PCBA heat dissipation assembly
By using a heat sink and thermally conductive silicone design in the PCBA heat dissipation assembly, the problem of insufficient heat dissipation in a closed space is solved, efficient heat conduction and dissipation is achieved, and the stability and performance of the equipment are ensured.
Patent Information
- Application Number
- CN202422876634.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In space-constrained or closed environments, existing PCBA heat dissipation technologies are unable to effectively dissipate the heat of IC components in a timely manner, especially when fans cannot be used, the heat dissipation effect is insufficient.
The radiator design includes a top plate, a bottom plate and a connecting plate. The top plate contacts the circuit board, and the bottom plate contacts the outer shell. The radiator is equipped with wavy heat dissipation blades, and thermal conductive silicone is used between the circuit board and the radiator, and between the outer shell and the radiator to ensure rapid heat conduction and diffusion.
Improve heat conduction efficiency in closed spaces. Through the design of thermal conductive silicone and wavy blades, the contact area and air flow are increased to ensure rapid heat dissipation, solve the problem of insufficient heat dissipation in closed environments, and ensure equipment stability and performance.
Smart Images
Figure CN223452295U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of printed circuit boards, in particular to a PCBA heat dissipation assembly. BACKGROUND
[0002] With the continuous enhancement of the functions of electronic devices, the application of integrated circuit (IC) elements in PCBA (printed circuit board assembly) becomes increasingly common, especially in the fields of computers, smartphones, home appliances and industrial control systems. With the improvement of the integration and processing capacity of IC elements, the power consumption also increases, resulting in a large amount of heat generated by these elements during operation. In order to ensure the normal operation of electronic devices and prolong the service life, effective heat management and heat dissipation system has become a key technology in modern electronic design. The continuous innovation and optimization of heat dissipation technology have attracted widespread attention in PCBA heat dissipation technology.
[0003] In the existing heat dissipation scheme, the IC elements on the PCBA are usually cooled by heat sinks (such as aluminum heat sinks) and fans. Aluminum heat sinks are widely used due to their good thermal conductivity, and the heat dissipation is accelerated by increasing the surface area and improving the air contact. The use of fans can enhance air flow and further improve heat dissipation effect. However, in actual application, the fan usually needs a larger space and is connected with the external air channel to play the best heat dissipation effect. The design of the heat sink and the heat sink mainly depends on increasing the heat dissipation area and optimizing the heat conduction path to improve the heat dissipation efficiency.
[0004] However, in a space-limited or closed environment, the heat conduction efficiency on the PCBA is low. In a closed or small device, air flow is limited, and heat dissipation effect is difficult to fully play. Especially in the case where the fan cannot be used, relying solely on passive heat dissipation design such as aluminum heat sink cannot effectively dissipate the heat of IC elements to the outside in time. Invention content
[0005] In order to make full use of the super large surface area of the shell for heat dissipation and improve the heat dissipation efficiency in the closed space, the present application provides a PCBA heat dissipation assembly. The present application provides the following technical solutions:
[0006] A PCBA heat dissipation assembly, comprising a shell and a circuit board, the circuit board is arranged in the closed space of the shell; a heat sink is arranged between the circuit board and the shell, and the heat sink is provided with heat dissipation blades; the top end of the heat sink is in contact with the bottom surface of the circuit board, and the bottom end of the heat sink is in contact with the inner bottom surface of the shell.
[0007] In a specific embodiment, the heat sink comprises a top plate and a bottom plate arranged horizontally, the top plate and the bottom plate are connected by a connecting plate, the top plate is in contact with the bottom surface of the circuit board, and the bottom plate is in contact with the inner bottom surface of the shell.
[0008] In a specific embodiment, the heat dissipation fins are arranged on the bottom surface of the top plate.
[0009] In a specific embodiment, the outer surface of each heat dissipation fin is in a continuous wave shape.
[0010] In a specific embodiment, the first heat-conducting silica gel is arranged between the bottom surface of the circuit board and the top plate.
[0011] In a specific embodiment, the shape and number of the first heat-conducting silica gel are the same as the shape and number of IC elements on the circuit board.
