Printed circuit board (PCB) capable of improving welding spot quality of plug-in element

Abstract

The utility model relates to a PCB (Printed Circuit Board) for improving the welding spot quality of a plug-in element, the PCB is a double-sided board, the front and back surfaces of the PCB are respectively provided with a copper foil layer, the surface of each copper foil layer is provided with a solder mask oil layer, the front and back surfaces of the PCB are provided with a plurality of bonding pads, a first bonding pad is arranged around the front surface of a pin jack of a vertical plug-in element, and a second bonding pad is arranged around the front surface of a pin jack of the vertical plug-in element. A second bonding pad is arranged on the periphery of the reverse side of a pin jack of the vertical plug-in element, a blocking-up mechanism is arranged beside a first bonding pad of the vertical plug-in element, and a plurality of exhaust channels are formed between the pin jack and the bottom face of the vertical plug-in element and between the pin jack and the blocking-up mechanism. According to the scheme, the shape of the element does not need to be improved, only a small change is made on the PCB arrangement structure, the PCB arrangement data with the improved structure is used for producing and manufacturing the PCB, and the improved PCB can meet the requirement that the plug-in element with the plane bottom surface is suitable for wave soldering; and the welding quality is obviously improved, customers can accept the welding method easily, and the production efficiency is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB board product technical field especially relates to the PCB board of improving plug -in component welding point quality. BACKGROUND

[0002] PCB board (is the abbreviation of Printed Circuit Board) it is a kind of plate structure material for loading electronic components.It forms conductive loop by advanced printing technology to metal wire, realizes the connection between electronic components, to build complete circuit system.PCB is widely used in electronics, communication, computer and automobile and many other fields because of its high reliability, high integration and repeatable production characteristics.

[0003] For the bottom of some DIP components (i.e. plug-in components with pins, such as: toggle switch, plug-in electrolytic, plug-in inductor, plug-in crystal oscillator, etc. The bottom of the plug-in component is flat and tightly attached to the surface of the PCB. Because the bottom of the component is completely attached to the surface of the PCB, it will cause the gas in the hole to be unable to effectively discharge when the component is wave soldered, resulting in tin climbing difficulty when the tin furnace is over, causing false welding and low roundness of the welding point. In order to improve this situation, it is usually required to increase the bottom boss of the component from the raw material to improve, but the improvement of the raw material needs the synchronous acceptance of the customer and the supplier, and the improvement is resisted due to the increase of various costs. Another countermeasure is manual welding, but manual welding has the disadvantages of low work efficiency, high labor cost and high quality risk.

[0004] In order to solve the above-mentioned deficiencies, the present scheme proposes a PCB board for improving the welding point quality of plug-in components. INVENTION CONTENTS

[0005] The purpose of the present application is to solve the problem that the bottom of the existing DIP component is tightly attached to the surface of the PCB, and the gas in the hole cannot be effectively discharged when wave soldering, resulting in false welding and low roundness of the welding point. The specific solution is as follows:

[0006] Scheme 1:

[0007] The PCB board for improving the welding point quality of plug-in components, the PCB is a double-sided board, the front and back surfaces of the PCB board are respectively provided with a copper foil layer, the surface of the copper foil layer is provided with a solder resist layer, the front and back surfaces of the PCB board are provided with a plurality of pads, the front surface of the pin jack of the vertical plug-in component is provided with a first pad, the back surface of the pin jack of the vertical plug-in component is provided with a second pad, the first pad of the vertical plug-in component is provided with a heightening mechanism beside it, and a plurality of exhaust passages are formed between the pin jack and the bottom surface of the vertical plug-in component and the heightening mechanism.

[0008] Further, the first pad and the second pad are of the same size, or the first pad and the second pad are of different sizes.

[0009] Further, the heightening mechanism is a plurality of independent oil blocks, each of which is spaced apart from each other, and the oil blocks are symmetrically arranged around the center of the vertical plug-in component.

[0010] Further, the oil blocks are arranged on the front surface of the PCB.

