Power semiconductor module
By opening a heat dissipation gap on the top wall of the power semiconductor module and embedding a heat sink, the pins are fitted to the substrate surface, solving the problems of low pin connection reliability and heavy heat dissipation burden, and achieving reliable connection and efficient heat dissipation.
Patent Information
- Application Number
- CN202422934464.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Existing power semiconductor modules have low pin connection reliability and a heavy heat dissipation burden, which affects normal operation.
A heat dissipation gap is designed on the top wall of the main body and a heat sink is embedded in it. The pins are fitted to the substrate surface, and the other end extends out of the main body to connect to the external circuit. The substrate is connected to the heat sink through an insulating layer, and heat is quickly transferred to the heat sink and outside.
It improves the reliable connection between the pins and the external circuit, enhances the heat dissipation effect, reduces the possibility of the overall temperature of the module rising, and ensures normal operation.
Smart Images
Figure CN223450887U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of power electronics, especially relates to power semiconductor module. BACKGROUND
[0002] Power semiconductor module plays a vital role in electric energy conversion, control and distribution, especially in electric vehicles, smart grid and renewable energy, its requirements for electric energy gradually improve, then the role of power semiconductor module is more important.
[0003] In the prior art, the power semiconductor module includes a pin, the pin is installed in the shell through a packaging process, the shell is provided with a substrate, a chip and other elements connected with the pin, the pin is exposed on the surface of the shell to be connected with an external circuit.
[0004] However, the pin has a small exposed area, which reduces the reliability of the connection with the external circuit, and heat is more easily accumulated in the shell, which increases the overall heat dissipation burden and easily affects the normal operation of the power semiconductor module. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing power semiconductor module, solveed the pin of power semiconductor module in prior art when connecting the reliability is low, and the overall heat dissipation burden is big, easily affects the normal operation of power semiconductor module problem.
[0006] To achieve this purpose, the utility model adopts the following technical scheme:
[0007] The utility model provides power semiconductor module, it includes:
[0008] Main body, the top wall of main body is equipped with heat dissipation gap;
[0009] Radiating fin, set up in the heat dissipation gap and close the heat dissipation gap;
[0010] Substrate, fixed in the inside of main body and is connected with radiating fin;
[0011] Multiple pins, one end of pin is located in the main body and forms face bonding between substrate, and the other end extends the main body.
[0012] Optionally, the pin includes a mounting section, an extension section, and a connecting section connecting the mounting section and the extension section, the side surface of the mounting section is parallel to the side surface of the substrate and forms face bonding.
[0013] Optionally, the extension section extends out of the main body in a direction parallel to the bottom wall of the main body, and the side surface of the extension section is flush with the outer bottom wall of the main body.
[0014] Optionally, the connecting section extends obliquely.
[0015] Optionally, an insulating layer is arranged between the substrate and the heat sink.
[0016] Optionally, the thickness of the heat sink is greater than that of the heat dissipation gap, and the side surface of the heat sink is flush with the outer top wall of the main body.
[0017] Optionally, the power semiconductor module further comprises:
[0018] a heat sink arranged on the heat sink.
[0019] Optionally, a plurality of the pins are distributed on opposite sides of the main body.
[0020] Optionally, a fixing hole is formed on the main body.
[0021] Optionally, a plurality of the fixing holes are formed, and the plurality of fixing holes are arranged in a ring around the circumference of the main body.
[0022] The power semiconductor module has the following beneficial effects:
[0023] By forming a surface fit between one side of the pin and the substrate and extending the other side out of the main body, on the one hand, the pin can be used to connect the part, so that the pin and the external circuit form a reliable connection, on the other hand, the heat of the pin can be quickly transferred to the outside of the main body, and the surface fit can also make the pin in a planar surface mount type layout to reduce the occupied space and improve the utilization rate of the space. The heat in the main body can be quickly transferred to the heat sink by the substrate, and the heat sink is embedded in the heat dissipation gap, so that the heat sink has a large contact area with the outside, and the heat can be quickly transferred to the outside of the main body. Therefore, when the power semiconductor module is used, not only can the pin and the external circuit form a reliable connection, but also the heat can be quickly transferred to the outside through the top of the main body, reducing the possibility of continuous temperature rise of the power semiconductor module as a whole, thereby reducing the possibility of affecting the normal operation of the power semiconductor module. BRIEF DESCRIPTION OF DRAWINGS
[0024] Fig. 1 is a structure schematic view of the power semiconductor module in the embodiment of the utility model;
[0025] Fig. 2 is a structure sectional view of the power semiconductor module in the embodiment of the utility model;
[0026] Fig. 3 is a structure schematic view of the main body of the power semiconductor module after the fixing hole is formed.
[0027] In the drawings:
[0028] 1, main body; 11, fixing hole; 2, heat dissipation fin; 3, substrate; 4, pin; 41, mounting section; 42, extension section; 43, connecting section; 5, insulating layer. DETAILED DESCRIPTION
[0029] The utility model will be described in further detail below in connection with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model, and not limit the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.