[0012] In a specific embodiment, the second heat-conducting silica gel is arranged between the inner bottom surface of the shell and the bottom plate.
[0013] In a specific embodiment, the shape of the second heat-conducting silica gel is the same as the shape of the bottom plate.
[0014] In summary, the beneficial effects of the present application include at least:
[0015] 1) By arranging heat-conducting silica gel between the circuit board and the heat sink, and precisely matching according to the shape and number of IC elements, it ensures that heat can be quickly and efficiently transferred from IC elements to the heat sink, reducing thermal resistance and improving heat conduction efficiency.
[0016] 2) The wave-shaped design of the heat sink fins increases the heat dissipation surface area and promotes air flow, breaking the laminar state of the airflow and accelerating the transfer and dissipation of heat, thereby significantly improving the heat dissipation effect.
[0017] 3) By arranging heat-conducting silica gel between the heat sink and the shell, it ensures that heat can be quickly conducted from the bottom plate of the heat sink to the shell, and effectively dissipates heat by using the large surface area of the shell to contact the external air, solving the problem of insufficient heat dissipation in limited space or closed environments, and ensuring effective control of the internal temperature of the equipment.
[0018] The problem of low heat dissipation efficiency in closed spaces and small devices is effectively solved by optimizing the design of the heat sink and the use of heat-conductive materials. The assembly includes a housing, a circuit board, a heat sink, and heat-conductive silicone, wherein the top plate and the bottom plate of the heat sink are in close contact with the circuit board and the housing, forming an efficient heat conduction channel. By using heat-conductive silicone between the circuit board and the heat sink, the heat generated by the IC components can be quickly transferred to the heat sink, and then the heat is dissipated through the super large surface area of the housing. The wave-shaped design of the heat sink fins further increases the contact area and promotes air flow, thereby improving the heat dissipation efficiency. Under this design, even without the use of a fan, the heat sink can still efficiently conduct the heat of the IC components to the external environment, solving the problem of insufficient heat dissipation in closed spaces and ensuring the stability and performance of the device.
[0019] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, and to implement the content of the description, the following will be described in detail with the preferred embodiments of the present application and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a structural schematic diagram of a PCBA heat dissipation assembly in an embodiment of the present application.
[0021] Figure 2 is an exploded schematic diagram of a PCBA heat dissipation assembly in an embodiment of the present application.
[0022] Figure 3 is Figure 2 an enlarged view of part A in
[0023] Reference signs: 1, circuit board; 2, housing; 3, heat sink; 31, top plate; 32, connecting plate; 33, bottom plate; 34, heat dissipation fin; 4, first heat-conductive silicone; 5, second heat-conductive silicone. DETAILED DESCRIPTION
[0024] The specific embodiments of the present application will be further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.
[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in conjunction with the drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that only the parts related to the present application are shown in the drawings, not all the structures. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0026] The terms "comprising" and "having" and any variations thereof in the present application are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or apparatus that comprises a list of steps or units is not limited to the listed steps or units but can optionally further include additional steps or units not listed or can optionally further include other steps or units inherent to such process, method, product or apparatus.
[0027] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily all directed to the same embodiment, or to a single alternative embodiment. It is explicitly contemplated that embodiments described herein can be combined with each other.
[0028] The embodiments of the present application disclose a PCBA heat dissipation assembly.
[0029] With reference to Figure 1 , the PCBA heat dissipation assembly comprises a housing 2 and a circuit board 1, the circuit board 1 is arranged in a closed space of the housing 2, Figure 1 Only for the convenience of showing the structure, in fact Figure 1 The housing 2 in the embodiment is a closed structure. In combination with Figure 2 and Figure 3 , the circuit board 1 is arranged between the inner bottom surface of the housing 2 and a heat dissipation device 3, the heat dissipation device 3 comprises a top plate 31, a bottom plate 33 and a connecting plate 32, the top plate 31 and the bottom plate 33 are both horizontally arranged, the connecting plate 32 is vertically arranged, and the top plate 31 and the bottom plate 33 are fixedly connected through the connecting plate 32. The top plate 31 is in contact with the bottom surface of the circuit board 1, and the bottom plate 33 is in contact with the inner bottom surface of the housing 2. The bottom surface of the top plate 31 is fixedly connected with a plurality of heat dissipation fins 34, and the plurality of heat dissipation fins 34 are uniformly distributed on the bottom surface of the top plate 31. The outer surface of each heat dissipation fin 34 is in a continuous wave shape.