[0011] Further, the oil blocks are of any one of square, strip or circular shape.

[0012] Further, the oil blocks do not intersect with the first pad.

[0013] Further, the thickness of the oil blocks is 40um-80um.

[0014] Scheme 2:

[0015] The PCB with improved plug-in component soldering quality is a single-sided PCB, the back surface of the PCB is provided with a copper foil layer, the surface of the copper foil layer is provided with a solder resist oil layer, and the back surface of the PCB is provided with a plurality of pads, wherein the heightening mechanism is arranged beside the pin jack of the vertical plug-in component, a plurality of exhaust channels are formed between the pin jack, the bottom surface of the vertical plug-in component and the heightening mechanism.

[0016] Further, the heightening mechanism is a plurality of independent oil blocks, each of which is spaced apart from each other, and the oil blocks are symmetrically arranged around the center of the vertical plug-in component, and the oil blocks are arranged on the front surface of the PCB.

[0017] Further, the thickness of the oil blocks is 40um-80um.

[0018] The present scheme has the following beneficial effects:

[0019] The PCB board for improving the quality of the plug-in component soldering point of the present application does not need to improve the component shape, but only makes a small change in the PCB plate arrangement structure, uses the PCB plate arrangement data after the structure improvement to produce the PCB board, and the improved PCB board can meet the requirement of the plug-in component with a flat bottom surface for wave soldering, and has the beneficial effects of obviously improving the soldering quality, easy acceptance of the customer, and further improving the production efficiency. The improvement idea of the present application is simple, effective, low in cost, large in effect, and good in universality, and is suitable for the wave soldering of various plug-in components with a flat bottom surface. The invention principle of the present application is that, in order to increase the exhaust guide in the plug-in hole of the PCB board, the thickness of the oil layer block corresponding to the four corner positions of the plug-in component bottom is increased, the height of the component is increased (about 40um-80um), the exhaust passage is formed between the plug-in hole, the plug-in component bottom surface and the oil layer block, the gas in the pin hole of the PCB board is effectively exhausted, the soldering ability of the plug-in component pin pad is promoted, the beneficial effects of full soldering, smooth and round soldering point, improved soldering quality and soldering efficiency are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 FIG. 1 is a structure diagram of the embodiment 1 of the PCB board for improving the quality of the plug-in component soldering point of the present application;

[0021] Figure 2 FIG. 2 is an assembly schematic diagram of the switch and the PCB board of the embodiment 1 of the present application;

[0022] Figure 3 FIG. 3 is a structure diagram of the embodiment 2 of the PCB board for improving the quality of the plug-in component soldering point of the present application;

[0023] Figure 4 FIG. 4 is an assembly schematic diagram of the crystal oscillator and the PCB board of the embodiment 2 of the present application.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 10-double-sided board, 11-soldering pad, 12-copper foil layer, 13-wire, 20-vertical plug-in component, 21-pin hole, 211-first soldering pad, 30-oil layer block, 40-single-sided board. DETAILED DESCRIPTION

[0026] The embodiments are only for illustrative purposes, and cannot be understood as the limitation of the present application, including the drawings for reference and illustration, and do not constitute the limitation of the patent protection range of the present application, because many changes can be made to the present application without departing from the spirit and scope of the present application.

[0027] Embodiment 1:

[0028] As Figure 1 ,2 As shown in the drawings, the PCB with improved plug-in component soldering quality is a double-sided PCB 10, the front and back surfaces of the PCB are respectively provided with a copper foil layer 12 (the back copper foil layer 12 is shown by a dashed line in the drawings), the surface of the copper foil layer 12 is provided with a solder resist layer (not shown in the drawings), and the front and back surfaces of the PCB are provided with a plurality of pads 11, the front periphery of the pin hole 21 of the vertical plug-in component 20 (such as a switch, with three pins) is provided with a first pad 211, the back periphery of the pin hole 21 of the vertical plug-in component 20 is provided with a second pad (not shown in the drawings), the first pad 211 of the vertical plug-in component 20 is provided with a heightening mechanism beside it, and a plurality of exhaust channels are formed between the pin hole 21 and the bottom surface of the vertical plug-in component 20 and the heightening mechanism. The embodiment 1 shows a switch PCB, which is not provided with a front copper foil layer, and the pads 11 are used for inserting and soldering wires 13. When the scheme is used for other product PCBs (not shown in the drawings) with more components, the front surface of the double-sided PCB is also provided with a copper foil layer, and the PCB is also provided with other plug-in components, such as vertical transformers, inductors, electrolytic components, crystal oscillators, etc.

[0029] Optionally, the first pad 211 and the second pad are the same in size (such as the embodiment 1) or the first pad 211 and the second pad are different in size (not shown in the drawings), for example, when there are more components on the double-sided PCB, the first pad on the front surface is usually smaller than the second pad on the back surface. The soldering of the components mainly relies on the solder on the second pad. The first pad 211 and the second pad of the embodiment 1 have the advantages of increasing the solder area on the pins of the vertical plug-in component 20 and improving the soldering strength.

[0030] Preferably, the heightening mechanism is four independent oil blocks 30, each of which is spaced apart from each other (for the purpose of exhaust), and the oil blocks 30 are symmetrically arranged around the center of the vertical plug-in component 20. The symmetric arrangement is to stabilize the center of gravity of the vertical plug-in component 20 and make the vertical plug-in component 20 flat after wave soldering, so as to ensure the appearance quality.

[0031] Specifically, the oil blocks 30 are arranged on the surface of the front surface of the PCB. That is, they are arranged on the outer surface of the front solder resist layer. The oil blocks 30 can be any one of white oil blocks or black oil blocks, and are preferably selected to be the same as the color and material of the silk-screen printing ink of the component number, so as to facilitate production, save material cost and improve production efficiency.

[0032] Optionally, the oil blocks 30 have any one of a square shape, a strip shape or a circular shape, which is determined according to actual needs. Each of the oil blocks 30 has the same structure, which is beautiful and consistent.

[0033] Specifically, the oil blocks 30 do not intersect with the first pad 211. This is to prevent the oil blocks 30 from occupying the area of the first pad 211 and affecting the soldering quality.

[0034] Preferably, the thickness of the oil layer block 30 is 40-80um. The actual thickness of the oil layer block 30 can be adjusted according to the specific product requirements.

[0035] Embodiment 2

[0036] As shown in Figure 3 , 4 , the PCB is a single-sided board 40 (only a part is shown in the figure), the reverse side of the PCB board (indicated by a dashed line) is provided with a copper foil layer 12, the surface of the copper foil layer 12 is provided with a solder resist layer (not shown in the figure), and the reverse side of the PCB board (indicated by a dashed line) is provided with a plurality of pads 11. The pin socket 21 of the vertical plug-in component 20 (such as a crystal oscillator used in this embodiment 2) is provided with a lifting mechanism beside it, and a plurality of exhaust channels are formed between the pin socket 21 and the bottom surface of the vertical plug-in component 20 and the lifting mechanism. The front side of the single-sided board 40 does not have a copper foil layer, a pad, and a solder resist layer, which has the advantage of low cost.

[0037] Preferably, the lifting mechanism is four independent oil layer blocks 30, each of which is spaced apart from each other, and the oil layer blocks 30 are symmetrically arranged around the center of the vertical plug-in component 20 and are provided on the front surface of the PCB board. The oil layer block 30 can be any one of a white oil block or a black oil block, and is preferably selected to be the same as the color and material of the component number silk screen ink. In this way, production can be facilitated, material costs can be saved, and production efficiency can be improved.

[0038] Preferably, the thickness of the oil layer block 30 is 40-80um. The actual thickness of the oil layer block 30 can be adjusted according to the specific product requirements.