[0030] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0031] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0032] In the description of the embodiment, the terms "up", "down", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model. In addition, the terms "first", "second" are only used to distinguish in description, and have no special meaning.
[0033] The utility model embodiment discloses a power semiconductor module.
[0034] Reference Figs. 1 to 3The power semiconductor module comprises a main body 1, a heat dissipation fin 2, a substrate 3 and a plurality of pins 4. The top wall of the main body 1 is provided with a heat dissipation gap; the heat dissipation fin 2 is arranged in the heat dissipation gap and closes the heat dissipation gap; the substrate 3 is fixed in the interior of the main body 1 and connected with the heat dissipation fin 2; one end of the pin 4 is located in the main body 1 and forms a surface fit with the substrate 3, and the other end extends out of the main body 1.
[0035] Specifically, the main body 1 is cuboid, the heat dissipation gap is provided on the top wall of the main body 1, the area of the heat dissipation gap accounts for more than 80% of the top wall of the main body 1, the heat dissipation fin 2 is made of a material with good heat dissipation coefficient, and is embedded in the heat dissipation gap; the heat dissipation fin 2 and the heat dissipation gap can be interference fit, can be fixed by adhesion, and can be fixed by bolt connection, and the utility model does not make limitation on this. The substrate 3 is arranged at the inner top wall of the main body 1, one side of the substrate 3 forms a surface fit with the heat dissipation fin 2, the other side of the substrate 3 forms a surface fit with the pin 4, and the side of the pin 4 away from the substrate 3 extends out of the main body 1 from the position close to the bottom wall of the main body 1. The end of the pin 4 extending out of the main body 1 is used for forming connection with external circuit.
[0036] By forming a surface fit between one side of the pin 4 and the substrate 3 and extending the other side out of the main body 1, on the one hand, the part that can be used for connection of the pin 4 can be increased, so that the pin 4 forms reliable connection with external circuit, and on the other hand, the heat of the pin 4 can be quickly transferred to the outside of the main body 1, and the surface fit can also make the pin 4 in a surface mount type layout, so as to reduce the occupied space and improve the utilization rate of space. The heat in the interior of the main body 1 can be quickly transferred to the heat dissipation fin 2 by the substrate 3, the heat dissipation fin 2 is embedded in the heat dissipation gap, so that the heat dissipation fin 2 has a large contact area with the outside, and the heat can be quickly transferred to the outside of the main body 1. Therefore, when the power semiconductor module is used, not only can the pin 4 form reliable connection with external circuit, but also the heat can be quickly transferred to the outside through the top of the main body 1, so as to reduce the possibility of continuous temperature rise of the whole power semiconductor module, thereby reducing the possibility of affecting the normal operation of the power semiconductor module.
[0037] Optionally, the pin 4 comprises a mounting section 41, an extension section 42 and a connecting section 43. The mounting section 41 and the extension section 42 are connected through the connecting section 43, and the side surface of the mounting section 41 is parallel to the side surface of the substrate 3 and forms a surface fit with the side surface of the substrate 3.
[0038] Specifically, the mounting section 41 extends in the direction parallel to the side surface of the substrate 3 and forms a surface fit with the substrate 3, and when the pin 4 is arranged, only the length of the mounting section 41 needs to be determined, so as to ensure that the pin 4 forms effective surface contact with the substrate 3.
[0039] Optionally, the extension section 42 extends out of the main body 1 in a direction parallel to the bottom wall of the main body 1 , and a side surface of the extension section 42 is flush with the outer bottom wall of the main body 1 .
[0040] Specifically, an opening is provided on the side wall of the main body 1 near the bottom wall, and the extension section 42 is disposed through this opening. The extension section 42 extends parallel to the plane of the bottom wall of the main body 1. The extension section 42 itself can be elongated or stepped, depending on the circuit to which the extension section 42 is to be connected, and this is not limited by the present invention. The bottom wall of the extension section 42 is flush with the outer bottom wall of the main body 1, which reduces the size of the entire power semiconductor module and facilitates its integral soldering to the PCB board.
[0041] By extending the extension section 42 out of the main body 1 , when connection with an external circuit is required, it is only necessary to design the extension section 42 with a suitable length to ensure sufficient connection length so that the extension section 42 and the external circuit can form a reliable connection.
[0042] Optionally, the connecting section 43 extends obliquely.
[0043] Specifically, the connecting section 43 extends obliquely from the inner top wall of the main body 1 toward the side wall of the main body 1 so that the connection between the connecting section 43 and the extension section 42 is close to the side wall of the main body 1, thereby ensuring that the extension section 42 can extend out of the main body 1 to a greater length, and also reducing the space occupied by the connecting section 43 inside the main body 1.
[0044] Optionally, an insulating layer 5 is provided between the substrate 3 and the heat sink 2 .
