 635 abuts against the top end of the chip, convex ring 633 compresses spring 634, wherein spring 634 can buffer the abutting force to avoid damaging the chip.

[0026] The working principle of the chip packaging pickup device is as follows: sliding block 42 can be driven to slide along top frame 3 by electric telescopic rod 44, in turn, the picked chip can be driven to displace, lifting plate 53 can be driven to lift by electric lifting rod 52 on lifting frame 51, in turn, the picked chip can be driven to lift, and the picked chip can be picked by vacuum suction pen 632 in cooperation with suction disc 635, and when suction disc 635 abuts against the top end of the chip, convex ring 633 compresses spring 634, wherein spring 634 can buffer the abutting force to avoid damaging the chip.

[0027] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging pickup device, comprising a base (1), a stand (2) fixed on the top of the base (1), characterized in that: A top frame (3) is fixed to the top of the vertical frame (2), a reciprocating assembly (4) is installed on the top frame (3), a lifting assembly (5) is fixed to the bottom of the moving end of the reciprocating assembly (4), an adsorption assembly (6) is fixed to the lifting end of the lifting assembly (5), and the adsorption assembly (6) includes a driving motor (61) fixed to the lifting end of the bottom of the lifting assembly (5), a rotating plate (62) is fixed to the output shaft of the driving motor (61), and a suction member (63) that can elastically move up and down is fixed to one side of the rotating plate (62).

2. The chip packaging pickup device according to claim 1, characterized in that: The suction member (63) comprises a U-shaped frame (631) fixed on the rotating plate (62); a vacuum suction pen (632) is slidably plugged into the rotating plate (62); a suction cup (635) is connected to the bottom end of the vacuum suction pen (632); a convex ring (633) is fixed to the outside of the vacuum suction pen (632); a spring (634) is provided on the convex ring (633) and is sleeved on the outside of the vacuum suction pen (632); and the top end of the spring (634) is connected to the top end of the U-shaped frame (631).

3. The chip packaging pickup device according to claim 1, wherein: The reciprocating assembly (4) includes a slider (42) slidably mounted on the top frame (3), end plates (41) are fixed to the top frame (3) and the slider (42), an electric telescopic rod (44) is fixed between the two end plates (41), and the bottom of the slider (42) is connected to the top of the lifting assembly (5).

4. The chip packaging pickup device according to claim 3, wherein: A slide bar (43) is fixed on the top frame (3), and the slider (42) is slidably sleeved on the slide bar (43).

5. The chip packaging pickup device according to claim 3, wherein: The lifting assembly (5) comprises a lifting frame (51) fixed to the bottom of the slider (42), an electric lifting rod (52) is fixed on the lifting frame (51), and a lifting plate (53) is fixed at the bottom end of the electric lifting rod (52).

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