[0039] The present scheme has the following beneficial effects:

[0040] The PCB board of the scheme improves the quality of the plug-in component soldering point, without improving the component shape, only making a small change in the PCB plate structure, using the improved PCB plate data to produce the PCB board, and the improved PCB board meets the plug-in component suitable for the wave soldering, and has the beneficial effects of obviously improving the soldering quality, easy to be accepted by the customer, and further improving the production efficiency.The improvement idea of the scheme is simple, effective, low in cost, large in effect, good in universality, and suitable for the wave soldering of various plug-in components with the flat bottom surface.The invention principle of the scheme is that, in order to increase the exhaust guide in the plug-in hole of the PCB board, the thickness of the oil layer block corresponding to the four corner positions of the plug-in component bottom is increased, the height of the component is increased (about 40um-80um), the exhaust channel is formed between the gap between the plug-in hole, the plug-in component bottom surface and the oil layer block, the gas in the pin hole of the PCB board is effectively exhausted, the soldering ability of the plug-in component pin pad is promoted, the beneficial effects of the full soldering, the smooth and round soldering point, the improved soldering quality and the soldering efficiency are achieved.

[0041] The above embodiment is the preferred embodiment of the utility model, but the embodiment of the utility model is not limited by the above embodiment, and any change, modification, replacement, combination, simplification, which does not deviate from the spirit and principle of the utility model, should be the equivalent replacement mode, and all are included in the protection scope of the utility model.

Claims

1. A PCB board with improved solder joint quality for plug-in components, characterized by: The PCB is a double-sided board, with copper foil layers provided on the front and back sides of the PCB respectively, and a solder resist layer provided on the surface of the copper foil layer. A plurality of solder pads are provided on the front and back sides of the PCB, wherein a first solder pad is provided around the front side of the pin socket of the vertical plug-in component, and a second solder pad is provided around the back side of the pin socket of the vertical plug-in component. A padding mechanism is provided next to the first solder pad of the vertical plug-in component, and a plurality of exhaust channels are formed between the pin socket, the bottom surface of the vertical plug-in component, and the padding mechanism.

2. The PCB board for improving the quality of solder joints of plug-in components according to claim 1, characterized in that: The first pad and the second pad have the same size, or the first pad and the second pad have different sizes.

3. The PCB board with improved solder joint quality of plug-in components according to claim 1, characterized in that: The raising mechanism is composed of a plurality of independent oil layer blocks, each of which is spaced apart from the other, and the oil layer blocks are symmetrically distributed around the center of the vertical plug-in element.

4. The PCB board for improving the quality of solder joints of plug-in components according to claim 3, characterized in that: The oil layer block is arranged on the front surface of the PCB board.

5. The PCB board with improved solder joint quality of plug-in components according to claim 3, characterized in that: The oil layer block has a shape of square, strip or circle.

6. The PCB board with improved solder joint quality of plug-in components according to claim 3, characterized in that: The oil layer block has no intersection with the first pad.

7. The PCB board with improved solder joint quality of plug-in components according to claim 3, characterized in that: The thickness of the oil layer block is 40um to 80um.

8. A PCB board with improved solder joint quality of plug-in components, characterized by: The PCB is a single-sided board. A copper foil layer is provided on the back of the PCB. A solder mask layer is provided on the surface of the copper foil layer. A plurality of solder pads are provided on the back of the PCB. A padding mechanism is provided next to the pin socket of the vertical plug-in component. Multiple exhaust channels are formed between the pin socket, the bottom surface of the vertical plug-in component, and the padding mechanism.

9. The PCB board with improved solder joint quality of plug-in components according to claim 8, characterized in that: The raising mechanism is a plurality of independent oil layer blocks, each oil layer block is spaced apart from each other, the oil layer blocks are symmetrically distributed around the center of the vertical plug-in component, and the oil layer blocks are arranged on the front surface of the PCB board.

10. The PCB board for improving the quality of solder joints of plug-in components according to claim 9, characterized in that: The thickness of the oil layer block is 40um to 80um.

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