[0045] Specifically, an insulating layer 5 is bonded and fixed to the side of the heat sink 2 close to the substrate 3. The insulating layer 5 is made of insulating material and has a high thermal conductivity. The insulating layer 5 is fixedly connected to the substrate 3, and the fixing method can be bonding to ensure that the heat of the substrate 3 can be quickly transferred to the heat sink 2 through the insulating layer 5.
[0046] By providing the insulating layer 5 , it is possible to ensure that the overall insulation performance of the main body 1 meets the requirements, and it is also possible to ensure that the overall heat dissipation effect will not be affected by the insulating layer 5 .
[0047] Optionally, the thickness of the heat sink 2 is greater than the thickness of the heat dissipation gap, and the side surface of the heat sink 2 is flush with the outer top wall of the main body 1 .
[0048] Specifically, the outer wall of the heat sink 2 is flush with the outer top wall of the main body 1, so that the outer wall of the main body 1 remains flat, and the thickness of the heat sink 2 is large, so that the inner wall of the heat sink 2 extends into the interior of the main body 1 to ensure that the inner side of the heat sink 2 can form sufficient contact with the insulating layer 5, which is conducive to the rapid transfer of heat.
[0049] Optionally, the power semiconductor module further comprises a heat sink (not shown in the figure). The heat sink is arranged on the cooling fin 2. The heat sink can adopt a fan, a water cooling module or the like, and the utility model does not make limitation on this. The heat dissipation surface of the heat sink is attached to the outer side wall of the cooling fin 2, so as to quickly transfer the heat of the cooling fin 2 to the outside, and further improve the heat dissipation effect.
[0050] Optionally, the plurality of pins 4 are distributed on the opposite sides of the main body 1.
[0051] Specifically, the main body 1 is a square, and the plurality of pins 4 are distributed on two opposite side walls respectively. In the embodiment, 3 or 4 pins 4 are distributed on one side, and 4 or 5 pins 4 are distributed on the other side. The number of pins 4 can be designed according to the actual connection requirement, and the utility model does not make limitation on this.
[0052] Optionally, a fixing hole 11 is formed on the main body 1.
[0053] Specifically, a through hole is formed on the main body 1 as the fixing hole 11. The fixing hole 11 can be passed through by a screw, so as to fix the main body 1 at a specified position. The fixing hole 11 can be formed on the edge of the main body 1, or can be formed on the middle part of the main body 1. The specific forming position can be designed according to the fixing position of the main body 1.
[0054] Optionally, a plurality of fixing holes 11 are formed, and the plurality of fixing holes 11 are annularly arranged around the circumference of the main body 1.
[0055] Specifically, in the embodiment, one fixing hole 11 is formed on each of the two side walls without the pin 4, and the fixing hole 11 is located at the middle position of the side wall, so as to fix the main body 1 from both sides. In other embodiments, the number of fixing holes 11 can also be multiple. The number of fixing holes 11 can be designed according to the size of the main body 1, and the utility model does not make limitation on this.
[0056] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not limitation on the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, re-adjustment and replacement can be made without departing from the protection scope of the utility model. Here, it is unnecessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.
Claims
1. A power semiconductor module, characterized in that include: A main body (1), wherein a top wall of the main body (1) is provided with a heat dissipation notch; A heat sink (2) is provided on the heat dissipation gap and closes the heat dissipation gap; A base plate (3) is fixed inside the main body (1) and connected to the heat sink (2); A plurality of pins (4), one end of each pin (4) is located in the main body (1) and is in surface contact with the substrate (3), and the other end extends out of the main body (1).
2. The power semiconductor module according to claim 1, wherein: The pin (4) comprises a mounting section (41), an extension section (42), and a connecting section (43) connecting the mounting section (41) and the extension section (42); the side surface of the mounting section (41) is parallel to the side surface of the substrate (3), and the two are in surface contact.
3. The power semiconductor module according to claim 2, wherein: The extension section (42) extends out of the main body (1) in a direction parallel to the bottom wall of the main body (1), and the side surface of the extension section (42) is flush with the outer bottom wall of the main body (1).
4. The power semiconductor module according to claim 2, wherein: The connecting section (43) extends obliquely.
5. The power semiconductor module according to claim 1, wherein: An insulating layer (5) is provided between the substrate (3) and the heat sink (2).
6. The power semiconductor module according to claim 1, wherein: The thickness of the heat sink (2) is greater than the thickness of the heat dissipation notch, and the side surface of the heat sink (2) is flush with the outer top wall of the main body (1).
7. The power semiconductor module according to claim 1, wherein: The power semiconductor module further includes: A radiator is arranged on the heat sink (2).
8. The power semiconductor module according to claim 1, wherein: The plurality of pins (4) are distributed on opposite sides of the main body (1).
9. The power semiconductor module according to claim 1, wherein: The main body (1) is provided with a fixing hole (11).
10. The power semiconductor module according to claim 9, characterized in that A plurality of fixing holes (11) are provided, and the plurality of fixing holes (11) are arranged at intervals around the circumference of the main body (1).