[0030] With reference to Figure 1 and Figure 3In practice, the top plate 31 and bottom plate 33 of the heat sink 3 are both horizontally arranged and fixedly connected by a vertically arranged connecting plate 32, ensuring stable contact between the circuit board 1 and the housing 2. This structural design ensures that heat is efficiently transferred from the circuit board 1 to the heat sink 3 through the top plate 31, and then to the housing 2 through the bottom plate 33, effectively dissipating the heat by utilizing the large surface area of the housing 2. Several heat dissipating fins 34 are fixed to the bottom surface of the top plate 31 of the heat sink 3, and these heat dissipating fins 34 are evenly distributed on the bottom surface of the top plate 31. The even distribution of heat dissipating fins 34 increases the overall surface area of the heat sink 3, promoting uniform heat dissipation, thereby avoiding local overheating and improving the heat dissipation effect. The outer surface of each heat dissipating fin 34 exhibits a continuous wavy shape. This design further increases the surface area of the heat dissipating fin 34 while making the air flow more irregular and disrupting the laminar state of the airflow. The wavy fin surface effectively increases the air flow velocity, enhances the contact between heat and air, and thus accelerates heat transfer and dissipation. Through the above structural design, the radiator 3 can quickly and efficiently transfer the heat generated by the circuit board 1 to the housing 2 in a space-constrained and closed environment, and dissipate it through the surface of the housing 2, thereby effectively reducing the temperature inside the device and ensuring the stability and performance of the device.
[0031] Reference Figure 2 and Figure 3 A first thermally conductive silicone rubber pad (4) is positioned between the bottom surface of the circuit board 1 and the top surface of the top plate 31. This first thermally conductive silicone pad (4) is designed to match the IC components located on the bottom surface of the circuit board 1, i.e., its shape and number are identical to those of the IC components on the circuit board 1. The first thermally conductive silicone pad (4) between the bottom surface of the circuit board 1 and the top plate 31 of the heat sink 3 effectively transfers heat. When the IC components operate, heat generated by the thermally conductive silicone pad is transferred from the bottom surface of the circuit board 1 to the thermally conductive silicone pad. The excellent thermal conductivity of the thermally conductive silicone pad quickly transfers the heat to the top plate 31 of the heat sink 3, thereby achieving rapid heat dissipation. Because the thermally conductive silicone pad closely contacts the bottom surface of the IC components and fills the tiny gaps between them, it significantly reduces thermal resistance during heat transfer, ensuring rapid and efficient heat transfer from the IC components to the heat sink 3. Furthermore, because the shape and number of the first thermally conductive silicone pads match those of the IC components on the circuit board 1, this precise, adaptable design ensures that the thermally conductive silicone pad completely covers each IC component, avoiding uneven heat distribution across the thermally conductive silicone pad area. Heat from each IC component is evenly distributed and effectively dissipated, thus avoiding the risk of local overheating and improving overall heat dissipation. The first thermally conductive silicone fills the tiny gaps between the circuit board 1 and the heat sink 3, ensuring closer contact between the bottom surface of the circuit board 1 and the top plate 31 of the heat sink 3. This avoids thermal resistance caused by gaps and further improves heat conduction efficiency.
[0032] Referring to Figure 2 And Figure 3 , a second heat-conducting silicone 5 is provided between the inner bottom surface of the housing 2 and the bottom surface of the bottom plate 33, and the second heat-conducting silicone 5 has the same shape as the bottom plate 33. As part of the circuit board 1 heat dissipation system, the second heat-conducting silicone 5 serves to conduct heat from the bottom plate 33 of the heat sink 3 to the housing 2. Since the second heat-conducting silicone 5 has the same shape as the bottom plate 33, it can uniformly cover the contact surface between the bottom plate 33 and the inner bottom surface of the housing 2, thereby reducing thermal resistance during heat conduction. The gap between the two is effectively filled, ensuring that heat can be quickly transferred from the bottom plate 33 to the housing 2, improving overall heat dissipation efficiency. In addition, since the heat-conducting silicone has good thermal conductivity, it can quickly transfer the heat from the bottom plate 33 to the housing 2. The larger surface area of the housing 2 allows heat to spread more quickly into the air, speeding up the heat dissipation process. By effectively utilizing the surface area of the housing 2, the second heat-conducting silicone 5 can help quickly release heat during the heat dissipation process to the external environment, further reducing the temperature inside the device. The second heat-conducting silicone 5 can fill the small gaps between the bottom plate 33 and the inner bottom surface of the housing 2, avoiding the presence of air or other non-heat-conducting materials that can cause heat to be unable to effectively transfer during conduction. By providing a consistent heat-conducting path, the second heat-conducting silicone 5 optimizes the route of heat conduction, ensuring that heat is transferred from the heat sink 3 to the housing 2 at the fastest speed, maximizing heat dissipation efficiency.
[0033] In summary, by optimizing the design of the heat sink 3 and the use of heat-conducting materials, the problem of low heat dissipation efficiency in enclosed spaces and small devices has been effectively solved. The assembly includes a housing 2, a circuit board 1, a heat sink 3, and a heat-conducting silicone, where the top plate 31 and the bottom plate 33 of the heat sink 3 are in close contact with the circuit board 1 and the housing 2, forming an efficient heat conduction channel. By using heat-conducting silicone between the circuit board 1 and the heat sink 3, heat generated by the IC components can be quickly transferred to the heat sink 3, and then dissipated through the super-large surface area of the housing 2. The wavy design of the heat sink 3 fins further increases the contact area and promotes air flow, thereby improving heat dissipation efficiency. Under this design, even without the use of a fan, the heat sink 3 can still efficiently conduct the heat of the IC components to the external environment, solving the problem of insufficient heat dissipation in enclosed spaces and ensuring the stability and performance of the device.
[0034] The above are preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: any equivalent changes made on the basis of the structure, shape, principle of the present application shall be covered by the protection scope of the present application.
Claims
1. A PCBA heat dissipation assembly, comprising a housing (2) and a circuit board (1), wherein the circuit board (1) is arranged in a confined space of the housing (2); characterized in that: A heat sink (3) is provided between the circuit board (1) and the housing (2), and heat sink blades (34) are provided on the heat sink (3); the top end of the heat sink (3) contacts the bottom surface of the circuit board (1), and the bottom end of the heat sink (3) contacts the inner bottom surface of the housing (2).
2. The PCBA heat dissipation assembly according to claim 1, characterized in that: The heat sink (3) comprises a top plate (31) and a bottom plate (33) both arranged horizontally, the top plate (31) and the bottom plate (33) being connected via a connecting plate (32), the top plate (31) being in contact with the bottom surface of the circuit board (1), and the bottom plate (33) being in contact with the inner bottom surface of the housing (2).
3. The PCBA heat dissipation assembly according to claim 2, characterized in that: A plurality of heat dissipation blades (34) are provided, and the plurality of heat dissipation blades (34) are evenly distributed on the bottom surface of the top plate (31).
4. The PCBA heat dissipation assembly according to claim 3, characterized in that: The outer surface of each heat dissipation blade (34) presents a continuous wave shape.
5. The PCBA heat dissipation assembly according to claim 2, characterized in that: A first heat-conducting (4) silica gel is provided between the bottom surface of the circuit board (1) and the top plate (31).
6. The PCBA heat dissipation assembly according to claim 5, characterized in that: The shape and quantity of the first heat-conducting (4) silica gel are the same as the shape and quantity of the IC components on the circuit board (1).
7. The PCBA heat dissipation assembly according to claim 2, characterized in that: A second heat-conducting silica gel (5) is provided between the inner bottom surface of the outer shell (2) and the bottom plate (33).
8. The PCBA heat dissipation assembly according to claim 7, characterized in that: The shape of the second thermally conductive silica gel (5) is the same as that of the bottom plate (33).